HUE049424T2 - Hordozóbeli csatolt induktorszerkezet - Google Patents
Hordozóbeli csatolt induktorszerkezetInfo
- Publication number
- HUE049424T2 HUE049424T2 HUE14706428A HUE14706428A HUE049424T2 HU E049424 T2 HUE049424 T2 HU E049424T2 HU E14706428 A HUE14706428 A HU E14706428A HU E14706428 A HUE14706428 A HU E14706428A HU E049424 T2 HUE049424 T2 HU E049424T2
- Authority
- HU
- Hungary
- Prior art keywords
- coupled inductor
- inductor structure
- substrate coupled
- substrate
- inductor
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2871—Pancake coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/004—Printed inductances with the coil helically wound around an axis without a core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361764310P | 2013-02-13 | 2013-02-13 | |
US13/794,558 US20140225706A1 (en) | 2013-02-13 | 2013-03-11 | In substrate coupled inductor structure |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE049424T2 true HUE049424T2 (hu) | 2020-09-28 |
Family
ID=51297099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE14706428A HUE049424T2 (hu) | 2013-02-13 | 2014-02-07 | Hordozóbeli csatolt induktorszerkezet |
Country Status (8)
Country | Link |
---|---|
US (1) | US20140225706A1 (hu) |
EP (1) | EP2956948B1 (hu) |
JP (2) | JP6476132B2 (hu) |
KR (1) | KR102108707B1 (hu) |
CN (1) | CN105009236A (hu) |
ES (1) | ES2778872T3 (hu) |
HU (1) | HUE049424T2 (hu) |
WO (1) | WO2014126812A1 (hu) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140225706A1 (en) * | 2013-02-13 | 2014-08-14 | Qualcomm Incorporated | In substrate coupled inductor structure |
US9129843B1 (en) * | 2014-06-12 | 2015-09-08 | Globalfoundries Inc. | Integrated inductor |
CN107210231B (zh) * | 2014-12-01 | 2019-12-27 | 朝阳半导体技术江阴有限公司 | 具有集成无源组件的开关式功率级 |
US10236209B2 (en) * | 2014-12-24 | 2019-03-19 | Intel Corporation | Passive components in vias in a stacked integrated circuit package |
US9959964B2 (en) | 2015-11-13 | 2018-05-01 | Qualcomm Incorporated | Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications |
US20170169934A1 (en) * | 2015-12-15 | 2017-06-15 | Globalfoundries Inc. | Patterned magnetic shields for inductors and transformers |
US10026546B2 (en) | 2016-05-20 | 2018-07-17 | Qualcomm Incorported | Apparatus with 3D wirewound inductor integrated within a substrate |
WO2018018441A1 (en) | 2016-07-27 | 2018-02-01 | Credo Technology Group Ltd. | Enhanced inductors suitable for integrated multi-channel receivers |
JP6838328B2 (ja) * | 2016-09-15 | 2021-03-03 | 大日本印刷株式会社 | インダクタおよびインダクタの製造方法 |
US10483910B2 (en) | 2017-02-02 | 2019-11-19 | Credo Technology Group Limited | Multiport inductors for enhanced signal distribution |
US10818608B2 (en) * | 2017-04-10 | 2020-10-27 | Credo Technology Group Limited | Cage-shielded interposer inductances |
KR102342732B1 (ko) | 2021-03-15 | 2021-12-23 | 서울대학교산학협력단 | 주기적인 금속 패턴 구조를 이용하여 q 인자가 향상된 인덕터 소자 |
Family Cites Families (33)
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US5206621A (en) * | 1990-07-02 | 1993-04-27 | General Electric Company | Barrel-wound conductive film transformer |
JP3102125B2 (ja) * | 1992-02-28 | 2000-10-23 | 富士電機株式会社 | 薄膜磁気素子 |
JPH06267746A (ja) * | 1993-03-09 | 1994-09-22 | Murata Mfg Co Ltd | ノイズ除去部品 |
US6252487B1 (en) * | 1997-11-04 | 2001-06-26 | Philips Electronics North America Corporation | Planar magnetic component with transverse winding pattern |
US6417753B1 (en) * | 2000-02-17 | 2002-07-09 | Koninklijke Philips Electronics N.V. | Planar magnetic device without center core leg |
US6512285B1 (en) * | 2001-10-05 | 2003-01-28 | Skyworks Solutions, Inc. | High inductance inductor in a semiconductor package |
US6794978B2 (en) * | 2002-05-15 | 2004-09-21 | John C. Tung | Accurate multi-ground inductors for high-speed integrated circuits |
JP2004319675A (ja) * | 2003-04-15 | 2004-11-11 | Matsushita Electric Ind Co Ltd | カーボンナノチューブインダクタおよびその製造方法 |
