KR101946092B1 - 수지 조성물 및 그것을 이용한 막 형성 방법 - Google Patents

수지 조성물 및 그것을 이용한 막 형성 방법 Download PDF

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Publication number
KR101946092B1
KR101946092B1 KR1020147011045A KR20147011045A KR101946092B1 KR 101946092 B1 KR101946092 B1 KR 101946092B1 KR 1020147011045 A KR1020147011045 A KR 1020147011045A KR 20147011045 A KR20147011045 A KR 20147011045A KR 101946092 B1 KR101946092 B1 KR 101946092B1
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South Korea
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group
resin composition
film
solvent
compound
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KR1020147011045A
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English (en)
Korean (ko)
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KR20140069264A (ko
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다카후미 시미즈
신타로 후지토미
노부유키 미야키
유이치 에리야마
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제이에스알 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020147011045A 2011-09-29 2012-09-24 수지 조성물 및 그것을 이용한 막 형성 방법 KR101946092B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-214751 2011-09-29
JP2011214751 2011-09-29
PCT/JP2012/074427 WO2013047451A1 (ja) 2011-09-29 2012-09-24 樹脂組成物およびそれを用いた膜形成方法

Publications (2)

Publication Number Publication Date
KR20140069264A KR20140069264A (ko) 2014-06-09
KR101946092B1 true KR101946092B1 (ko) 2019-02-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147011045A KR101946092B1 (ko) 2011-09-29 2012-09-24 수지 조성물 및 그것을 이용한 막 형성 방법

Country Status (5)

Country Link
JP (1) JP5862674B2 (zh)
KR (1) KR101946092B1 (zh)
CN (1) CN103842409A (zh)
TW (1) TWI577734B (zh)
WO (1) WO2013047451A1 (zh)

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KR102116229B1 (ko) * 2012-12-21 2020-05-28 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
EP3112394A4 (en) 2014-02-26 2017-08-16 Toray Industries, Inc. Polyimide resin, resin composition using same, and laminated film
CN105637016B (zh) 2014-05-30 2017-11-07 株式会社Lg化学 聚酰亚胺基液体和使用其制备的聚酰亚胺基膜
KR102139455B1 (ko) * 2014-06-25 2020-07-30 아사히 가세이 가부시키가이샤 공극을 갖는 폴리이미드 필름 및 그 제조 방법
JP2016029126A (ja) * 2014-07-25 2016-03-03 Jsr株式会社 樹脂組成物、それを用いた膜形成方法、および基板
CN106536647B (zh) * 2014-08-01 2019-05-07 日产化学工业株式会社 固化膜形成用树脂组合物
JP2016076481A (ja) * 2014-10-02 2016-05-12 セントラル硝子株式会社 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ
JP6476278B2 (ja) * 2015-03-13 2019-02-27 旭化成株式会社 ポリイミド前駆体樹脂組成物
CN107531996B (zh) * 2015-04-17 2021-03-30 旭化成株式会社 树脂组合物、聚酰亚胺树脂膜及其制造方法
JP2017052877A (ja) * 2015-09-09 2017-03-16 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体組成物の製造方法、及びポリイミド成形体の製造方法
JP6846148B2 (ja) * 2015-09-30 2021-03-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体溶液及びその製造方法並びにポリイミドフィルムの製造方法及び積層体の製造方法
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
WO2019065164A1 (ja) * 2017-09-26 2019-04-04 東レ株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂組成物、ポリイミド樹脂膜、積層体の製造方法、カラーフィルタの製造方法、液晶素子の製造方法および有機ｅｌ素子の製造方法
KR102117151B1 (ko) * 2017-09-29 2020-05-29 주식회사 엘지화학 폴리이미드 전구체 용액 및 이를 이용하여 제조된 폴리이미드 필름
WO2019142866A1 (ja) * 2018-01-17 2019-07-25 旭化成株式会社 ポリイミド前駆体樹脂組成物
US20200339754A1 (en) * 2018-01-18 2020-10-29 Toray Industries, Inc. Resin composition for display substrate, resin film for display substrate and laminate body containing this, image display device, organic el display, and manufacturing method of these
JP7361479B2 (ja) * 2018-03-28 2023-10-16 住友化学株式会社 透明ポリイミド系高分子を含む光学フィルム
CN111936581A (zh) * 2018-03-28 2020-11-13 住友化学株式会社 包含透明聚酰亚胺系高分子和溶剂的清漆
WO2019188380A1 (ja) * 2018-03-30 2019-10-03 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法
WO2019208590A1 (ja) * 2018-04-23 2019-10-31 信越化学工業株式会社 ケイ素含有化合物
JP7327983B2 (ja) 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物
KR20210088551A (ko) * 2018-11-09 2021-07-14 도레이 카부시키가이샤 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스
WO2020189759A1 (ja) * 2019-03-20 2020-09-24 株式会社カネカ ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法
WO2023276093A1 (ja) * 2021-06-30 2023-01-05 昭和電工マテリアルズ株式会社 樹脂組成物、半導体装置の製造方法

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KR100211440B1 (ko) 1998-08-31 1999-08-02 호소이 쇼지로 신규한 폴리이미드 및 그의 제조방법
JP2004051794A (ja) 2002-07-19 2004-02-19 Shin Etsu Chem Co Ltd フェノール性水酸基を有するポリイミド樹脂、その製造方法、及びポリイミド樹脂組成物

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JP5136441B2 (ja) * 2009-01-26 2013-02-06 宇部興産株式会社 アミド酸オリゴマー溶液組成物を用いたポリイミド膜の製造方法、及びアミド酸オリゴマー溶液組成物
JP5510908B2 (ja) * 2010-02-26 2014-06-04 株式会社ピーアイ技術研究所 半導体装置用ポリイミド樹脂組成物並びにそれを用いた半導体装置中の膜形成方法及び半導体装置

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
KR100211440B1 (ko) 1998-08-31 1999-08-02 호소이 쇼지로 신규한 폴리이미드 및 그의 제조방법
JP2004051794A (ja) 2002-07-19 2004-02-19 Shin Etsu Chem Co Ltd フェノール性水酸基を有するポリイミド樹脂、その製造方法、及びポリイミド樹脂組成物

Also Published As

Publication number Publication date
CN103842409A (zh) 2014-06-04
TWI577734B (zh) 2017-04-11
KR20140069264A (ko) 2014-06-09
JPWO2013047451A1 (ja) 2015-03-26
JP5862674B2 (ja) 2016-02-16
WO2013047451A1 (ja) 2013-04-04
TW201315772A (zh) 2013-04-16

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