JP6692357B2 - 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 - Google Patents
半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 Download PDFInfo
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020072339A JP6977100B2 (ja) | 2014-12-19 | 2020-04-14 | 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462094466P | 2014-12-19 | 2014-12-19 | |
| US62/094,466 | 2014-12-19 | ||
| PCT/US2015/066617 WO2016100792A1 (en) | 2014-12-19 | 2015-12-18 | Systems and methods for performing epitaxial smoothing processes on semiconductor structures |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| JP2020072339A Division JP6977100B2 (ja) | 2014-12-19 | 2020-04-14 | 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018504777A JP2018504777A (ja) | 2018-02-15 |
| JP2018504777A5 JP2018504777A5 (enExample) | 2019-01-24 |
| JP6692357B2 true JP6692357B2 (ja) | 2020-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2017532623A Active JP6692357B2 (ja) | 2014-12-19 | 2015-12-18 | 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 |
| JP2020072339A Active JP6977100B2 (ja) | 2014-12-19 | 2020-04-14 | 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 |
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| JP2020072339A Active JP6977100B2 (ja) | 2014-12-19 | 2020-04-14 | 半導体構造上にエピタキシャルスムージング加工を実行するためのシステムおよび方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10332781B2 (enExample) |
| EP (1) | EP3234987B1 (enExample) |
| JP (2) | JP6692357B2 (enExample) |
| CN (2) | CN112420509B (enExample) |
| WO (1) | WO2016100792A1 (enExample) |
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| US10332781B2 (en) | 2019-06-25 |
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| US20180277423A1 (en) | 2018-09-27 |
| CN112420509A (zh) | 2021-02-26 |
| EP3234987B1 (en) | 2020-09-23 |
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