TWI711508B - 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法 - Google Patents

用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法 Download PDF

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Publication number
TWI711508B
TWI711508B TW107130773A TW107130773A TWI711508B TW I711508 B TWI711508 B TW I711508B TW 107130773 A TW107130773 A TW 107130773A TW 107130773 A TW107130773 A TW 107130773A TW I711508 B TWI711508 B TW I711508B
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TW
Taiwan
Prior art keywords
wafer
water
attaching
polishing device
sided polishing
Prior art date
Application number
TW107130773A
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English (en)
Chinese (zh)
Other versions
TW201922418A (zh
Inventor
山本勝利
Original Assignee
日商Ｓｕｍｃｏ股份有限公司
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Application filed by 日商Ｓｕｍｃｏ股份有限公司 filed Critical 日商Ｓｕｍｃｏ股份有限公司
Publication of TW201922418A publication Critical patent/TW201922418A/zh
Application granted granted Critical
Publication of TWI711508B publication Critical patent/TWI711508B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107130773A 2017-10-16 2018-09-03 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法 TWI711508B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-200286 2017-10-16
JP2017200286A JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Publications (2)

Publication Number Publication Date
TW201922418A TW201922418A (zh) 2019-06-16
TWI711508B true TWI711508B (zh) 2020-12-01

Family

ID=66174496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130773A TWI711508B (zh) 2017-10-16 2018-09-03 用於單面研磨裝置的晶圓貼附裝置及用於單面研磨裝置的晶圓貼附方法

Country Status (6)

Country Link
JP (1) JP6863220B2 (ko)
KR (1) KR102370447B1 (ko)
CN (1) CN111295267B (ko)
DE (1) DE112018004568T5 (ko)
TW (1) TWI711508B (ko)
WO (1) WO2019078009A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741866B (zh) * 2020-11-06 2021-10-01 環球晶圓股份有限公司 晶圓載具的貼覆裝置及其操作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09115989A (ja) * 1995-10-23 1997-05-02 Rap Master S F T Kk 半導体ウエハの位置合わせ及び水張り方法
TW516990B (en) * 1999-08-20 2003-01-11 Ebara Corp Polishing apparatus
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102114A (ja) * 1991-10-03 1993-04-23 Shibayama Kikai Kk 半導体ウエハの仮置台
JPH10337656A (ja) * 1997-06-05 1998-12-22 Mitsubishi Materials Corp ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法
JP2003109926A (ja) * 2001-09-26 2003-04-11 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置
JP2007103707A (ja) 2005-10-05 2007-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨装置および研磨方法
JP2008080443A (ja) 2006-09-27 2008-04-10 Covalent Materials Corp 片面研磨装置
JP2011121218A (ja) * 2009-12-09 2011-06-23 Seiko Epson Corp ノズルプレート、吐出ヘッド及びそれらの製造方法並びに吐出装置
CN106206280B (zh) * 2016-08-17 2019-03-01 苏州聚晶科技有限公司 一种硅晶片的单面去psg层及抛光的制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09115989A (ja) * 1995-10-23 1997-05-02 Rap Master S F T Kk 半導体ウエハの位置合わせ及び水張り方法
TW516990B (en) * 1999-08-20 2003-01-11 Ebara Corp Polishing apparatus
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置

Also Published As

Publication number Publication date
TW201922418A (zh) 2019-06-16
CN111295267B (zh) 2022-07-08
WO2019078009A1 (ja) 2019-04-25
JP2019072796A (ja) 2019-05-16
JP6863220B2 (ja) 2021-04-21
KR20200067875A (ko) 2020-06-12
KR102370447B1 (ko) 2022-03-03
CN111295267A (zh) 2020-06-16
DE112018004568T5 (de) 2020-06-04

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