JP6918146B2 - 液体および固体の排出物を収集して後に反応させて気体の排出物にする装置 - Google Patents
液体および固体の排出物を収集して後に反応させて気体の排出物にする装置 Download PDFInfo
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- JP6918146B2 JP6918146B2 JP2019564021A JP2019564021A JP6918146B2 JP 6918146 B2 JP6918146 B2 JP 6918146B2 JP 2019564021 A JP2019564021 A JP 2019564021A JP 2019564021 A JP2019564021 A JP 2019564021A JP 6918146 B2 JP6918146 B2 JP 6918146B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
- H01J37/32844—Treating effluent gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32889—Connection or combination with other apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/204—Inorganic halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/55—Compounds of silicon, phosphorus, germanium or arsenic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/02—Other waste gases
- B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
- B01D2259/818—Employing electrical discharges or the generation of a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
Claims (12)
- 第1の端部、前記第1の端部の反対側に形成された第2の端部、入口ポート、および前記第2の端部に形成された出口ポートを含む本体アセンブリであって、前記入口ポートおよび前記出口ポートを流体的に連結する中空内部を有する本体アセンブリと、
前記第1の端部に結合された第1の端部板と、
前記第2の端部に結合された第2の端部板と、
前記第1の端部板から片持ち梁式に突出され、前記中空内部内に配置された第1の板と、
前記第2の端部板から片持ち梁式に突出され、前記第1の板と前記出口ポートとの間の前記中空内部内に配置された第2の板であって、前記第2の板は、冷却剤入口に結合され、そこに形成された冷却材チャネルを有し、前記第2の板を前記第1の板より低温で維持するように構成された第2の板と
を含む、
排気冷却装置。 - 前記第1の板および前記第2の板の周りに前記入口ポートと前記出口ポートとの間を第1の方向に画定された第1の蛇行流路
をさらに備える、請求項1に記載の排気冷却装置。 - 前記第1の板および前記第2の板の周りに入口ポートと出口ポートとの間を第2の方向に画定された第2の蛇行流路をさらに備え、前記第1の方向が、前記第2の方向に対して90度に配向されている、
請求項2に記載の排気冷却装置。 - 前記第1の板がトレイである、請求項1に記載の排気冷却装置。
- 前記第1の板が湾曲している、請求項1に記載の排気冷却装置。
- 排気出口を有する第1のプラズマ源と、
本体を有する排気冷却装置であって、前記本体が入口ポートと、内部に配置された冷却板を備えた前記内部への出口ポートとを有し、前記第1のプラズマ源が前記入口ポートに結合され、排気ガスが前記第1のプラズマ源の前記排気出口から流出するように構成され、前記入口ポートに流入するように構成された、排気冷却装置と、
前記排気冷却装置に導管を介して結合された第2のプラズマ源と
を備える、軽減システム。 - 前記排気冷却装置が、
第1の端部、第2の端部、入口ポート、および出口ポートを有する本体アセンブリであって、前記入口ポートおよび前記出口ポートを流体的に連結する中空内部を有する本体アセンブリと、
前記中空内部内に配置された第1の板と、
前記中空内部内で前記第1の板と前記出口ポートとの間に配置された第2の板とを備え、前記第2の板が、前記第2の板を前記第1の板より低温で維持するように動作可能な温度制御要素を有する、請求項6に記載の軽減システム。 - 前記排気冷却装置が、
前記第1の板および前記第2の板の周りに前記入口ポートと前記出口ポートとの間を第1の方向に画定された第1の蛇行流路を備える、請求項7に記載の軽減システム。 - 前記排気冷却装置が、
前記第1の板および前記第2の板の周りに前記入口ポートと前記出口ポートとの間を第2の方向に画定された第2の蛇行流路を備え、前記第1の方向が、前記第2の方向に対して90度に配向されている、請求項8に記載の軽減システム。 - 第1の端部、第2の端部、入口ポート、および出口ポートを有する本体アセンブリであって、前記入口ポートおよび前記出口ポートを流体的に連結する中空内部を有する本体アセンブリと、
前記中空内部内に配置されたトレイであって、前記第1の端部から片持ち梁式に突出するトレイと、
前記中空内部内で前記トレイと前記出口ポートとの間に配置された板であって、冷却剤入口に結合され、そこに形成された冷却材チャネルを有する板と
を備える排気冷却装置。 - 前記トレイおよび前記板の周りに前記入口ポートと前記出口ポートとの間を第1の方向に画定された第1の蛇行流路
をさらに備える、請求項10に記載の排気冷却装置。 - 前記トレイおよび前記板の周りに前記入口ポートと前記出口ポートとの間を第2の方向に画定された第2の蛇行流路をさらに備え、前記第1の方向が、前記第2の方向に対して90度に配向されている、
請求項11に記載の排気冷却装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201762508930P | 2017-05-19 | 2017-05-19 | |
US62/508,930 | 2017-05-19 | ||
PCT/US2018/029031 WO2018212940A1 (en) | 2017-05-19 | 2018-04-24 | Apparatus for collection and subsequent reaction of liquid and solid effluent into gaseous effluent |
Publications (2)
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JP2020521328A JP2020521328A (ja) | 2020-07-16 |
JP6918146B2 true JP6918146B2 (ja) | 2021-08-11 |
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JP2019564021A Active JP6918146B2 (ja) | 2017-05-19 | 2018-04-24 | 液体および固体の排出物を収集して後に反応させて気体の排出物にする装置 |
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US (1) | US10861681B2 (ja) |
JP (1) | JP6918146B2 (ja) |
KR (1) | KR102306675B1 (ja) |
CN (1) | CN110709974B (ja) |
TW (1) | TWI766019B (ja) |
WO (1) | WO2018212940A1 (ja) |
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