JP6623513B2 - 電子素子およびシート材 - Google Patents

電子素子およびシート材 Download PDF

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Publication number
JP6623513B2
JP6623513B2 JP2014226595A JP2014226595A JP6623513B2 JP 6623513 B2 JP6623513 B2 JP 6623513B2 JP 2014226595 A JP2014226595 A JP 2014226595A JP 2014226595 A JP2014226595 A JP 2014226595A JP 6623513 B2 JP6623513 B2 JP 6623513B2
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JP
Japan
Prior art keywords
sheet material
resin
conductive particles
electronic
insulating layer
Prior art date
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Active
Application number
JP2014226595A
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English (en)
Japanese (ja)
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JP2015130484A (ja
JP2015130484A5 (ko
Inventor
英宣 小林
英宣 小林
和規 松戸
和規 松戸
淳 御子柴
淳 御子柴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Priority to JP2014226595A priority Critical patent/JP6623513B2/ja
Publication of JP2015130484A publication Critical patent/JP2015130484A/ja
Publication of JP2015130484A5 publication Critical patent/JP2015130484A5/ja
Application granted granted Critical
Publication of JP6623513B2 publication Critical patent/JP6623513B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014226595A 2013-12-03 2014-11-07 電子素子およびシート材 Active JP6623513B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014226595A JP6623513B2 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013249809 2013-12-03
JP2013249809 2013-12-03
JP2014226595A JP6623513B2 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Publications (3)

Publication Number Publication Date
JP2015130484A JP2015130484A (ja) 2015-07-16
JP2015130484A5 JP2015130484A5 (ko) 2017-12-07
JP6623513B2 true JP6623513B2 (ja) 2019-12-25

Family

ID=53273262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014226595A Active JP6623513B2 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Country Status (5)

Country Link
JP (1) JP6623513B2 (ko)
KR (2) KR102150258B1 (ko)
CN (1) CN105794331A (ko)
TW (1) TW201524284A (ko)
WO (1) WO2015083491A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018060990A (ja) * 2016-07-08 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP6747129B2 (ja) * 2016-07-20 2020-08-26 東洋インキＳｃホールディングス株式会社 電子素子
KR101915947B1 (ko) * 2016-07-20 2019-01-30 스템코 주식회사 연성 회로 기판 및 그 제조 방법
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
FR3062982B1 (fr) * 2017-02-13 2019-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de blindage electromagnetique pour cartes electroniques
FR3062981A1 (fr) * 2017-02-13 2018-08-17 Commissariat Energie Atomique Structure de blindage electromagnetique pour cartes electroniques
US10403582B2 (en) * 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material
JP2019021757A (ja) * 2017-07-14 2019-02-07 住友ベークライト株式会社 封止用フィルムおよび電子部品搭載基板の封止方法
KR102071110B1 (ko) 2017-09-19 2020-01-29 학교법인혜화학원 독활 복합오일을 포함하는 항아토피성 약학 조성물
KR102031418B1 (ko) 2017-09-19 2019-10-11 학교법인혜화학원 산조인 복합오일을 포함하는 항아토피성 피부염 약학 조성물
JP6992083B2 (ja) * 2017-10-13 2022-01-13 タツタ電線株式会社 シールドパッケージ
JP2019091866A (ja) * 2017-11-17 2019-06-13 東洋インキＳｃホールディングス株式会社 電子素子の製造方法
US10541065B2 (en) 2017-12-21 2020-01-21 The Boeing Company Multilayer stack with enhanced conductivity and stability
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
JP7290083B2 (ja) * 2019-07-31 2023-06-13 株式会社オートネットワーク技術研究所 配線部材
JP7010323B2 (ja) * 2020-04-02 2022-01-26 東洋インキＳｃホールディングス株式会社 電子素子
CN118266274A (zh) * 2021-11-29 2024-06-28 爱天思株式会社 保护片、电子器件封装及电子器件封装的制造方法

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CA1255203A (en) * 1984-11-15 1989-06-06 Paul A. Krieger Transfer adhesive sandwich and method of applying adhesive to substrates
JPH01164099A (ja) * 1987-12-21 1989-06-28 Shin Etsu Chem Co Ltd 放熱シールドシート
JPH09116289A (ja) * 1995-10-24 1997-05-02 Tokin Corp ノイズ抑制型電子装置およびその製造方法
JPH10173392A (ja) * 1996-12-09 1998-06-26 Daido Steel Co Ltd 電磁波遮蔽用シート
JPH1187984A (ja) * 1997-09-05 1999-03-30 Yamaichi Electron Co Ltd 実装回路装置
JP2000276053A (ja) * 1999-03-29 2000-10-06 Sato Corp 多層ラベル
JP4406484B2 (ja) * 1999-12-03 2010-01-27 ポリマテック株式会社 熱伝導性電磁波シールドシート
JP2003273562A (ja) * 2002-03-13 2003-09-26 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
AU2003265440A1 (en) * 2002-08-14 2004-03-03 Honeywell International, Inc. Method and apparatus for reducing electromagnetic emissions from electronic circuits
JP2005064266A (ja) * 2003-08-13 2005-03-10 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
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KR20080039507A (ko) * 2005-08-30 2008-05-07 마쯔시다덴기산교 가부시키가이샤 기판 구조
US8058951B2 (en) * 2005-09-30 2011-11-15 Panasonic Corporation Sheet-like composite electronic component and method for manufacturing same
JP4857927B2 (ja) 2006-06-13 2012-01-18 日産自動車株式会社 サスペンション構造
JPWO2008026247A1 (ja) * 2006-08-29 2010-01-14 日本包材株式会社 電磁波シールド構造とその形成方法
JP2009021578A (ja) * 2007-06-15 2009-01-29 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2009081400A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP4911321B2 (ja) * 2008-02-05 2012-04-04 株式会社村田製作所 電磁遮蔽シート及び電磁遮蔽方法
KR100874689B1 (ko) * 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
JP2011124413A (ja) * 2009-12-11 2011-06-23 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール
JP5528259B2 (ja) * 2010-05-17 2014-06-25 日東電工株式会社 配線回路基板の製造方法
JP2012124413A (ja) * 2010-12-10 2012-06-28 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法
JP5587804B2 (ja) * 2011-01-21 2014-09-10 日本特殊陶業株式会社 電子部品実装用配線基板の製造方法、電子部品実装用配線基板、及び電子部品付き配線基板の製造方法
KR101250677B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그의 제조 방법

Also Published As

Publication number Publication date
TW201524284A (zh) 2015-06-16
JP2015130484A (ja) 2015-07-16
KR102150258B1 (ko) 2020-09-01
CN105794331A (zh) 2016-07-20
KR20180059952A (ko) 2018-06-05
WO2015083491A1 (ja) 2015-06-11
KR20160074559A (ko) 2016-06-28

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