CN104039914B - 各向异性导电粘接剂及其制造方法、发光装置及其制造方法 - Google Patents

各向异性导电粘接剂及其制造方法、发光装置及其制造方法 Download PDF

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Publication number
CN104039914B
CN104039914B CN201280060251.8A CN201280060251A CN104039914B CN 104039914 B CN104039914 B CN 104039914B CN 201280060251 A CN201280060251 A CN 201280060251A CN 104039914 B CN104039914 B CN 104039914B
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light
light reflective
silver
cover layer
metal
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CN104039914A (zh
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石神明
蟹泽士行
波木秀次
马越英明
青木正治
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201280060251.8A 2011-10-07 2012-10-05 各向异性导电粘接剂及其制造方法、发光装置及其制造方法 Active CN104039914B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
JP2011-222498 2011-10-07
PCT/JP2012/076011 WO2013051708A1 (ja) 2011-10-07 2012-10-05 異方性導電接着剤及びその製造方法、発光装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN104039914A CN104039914A (zh) 2014-09-10
CN104039914B true CN104039914B (zh) 2016-08-24

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Country Status (7)

Country Link
US (1) US20140217450A1 (https=)
EP (1) EP2765173A4 (https=)
JP (1) JP5916334B2 (https=)
KR (1) KR102010103B1 (https=)
CN (1) CN104039914B (https=)
TW (1) TWI559334B (https=)
WO (1) WO2013051708A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5965199B2 (ja) * 2012-04-17 2016-08-03 デクセリアルズ株式会社 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
US9269681B2 (en) * 2012-11-16 2016-02-23 Qualcomm Incorporated Surface finish on trace for a thermal compression flip chip (TCFC)
JP5985414B2 (ja) * 2013-02-19 2016-09-06 デクセリアルズ株式会社 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
CN105009314B (zh) * 2013-02-27 2019-11-05 日亚化学工业株式会社 发光装置、发光元件安装方法以及发光元件用安装装置
EP3051598A4 (en) * 2013-09-26 2017-06-28 Dexerials Corporation Light emitting device, anisotropic conductive adhesive and method for manufacturing light emitting device
TWI707484B (zh) 2013-11-14 2020-10-11 晶元光電股份有限公司 發光裝置
JP6324746B2 (ja) * 2014-02-03 2018-05-16 デクセリアルズ株式会社 接続体、接続体の製造方法、電子機器
JP6347635B2 (ja) * 2014-03-19 2018-06-27 デクセリアルズ株式会社 異方性導電接着剤
WO2016047950A1 (en) * 2014-09-26 2016-03-31 Seoul Viosys Co., Ltd. Light emitting device and method of fabricating the same
JP6375063B2 (ja) * 2015-05-21 2018-08-15 ゴルテック．インク マイクロ発光ダイオードの搬送方法、製造方法、装置及び電子機器
DE102015112967A1 (de) * 2015-08-06 2017-02-09 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
DE102016106494A1 (de) 2016-04-08 2017-10-12 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
KR102555383B1 (ko) * 2016-12-07 2023-07-12 엘지디스플레이 주식회사 유기발광소자를 이용한 조명장치 및 그 제조방법
KR102732406B1 (ko) * 2017-12-28 2024-11-19 가부시끼가이샤 레조낙 접속 구조체 및 그의 제조 방법
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7093639B2 (ja) * 2018-02-06 2022-06-30 三菱マテリアル株式会社 銀被覆樹脂粒子
CN113930167B (zh) * 2018-03-01 2023-06-23 住友电木株式会社 糊状粘接剂组合物和半导体装置
CN111788275B (zh) * 2018-03-01 2021-12-03 住友电木株式会社 糊状粘接剂组合物和半导体装置
JP7348478B2 (ja) * 2018-07-09 2023-09-21 日亜化学工業株式会社 発光装置及びその製造方法
TWI671921B (zh) 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片
JP7366337B2 (ja) * 2018-12-25 2023-10-23 日亜化学工業株式会社 光源装置の製造方法および光源装置
EP3675190B1 (en) 2018-12-25 2023-05-03 Nichia Corporation Method of manufacturing light source device and light source device
TWI690102B (zh) * 2019-01-04 2020-04-01 友達光電股份有限公司 發光裝置及其製造方法
JP7292669B2 (ja) * 2019-04-11 2023-06-19 株式会社レゾナック 導電粒子の製造方法
JP7298256B2 (ja) * 2019-04-11 2023-06-27 株式会社レゾナック 導電粒子
KR102862766B1 (ko) * 2019-05-29 2025-09-22 삼성전자주식회사 마이크로 엘이디 디스플레이 및 이의 제작 방법
CN111574937B (zh) * 2020-05-15 2021-10-08 武汉华星光电半导体显示技术有限公司 一种异方性导电胶、显示面板及显示装置
DE102021120689A1 (de) * 2021-08-09 2023-02-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Transferverfahren für optoelektronsiche halbleiterbauelemete
KR20240038495A (ko) * 2022-09-16 2024-03-25 삼성전자주식회사 고반사율 이방성 도전 필름 및 이를 포함하는 디스플레이 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002260446A (ja) * 2001-02-27 2002-09-13 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
TW511099B (en) * 2000-08-04 2002-11-21 Sekisui Chemical Co Ltd Conductive fine particles, method for plating fine particles, and substrate structural body

