JP6863220B2 - 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法 - Google Patents

片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法 Download PDF

Info

Publication number
JP6863220B2
JP6863220B2 JP2017200286A JP2017200286A JP6863220B2 JP 6863220 B2 JP6863220 B2 JP 6863220B2 JP 2017200286 A JP2017200286 A JP 2017200286A JP 2017200286 A JP2017200286 A JP 2017200286A JP 6863220 B2 JP6863220 B2 JP 6863220B2
Authority
JP
Japan
Prior art keywords
wafer
sided polishing
water
affixing
discharge tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017200286A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019072796A (ja
Inventor
山本　勝利
勝利 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Priority to JP2017200286A priority Critical patent/JP6863220B2/ja
Priority to TW107130773A priority patent/TWI711508B/zh
Priority to KR1020207013615A priority patent/KR102370447B1/ko
Priority to CN201880067566.2A priority patent/CN111295267B/zh
Priority to DE112018004568.4T priority patent/DE112018004568T5/de
Priority to PCT/JP2018/037125 priority patent/WO2019078009A1/ja
Publication of JP2019072796A publication Critical patent/JP2019072796A/ja
Application granted granted Critical
Publication of JP6863220B2 publication Critical patent/JP6863220B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017200286A 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法 Active JP6863220B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017200286A JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法
TW107130773A TWI711508B (zh) 2017-10-16 2018-09-03 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法
KR1020207013615A KR102370447B1 (ko) 2017-10-16 2018-10-03 편면 연마 장치로의 웨이퍼 접착 장치 및, 편면 연마 장치로의 웨이퍼 접착 방법
CN201880067566.2A CN111295267B (zh) 2017-10-16 2018-10-03 用于单面抛光装置的晶片贴附装置及单面抛光装置上的晶片贴附方法
DE112018004568.4T DE112018004568T5 (de) 2017-10-16 2018-10-03 Einrichtung zum befestigen eines wafers an einer einseiten-poliereinrichtung und verfahren zum befestigen eines wafers an einer einseiten-poliereinrichtung
PCT/JP2018/037125 WO2019078009A1 (ja) 2017-10-16 2018-10-03 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017200286A JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Publications (2)

Publication Number Publication Date
JP2019072796A JP2019072796A (ja) 2019-05-16
JP6863220B2 true JP6863220B2 (ja) 2021-04-21

Family

ID=66174496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017200286A Active JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Country Status (6)

Country Link
JP (1) JP6863220B2 (ko)
KR (1) KR102370447B1 (ko)
CN (1) CN111295267B (ko)
DE (1) DE112018004568T5 (ko)
TW (1) TWI711508B (ko)
WO (1) WO2019078009A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741866B (zh) * 2020-11-06 2021-10-01 環球晶圓股份有限公司 晶圓載具的貼覆裝置及其操作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102114A (ja) * 1991-10-03 1993-04-23 Shibayama Kikai Kk 半導体ウエハの仮置台
JP4062552B2 (ja) * 1995-10-23 2008-03-19 日本政策投資銀行 半導体ウエハの位置合わせ及び水張り方法
JPH10337656A (ja) * 1997-06-05 1998-12-22 Mitsubishi Materials Corp ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP2003109926A (ja) * 2001-09-26 2003-04-11 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP2007103707A (ja) 2005-10-05 2007-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨装置および研磨方法
JP2008080443A (ja) 2006-09-27 2008-04-10 Covalent Materials Corp 片面研磨装置
JP2011121218A (ja) * 2009-12-09 2011-06-23 Seiko Epson Corp ノズルプレート、吐出ヘッド及びそれらの製造方法並びに吐出装置
CN106206280B (zh) * 2016-08-17 2019-03-01 苏州聚晶科技有限公司 一种硅晶片的单面去psg层及抛光的制备方法

Also Published As

Publication number Publication date
TW201922418A (zh) 2019-06-16
KR20200067875A (ko) 2020-06-12
DE112018004568T5 (de) 2020-06-04
WO2019078009A1 (ja) 2019-04-25
CN111295267B (zh) 2022-07-08
KR102370447B1 (ko) 2022-03-03
TWI711508B (zh) 2020-12-01
CN111295267A (zh) 2020-06-16
JP2019072796A (ja) 2019-05-16

Similar Documents

Publication Publication Date Title
JP6659332B2 (ja) 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
JP4541824B2 (ja) 非接触型吸着保持装置
KR100977914B1 (ko) 가동 페데스탈을 이용한 폴리싱 헤드 테스트
JP6974065B2 (ja) 基板処理装置および基板を基板処理装置のテーブルから離脱させる方法
TWI462665B (zh) 黏附性吸座及基板結合設備
JP6746471B2 (ja) 基板処理装置
JP4796430B2 (ja) 保護テープ貼着方法
JP2011258639A (ja) 研磨装置および方法
JP6863220B2 (ja) 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法
JP3608121B2 (ja) 基板の機械的脱離機構およびその機構を用いた脱離方法
JP2016159412A (ja) パッケージ基板の研削方法
JP5005933B2 (ja) 基板搬送器具用吸着パッドおよび基板の搬送方法
JP2009302237A (ja) テープ貼付装置
JP3602943B2 (ja) 半導体ウエハの研削装置
JP5433542B2 (ja) 両面粘着テープ剥離方法および両面粘着テープ剥離装置
TWI831174B (zh) 基板清洗裝置及其控制方法
JP5756022B2 (ja) ウエハテーピング
JP5033354B2 (ja) ワークセンタリング装置
JP6349131B2 (ja) 洗浄装置
JP6933788B2 (ja) 基板への接着テープ貼り付け装置及び貼り付け方法
JP5384904B2 (ja) 洗浄装置
JP2006281400A (ja) 研磨装置
TW202307923A (zh) 基板處理裝置
JP2010165883A (ja) 半導体ウエハの搬送装置及び搬送方法
JPH05152262A (ja) ウエーハ接着装置およびウエーハ接着方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191017

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210302

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210315

R150 Certificate of patent or registration of utility model

Ref document number: 6863220

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250