JP5717147B2 - はんだペースト組成物、はんだペーストおよびはんだ付用フラックス - Google Patents

はんだペースト組成物、はんだペーストおよびはんだ付用フラックス Download PDF

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Publication number
JP5717147B2
JP5717147B2 JP2012545285A JP2012545285A JP5717147B2 JP 5717147 B2 JP5717147 B2 JP 5717147B2 JP 2012545285 A JP2012545285 A JP 2012545285A JP 2012545285 A JP2012545285 A JP 2012545285A JP 5717147 B2 JP5717147 B2 JP 5717147B2
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Japan
Prior art keywords
soldering
flux
mass
present
solder
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JP2012545285A
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Japanese (ja)
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JP2013515611A5 (https=
JP2013515611A (ja
Inventor
ヤン・フイイン
ル・ダオチャン
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Henkel AG and Co KGaA
Henkel Corp
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Henkel AG and Co KGaA
Henkel Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012545285A 2009-12-24 2010-12-21 はんだペースト組成物、はんだペーストおよびはんだ付用フラックス Active JP5717147B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200910215134.4 2009-12-24
CN200910215134.4A CN102107340B (zh) 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂
PCT/EP2010/070329 WO2011076770A2 (en) 2009-12-24 2010-12-21 A solder paste composition, a solder paste and a soldering flux

Publications (3)

Publication Number Publication Date
JP2013515611A JP2013515611A (ja) 2013-05-09
JP2013515611A5 JP2013515611A5 (https=) 2014-02-20
JP5717147B2 true JP5717147B2 (ja) 2015-05-13

Family

ID=43836664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012545285A Active JP5717147B2 (ja) 2009-12-24 2010-12-21 はんだペースト組成物、はんだペーストおよびはんだ付用フラックス

Country Status (9)

Country Link
US (1) US9511453B2 (https=)
EP (1) EP2516104B1 (https=)
JP (1) JP5717147B2 (https=)
CN (2) CN102107340B (https=)
DK (1) DK2516104T3 (https=)
ES (1) ES2712549T3 (https=)
HU (1) HUE042953T2 (https=)
PL (1) PL2516104T3 (https=)
WO (1) WO2011076770A2 (https=)

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JPWO2017086335A1 (ja) * 2015-11-17 2018-08-30 積水化学工業株式会社 はんだ接合材料、接続構造体及び接続構造体の製造方法

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CA2842762A1 (en) * 2011-08-02 2013-02-07 Alpha Metals, Inc. Solder compositions
JP5218686B2 (ja) * 2011-08-08 2013-06-26 Ｊｓｒ株式会社 フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6088204B2 (ja) * 2012-10-29 2017-03-01 株式会社タムラ製作所 はんだ組成物
KR102156373B1 (ko) 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
CN104646862A (zh) * 2013-11-26 2015-05-27 刘现梅 一种含有松油醇副产松油烯衍生物的助焊剂
CN104476018B (zh) * 2014-11-17 2016-06-01 如皋市大昌电子有限公司 一种贴片二极管焊接专用焊锡膏
CN107731434B (zh) * 2017-09-25 2019-07-19 江苏时恒电子科技有限公司 一种热敏电阻铜电极多功能防护膜层及其制备方法
JP6824208B2 (ja) * 2018-02-26 2021-02-03 株式会社タムラ製作所 フラックス及びソルダペースト
CN111660037B (zh) * 2019-03-05 2022-04-15 潮州三环（集团）股份有限公司 助焊剂及包含该助焊剂的锡膏
CN110369818B (zh) * 2019-08-05 2022-03-04 大连爱碧克空调配件有限公司 铝合金支架焊接方法
JP6764123B1 (ja) * 2019-10-04 2020-09-30 千住金属工業株式会社 ソルダペースト
JP7194141B2 (ja) * 2020-03-25 2022-12-21 株式会社タムラ製作所 レーザーはんだ付け用はんだ組成物、および電子基板の製造方法
CN111777944A (zh) * 2020-07-01 2020-10-16 云南锡业锡材有限公司 一种芯片封装用焊锡球表面处理剂及其制备方法
JP6928295B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 フラックス及びソルダペースト
JP6928296B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 ソルダペースト
WO2022266839A1 (zh) * 2021-06-22 2022-12-29 京东方科技集团股份有限公司 一种助焊剂、基板及其制作方法、装置
CN115870660A (zh) * 2021-09-29 2023-03-31 比亚迪股份有限公司 活性金属焊膏组合物、焊膏及焊接陶瓷与金属的方法
JP7037103B1 (ja) 2021-10-06 2022-03-16 千住金属工業株式会社 フラックス及びソルダペースト
CA3253015A1 (en) * 2022-02-25 2023-08-31 Hubbell Incorporated EXOTHORMIC REACTION METAL WELDING ASSEMBLIES AND METHODS OF USE
KR102882331B1 (ko) * 2022-05-10 2025-11-06 한국화학연구원 솔더 페이스트
JP7208579B1 (ja) * 2022-07-22 2023-01-19 千住金属工業株式会社 フラックス及びソルダペースト
CN119635086A (zh) * 2025-02-10 2025-03-18 安徽固晶新材料有限公司 一种用于不锈钢焊接焊料及其焊接方法

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JPH106074A (ja) * 1996-06-20 1998-01-13 Harima Chem Inc ソルダペースト組成物
JPH10109188A (ja) * 1996-10-01 1998-04-28 Showa Denko Kk はんだペースト
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
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JP2005152999A (ja) * 2003-11-28 2005-06-16 Tamura Kaken Co Ltd ソルダーペースト組成物
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JP2006009125A (ja) * 2004-06-29 2006-01-12 Kumamoto Technology & Industry Foundation 表面修飾金属微粒子および該金属微粒子を含有するペースト
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017086335A1 (ja) * 2015-11-17 2018-08-30 積水化学工業株式会社 はんだ接合材料、接続構造体及び接続構造体の製造方法
JP7011892B2 (ja) 2015-11-17 2022-02-10 積水化学工業株式会社 はんだ接合材料及び接続構造体の製造方法

Also Published As

Publication number Publication date
CN102666001A (zh) 2012-09-12
JP2013515611A (ja) 2013-05-09
CN102107340B (zh) 2015-10-21
CN102666001B (zh) 2016-09-14
ES2712549T3 (es) 2019-05-13
PL2516104T3 (pl) 2019-08-30
WO2011076770A3 (en) 2011-09-09
EP2516104A2 (en) 2012-10-31
HUE042953T2 (hu) 2019-07-29
EP2516104B1 (en) 2019-01-30
US9511453B2 (en) 2016-12-06
CN102107340A (zh) 2011-06-29
US20130042946A1 (en) 2013-02-21
WO2011076770A2 (en) 2011-06-30
DK2516104T3 (en) 2019-04-08

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