JP6332680B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP6332680B2
JP6332680B2 JP2014122705A JP2014122705A JP6332680B2 JP 6332680 B2 JP6332680 B2 JP 6332680B2 JP 2014122705 A JP2014122705 A JP 2014122705A JP 2014122705 A JP2014122705 A JP 2014122705A JP 6332680 B2 JP6332680 B2 JP 6332680B2
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JP
Japan
Prior art keywords
layer
wiring
insulating layer
wiring layer
metal plane
Prior art date
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Active
Application number
JP2014122705A
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English (en)
Japanese (ja)
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JP2016004833A5 (enExample
JP2016004833A (ja
Inventor
国本　裕治
裕治 国本
潤 古市
古市　　潤
清水　規良
規良 清水
小泉　直幸
直幸 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014122705A priority Critical patent/JP6332680B2/ja
Priority to US14/734,395 priority patent/US9412687B2/en
Publication of JP2016004833A publication Critical patent/JP2016004833A/ja
Priority to US15/170,313 priority patent/US9646926B2/en
Publication of JP2016004833A5 publication Critical patent/JP2016004833A5/ja
Application granted granted Critical
Publication of JP6332680B2 publication Critical patent/JP6332680B2/ja
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W42/20—
    • H10W42/267—
    • H10W70/05—
    • H10W70/093—
    • H10W70/611—
    • H10W70/65—
    • H10W70/685—
    • H10W74/012—
    • H10W74/141—
    • H10W74/15—
    • H10W90/00—
    • H10W90/401—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H10W70/63—
    • H10W70/635—
    • H10W72/072—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
JP2014122705A 2014-06-13 2014-06-13 配線基板及びその製造方法 Active JP6332680B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014122705A JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法
US14/734,395 US9412687B2 (en) 2014-06-13 2015-06-09 Wiring substrate and method of manufacturing the same
US15/170,313 US9646926B2 (en) 2014-06-13 2016-06-01 Wiring substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014122705A JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2016004833A JP2016004833A (ja) 2016-01-12
JP2016004833A5 JP2016004833A5 (enExample) 2017-02-09
JP6332680B2 true JP6332680B2 (ja) 2018-05-30

Family

ID=54836784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014122705A Active JP6332680B2 (ja) 2014-06-13 2014-06-13 配線基板及びその製造方法

Country Status (2)

Country Link
US (2) US9412687B2 (enExample)
JP (1) JP6332680B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6341714B2 (ja) 2014-03-25 2018-06-13 新光電気工業株式会社 配線基板及びその製造方法
JP6527420B2 (ja) * 2015-07-31 2019-06-05 ルネサスエレクトロニクス株式会社 半導体装置
EP3430646B1 (en) * 2016-03-16 2021-11-10 INTEL Corporation Stairstep interposers with integrated shielding for electronics packages
US20180096938A1 (en) * 2016-09-30 2018-04-05 Advanced Micro Devices, Inc. Circuit board with multiple density regions
JP2019062092A (ja) * 2017-09-27 2019-04-18 イビデン株式会社 プリント配線板
CN110504275B (zh) * 2018-05-17 2021-11-12 京东方科技集团股份有限公司 阵列基板及其制作方法、显示面板和显示装置
US11032917B2 (en) 2018-06-08 2021-06-08 Unimicron Technology Corp. Circuit carrier board and manufacturing method thereof
US10888001B2 (en) 2018-06-08 2021-01-05 Unimicron Technology Corp. Circuit carrier board structure and manufacturing method thereof
TWI734945B (zh) * 2018-12-12 2021-08-01 欣興電子股份有限公司 複合基板結構及其製作方法
US10825782B2 (en) * 2018-12-27 2020-11-03 Micron Technology, Inc. Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact
CN113826194B (zh) * 2019-05-20 2024-09-27 三井金属矿业株式会社 带载体的金属箔以及其使用方法和制造方法
US11113443B1 (en) * 2020-06-12 2021-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit with thicker metal lines on lower metallization layer
KR102908327B1 (ko) * 2020-06-30 2026-01-05 삼성전기주식회사 인쇄회로기판
US12266611B2 (en) * 2020-08-12 2025-04-01 Advanced Micro Devices, Inc. Mixed density interconnect architectures using hybrid fan-out
WO2022264378A1 (ja) * 2021-06-17 2022-12-22 昭和電工マテリアルズ株式会社 配線基板の製造方法及び積層板
US20230073823A1 (en) * 2021-09-09 2023-03-09 Qualcomm Incorporated Package comprising a substrate with high-density interconnects
US20230420366A1 (en) * 2022-06-22 2023-12-28 International Business Machines Corporation Power planes and pass-through vias
JP2025173999A (ja) * 2024-05-16 2025-11-28 Ｆｉｃｔ株式会社 回路基板及び回路基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2998237B2 (ja) * 1991-03-07 2000-01-11 ソニー株式会社 ブラインド孔の加工方法
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
US5635761A (en) * 1994-12-14 1997-06-03 International Business Machines, Inc. Internal resistor termination in multi-chip module environments
JP3199592B2 (ja) * 1995-01-27 2001-08-20 株式会社日立製作所 多層印刷回路基板
JP2001203470A (ja) * 2000-01-21 2001-07-27 Toshiba Corp 配線基板、半導体パッケージ、および半導体装置
JP3582460B2 (ja) * 2000-06-20 2004-10-27 株式会社村田製作所 高周波モジュール
JP2003023252A (ja) 2001-07-10 2003-01-24 Ibiden Co Ltd 多層プリント配線板
JP5191074B2 (ja) 2001-07-10 2013-04-24 イビデン株式会社 多層プリント配線板
JP2002329976A (ja) * 2001-04-26 2002-11-15 Kyocera Corp 多層配線基板
JP4195883B2 (ja) * 2004-02-04 2008-12-17 インターナショナル・ビジネス・マシーンズ・コーポレーション 多層モジュール
JP2007165642A (ja) * 2005-12-14 2007-06-28 Mitsubishi Electric Corp 部品実装用基板
US7820233B2 (en) * 2006-09-27 2010-10-26 Unimicron Technology Corp. Method for fabricating a flip chip substrate structure
JP4978269B2 (ja) * 2007-03-27 2012-07-18 日本電気株式会社 多層配線基板
JP5649490B2 (ja) * 2011-03-16 2015-01-07 新光電気工業株式会社 配線基板及びその製造方法
JP6337775B2 (ja) * 2012-08-31 2018-06-06 ソニー株式会社 配線基板及び配線基板の製造方法
JP6013960B2 (ja) * 2013-03-28 2016-10-25 京セラ株式会社 配線基板
JP2014229698A (ja) * 2013-05-21 2014-12-08 イビデン株式会社 配線板及び配線板の製造方法

Also Published As

Publication number Publication date
US20150364405A1 (en) 2015-12-17
JP2016004833A (ja) 2016-01-12
US9412687B2 (en) 2016-08-09
US9646926B2 (en) 2017-05-09
US20160276259A1 (en) 2016-09-22

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