KR102506718B1 - 이간 장치 및 이간 방법 - Google Patents

이간 장치 및 이간 방법 Download PDF

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Publication number
KR102506718B1
KR102506718B1 KR1020180027908A KR20180027908A KR102506718B1 KR 102506718 B1 KR102506718 B1 KR 102506718B1 KR 1020180027908 A KR1020180027908 A KR 1020180027908A KR 20180027908 A KR20180027908 A KR 20180027908A KR 102506718 B1 KR102506718 B1 KR 102506718B1
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KR
South Korea
Prior art keywords
adhesive sheet
holding
adherends
mutual distance
widened
Prior art date
Application number
KR1020180027908A
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English (en)
Korean (ko)
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KR20180114831A (ko
Inventor
요시아키 스기시타
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20180114831A publication Critical patent/KR20180114831A/ko
Application granted granted Critical
Publication of KR102506718B1 publication Critical patent/KR102506718B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Liquid Crystal Substances (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020180027908A 2017-04-11 2018-03-09 이간 장치 및 이간 방법 KR102506718B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017078140A JP7073606B2 (ja) 2017-04-11 2017-04-11 離間装置および離間方法
JPJP-P-2017-078140 2017-04-11

Publications (2)

Publication Number Publication Date
KR20180114831A KR20180114831A (ko) 2018-10-19
KR102506718B1 true KR102506718B1 (ko) 2023-03-06

Family

ID=63844499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180027908A KR102506718B1 (ko) 2017-04-11 2018-03-09 이간 장치 및 이간 방법

Country Status (4)

Country Link
JP (1) JP7073606B2 (zh)
KR (1) KR102506718B1 (zh)
CN (1) CN108695195B (zh)
TW (1) TWI778024B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7108516B2 (ja) * 2018-10-25 2022-07-28 リンテック株式会社 シート貼付方法
JP6831035B1 (ja) * 2020-09-11 2021-02-17 リンテック株式会社 個片体製造方法および個片体製造装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209829A (ja) * 2004-01-22 2005-08-04 Taiyo Yuden Co Ltd 半導体ウェハ固定方法及び装置、並びに半導体ウェハが固定された構造体
JP2006294731A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd 半導体製造装置
JP2008140874A (ja) 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2010192510A (ja) 2009-02-16 2010-09-02 Disco Abrasive Syst Ltd ワークの移載方法および移載装置
JP2014007257A (ja) 2012-06-22 2014-01-16 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2016081974A (ja) 2014-10-10 2016-05-16 リンテック株式会社 離間装置および離間方法
JP2016157903A (ja) * 2015-02-26 2016-09-01 株式会社ディスコ ウエーハの分割方法及びチャックテーブル

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054246A (ja) * 2004-08-10 2006-02-23 Disco Abrasive Syst Ltd ウエーハの分離方法
JP4630377B2 (ja) * 2009-03-11 2011-02-09 古河電気工業株式会社 半導体装置の製造方法
JP2011211054A (ja) * 2010-03-30 2011-10-20 Lintec Corp エキスパンド装置及びこれを用いたチップの取扱方法
JP2013191718A (ja) * 2012-03-14 2013-09-26 Disco Abrasive Syst Ltd 被加工物の分割装置及び分割方法
JP2014107292A (ja) * 2012-11-22 2014-06-09 Disco Abrasive Syst Ltd チップ間隔維持装置
JP2016092207A (ja) * 2014-11-05 2016-05-23 株式会社ディスコ フレームユニットの製造方法
JP6408366B2 (ja) * 2014-12-05 2018-10-17 リンテック株式会社 離間装置および離間方法
JP6363947B2 (ja) 2014-12-26 2018-07-25 リンテック株式会社 離間装置および離間方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005209829A (ja) * 2004-01-22 2005-08-04 Taiyo Yuden Co Ltd 半導体ウェハ固定方法及び装置、並びに半導体ウェハが固定された構造体
JP2006294731A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd 半導体製造装置
JP2008140874A (ja) 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd テープ拡張装置
JP2010192510A (ja) 2009-02-16 2010-09-02 Disco Abrasive Syst Ltd ワークの移載方法および移載装置
JP2014007257A (ja) 2012-06-22 2014-01-16 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2016081974A (ja) 2014-10-10 2016-05-16 リンテック株式会社 離間装置および離間方法
JP2016157903A (ja) * 2015-02-26 2016-09-01 株式会社ディスコ ウエーハの分割方法及びチャックテーブル

Also Published As

Publication number Publication date
KR20180114831A (ko) 2018-10-19
JP2018182017A (ja) 2018-11-15
TW201838002A (zh) 2018-10-16
CN108695195B (zh) 2023-06-13
TWI778024B (zh) 2022-09-21
JP7073606B2 (ja) 2022-05-24
CN108695195A (zh) 2018-10-23

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