GB0321658D0 (en) * | 2003-09-16 | 2003-10-15 | South Bank Univ Entpr Ltd | Bifilar transformer |
US7791440B2 (en) * | 2004-06-09 | 2010-09-07 | Agency For Science, Technology And Research | Microfabricated system for magnetic field generation and focusing |
US7569918B2 (en) * | 2006-05-01 | 2009-08-04 | Texas Instruments Incorporated | Semiconductor package-on-package system including integrated passive components |
JP2008103603A (ja) * | 2006-10-20 | 2008-05-01 | Seiko Epson Corp | 電子基板および電子機器 |
US20080186123A1 (en) * | 2007-02-07 | 2008-08-07 | Industrial Technology Research Institute | Inductor devices |
US7841070B2 (en) * | 2007-08-21 | 2010-11-30 | Intel Corporation | Method of fabricating a transformer device |
US8149080B2 (en) * | 2007-09-25 | 2012-04-03 | Infineon Technologies Ag | Integrated circuit including inductive device and ferromagnetic material |
JP2009111036A (ja) * | 2007-10-29 | 2009-05-21 | Fuji Electric Device Technology Co Ltd | 薄膜トランスおよびその製造方法 |
US7986209B2 (en) * | 2007-11-20 | 2011-07-26 | Intel Corporation | Inductor using bulk metallic glass material |
US8217748B2 (en) * | 2007-11-23 | 2012-07-10 | Alpha & Omega Semiconductor Inc. | Compact inductive power electronics package |
US7911313B2 (en) * | 2008-07-02 | 2011-03-22 | Intel Corporation | Inductors for integrated circuit packages |
US9190201B2 (en) * | 2009-03-04 | 2015-11-17 | Qualcomm Incorporated | Magnetic film enhanced inductor |
JP4654317B1 (ja) * | 2009-07-16 | 2011-03-16 | 株式会社神戸製鋼所 | リアクトル |
US20110050334A1 (en) * | 2009-09-02 | 2011-03-03 | Qualcomm Incorporated | Integrated Voltage Regulator with Embedded Passive Device(s) |
WO2011033496A1 (en) * | 2009-09-16 | 2011-03-24 | Maradin Technologies Ltd. | Micro coil apparatus and manufacturing methods therefor |
CN101764128A (zh) * | 2009-12-31 | 2010-06-30 | 锐迪科科技有限公司 | 半导体器件封装结构中的电感 |
JP5307105B2 (ja) * | 2010-01-06 | 2013-10-02 | 株式会社神戸製鋼所 | 複合型巻線素子ならびにこれを用いた変圧器、変圧システムおよびノイズカットフィルタ用複合型巻線素子 |
CN102870175B (zh) * | 2010-02-19 | 2014-06-04 | 王明亮 | 硅基功率电感 |
JP2012033764A (ja) * | 2010-07-30 | 2012-02-16 | Toshiba Corp | 電磁シールドシートとその製造方法 |
US9287344B2 (en) * | 2010-08-23 | 2016-03-15 | The Hong Kong University Of Science And Technology | Monolithic magnetic induction device |
WO2012093133A1 (en) * | 2011-01-04 | 2012-07-12 | ÅAC Microtec AB | Coil assembly comprising planar coil |
KR101817159B1 (ko) * | 2011-02-17 | 2018-02-22 | 삼성전자 주식회사 | Tsv를 가지는 인터포저를 포함하는 반도체 패키지 및 그 제조 방법 |
US9679863B2 (en) * | 2011-09-23 | 2017-06-13 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming interconnect substrate for FO-WLCSP |
US8963671B2 (en) * | 2012-08-31 | 2015-02-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor transformer device and method for manufacturing the same |
US20140225706A1 (en) * | 2013-02-13 | 2014-08-14 | Qualcomm Incorporated | In substrate coupled inductor structure |
-
2013
- 2013-03-11 US US13/794,558 patent/US20140225706A1/en not_active Abandoned
-
2014
- 2014-02-07 KR KR1020157024507A patent/KR102108707B1/ko active IP Right Grant
- 2014-02-07 HU HUE14706428A patent/HUE049424T2/hu unknown
- 2014-02-07 ES ES14706428T patent/ES2778872T3/es active Active
- 2014-02-07 CN CN201480008407.7A patent/CN105009236A/zh active Pending
- 2014-02-07 JP JP2015557138A patent/JP6476132B2/ja active Active
- 2014-02-07 EP EP14706428.1A patent/EP2956948B1/en active Active
- 2014-02-07 WO PCT/US2014/015380 patent/WO2014126812A1/en active Application Filing
-
2018
- 2018-12-05 JP JP2018228062A patent/JP2019062217A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2016509373A (ja) | 2016-03-24 |
JP6476132B2 (ja) | 2019-02-27 |
US20140225706A1 (en) | 2014-08-14 |
ES2778872T3 (es) | 2020-08-12 |
EP2956948A1 (en) | 2015-12-23 |
JP2019062217A (ja) | 2019-04-18 |
EP2956948B1 (en) | 2019-12-18 |
CN105009236A (zh) | 2015-10-28 |
KR102108707B1 (ko) | 2020-05-28 |
KR20150119039A (ko) | 2015-10-23 |
WO2014126812A1 (en) | 2014-08-21 |
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