JP6696851B2 - チャックテーブル機構 - Google Patents
チャックテーブル機構 Download PDFInfo
- Publication number
- JP6696851B2 JP6696851B2 JP2016138339A JP2016138339A JP6696851B2 JP 6696851 B2 JP6696851 B2 JP 6696851B2 JP 2016138339 A JP2016138339 A JP 2016138339A JP 2016138339 A JP2016138339 A JP 2016138339A JP 6696851 B2 JP6696851 B2 JP 6696851B2
- Authority
- JP
- Japan
- Prior art keywords
- chuck table
- base
- fixed base
- suction
- insertion portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000003780 insertion Methods 0.000 claims description 47
- 230000037431 insertion Effects 0.000 claims description 47
- 238000004891 communication Methods 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
Description
41 保持面
50 チャックテーブル機構
51 回転手段
52 固定基台
54 回転基台
55 挿入部
57 軸受
72 挿入部の係合端部
73 固定基台の係合凹部
78 環状溝
84 シールリング
91 回転モータ
94 外部吸引源
95 吸引経路
97 連通経路
W 被加工物
Claims (2)
- 被加工物を上面に吸引保持するチャックテーブルを上部に装着し回転可能に支持するチャックテーブル機構であって、
外部吸引源に連通する連通経路が内部に形成された固定基台と、該固定基台の上方に回転可能に配設され上部にチャックテーブルを装着する回転手段と、を備え、
該回転手段は、該固定基台上方に回転可能に配設された回転基台と、回転中心に該回転基台に対して着脱自在に固定され且つ該固定基台に挿入可能に構成された挿入部と、を備え、
該挿入部は、該チャックテーブル上面に吸引力を伝達する吸引経路が内部に形成され、該固定基台の係合凹部に係合する係合端部を備え、
該係合端部が該係合凹部に係合すると、該係合端部の外周壁と該固定基台の該係合凹部の内壁との間でシールリングでシールされると共に、該連通経路と該吸引経路とが連結されること、を特徴とするチャックテーブル機構。 - 該回転手段は該固定基台に軸受けで保持されており、該固定基台には、該回転手段を回転させる回転モータを備えること、を特徴とする請求項1記載のチャックテーブル機構。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016138339A JP6696851B2 (ja) | 2016-07-13 | 2016-07-13 | チャックテーブル機構 |
TW106119308A TWI715779B (zh) | 2016-07-13 | 2017-06-09 | 吸盤台機構 |
KR1020170087746A KR102231552B1 (ko) | 2016-07-13 | 2017-07-11 | 척 테이블 기구 |
CN201710559661.1A CN107622971B (zh) | 2016-07-13 | 2017-07-11 | 卡盘工作台机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016138339A JP6696851B2 (ja) | 2016-07-13 | 2016-07-13 | チャックテーブル機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018010953A JP2018010953A (ja) | 2018-01-18 |
JP6696851B2 true JP6696851B2 (ja) | 2020-05-20 |
Family
ID=60995794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016138339A Active JP6696851B2 (ja) | 2016-07-13 | 2016-07-13 | チャックテーブル機構 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6696851B2 (ja) |
KR (1) | KR102231552B1 (ja) |
CN (1) | CN107622971B (ja) |
TW (1) | TWI715779B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6746756B1 (ja) * | 2019-05-24 | 2020-08-26 | Towa株式会社 | 吸着プレート、切断装置および切断方法 |
KR20210082293A (ko) * | 2019-12-24 | 2021-07-05 | 주식회사 제우스 | 기판 처리장치 |
TWI714497B (zh) * | 2020-04-14 | 2020-12-21 | 盛方源科技股份有限公司 | 可連續環轉之真空吸盤結構 |
WO2024201919A1 (ja) * | 2023-03-30 | 2024-10-03 | 日本碍子株式会社 | セラミックヒータ及びそれを含むキット、並びにセラミックヒータの放熱特性を調整する方法 |
CN117198971B (zh) * | 2023-11-07 | 2024-01-30 | 沈阳和研科技股份有限公司 | 一种晶圆卡盘台 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5953137A (ja) * | 1982-09-13 | 1984-03-27 | Brother Ind Ltd | 精密機械における回転軸への通路接続装置 |
KR100375744B1 (ko) * | 2000-11-10 | 2003-03-10 | (주)케이.씨.텍 | 퍼지 기능을 가지는 기판 처리 장치의 기판 지지 기구 |
JP2005349540A (ja) * | 2004-06-11 | 2005-12-22 | Nsk Ltd | スピンドル装置 |
JP4574424B2 (ja) | 2005-04-21 | 2010-11-04 | 株式会社ディスコ | 吸着保持装置 |
JP4874602B2 (ja) | 2005-08-26 | 2012-02-15 | 株式会社ディスコ | ウエーハの加工方法およびウエーハの加工方法に用いる粘着テープ |
JP2007214459A (ja) | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | 基板の洗浄装置 |
JP2007229904A (ja) * | 2006-03-03 | 2007-09-13 | Disco Abrasive Syst Ltd | ターンテーブルを有する加工装置 |
JP4783404B2 (ja) * | 2008-07-02 | 2011-09-28 | 光洋機械工業株式会社 | ワーク装着装置 |
JP5318517B2 (ja) * | 2008-10-10 | 2013-10-16 | 株式会社ディスコ | チャックテーブル機構 |
TWM374384U (en) * | 2009-05-20 | 2010-02-21 | Wu mao xiang | Rotary head type for grinder |
JP2010278052A (ja) | 2009-05-26 | 2010-12-09 | Disco Abrasive Syst Ltd | 切削装置のチャックテーブル |
JP5953137B2 (ja) | 2012-06-15 | 2016-07-20 | 株式会社サムシング | 基礎構造体 |
JP2014042945A (ja) * | 2012-08-24 | 2014-03-13 | Toshiba Mach Co Ltd | ワーク保持装置および加工機械 |
JP2015036179A (ja) * | 2013-08-16 | 2015-02-23 | 株式会社ディスコ | チャックテーブル機構 |
JP6335672B2 (ja) * | 2014-06-17 | 2018-05-30 | 株式会社ディスコ | 搬送装置 |
CN104096980B (zh) * | 2014-06-26 | 2016-01-20 | 长春光华微电子设备工程中心有限公司 | 激光切割真空吸附平台 |
JP6394337B2 (ja) * | 2014-12-04 | 2018-09-26 | 株式会社Sumco | 吸着チャック、面取り研磨装置、及び、シリコンウェーハの面取り研磨方法 |
-
2016
- 2016-07-13 JP JP2016138339A patent/JP6696851B2/ja active Active
-
2017
- 2017-06-09 TW TW106119308A patent/TWI715779B/zh active
- 2017-07-11 KR KR1020170087746A patent/KR102231552B1/ko active IP Right Grant
- 2017-07-11 CN CN201710559661.1A patent/CN107622971B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201803693A (zh) | 2018-02-01 |
JP2018010953A (ja) | 2018-01-18 |
CN107622971B (zh) | 2023-03-28 |
KR102231552B1 (ko) | 2021-03-23 |
KR20180007685A (ko) | 2018-01-23 |
TWI715779B (zh) | 2021-01-11 |
CN107622971A (zh) | 2018-01-23 |
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