JP5862674B2 - 樹脂組成物およびそれを用いた膜形成方法 - Google Patents
樹脂組成物およびそれを用いた膜形成方法 Download PDFInfo
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- JP5862674B2 JP5862674B2 JP2013536270A JP2013536270A JP5862674B2 JP 5862674 B2 JP5862674 B2 JP 5862674B2 JP 2013536270 A JP2013536270 A JP 2013536270A JP 2013536270 A JP2013536270 A JP 2013536270A JP 5862674 B2 JP5862674 B2 JP 5862674B2
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- 239000011342 resin composition Substances 0.000 title claims description 139
- 238000000034 method Methods 0.000 title claims description 39
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- 239000002243 precursor Substances 0.000 claims description 106
- 239000002904 solvent Substances 0.000 claims description 92
- 239000000758 substrate Substances 0.000 claims description 86
- 125000004432 carbon atom Chemical group C* 0.000 claims description 83
- 125000000217 alkyl group Chemical group 0.000 claims description 59
- 125000005843 halogen group Chemical group 0.000 claims description 42
- 125000000962 organic group Chemical group 0.000 claims description 40
- 238000000576 coating method Methods 0.000 claims description 35
- 125000002947 alkylene group Chemical group 0.000 claims description 34
- 238000009835 boiling Methods 0.000 claims description 34
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 29
- GHLZUHZBBNDWHW-UHFFFAOYSA-N nonanamide Chemical compound CCCCCCCCC(N)=O GHLZUHZBBNDWHW-UHFFFAOYSA-N 0.000 claims description 23
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- 239000012046 mixed solvent Substances 0.000 claims description 18
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 14
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- 125000003368 amide group Chemical group 0.000 claims description 13
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- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 7
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- 238000006243 chemical reaction Methods 0.000 description 6
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
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- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
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- 235000012431 wafers Nutrition 0.000 description 5
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
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- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
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- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
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- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000002993 cycloalkylene group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
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- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 3
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- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
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- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
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- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 2
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20200052303A (ko) | 2017-09-26 | 2020-05-14 | 도레이 카부시키가이샤 | 폴리이미드 전구체 수지 조성물, 폴리이미드 수지 조성물, 폴리이미드 수지막, 적층체의 제조 방법, 컬러 필터의 제조 방법, 액정 소자의 제조 방법 및 유기 el 소자의 제조 방법 |
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| WO2014098235A1 (ja) * | 2012-12-21 | 2014-06-26 | 旭化成イーマテリアルズ株式会社 | ポリイミド前駆体及びそれを含有する樹脂組成物 |
| JP6555126B2 (ja) * | 2014-02-26 | 2019-08-07 | 東レ株式会社 | ポリイミド樹脂、これを用いた樹脂組成物および積層フィルム |
