JP6746471B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP6746471B2 JP6746471B2 JP2016218314A JP2016218314A JP6746471B2 JP 6746471 B2 JP6746471 B2 JP 6746471B2 JP 2016218314 A JP2016218314 A JP 2016218314A JP 2016218314 A JP2016218314 A JP 2016218314A JP 6746471 B2 JP6746471 B2 JP 6746471B2
- Authority
- JP
- Japan
- Prior art keywords
- lift pin
- liquid supply
- push
- supply unit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Description
20 リフトピンプレート
20a 貫通穴
22 リフトピン
26 バネ
30 保持プレート
30a 貫通穴
30b 貫通穴
39 回転駆動部
40 液供給管
60 昇降機構
61 第1押し上げ部材
W ウエハ
Claims (9)
- 第1貫通穴が形成され、基板を保持する保持プレートと、
前記保持プレートを回転させる回転駆動部と、
前記保持プレートの上側に設けられ、前記基板を下方から支持するリフトピンと、
前記第1貫通穴を通るように設けられ、前記保持プレートにより保持された前記基板の裏面に液を供給する液供給部と、
前記リフトピン及び前記液供給部が前記保持プレートに隣接するとともに前記基板が保持される位置である隣接位置と、前記リフトピン及び前記液供給部が前記保持プレートから上方に離間するとともに前記基板を搬出する位置である離間位置との間で、前記リフトピン及び前記液供給部を昇降させる昇降機構と、を備え、
前記昇降機構は、前記リフトピンを前記離間位置に移行させる第1押し上げ部材を有し、
前記第1押し上げ部材は、前記リフトピン及び前記液供給部が前記隣接位置にあるときに、前記リフトピンに対して非連結状態であり、
前記リフトピン及び前記液供給部が前記隣接位置から前記離間位置に移行する際、前記第1押し上げ部材は前記非連結状態から前記リフトピンに対して連結される連結状態になり、前記昇降機構は、前記第1押し上げ部材が前記リフトピンに対して連結された状態で前記隣接位置と前記離間位置の間の予め設定された位置まで上昇する間は、前記リフトピンのみを上昇させ、前記第1押し上げ部材が当該予め設定された位置から前記離間位置まで上昇する間は、前記リフトピン及び前記液供給部を上昇させることを特徴とする基板処理装置。 - 前記昇降機構は、
前記液供給部を前記離間位置に移行させる第2押し上げ部材と、
前記第1押し上げ部材及び前記第2押し上げ部材を昇降させる昇降駆動部と、を更に有し、
前記昇降駆動部は、前記第1押し上げ部材及び前記第2押し上げ部材を昇降させて、前記第1押し上げ部材が前記リフトピンに対して連結せず且つ前記第2押し上げ部材が前記液供給部に対して連結しない状態と、前記第1押し上げ部材が前記リフトピンに対して連結し且つ前記第2押し上げ部材が前記液供給部に対して連結する状態とを実現することができる請求項1に記載の基板処理装置。 - 前記昇降機構は、前記第1押し上げ部材及び前記第2押し上げ部材に連結される中間連結部を更に含み、
前記昇降駆動部は、前記中間連結部を昇降させることで、前記第1押し上げ部材及び前記第2押し上げ部材を昇降させる請求項2に記載の基板処理装置。 - 前記液供給部に対して固定され、前記液供給部と一体的に昇降する固定昇降部を更に備え、
前記第2押し上げ部材は、前記固定昇降部に接触することによって前記液供給部に連結され、前記固定昇降部から離れることによって前記液供給部に連結されなくなる請求項2又は3に記載の基板処理装置。 - 前記リフトピン及び前記液供給部が前記隣接位置から前記離間位置に移行する際、前記液供給部に対する前記第2押し上げ部材の連結が、前記リフトピンを介した前記基板に対する前記第1押し上げ部材の連結と同時に行われる請求項2〜4のいずれか一項に記載の基板処理装置。
- 前記液供給部に連結され、前記液供給部と一体的に昇降するガイド部材と、
前記ガイド部材を昇降自在に保持し、且つ、予め設定された最下方位置よりも下方に前記ガイド部材が移動しないように前記ガイド部材の移動を制限するガイド規制部と、を更に備える請求項1〜5のいずれか一項に記載の基板処理装置。 - 前記リフトピンに接続される接続部材を更に備え、
前記第1押し上げ部材は、前記接続部材に接触することによって前記リフトピンに連結され、前記接続部材から離れることによって前記リフトピンに連結されなくなる請求項1〜6のいずれか一項に記載の基板処理装置。 - 前記リフトピンが前記隣接位置に維持されるように前記リフトピンを付勢するバネを備え、
前記バネは、前記接続部材に弾性力を加えることによって、前記リフトピンを付勢し、
前記第1押し上げ部材は、前記バネの弾性力に抗して前記接続部材を押し上げることによって、前記リフトピンを上昇させる請求項7に記載の基板処理装置。 - 前記昇降駆動部は、エアシリンダを含む請求項2〜5のいずれか一項に記載の基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016218314A JP6746471B2 (ja) | 2016-11-08 | 2016-11-08 | 基板処理装置 |
CN201711066321.1A CN108074839B (zh) | 2016-11-08 | 2017-11-02 | 基板处理装置 |
US15/805,311 US10460962B2 (en) | 2016-11-08 | 2017-11-07 | Substrate processing apparatus |
KR1020170147559A KR102372646B1 (ko) | 2016-11-08 | 2017-11-07 | 기판 처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016218314A JP6746471B2 (ja) | 2016-11-08 | 2016-11-08 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018078173A JP2018078173A (ja) | 2018-05-17 |
JP6746471B2 true JP6746471B2 (ja) | 2020-08-26 |
Family
ID=62064097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016218314A Active JP6746471B2 (ja) | 2016-11-08 | 2016-11-08 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10460962B2 (ja) |
JP (1) | JP6746471B2 (ja) |
KR (1) | KR102372646B1 (ja) |
CN (1) | CN108074839B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102597602B1 (ko) * | 2018-05-18 | 2023-11-02 | 삼성전자주식회사 | 박막 형성 장치 및 이를 이용한 박막 형성 방법 |
