DE112015001398B4 - Halbleitervorrichtung und Verfahren zum Herstellen derselben - Google Patents

Halbleitervorrichtung und Verfahren zum Herstellen derselben Download PDF

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Publication number
DE112015001398B4
DE112015001398B4 DE112015001398.9T DE112015001398T DE112015001398B4 DE 112015001398 B4 DE112015001398 B4 DE 112015001398B4 DE 112015001398 T DE112015001398 T DE 112015001398T DE 112015001398 B4 DE112015001398 B4 DE 112015001398B4
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heat sink
semiconductor chip
passive component
electrode
island
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English (en)
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DE112015001398T5 (de
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Syoichirou Oomae
Akira Iwabuchi
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Denso Corp
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Denso Corp
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JP6595325B2 (ja) * 2015-12-04 2019-10-23 トヨタ自動車株式会社 半導体装置
JP6358296B2 (ja) * 2016-08-05 2018-07-18 トヨタ自動車株式会社 半導体モジュールの製造方法
JP6610568B2 (ja) * 2017-01-16 2019-11-27 株式会社デンソー 半導体装置
JP6512231B2 (ja) * 2017-01-27 2019-05-15 トヨタ自動車株式会社 半導体装置
JP6874467B2 (ja) * 2017-03-29 2021-05-19 株式会社デンソー 半導体装置とその製造方法
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
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