JP7073606B2 - 離間装置および離間方法 - Google Patents

離間装置および離間方法 Download PDF

Info

Publication number
JP7073606B2
JP7073606B2 JP2017078140A JP2017078140A JP7073606B2 JP 7073606 B2 JP7073606 B2 JP 7073606B2 JP 2017078140 A JP2017078140 A JP 2017078140A JP 2017078140 A JP2017078140 A JP 2017078140A JP 7073606 B2 JP7073606 B2 JP 7073606B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
holding
adherends
widened
mutual spacing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017078140A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018182017A (ja
Inventor
芳昭 杉下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2017078140A priority Critical patent/JP7073606B2/ja
Priority to TW107106097A priority patent/TWI778024B/zh
Priority to KR1020180027908A priority patent/KR102506718B1/ko
Priority to CN201810193530.0A priority patent/CN108695195B/zh
Publication of JP2018182017A publication Critical patent/JP2018182017A/ja
Application granted granted Critical
Publication of JP7073606B2 publication Critical patent/JP7073606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Liquid Crystal Substances (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2017078140A 2017-04-11 2017-04-11 離間装置および離間方法 Active JP7073606B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017078140A JP7073606B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法
TW107106097A TWI778024B (zh) 2017-04-11 2018-02-23 分離裝置及分離方法
KR1020180027908A KR102506718B1 (ko) 2017-04-11 2018-03-09 이간 장치 및 이간 방법
CN201810193530.0A CN108695195B (zh) 2017-04-11 2018-03-09 分离装置及分离方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017078140A JP7073606B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法

Publications (2)

Publication Number Publication Date
JP2018182017A JP2018182017A (ja) 2018-11-15
JP7073606B2 true JP7073606B2 (ja) 2022-05-24

Family

ID=63844499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017078140A Active JP7073606B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法

Country Status (4)

Country Link
JP (1) JP7073606B2 (zh)
KR (1) KR102506718B1 (zh)
CN (1) CN108695195B (zh)
TW (1) TWI778024B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108516B2 (ja) * 2018-10-25 2022-07-28 リンテック株式会社 シート貼付方法
JP6831035B1 (ja) * 2020-09-11 2021-02-17 リンテック株式会社 個片体製造方法および個片体製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016111188A (ja) 2014-12-05 2016-06-20 リンテック株式会社 離間装置および離間方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209829A (ja) * 2004-01-22 2005-08-04 Taiyo Yuden Co Ltd 半導体ウェハ固定方法及び装置、並びに半導体ウェハが固定された構造体
JP2006054246A (ja) * 2004-08-10 2006-02-23 Disco Abrasive Syst Ltd ウエーハの分離方法
JP2006294731A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd 半導体製造装置
JP2008140874A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2010192510A (ja) * 2009-02-16 2010-09-02 Disco Abrasive Syst Ltd ワークの移載方法および移載装置
JP4630377B2 (ja) * 2009-03-11 2011-02-09 古河電気工業株式会社 半導体装置の製造方法
JP2011211054A (ja) * 2010-03-30 2011-10-20 Lintec Corp エキスパンド装置及びこれを用いたチップの取扱方法
JP2013191718A (ja) * 2012-03-14 2013-09-26 Disco Abrasive Syst Ltd 被加工物の分割装置及び分割方法
JP5961047B2 (ja) * 2012-06-22 2016-08-02 株式会社ディスコ ウエーハの加工方法
JP2014107292A (ja) * 2012-11-22 2014-06-09 Disco Abrasive Syst Ltd チップ間隔維持装置
JP6420623B2 (ja) * 2014-10-10 2018-11-07 リンテック株式会社 離間装置および離間方法
JP2016092207A (ja) * 2014-11-05 2016-05-23 株式会社ディスコ フレームユニットの製造方法
JP6363947B2 (ja) 2014-12-26 2018-07-25 リンテック株式会社 離間装置および離間方法
JP6417236B2 (ja) * 2015-02-26 2018-10-31 株式会社ディスコ ウエーハの分割方法及びチャックテーブル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016111188A (ja) 2014-12-05 2016-06-20 リンテック株式会社 離間装置および離間方法

Also Published As

Publication number Publication date
KR20180114831A (ko) 2018-10-19
KR102506718B1 (ko) 2023-03-06
JP2018182017A (ja) 2018-11-15
TW201838002A (zh) 2018-10-16
CN108695195B (zh) 2023-06-13
TWI778024B (zh) 2022-09-21
CN108695195A (zh) 2018-10-23

Similar Documents

Publication Publication Date Title
JP7073606B2 (ja) 離間装置および離間方法
CN108878311B (zh) 分离装置及分离方法
JP6438796B2 (ja) シート剥離装置および剥離方法
JP6884961B2 (ja) 離間装置および離間方法
JP6848151B2 (ja) 離間装置および離間方法
JP6880431B2 (ja) 離間装置および離間方法
JP6815270B2 (ja) エネルギー付与装置およびエネルギー付与方法
JP3234507U (ja) 支持装置
TW201901854A (zh) 離間裝置及離間方法
JP6996046B2 (ja) 離間装置および離間方法
JP7108444B2 (ja) 離間装置および離間方法
JP7093630B2 (ja) 離間装置および離間方法
JP7009105B2 (ja) シート貼付装置および貼付方法
JP3215971U (ja) 離間装置
JP7009177B2 (ja) シート剥離装置および剥離方法
JP3210844U (ja) シート繰出装置
JP2017130638A (ja) 加工装置および加工方法
JP2017107978A (ja) シート剥離装置および剥離方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200116

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20201124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201215

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210212

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20210413

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20210629

C22 Notice of designation (change) of administrative judge

Free format text: JAPANESE INTERMEDIATE CODE: C22

Effective date: 20211026

C13 Notice of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: C13

Effective date: 20211130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220124

C23 Notice of termination of proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C23

Effective date: 20220308

C03 Trial/appeal decision taken

Free format text: JAPANESE INTERMEDIATE CODE: C03

Effective date: 20220412

C30A Notification sent

Free format text: JAPANESE INTERMEDIATE CODE: C3012

Effective date: 20220412

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220419

R150 Certificate of patent or registration of utility model

Ref document number: 7073606

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150