JP5936616B2 - ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ - Google Patents
ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ Download PDFInfo
- Publication number
- JP5936616B2 JP5936616B2 JP2013536774A JP2013536774A JP5936616B2 JP 5936616 B2 JP5936616 B2 JP 5936616B2 JP 2013536774 A JP2013536774 A JP 2013536774A JP 2013536774 A JP2013536774 A JP 2013536774A JP 5936616 B2 JP5936616 B2 JP 5936616B2
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- region
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- extended drain
- integrated circuit
- drain
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0281—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/115—Dielectric isolations, e.g. air gaps
- H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/158—Dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
-
- H10P54/00—
-
- H10P58/00—
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40664010P | 2010-10-26 | 2010-10-26 | |
| US61/406,640 | 2010-10-26 | ||
| US13/281,260 US8754469B2 (en) | 2010-10-26 | 2011-10-25 | Hybrid active-field gap extended drain MOS transistor |
| US13/281,260 | 2011-10-25 | ||
| PCT/US2011/057843 WO2012058281A2 (en) | 2010-10-26 | 2011-10-26 | Hybrid active-field gap extended drain mos transistor |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016095753A Division JP6106310B2 (ja) | 2010-10-26 | 2016-05-12 | ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013545304A JP2013545304A (ja) | 2013-12-19 |
| JP2013545304A5 JP2013545304A5 (enExample) | 2014-12-11 |
| JP5936616B2 true JP5936616B2 (ja) | 2016-06-22 |
Family
ID=45972272
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013536774A Active JP5936616B2 (ja) | 2010-10-26 | 2011-10-26 | ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ |
| JP2016095753A Active JP6106310B2 (ja) | 2010-10-26 | 2016-05-12 | ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016095753A Active JP6106310B2 (ja) | 2010-10-26 | 2016-05-12 | ハイブリッド能動フィールドギャップ拡張ドレインmosトランジスタ |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US8754469B2 (enExample) |
| JP (2) | JP5936616B2 (enExample) |
| CN (2) | CN106057797B (enExample) |
| WO (1) | WO2012058281A2 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5586546B2 (ja) * | 2011-03-23 | 2014-09-10 | 株式会社東芝 | 半導体装置 |
| JP5973824B2 (ja) * | 2012-07-25 | 2016-08-23 | 旭化成エレクトロニクス株式会社 | 電界効果トランジスタ及び半導体装置 |
| JP2014154595A (ja) * | 2013-02-05 | 2014-08-25 | Seiko Instruments Inc | 半導体装置 |
| US9224861B2 (en) * | 2013-05-09 | 2015-12-29 | Freescale Semiconductor, Inc. | Semiconductor device with notched gate |
| US9306059B2 (en) * | 2014-03-20 | 2016-04-05 | Kinetic Technologies | Power semiconductor transistor with improved gate charge |
| JP6284421B2 (ja) * | 2014-05-09 | 2018-02-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| EP4024474A3 (en) * | 2014-06-18 | 2022-10-26 | INTEL Corporation | Extended-drain structures for high voltage field effect transistors |
| US10217821B2 (en) * | 2014-09-01 | 2019-02-26 | Sk Hynix System Ic Inc. | Power integrated devices, electronic devices and electronic systems including the same |
| KR102228655B1 (ko) * | 2014-11-07 | 2021-03-18 | 에스케이하이닉스 주식회사 | 고전압 집적소자 및 그 제조방법 |
| KR102122365B1 (ko) * | 2014-12-12 | 2020-06-12 | 삼성전자주식회사 | 반도체 소자 |
| JP6345126B2 (ja) * | 2015-01-21 | 2018-06-20 | 三菱電機株式会社 | ショットキーバリアダイオード |
| TWI557919B (zh) * | 2015-03-09 | 2016-11-11 | 世界先進積體電路股份有限公司 | 半導體裝置及其製造方法 |
| US9818861B2 (en) | 2015-04-24 | 2017-11-14 | Vanguard International Semiconductor Corporation | Semiconductor device and method for forming the same |
| CN105742365A (zh) * | 2016-04-14 | 2016-07-06 | 东莞电子科技大学电子信息工程研究院 | 射频ldmos晶体管及其制作方法 |
| EP3428971B1 (en) * | 2017-07-12 | 2020-09-09 | Nxp B.V. | A semiconductor switch device and method |
| CN107845675B (zh) * | 2017-10-30 | 2020-02-18 | 济南大学 | 一种横向双扩散金属氧化物半导体场效应管 |
| US11145743B2 (en) | 2019-04-29 | 2021-10-12 | International Business Machines Corporation | Transistor device having a comb-shaped channel region to increase the effective gate width |
| JP7175864B2 (ja) | 2019-09-17 | 2022-11-21 | 株式会社東芝 | 半導体装置 |
| CN113707715A (zh) * | 2020-05-21 | 2021-11-26 | 无锡华润上华科技有限公司 | 半导体器件 |
| US11581215B2 (en) * | 2020-07-14 | 2023-02-14 | Newport Fab, Llc | Body-source-tied semiconductor-on-insulator (SOI) transistor |
| US10978559B1 (en) * | 2020-08-03 | 2021-04-13 | Texas Instruments Incorporated | MOS transistor with folded channel and folded drift region |
| US11658214B2 (en) | 2021-01-12 | 2023-05-23 | Semiconductor Components Industries, Llc | MOSFET device with undulating channel |
| US11610978B2 (en) | 2021-03-11 | 2023-03-21 | Nxp B.V. | LDMOS with an improved breakdown performance |
| US11791392B2 (en) * | 2021-06-08 | 2023-10-17 | Globalfoundries Singapore Pte. Ltd. | Extended-drain metal-oxide-semiconductor devices with a notched gate electrode |
| US12336220B2 (en) * | 2022-02-24 | 2025-06-17 | Globalfoundries Singapore Pte. Ltd. | Extended-drain metal-oxide-semiconductor devices with a gap between the drain and body wells |
| JPWO2024203661A1 (enExample) * | 2023-03-30 | 2024-10-03 | ||
| TW202523090A (zh) * | 2023-11-24 | 2025-06-01 | 日商村田製作所股份有限公司 | 半導體裝置 |
| CN120417472B (zh) * | 2025-07-04 | 2025-09-09 | 浙江创芯集成电路有限公司 | 半导体结构及其形成方法、半导体器件和电子设备 |
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| DE69225552T2 (de) * | 1991-10-15 | 1999-01-07 | Texas Instruments Inc., Dallas, Tex. | Lateraler doppel-diffundierter MOS-Transistor und Verfahren zu seiner Herstellung |
| US5512495A (en) * | 1994-04-08 | 1996-04-30 | Texas Instruments Incorporated | Method of manufacturing extended drain resurf lateral DMOS devices |
| EP0714135B1 (en) * | 1994-11-08 | 1999-01-13 | STMicroelectronics S.r.l. | Integrated device with a structure for protection against high electric fields |
| US6160290A (en) | 1997-11-25 | 2000-12-12 | Texas Instruments Incorporated | Reduced surface field device having an extended field plate and method for forming the same |
| US6211552B1 (en) * | 1999-05-27 | 2001-04-03 | Texas Instruments Incorporated | Resurf LDMOS device with deep drain region |
| DE10131706B4 (de) * | 2001-06-29 | 2005-10-06 | Atmel Germany Gmbh | Verfahren zur Herstellung eines DMOS-Transistors |
| US6900101B2 (en) * | 2003-06-13 | 2005-05-31 | Texas Instruments Incorporated | LDMOS transistors and methods for making the same |
| US6960807B2 (en) * | 2003-11-25 | 2005-11-01 | Texas Instruments Incorporated | Drain extend MOS transistor with improved breakdown robustness |
| JP5133510B2 (ja) * | 2005-08-24 | 2013-01-30 | ラピスセミコンダクタ株式会社 | 半導体装置およびその製造方法 |
| KR100887030B1 (ko) * | 2007-05-29 | 2009-03-04 | 주식회사 동부하이텍 | 반도체 소자의 고전압 드리프트 형성 방법 |
| KR100898225B1 (ko) * | 2007-09-07 | 2009-05-18 | 주식회사 동부하이텍 | 반도체 소자 및 이의 제조방법 |
| CN100592533C (zh) | 2007-10-15 | 2010-02-24 | 天钰科技股份有限公司 | 横向扩散金属氧化物晶体管 |
| US7838940B2 (en) * | 2007-12-04 | 2010-11-23 | Infineon Technologies Ag | Drain-extended field effect transistor |
| US7888732B2 (en) * | 2008-04-11 | 2011-02-15 | Texas Instruments Incorporated | Lateral drain-extended MOSFET having channel along sidewall of drain extension dielectric |
| US7847351B2 (en) * | 2008-04-11 | 2010-12-07 | Texas Instruments Incorporated | Lateral metal oxide semiconductor drain extension design |
| JP2010045130A (ja) * | 2008-08-11 | 2010-02-25 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| EP2338177B1 (en) * | 2008-10-20 | 2014-06-04 | Nxp B.V. | Insulated gate semiconductor device and method of manufacturing the same |
| JP4602465B2 (ja) * | 2008-12-04 | 2010-12-22 | 株式会社東芝 | 半導体装置 |
| US8236640B2 (en) * | 2009-12-18 | 2012-08-07 | Intel Corporation | Method of fabricating a semiconductor device having gate finger elements extended over a plurality of isolation regions formed in the source and drain regions |
-
2011
- 2011-10-25 US US13/281,260 patent/US8754469B2/en active Active
- 2011-10-26 CN CN201610377205.0A patent/CN106057797B/zh active Active
- 2011-10-26 WO PCT/US2011/057843 patent/WO2012058281A2/en not_active Ceased
- 2011-10-26 JP JP2013536774A patent/JP5936616B2/ja active Active
- 2011-10-26 CN CN201180051651.8A patent/CN103189987B/zh active Active
-
2014
- 2014-05-22 US US14/284,696 patent/US9608088B2/en active Active
-
2016
- 2016-05-12 JP JP2016095753A patent/JP6106310B2/ja active Active
- 2016-08-02 US US15/226,036 patent/US10205001B2/en active Active
-
2019
- 2019-02-11 US US16/272,025 patent/US11482613B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US10205001B2 (en) | 2019-02-12 |
| US9608088B2 (en) | 2017-03-28 |
| JP6106310B2 (ja) | 2017-03-29 |
| US20190172930A1 (en) | 2019-06-06 |
| WO2012058281A3 (en) | 2012-07-12 |
| WO2012058281A2 (en) | 2012-05-03 |
| CN106057797A (zh) | 2016-10-26 |
| US8754469B2 (en) | 2014-06-17 |
| CN103189987A (zh) | 2013-07-03 |
| US20140256108A1 (en) | 2014-09-11 |
| CN106057797B (zh) | 2019-09-27 |
| JP2013545304A (ja) | 2013-12-19 |
| US11482613B2 (en) | 2022-10-25 |
| US20160343852A1 (en) | 2016-11-24 |
| JP2016178323A (ja) | 2016-10-06 |
| US20120098062A1 (en) | 2012-04-26 |
| CN103189987B (zh) | 2016-07-06 |
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