JP6476132B2 - 基板内結合インダクタ構造 - Google Patents

基板内結合インダクタ構造 Download PDF

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Publication number
JP6476132B2
JP6476132B2 JP2015557138A JP2015557138A JP6476132B2 JP 6476132 B2 JP6476132 B2 JP 6476132B2 JP 2015557138 A JP2015557138 A JP 2015557138A JP 2015557138 A JP2015557138 A JP 2015557138A JP 6476132 B2 JP6476132 B2 JP 6476132B2
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Prior art keywords
substrate
inductor
implementations
package
guiding means
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Expired - Fee Related
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JP2015557138A
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Japanese (ja)
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JP2016509373A5 (https=
JP2016509373A (ja
Inventor
ジェームズ・トーマス・ドイル
ファルシード・マハムディ
アミラリ・シャヤン・アラニ
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2871—Pancake coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2015557138A 2013-02-13 2014-02-07 基板内結合インダクタ構造 Expired - Fee Related JP6476132B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361764310P 2013-02-13 2013-02-13
US61/764,310 2013-02-13
US13/794,558 US20140225706A1 (en) 2013-02-13 2013-03-11 In substrate coupled inductor structure
US13/794,558 2013-03-11
PCT/US2014/015380 WO2014126812A1 (en) 2013-02-13 2014-02-07 In substrate coupled inductor structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018228062A Division JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Publications (3)

Publication Number Publication Date
JP2016509373A JP2016509373A (ja) 2016-03-24
JP2016509373A5 JP2016509373A5 (https=) 2017-03-02
JP6476132B2 true JP6476132B2 (ja) 2019-02-27

Family

ID=51297099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015557138A Expired - Fee Related JP6476132B2 (ja) 2013-02-13 2014-02-07 基板内結合インダクタ構造
JP2018228062A Pending JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018228062A Pending JP2019062217A (ja) 2013-02-13 2018-12-05 基板内結合インダクタ構造

Country Status (8)

Country Link
US (1) US20140225706A1 (https=)
EP (1) EP2956948B1 (https=)
JP (2) JP6476132B2 (https=)
KR (1) KR102108707B1 (https=)
CN (1) CN105009236A (https=)
ES (1) ES2778872T3 (https=)
HU (1) HUE049424T2 (https=)
WO (1) WO2014126812A1 (https=)

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US9129843B1 (en) * 2014-06-12 2015-09-08 Globalfoundries Inc. Integrated inductor
WO2016089917A2 (en) * 2014-12-01 2016-06-09 Endura Technologies LLC Switched power stage with integrated passive components
US10236209B2 (en) * 2014-12-24 2019-03-19 Intel Corporation Passive components in vias in a stacked integrated circuit package
US9959964B2 (en) 2015-11-13 2018-05-01 Qualcomm Incorporated Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
US20170169934A1 (en) * 2015-12-15 2017-06-15 Globalfoundries Inc. Patterned magnetic shields for inductors and transformers
US10026546B2 (en) 2016-05-20 2018-07-17 Qualcomm Incorported Apparatus with 3D wirewound inductor integrated within a substrate
CN108701525B (zh) 2016-07-27 2020-07-31 默升科技集团有限公司 适用于集成多信道接收器的增强型电感器
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
US10483910B2 (en) 2017-02-02 2019-11-19 Credo Technology Group Limited Multiport inductors for enhanced signal distribution
CN109314095B (zh) * 2017-04-10 2023-07-21 默升科技集团有限公司 笼式屏蔽中介层电感
US10784243B2 (en) 2018-06-04 2020-09-22 Globalfoundries Inc. Uniplanar (single layer) passive circuitry
KR102342732B1 (ko) 2021-03-15 2021-12-23 서울대학교산학협력단 주기적인 금속 패턴 구조를 이용하여 q 인자가 향상된 인덕터 소자

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Publication number Priority date Publication date Assignee Title
JP2019062217A (ja) * 2013-02-13 2019-04-18 クアルコム，インコーポレイテッド 基板内結合インダクタ構造

Also Published As

Publication number Publication date
EP2956948A1 (en) 2015-12-23
WO2014126812A1 (en) 2014-08-21
JP2019062217A (ja) 2019-04-18
HUE049424T2 (hu) 2020-09-28
JP2016509373A (ja) 2016-03-24
CN105009236A (zh) 2015-10-28
EP2956948B1 (en) 2019-12-18
KR102108707B1 (ko) 2020-05-28
ES2778872T3 (es) 2020-08-12
US20140225706A1 (en) 2014-08-14
KR20150119039A (ko) 2015-10-23

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