KR102010103B1 - 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 - Google Patents

이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 Download PDF

Info

Publication number
KR102010103B1
KR102010103B1 KR1020147011209A KR20147011209A KR102010103B1 KR 102010103 B1 KR102010103 B1 KR 102010103B1 KR 1020147011209 A KR1020147011209 A KR 1020147011209A KR 20147011209 A KR20147011209 A KR 20147011209A KR 102010103 B1 KR102010103 B1 KR 102010103B1
Authority
KR
South Korea
Prior art keywords
light reflective
conductive adhesive
light emitting
anisotropic conductive
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020147011209A
Other languages
English (en)
Korean (ko)
Other versions
KR20140084076A (ko
Inventor
아끼라 이시가미
시유끼 가니사와
히데쯔구 나미끼
히데아끼 우마꼬시
마사하루 아오끼
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20140084076A publication Critical patent/KR20140084076A/ko
Application granted granted Critical
Publication of KR102010103B1 publication Critical patent/KR102010103B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020147011209A 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법 Active KR102010103B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011222498A JP5916334B2 (ja) 2011-10-07 2011-10-07 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
JPJP-P-2011-222498 2011-10-07
PCT/JP2012/076011 WO2013051708A1 (ja) 2011-10-07 2012-10-05 異方性導電接着剤及びその製造方法、発光装置及びその製造方法

Publications (2)

Publication Number Publication Date
KR20140084076A KR20140084076A (ko) 2014-07-04
KR102010103B1 true KR102010103B1 (ko) 2019-08-12

Family

ID=48043861

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147011209A Active KR102010103B1 (ko) 2011-10-07 2012-10-05 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법

Country Status (7)

Country Link
US (1) US20140217450A1 (https=)
EP (1) EP2765173A4 (https=)
JP (1) JP5916334B2 (https=)
KR (1) KR102010103B1 (https=)
CN (1) CN104039914B (https=)
TW (1) TWI559334B (https=)
WO (1) WO2013051708A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024058398A1 (ko) * 2022-09-16 2024-03-21 삼성전자주식회사 고반사율 이방성 도전 필름 및 이를 포함하는 디스플레이 모듈

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5965199B2 (ja) * 2012-04-17 2016-08-03 デクセリアルズ株式会社 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
US9269681B2 (en) * 2012-11-16 2016-02-23 Qualcomm Incorporated Surface finish on trace for a thermal compression flip chip (TCFC)
JP5985414B2 (ja) * 2013-02-19 2016-09-06 デクセリアルズ株式会社 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
CN105009314B (zh) * 2013-02-27 2019-11-05 日亚化学工业株式会社 发光装置、发光元件安装方法以及发光元件用安装装置
EP3051598A4 (en) * 2013-09-26 2017-06-28 Dexerials Corporation Light emitting device, anisotropic conductive adhesive and method for manufacturing light emitting device
TWI707484B (zh) 2013-11-14 2020-10-11 晶元光電股份有限公司 發光裝置
JP6324746B2 (ja) * 2014-02-03 2018-05-16 デクセリアルズ株式会社 接続体、接続体の製造方法、電子機器
JP6347635B2 (ja) * 2014-03-19 2018-06-27 デクセリアルズ株式会社 異方性導電接着剤
WO2016047950A1 (en) * 2014-09-26 2016-03-31 Seoul Viosys Co., Ltd. Light emitting device and method of fabricating the same
JP6375063B2 (ja) * 2015-05-21 2018-08-15 ゴルテック．インク マイクロ発光ダイオードの搬送方法、製造方法、装置及び電子機器
DE102015112967A1 (de) * 2015-08-06 2017-02-09 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
DE102016106494A1 (de) 2016-04-08 2017-10-12 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
KR102555383B1 (ko) * 2016-12-07 2023-07-12 엘지디스플레이 주식회사 유기발광소자를 이용한 조명장치 및 그 제조방법
KR102732406B1 (ko) * 2017-12-28 2024-11-19 가부시끼가이샤 레조낙 접속 구조체 및 그의 제조 방법
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7093639B2 (ja) * 2018-02-06 2022-06-30 三菱マテリアル株式会社 銀被覆樹脂粒子
CN113930167B (zh) * 2018-03-01 2023-06-23 住友电木株式会社 糊状粘接剂组合物和半导体装置
CN111788275B (zh) * 2018-03-01 2021-12-03 住友电木株式会社 糊状粘接剂组合物和半导体装置
JP7348478B2 (ja) * 2018-07-09 2023-09-21 日亜化学工業株式会社 発光装置及びその製造方法
TWI671921B (zh) 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片
JP7366337B2 (ja) * 2018-12-25 2023-10-23 日亜化学工業株式会社 光源装置の製造方法および光源装置
EP3675190B1 (en) 2018-12-25 2023-05-03 Nichia Corporation Method of manufacturing light source device and light source device
TWI690102B (zh) * 2019-01-04 2020-04-01 友達光電股份有限公司 發光裝置及其製造方法
JP7292669B2 (ja) * 2019-04-11 2023-06-19 株式会社レゾナック 導電粒子の製造方法
JP7298256B2 (ja) * 2019-04-11 2023-06-27 株式会社レゾナック 導電粒子
KR102862766B1 (ko) * 2019-05-29 2025-09-22 삼성전자주식회사 마이크로 엘이디 디스플레이 및 이의 제작 방법
CN111574937B (zh) * 2020-05-15 2021-10-08 武汉华星光电半导体显示技术有限公司 一种异方性导电胶、显示面板及显示装置
DE102021120689A1 (de) * 2021-08-09 2023-02-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Transferverfahren für optoelektronsiche halbleiterbauelemete

