JP5976588B2 - フレキシブル銅張積層板の製造方法 - Google Patents

フレキシブル銅張積層板の製造方法 Download PDF

Info

Publication number
JP5976588B2
JP5976588B2 JP2013074202A JP2013074202A JP5976588B2 JP 5976588 B2 JP5976588 B2 JP 5976588B2 JP 2013074202 A JP2013074202 A JP 2013074202A JP 2013074202 A JP2013074202 A JP 2013074202A JP 5976588 B2 JP5976588 B2 JP 5976588B2
Authority
JP
Japan
Prior art keywords
copper foil
polyimide
copper
layer
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013074202A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014198385A (ja
Inventor
祐之 松下
祐之 松下
正一 井伊
正一 井伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013074202A priority Critical patent/JP5976588B2/ja
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to CN201711033823.4A priority patent/CN107839313B/zh
Priority to CN201410119210.2A priority patent/CN104070763B/zh
Priority to TW103111412A priority patent/TWI635951B/zh
Priority to KR1020140035897A priority patent/KR102329908B1/ko
Priority to TW107121717A priority patent/TWI665084B/zh
Publication of JP2014198385A publication Critical patent/JP2014198385A/ja
Application granted granted Critical
Publication of JP5976588B2 publication Critical patent/JP5976588B2/ja
Priority to KR1020200168073A priority patent/KR102319574B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
JP2013074202A 2013-03-29 2013-03-29 フレキシブル銅張積層板の製造方法 Active JP5976588B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013074202A JP5976588B2 (ja) 2013-03-29 2013-03-29 フレキシブル銅張積層板の製造方法
CN201410119210.2A CN104070763B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板的制造方法
TW103111412A TWI635951B (zh) 2013-03-29 2014-03-27 可撓性覆銅積層板的製造方法
KR1020140035897A KR102329908B1 (ko) 2013-03-29 2014-03-27 플렉시블 구리 피복 적층판의 제조 방법
CN201711033823.4A CN107839313B (zh) 2013-03-29 2014-03-27 柔性覆铜层叠板
TW107121717A TWI665084B (zh) 2013-03-29 2014-03-27 可撓性覆銅積層板及可撓性線路基板
KR1020200168073A KR102319574B1 (ko) 2013-03-29 2020-12-04 플렉시블 구리 피복 적층판의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013074202A JP5976588B2 (ja) 2013-03-29 2013-03-29 フレキシブル銅張積層板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016141656A Division JP2016215651A (ja) 2016-07-19 2016-07-19 フレキシブル銅張積層板及びフレキシブル回路基板

Publications (2)

Publication Number Publication Date
JP2014198385A JP2014198385A (ja) 2014-10-23
JP5976588B2 true JP5976588B2 (ja) 2016-08-23

Family

ID=51592560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013074202A Active JP5976588B2 (ja) 2013-03-29 2013-03-29 フレキシブル銅張積層板の製造方法

Country Status (4)

Country Link
JP (1) JP5976588B2 (zh)
KR (2) KR102329908B1 (zh)
CN (2) CN104070763B (zh)
TW (2) TWI635951B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11382210B1 (en) 2020-12-17 2022-07-05 International Business Machines Corporation Dielectric material change to optimize electrical and mechanical properties of flex circuit

