JP6256145B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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JP6256145B2
JP6256145B2 JP2014064193A JP2014064193A JP6256145B2 JP 6256145 B2 JP6256145 B2 JP 6256145B2 JP 2014064193 A JP2014064193 A JP 2014064193A JP 2014064193 A JP2014064193 A JP 2014064193A JP 6256145 B2 JP6256145 B2 JP 6256145B2
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Prior art keywords
heat sink
semiconductor chip
passive component
island
electrode
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JP2015185832A (ja
JP2015185832A5 (enExample
Inventor
翔一朗 大前
翔一朗 大前
岩渕　明
明 岩渕
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Denso Corp
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Denso Corp
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Priority to JP2014064193A priority Critical patent/JP6256145B2/ja
Priority to DE112015001398.9T priority patent/DE112015001398B4/de
Priority to PCT/JP2015/001622 priority patent/WO2015146130A1/ja
Priority to CN201580015859.2A priority patent/CN106133906B/zh
Priority to US15/128,126 priority patent/US9935074B2/en
Publication of JP2015185832A publication Critical patent/JP2015185832A/ja
Publication of JP2015185832A5 publication Critical patent/JP2015185832A5/ja
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