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002260446A (ja) * 2001-02-27 2002-09-13 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2011030621A1 (ja) * 2009-09-14 2011-03-17 ソニーケミカル＆インフォメーションデバイス株式会社 光反射性異方性導電接着剤及び発光装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2933771B2 (ja) 1991-11-25 1999-08-16 住友ベークライト株式会社 光半導体封止用エポキシ樹脂組成物
JPH07157720A (ja) * 1993-12-03 1995-06-20 Sumitomo Bakelite Co Ltd 異方導電フィルム
JP3284262B2 (ja) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 液晶表示装置及びそれを用いた電子機器
KR100568491B1 (ko) * 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제
US5990498A (en) * 1997-09-16 1999-11-23 Polaroid Corporation Light-emitting diode having uniform irradiance distribution
JP2001234152A (ja) * 2000-02-24 2001-08-28 Sumitomo Metal Mining Co Ltd 導電性接着剤
US7226660B2 (en) * 2000-08-04 2007-06-05 Sekisui Chemical Co., Ltd. Conductive fine particles, method for plating fine particles, and substrate structural body
JP2003026763A (ja) 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
WO2004105009A1 (ja) * 2003-05-22 2004-12-02 Ricoh Company, Ltd. 光記録媒体
EP1628363B1 (en) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Circuit member connecting structure and method of producing the same
DE10347704A1 (de) 2003-10-14 2005-05-12 Bayer Ag Verfahren zur Herstellung von gereinigten Elastomeren aus Lösung
JP4433876B2 (ja) * 2004-05-18 2010-03-17 住友金属鉱山株式会社 エポキシ樹脂組成物及びそれを用いた光半導体用接着剤
WO2006018995A1 (ja) * 2004-08-05 2006-02-23 Sekisui Chemical Co., Ltd. 導電性微粒子、導電性微粒子の製造方法、及び、無電解銀メッキ液
JP4802666B2 (ja) * 2005-11-08 2011-10-26 住友金属鉱山株式会社 エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
JP4978286B2 (ja) * 2007-04-16 2012-07-18 ソニー株式会社 銀系薄膜合金
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
US20120202218A1 (en) * 2008-09-12 2012-08-09 Modpro Ab Detection method and device based on nanoparticle aggregation
JP5526698B2 (ja) * 2009-10-16 2014-06-18 デクセリアルズ株式会社 光反射性導電粒子、異方性導電接着剤及び発光装置
JP2011186414A (ja) * 2010-02-12 2011-09-22 Sony Corp 光学素子、日射遮蔽装置、建具、窓材および光学素子の製造方法
JP5745776B2 (ja) * 2010-03-15 2015-07-08 デクセリアルズ株式会社 光学積層体および建具
JP5586300B2 (ja) * 2010-03-31 2014-09-10 デクセリアルズ株式会社 機能性積層体及び機能性構造体
JP5583613B2 (ja) * 2011-02-04 2014-09-03 株式会社日本触媒 導電性微粒子
JP5609716B2 (ja) * 2011-03-07 2014-10-22 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002260446A (ja) * 2001-02-27 2002-09-13 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
WO2011030621A1 (ja) * 2009-09-14 2011-03-17 ソニーケミカル＆インフォメーションデバイス株式会社 光反射性異方性導電接着剤及び発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024058398A1 (ko) * 2022-09-16 2024-03-21 삼성전자주식회사 고반사율 이방성 도전 필름 및 이를 포함하는 디스플레이 모듈

Also Published As

Publication number Publication date
CN104039914B (zh) 2016-08-24
TW201331955A (zh) 2013-08-01
US20140217450A1 (en) 2014-08-07
JP5916334B2 (ja) 2016-05-11
EP2765173A1 (en) 2014-08-13
CN104039914A (zh) 2014-09-10
WO2013051708A1 (ja) 2013-04-11
KR20140084076A (ko) 2014-07-04
TWI559334B (zh) 2016-11-21
JP2013082784A (ja) 2013-05-09
EP2765173A4 (en) 2015-04-29

Similar Documents

Publication Publication Date Title
KR102010103B1 (ko) 이방성 도전 접착제 및 그의 제조 방법, 발광 장치 및 그의 제조 방법
TWI579366B (zh) 異向性導電接著劑及其製造方法、發光裝置及其製造方法
JP5985414B2 (ja) 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
US9670385B2 (en) Anisotropic conductive adhesive
TWI534839B (zh) Light reflective conductive particles, anisotropic conductive adhesives and light-emitting devices
TWI597346B (zh) Anisotropic conductive adhesive and connecting structure
JP2012019203A (ja) 光反射性異方性導電ペースト及び発光装置
TWI517456B (zh) Light reflective conductive particles, anisotropic conductive adhesives and light-emitting devices
JP2014160708A (ja) 異方性導電接着剤、発光装置及び異方性導電接着剤の製造方法
JP2014030026A (ja) 異方性導電接着剤及び発光装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140425

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20170620

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20181128

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20190513

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190806

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190806

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20220701

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20230705

Start annual number: 5

End annual number: 5