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016159104A1 (ja) * 2015-03-31 2016-10-06 株式会社カネカ 多層ポリイミドフィルム、フレキシブル金属箔積層体、フレキシブル金属箔積層体の製造方法およびリジッドフレキシブル配線板の製造方法
JP2016215651A (ja) * 2016-07-19 2016-12-22 新日鉄住金化学株式会社 フレキシブル銅張積層板及びフレキシブル回路基板
CN108621513B (zh) * 2017-03-22 2019-11-12 昆山雅森电子材料科技有限公司 用于超细线路fpc及cof材料的纳米金属基板及制造方法
CN107696669B (zh) * 2017-09-20 2024-02-06 广东拓斯达科技股份有限公司 自动贴箔机
JP7212480B2 (ja) * 2017-09-29 2023-01-25 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板
JP6597983B2 (ja) * 2017-10-23 2019-10-30 パナソニックＩｐマネジメント株式会社 ロールプレス装置
CN109796761A (zh) * 2018-12-25 2019-05-24 努比亚技术有限公司 显示屏组件、其制备方法和显示终端
CN111635547B (zh) * 2020-06-11 2022-06-28 四川铂利明德科技有限公司 一种高性能改性聚酰亚胺可挠性复合膜的制备方法
CN114679837A (zh) * 2020-12-24 2022-06-28 广东生益科技股份有限公司 一种黑色无胶挠性覆铜板及其制备方法和应用
CN112764533A (zh) * 2020-12-30 2021-05-07 电子科技大学 一种用于手套式键盘的柔性碳系应变传感器阵列
JP2023000498A (ja) 2021-06-18 2023-01-04 合肥漢之和新材料科技有限公司 接着剤、接着シート及びフレキシブル銅張積層板
CN115179638B (zh) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 一种柔性覆铜板的制作方法
CN117528897A (zh) * 2022-07-27 2024-02-06 宏启胜精密电子(秦皇岛)有限公司 软性电路板及其制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04285586A (ja) 1991-03-13 1992-10-09 Juki Corp ミシンの布送り歯軌跡調節装置
JPH0637451A (ja) * 1992-07-20 1994-02-10 Hitachi Chem Co Ltd 多層印刷配線板及びその製造方法
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
JP4116869B2 (ja) * 2002-11-20 2008-07-09 株式会社巴川製紙所 耐熱性接着剤組成物及びこれを用いた積層体、並びにフレキシブルプリント基板
JP2006015681A (ja) * 2004-07-05 2006-01-19 Shin Etsu Chem Co Ltd フレキシブル金属箔ポリイミド積層板及びその製造方法
JP4756194B2 (ja) * 2005-02-22 2011-08-24 新日鐵化学株式会社 銅張積層板の製造方法
KR100965441B1 (ko) * 2005-04-04 2010-06-24 우베 고산 가부시키가이샤 구리박 적층 기판
WO2006112523A1 (ja) * 2005-04-19 2006-10-26 Ube Industries, Ltd. ポリイミドフィルム積層体
KR100629360B1 (ko) * 2005-05-30 2006-10-02 한국화학연구원 에틸렌이민 커플링제를 이용한 폴리이미드 필름의표면개질방법, 그를 이용한 동박 적층 필름의 제조방법 및그로 제조된 2층 구조의 동박 적층필름
TWI342323B (en) * 2007-01-22 2011-05-21 Chang Chun Plastics Co Ltd Thermoset resin modified polyimide resin composition
JP2009113475A (ja) * 2007-10-18 2009-05-28 Shin Etsu Chem Co Ltd フレキシブル片面ポリイミド銅張積層板の製造方法
JP2009292090A (ja) * 2008-06-06 2009-12-17 Nippon Mining & Metals Co Ltd 屈曲性に優れた二層フレキシブル銅貼積層板およびその製造方法
WO2010119908A1 (ja) * 2009-04-14 2010-10-21 宇部興産株式会社 メタライジング用のポリイミドフィルム、これらの製造方法、及び金属積層ポリイミドフィルム
JP2011148192A (ja) * 2010-01-21 2011-08-04 Jx Nippon Mining & Metals Corp 銅張積層板の製造方法、それに用いる銅箔、及び銅張積層板のラミネート装置。
CN101974155B (zh) * 2010-07-10 2013-08-28 横店集团东磁股份有限公司 聚酰亚胺前聚体树脂合成方法及单面柔性覆铜板制造方法
CN201774739U (zh) * 2010-09-29 2011-03-23 莱芜金鼎电子材料有限公司 一种四层双面挠性覆铜板结构及其生产设备
CN201872386U (zh) * 2010-12-13 2011-06-22 莱芜金鼎电子材料有限公司 双面不同铜箔厚度的挠性覆铜板
TW201304633A (zh) 2011-07-08 2013-01-16 Azotek Co Ltd 可撓性基板的製造方法
CN102794962A (zh) * 2012-08-29 2012-11-28 松扬电子材料(昆山)有限公司 复合式双面铜箔基板及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11382210B1 (en) 2020-12-17 2022-07-05 International Business Machines Corporation Dielectric material change to optimize electrical and mechanical properties of flex circuit

Also Published As

Publication number Publication date
KR102329908B1 (ko) 2021-11-22
JP2014198385A (ja) 2014-10-23
TWI665084B (zh) 2019-07-11
TW201836840A (zh) 2018-10-16
CN104070763A (zh) 2014-10-01
KR102319574B1 (ko) 2021-10-29
CN107839313B (zh) 2019-10-08
KR20140118894A (ko) 2014-10-08
TWI635951B (zh) 2018-09-21
CN104070763B (zh) 2017-12-05
TW201500181A (zh) 2015-01-01
CN107839313A (zh) 2018-03-27
KR20200141418A (ko) 2020-12-18

Similar Documents

Publication Publication Date Title
JP5976588B2 (ja) フレキシブル銅張積層板の製造方法
JP6534471B2 (ja) フレキシブル回路基板
JP6581224B2 (ja) フレキシブル銅張積層板
JP2017200759A (ja) ポリイミドフィルム及び銅張積層板
TWI771500B (zh) 聚醯亞胺膜、覆金屬層疊板及電路基板
JP2016215651A (ja) フレキシブル銅張積層板及びフレキシブル回路基板
JP7428646B2 (ja) 金属張積層板及び回路基板
JP6732065B2 (ja) フレキシブル銅張積層板及びフレキシブル回路基板
JP6344914B2 (ja) フレキシブル銅張積層板及びフレキシブル回路基板
TWI660649B (zh) 可撓性電路基板以及電子設備
JP2015088631A (ja) フレキシブル銅張積層板、フレキシブル回路基板及びその使用方法
JP2020015237A (ja) 金属張積層板の製造方法及び回路基板の製造方法
JP7405644B2 (ja) 金属張積層板及び回路基板
CN1750927B (zh) 聚酰亚胺金属层积体
KR101546393B1 (ko) 플렉시블 금속장 적층판 및 그 제조 방법
JP2006117791A (ja) ポリイミドフィルムの製造方法
JP2015070237A (ja) フレキシブル銅張積層板及びフレキシブル回路基板
JP2019119113A (ja) 金属張積層板及び回路基板
JP2006245286A (ja) フレキシブルプリント回路基板及びその製造方法
JP2008177214A (ja) フレキシブル回路基板用積層体及びその製造方法
JP2018062150A (ja) 金属張積層板の製造方法及び回路基板の製造方法
JP2017141379A (ja) ポリイミドフィルムの製造方法
JP2024052391A (ja) 積層板の製造方法、及び保護フィルム付き積層体のロール
JP6436809B2 (ja) フレキシブル回路基板及び電子機器
JP6461540B2 (ja) フレキシブル回路基板、その使用方法及び電子機器

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150910

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160623

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160705

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160720

R150 Certificate of patent or registration of utility model

Ref document number: 5976588

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250