| US10144847B2 (en) | 2014-05-30 | 2018-12-04 | Lg Chem, Ltd. | Polyimide-based solution and polyimide-based film produced using same |
| KR102305617B1 (ko) * | 2014-06-25 | 2021-09-27 | 아사히 가세이 가부시키가이샤 | 공극을 갖는 폴리이미드 필름 및 그 제조 방법 |
| JP2016029126A (ja) * | 2014-07-25 | 2016-03-03 | Jsr株式会社 | 樹脂組成物、それを用いた膜形成方法、および基板 |
| JP6555266B2 (ja) * | 2014-08-01 | 2019-08-07 | 日産化学株式会社 | 硬化膜形成用樹脂組成物 |
| JP2016076481A (ja) * | 2014-10-02 | 2016-05-12 | セントラル硝子株式会社 | 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ |
| WO2016147958A1 (ja) * | 2015-03-13 | 2016-09-22 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
| JP6491742B2 (ja) * | 2015-04-17 | 2019-03-27 | 旭化成株式会社 | 樹脂組成物、ポリイミド樹脂膜、及びその製造方法 |
| JP2017052877A (ja) * | 2015-09-09 | 2017-03-16 | 富士ゼロックス株式会社 | ポリイミド前駆体組成物、ポリイミド前駆体組成物の製造方法、及びポリイミド成形体の製造方法 |
| JP6846148B2 (ja) * | 2015-09-30 | 2021-03-24 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド前駆体溶液及びその製造方法並びにポリイミドフィルムの製造方法及び積層体の製造方法 |
| KR101840977B1 (ko) | 2017-09-14 | 2018-03-21 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름 |
| KR102117151B1 (ko) * | 2017-09-29 | 2020-05-29 | 주식회사 엘지화학 | 폴리이미드 전구체 용액 및 이를 이용하여 제조된 폴리이미드 필름 |
| KR102650759B1 (ko) * | 2018-01-17 | 2024-03-22 | 아사히 가세이 가부시키가이샤 | 폴리이미드 전구체 수지 조성물 |
| JP7322699B2 (ja) * | 2018-01-18 | 2023-08-08 | 東レ株式会社 | ディスプレイ基板用樹脂組成物、ディスプレイ基板用樹脂膜およびそれを含む積層体、画像表示装置、有機ｅｌディスプレイ、並びに、それらの製造方法 |
| JP7361479B2 (ja) * | 2018-03-28 | 2023-10-16 | 住友化学株式会社 | 透明ポリイミド系高分子を含む光学フィルム |
| WO2019189483A1 (ja) * | 2018-03-28 | 2019-10-03 | 住友化学株式会社 | 透明ポリイミド系高分子と溶媒とを含むワニス |
| CN111971327B (zh) * | 2018-03-30 | 2023-03-21 | 株式会社钟化 | 聚酰胺酸、聚酰胺酸溶液、聚酰亚胺、聚酰亚胺膜、层叠体、柔性装置及其制造方法 |
| TWI725415B (zh) * | 2018-04-23 | 2021-04-21 | 日商信越化學工業股份有限公司 | 含矽化合物 |
| JP7327983B2 (ja) | 2018-05-16 | 2023-08-16 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
| KR20210088551A (ko) * | 2018-11-09 | 2021-07-14 | 도레이 카부시키가이샤 | 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 |
| JPWO2020189759A1 (zh) * | 2019-03-20 | 2020-09-24 | ||
| WO2023276093A1 (ja) * | 2021-06-30 | 2023-01-05 | 昭和電工マテリアルズ株式会社 | 樹脂組成物、半導体装置の製造方法 |
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| JP2760520B2 (ja) * | 1988-09-29 | 1998-06-04 | 新日鐵化学株式会社 | ポリイミド共重合体及びその製造方法 |
| JP3440832B2 (ja) * | 1997-07-14 | 2003-08-25 | 東レ株式会社 | 感光性ポリイミド前駆体組成物 |
| KR100211440B1 (ko) | 1998-08-31 | 1999-08-02 | 호소이 쇼지로 | 신규한 폴리이미드 및 그의 제조방법 |
| JP2002020893A (ja) * | 2000-07-06 | 2002-01-23 | Sankyo Seiki Mfg Co Ltd | 電着材料及び電着塗膜形成方法並びにそれを用いた摺動機器 |
| JP4120780B2 (ja) | 2002-07-19 | 2008-07-16 | 信越化学工業株式会社 | フェノール性水酸基を有するポリイミド樹脂の製造方法 |
| JP4483331B2 (ja) * | 2004-02-17 | 2010-06-16 | チッソ株式会社 | シルセスキオキサン骨格を有するジアミン及びそれを用いた重合体 |
| JP2007177017A (ja) * | 2005-12-27 | 2007-07-12 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン系樹脂組成物 |
| JP5584134B2 (ja) * | 2008-11-10 | 2014-09-03 | 味の素株式会社 | シロキサン含有ポリイミド樹脂 |
| JP5136441B2 (ja) * | 2009-01-26 | 2013-02-06 | 宇部興産株式会社 | アミド酸オリゴマー溶液組成物を用いたポリイミド膜の製造方法、及びアミド酸オリゴマー溶液組成物 |
| JP5510908B2 (ja) * | 2010-02-26 | 2014-06-04 | 株式会社ピーアイ技術研究所 | 半導体装置用ポリイミド樹脂組成物並びにそれを用いた半導体装置中の膜形成方法及び半導体装置 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200052303A (ko) | 2017-09-26 | 2020-05-14 | 도레이 카부시키가이샤 | 폴리이미드 전구체 수지 조성물, 폴리이미드 수지 조성물, 폴리이미드 수지막, 적층체의 제조 방법, 컬러 필터의 제조 방법, 액정 소자의 제조 방법 및 유기 el 소자의 제조 방법 |
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| TW201315772A (zh) | 2013-04-16 |
| KR101946092B1 (ko) | 2019-02-08 |
| TWI577734B (zh) | 2017-04-11 |
| KR20140069264A (ko) | 2014-06-09 |
| JPWO2013047451A1 (ja) | 2015-03-26 |
| CN103842409A (zh) | 2014-06-04 |
| WO2013047451A1 (ja) | 2013-04-04 |
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