JP5936616B2 - ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ - Google Patents

ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ Download PDF

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JP5936616B2
JP5936616B2 JP2013536774A JP2013536774A JP5936616B2 JP 5936616 B2 JP5936616 B2 JP 5936616B2 JP 2013536774 A JP2013536774 A JP 2013536774A JP 2013536774 A JP2013536774 A JP 2013536774A JP 5936616 B2 JP5936616 B2 JP 5936616B2
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region
field
extended drain
integrated circuit
drain
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JP2013545304A5 (enExample
JP2013545304A (ja
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ピー ペンハルカル サミール
ピー ペンハルカル サミール
リン ジョン
リン ジョン
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日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0281Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of lateral DMOS [LDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10Integrated device layouts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65Lateral DMOS [LDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • H10D62/116Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/158Dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/257Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
    • H10P54/00
    • H10P58/00

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP2013536774A 2010-10-26 2011-10-26 ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ Active JP5936616B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US40664010P 2010-10-26 2010-10-26
US61/406,640 2010-10-26
US13/281,260 US8754469B2 (en) 2010-10-26 2011-10-25 Hybrid active-field gap extended drain MOS transistor
US13/281,260 2011-10-25
PCT/US2011/057843 WO2012058281A2 (en) 2010-10-26 2011-10-26 Hybrid active-field gap extended drain mos transistor

Related Child Applications (1)

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JP2016095753A Division JP6106310B2 (ja) 2010-10-26 2016-05-12 ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ

Publications (3)

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JP2013545304A JP2013545304A (ja) 2013-12-19
JP2013545304A5 JP2013545304A5 (enExample) 2014-12-11
JP5936616B2 true JP5936616B2 (ja) 2016-06-22

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JP2013536774A Active JP5936616B2 (ja) 2010-10-26 2011-10-26 ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ
JP2016095753A Active JP6106310B2 (ja) 2010-10-26 2016-05-12 ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ

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Country Link
US (4) US8754469B2 (enExample)
JP (2) JP5936616B2 (enExample)
CN (2) CN106057797B (enExample)
WO (1) WO2012058281A2 (enExample)

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JP2014154595A (ja) * 2013-02-05 2014-08-25 Seiko Instruments Inc 半導体装置
US9224861B2 (en) * 2013-05-09 2015-12-29 Freescale Semiconductor, Inc. Semiconductor device with notched gate
US9306059B2 (en) * 2014-03-20 2016-04-05 Kinetic Technologies Power semiconductor transistor with improved gate charge
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EP4024474A3 (en) * 2014-06-18 2022-10-26 INTEL Corporation Extended-drain structures for high voltage field effect transistors
US10217821B2 (en) * 2014-09-01 2019-02-26 Sk Hynix System Ic Inc. Power integrated devices, electronic devices and electronic systems including the same
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TWI557919B (zh) * 2015-03-09 2016-11-11 世界先進積體電路股份有限公司 半導體裝置及其製造方法
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Also Published As

Publication number Publication date
US10205001B2 (en) 2019-02-12
US9608088B2 (en) 2017-03-28
JP6106310B2 (ja) 2017-03-29
US20190172930A1 (en) 2019-06-06
WO2012058281A3 (en) 2012-07-12
WO2012058281A2 (en) 2012-05-03
CN106057797A (zh) 2016-10-26
US8754469B2 (en) 2014-06-17
CN103189987A (zh) 2013-07-03
US20140256108A1 (en) 2014-09-11
CN106057797B (zh) 2019-09-27
JP2013545304A (ja) 2013-12-19
US11482613B2 (en) 2022-10-25
US20160343852A1 (en) 2016-11-24
JP2016178323A (ja) 2016-10-06
US20120098062A1 (en) 2012-04-26
CN103189987B (zh) 2016-07-06

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