DE102018007307A1 (de) * | 2018-09-17 | 2020-03-19 | Vat Holding Ag | Stifthubvorrichtung |
JP7221739B2 (ja) * | 2019-03-06 | 2023-02-14 | 株式会社東京精密 | ウエハ保持装置 |
JP7285157B2 (ja) * | 2019-07-26 | 2023-06-01 | 株式会社Screenホールディングス | 基板処理装置、基板処理システムおよび基板処理方法 |
KR102271566B1 (ko) * | 2019-10-28 | 2021-07-01 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3354367B2 (ja) * | 1995-12-19 | 2002-12-09 | 大日本スクリーン製造株式会社 | 基板洗浄装置 |
JP3929192B2 (ja) * | 1998-12-21 | 2007-06-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3816734B2 (ja) * | 2000-09-13 | 2006-08-30 | 東京エレクトロン株式会社 | 基板洗浄装置 |
JP4494332B2 (ja) * | 2005-11-29 | 2010-06-30 | 東京エレクトロン株式会社 | リンス処理方法、現像処理装置、および制御プログラム |
JP5758445B2 (ja) | 2009-08-27 | 2015-08-05 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5301505B2 (ja) * | 2009-08-27 | 2013-09-25 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
KR101421645B1 (ko) * | 2009-09-01 | 2014-07-22 | 주식회사 원익아이피에스 | 기판처리장치 |
JP5512508B2 (ja) * | 2010-12-28 | 2014-06-04 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
JP5420597B2 (ja) * | 2011-07-12 | 2014-02-19 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
CN103730334B (zh) * | 2012-10-11 | 2016-08-03 | 沈阳芯源微电子设备有限公司 | 一种适用于方形基板的化学液回收装置 |
-
2016
- 2016-11-08 JP JP2016218314A patent/JP6746471B2/ja active Active
-
2017
- 2017-11-02 CN CN201711066321.1A patent/CN108074839B/zh active Active
- 2017-11-07 KR KR1020170147559A patent/KR102372646B1/ko active IP Right Grant
- 2017-11-07 US US15/805,311 patent/US10460962B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018078173A (ja) | 2018-05-17 |
US20180130677A1 (en) | 2018-05-10 |
US10460962B2 (en) | 2019-10-29 |
CN108074839B (zh) | 2023-02-28 |
KR102372646B1 (ko) | 2022-03-10 |
KR20180051418A (ko) | 2018-05-16 |
CN108074839A (zh) | 2018-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6746471B2 (ja) | 基板処理装置 | |
KR101490538B1 (ko) | 액처리 장치 및 액처리 방법 | |
KR102389767B1 (ko) | 기판 처리 장치 | |
KR101798320B1 (ko) | 기판 처리 장치 | |
KR101678231B1 (ko) | 액 처리 장치 및 액 처리 방법 | |
CN109773628A (zh) | 处理基板的表面的装置及方法 | |
KR20150000417A (ko) | 기판 유지 장치 및 기판 세정 장치 | |
JP2014120740A (ja) | 基板処理装置、及び基板の張り付け又は剥離方法 | |
KR102294642B1 (ko) | 액 처리 장치 | |
JP4850952B2 (ja) | 液処理装置、液処理方法および記憶媒体 | |
KR102402297B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
JP4601341B2 (ja) | 基板処理装置 | |
JP2010114101A (ja) | 基板処理装置および基板処理方法 | |
JP2007173458A (ja) | ガイド機構 | |
JP4926931B2 (ja) | 基板処理装置および基板処理方法 | |
CN107591315B (zh) | 用于处理基板的装置和方法 | |
KR101965349B1 (ko) | 기판 처리 장치 및 방법 | |
JP5758445B2 (ja) | 液処理装置および液処理方法 | |
KR102620706B1 (ko) | 처리액을 공급 및 회수하는 기판 처리 장치 및 기판 처리 방법 | |
CN107564837B (zh) | 用于处理基板的装置和方法 | |
KR100778394B1 (ko) | 기판 이송 장치 및 이를 포함하는 반도체 소자 제조용 장비 | |
US20240091815A1 (en) | Substrate cleaning apparatus and substrate cleaning method | |
US20240091816A1 (en) | Substrate cleaning apparatus and substrate cleaning method | |
KR101909191B1 (ko) | 기판 지지 유닛 및 이를 가지는 기판 처리 장치 | |
KR20060120730A (ko) | 반도체 웨이퍼 지지장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190827 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200625 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200707 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200805 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6746471 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |