JP6587651B2 - シリアルナンバーを有するセキュアチップ - Google Patents
シリアルナンバーを有するセキュアチップ Download PDFInfo
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- JP6587651B2 JP6587651B2 JP2017092422A JP2017092422A JP6587651B2 JP 6587651 B2 JP6587651 B2 JP 6587651B2 JP 2017092422 A JP2017092422 A JP 2017092422A JP 2017092422 A JP2017092422 A JP 2017092422A JP 6587651 B2 JP6587651 B2 JP 6587651B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/44—Program or device authentication
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/71—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information
- G06F21/73—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure computing or processing of information by creating or determining hardware identification, e.g. serial numbers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06037—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking multi-dimensional coding
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06046—Constructional details
- G06K19/06178—Constructional details the marking having a feature size being smaller than can be seen by the unaided human eye
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
- G06K7/1404—Methods for optical code recognition
- G06K7/1408—Methods for optical code recognition the method being specifically adapted for the type of code
- G06K7/1417—2D bar codes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09C—CIPHERING OR DECIPHERING APPARATUS FOR CRYPTOGRAPHIC OR OTHER PURPOSES INVOLVING THE NEED FOR SECRECY
- G09C5/00—Ciphering apparatus or methods not provided for in the preceding groups, e.g. involving the concealment or deformation of graphic data such as designs, written or printed messages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L63/00—Network architectures or network communication protocols for network security
- H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/14—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols using a plurality of keys or algorithms
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
- H04L9/3271—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using challenge-response
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2103—Challenge-response
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
- H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Software Systems (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Computing Systems (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electron Beam Exposure (AREA)
- Semiconductor Integrated Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Description
本願は、2016年9月08日に出願された米国出願番号第62/385,049号、2016年10月27日に出願された米国出願番号第62/413,470号、2016年12月23日に出願された米国出願番号第62/438,548号、2017年2月08日に出願された米国出願番号第62/456,144号、2017年2月13日に出願された米国出願番号第62/458,040号、2017年2月13日に出願された米国出願番号第62/458,071号、2017年2月13日に出願された米国出願番号第62/458,082号、及び2017年2月13日に出願された米国出願番号第62/458,062号からの優先権を主張する。すべての優先出願は参照によりその全体として本明細書に援用される。
本発明は、半導体チップを含む電子デバイスに関する。より詳細には、本発明は共通部分及び一意的回路を形成する一意的部分を有する半導体チップを含む電子デバイスに関する。本発明はさらに、係る電子デバイスを含む複数の遠隔端末と、チャレンジ−レスポンス手順に基づいたホストシステムとの間の認証のためのシステム、係るシステムで使用するための遠隔端末、及び係るシステムでの認証のための方法に関する。
Claims (5)
- 半導体チップに形成される複数の構造を備える前記半導体チップを備える電子デバイスを製造する方法であって、
前記半導体チップが半導体チップの集合の要素であり、半導体チップの前記集合が半導体チップの複数の部分集合を備え、前記半導体チップが前記部分集合の1つだけの要素であり、
前記半導体チップの前記複数の構造が、前記集合の前記半導体チップの全てに同じである共通構造の集合及び非共通構造の集合を含み、前記部分集合の前記半導体チップの前記非共通構造があらゆる他の部分集合の前記半導体チップの前記非共通構造とは異なり、
前記非共通構造の少なくとも第1の部分が第1の所定値を記憶する又は生成するように適応され、
前記第1の所定値が自動化された読取り手段によって前記半導体チップの外部から読み取り可能であり、
前記方法は、マスクレスリソグラフィー露光システムを使用して2つのビアを互いに近くに露光してマージすることにより、より大きい単一のビアを形成するステップを含み、
前記単一のビアは、前記非共通構造の少なくとも一部分を形成する、電子デバイスの製造方法。 - 前記共通構造の少なくとも前記第1の部分が、マスクベースフォトリソグラフィーシステムを使用し、形成され、
前記非共通構造の前記第1の部分が、マスクレスリソグラフィー露光システムを使用し、形成される、請求項1に記載の電子デバイスの製造方法。 - 前記半導体チップを形成するための前記マスクレスリソグラフィー露光システムを制御するために使用されるパターンデータが、前記共通構造を表す共通チップ設計部分、及び前記非共通構造を表す非共通チップ設計部分を含む、請求項1に記載の電子デバイスの製造方法。
- 前記パターンデータが、非共通設計レイアウト部分の作成中に前記マスクレスリソグラフィー露光システムに提供される秘密データに部分的に基づく、請求項3に記載の電子デバイスの製造方法。
- 前記秘密データが、ブラックボックスデバイス等の一意的データジェネレータから生じる、請求項4に記載の電子デバイスの製造方法。
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662385049P | 2016-09-08 | 2016-09-08 | |
US62/385,049 | 2016-09-08 | ||
US201662413470P | 2016-10-27 | 2016-10-27 | |
US62/413,470 | 2016-10-27 | ||
US201662438548P | 2016-12-23 | 2016-12-23 | |
US62/438,548 | 2016-12-23 | ||
US201762456144P | 2017-02-08 | 2017-02-08 | |
US62/456,144 | 2017-02-08 | ||
US201762458071P | 2017-02-13 | 2017-02-13 | |
US201762458082P | 2017-02-13 | 2017-02-13 | |
US201762458062P | 2017-02-13 | 2017-02-13 | |
US201762458040P | 2017-02-13 | 2017-02-13 | |
US62/458,082 | 2017-02-13 | ||
US62/458,071 | 2017-02-13 | ||
US62/458,062 | 2017-02-13 | ||
US62/458,040 | 2017-02-13 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019126024A Division JP2019169990A (ja) | 2016-09-08 | 2019-07-05 | シリアルナンバーを有するセキュアチップ |
Publications (2)
Publication Number | Publication Date |
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JP2018041951A JP2018041951A (ja) | 2018-03-15 |
JP6587651B2 true JP6587651B2 (ja) | 2019-10-09 |
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JP2017092422A Active JP6587651B2 (ja) | 2016-09-08 | 2017-05-08 | シリアルナンバーを有するセキュアチップ |
JP2019126024A Pending JP2019169990A (ja) | 2016-09-08 | 2019-07-05 | シリアルナンバーを有するセキュアチップ |
Family Applications After (1)
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JP2019126024A Pending JP2019169990A (ja) | 2016-09-08 | 2019-07-05 | シリアルナンバーを有するセキュアチップ |
Country Status (2)
Country | Link |
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US (5) | US10714427B2 (ja) |
JP (2) | JP6587651B2 (ja) |
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