JP5916334B2 - 異方性導電接着剤及びその製造方法、発光装置及びその製造方法 - Google Patents

異方性導電接着剤及びその製造方法、発光装置及びその製造方法 Download PDF

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Publication number
JP5916334B2
JP5916334B2 JP2011222498A JP2011222498A JP5916334B2 JP 5916334 B2 JP5916334 B2 JP 5916334B2 JP 2011222498 A JP2011222498 A JP 2011222498A JP 2011222498 A JP2011222498 A JP 2011222498A JP 5916334 B2 JP5916334 B2 JP 5916334B2
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Japan
Prior art keywords
light
anisotropic conductive
conductive adhesive
light emitting
emitting element
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Active
Application number
JP2011222498A
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English (en)
Japanese (ja)
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JP2013082784A5 (https=
JP2013082784A (ja
Inventor
明 石神
明 石神
士行 蟹澤
士行 蟹澤
秀次 波木
秀次 波木
英明 馬越
英明 馬越
青木　正治
正治 青木
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Dexerials Corp
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Dexerials Corp
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Priority to JP2011222498A priority Critical patent/JP5916334B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to EP12838614.1A priority patent/EP2765173A4/en
Priority to PCT/JP2012/076011 priority patent/WO2013051708A1/ja
Priority to KR1020147011209A priority patent/KR102010103B1/ko
Priority to CN201280060251.8A priority patent/CN104039914B/zh
Priority to TW101136830A priority patent/TWI559334B/zh
Publication of JP2013082784A publication Critical patent/JP2013082784A/ja
Priority to US14/246,618 priority patent/US20140217450A1/en
Publication of JP2013082784A5 publication Critical patent/JP2013082784A5/ja
Application granted granted Critical
Publication of JP5916334B2 publication Critical patent/JP5916334B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2011222498A 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法 Active JP5916334B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
PCT/JP2012/076011 WO2013051708A1 (ja) 2011-10-07 2012-10-05 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
KR1020147011209A KR102010103B1 (ko) 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법
CN201280060251.8A CN104039914B (zh) 2011-10-07 2012-10-05 各向异性导电粘接剂及其制造方法、发光装置及其制造方法
EP12838614.1A EP2765173A4 (en) 2011-10-07 2012-10-05 ANISOTROPER CONDUCTIVE ADHESIVE AND PRODUCTION PROCESS THEREFOR AND LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF
TW101136830A TWI559334B (zh) 2011-10-07 2012-10-05 異向性導電接著劑及其製造方法、發光裝置及其製造方法
US14/246,618 US20140217450A1 (en) 2011-10-07 2014-04-07 Anisotropic conductive adhesive and method for manufacturing same, and light-emitting device and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013082784A JP2013082784A (ja) 2013-05-09
JP2013082784A5 JP2013082784A5 (https=) 2014-11-20
JP5916334B2 true JP5916334B2 (ja) 2016-05-11

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Country Status (7)

Country Link
US (1) US20140217450A1 (https=)
EP (1) EP2765173A4 (https=)
JP (1) JP5916334B2 (https=)
KR (1) KR102010103B1 (https=)
CN (1) CN104039914B (https=)
TW (1) TWI559334B (https=)
WO (1) WO2013051708A1 (https=)

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EP3051598A4 (en) * 2013-09-26 2017-06-28 Dexerials Corporation Light emitting device, anisotropic conductive adhesive and method for manufacturing light emitting device
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Also Published As

Publication number Publication date
CN104039914B (zh) 2016-08-24
TW201331955A (zh) 2013-08-01
US20140217450A1 (en) 2014-08-07
EP2765173A1 (en) 2014-08-13
CN104039914A (zh) 2014-09-10
WO2013051708A1 (ja) 2013-04-11
KR20140084076A (ko) 2014-07-04
TWI559334B (zh) 2016-11-21
JP2013082784A (ja) 2013-05-09
KR102010103B1 (ko) 2019-08-12
EP2765173A4 (en) 2015-04-29

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