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933771B2 (ja) 1991-11-25 1999-08-16 住友ベークライト株式会社 光半導体封止用エポキシ樹脂組成物
JPH07157720A (ja) * 1993-12-03 1995-06-20 Sumitomo Bakelite Co Ltd 異方導電フィルム
JP3284262B2 (ja) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 液晶表示装置及びそれを用いた電子機器
KR100568491B1 (ko) * 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제
US5990498A (en) * 1997-09-16 1999-11-23 Polaroid Corporation Light-emitting diode having uniform irradiance distribution
JP2001234152A (ja) * 2000-02-24 2001-08-28 Sumitomo Metal Mining Co Ltd 導電性接着剤
JP2003026763A (ja) 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
WO2004105009A1 (ja) * 2003-05-22 2004-12-02 Ricoh Company, Ltd. 光記録媒体
EP1628363B1 (en) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Circuit member connecting structure and method of producing the same
DE10347704A1 (de) 2003-10-14 2005-05-12 Bayer Ag Verfahren zur Herstellung von gereinigten Elastomeren aus Lösung
JP4433876B2 (ja) * 2004-05-18 2010-03-17 住友金属鉱山株式会社 エポキシ樹脂組成物及びそれを用いた光半導体用接着剤
WO2006018995A1 (ja) * 2004-08-05 2006-02-23 Sekisui Chemical Co., Ltd. 導電性微粒子、導電性微粒子の製造方法、及び、無電解銀メッキ液
JP4802666B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
JP4978286B2 (ja) * 2007-04-16 2012-07-18 ソニー株式会社 銀系薄膜合金
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
US20120202218A1 (en) * 2008-09-12 2012-08-09 Modpro Ab Detection method and device based on nanoparticle aggregation
JP5617210B2 (ja) * 2009-09-14 2014-11-05 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
JP5526698B2 (ja) * 2009-10-16 2014-06-18 デクセリアルズ株式会社 光反射性導電粒子、異方性導電接着剤及び発光装置
JP2011186414A (ja) * 2010-02-12 2011-09-22 Sony Corp 光学素子、日射遮蔽装置、建具、窓材および光学素子の製造方法
JP5745776B2 (ja) * 2010-03-15 2015-07-08 デクセリアルズ株式会社 光学積層体および建具
JP5586300B2 (ja) * 2010-03-31 2014-09-10 デクセリアルズ株式会社 機能性積層体及び機能性構造体
JP5583613B2 (ja) * 2011-02-04 2014-09-03 株式会社日本触媒 導電性微粒子
JP5609716B2 (ja) * 2011-03-07 2014-10-22 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511099B (en) * 2000-08-04 2002-11-21 Sekisui Chemical Co Ltd Conductive fine particles, method for plating fine particles, and substrate structural body
JP2002260446A (ja) * 2001-02-27 2002-09-13 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体

Also Published As

Publication number Publication date
TW201331955A (zh) 2013-08-01
US20140217450A1 (en) 2014-08-07
JP5916334B2 (ja) 2016-05-11
EP2765173A1 (en) 2014-08-13
CN104039914A (zh) 2014-09-10
WO2013051708A1 (ja) 2013-04-11
KR20140084076A (ko) 2014-07-04
TWI559334B (zh) 2016-11-21
JP2013082784A (ja) 2013-05-09
KR102010103B1 (ko) 2019-08-12
EP2765173A4 (en) 2015-04-29

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