CN102107340B - 一种焊膏组合物、焊膏及一种助焊剂 - Google Patents

一种焊膏组合物、焊膏及一种助焊剂 Download PDF

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Publication number
CN102107340B
CN102107340B CN200910215134.4A CN200910215134A CN102107340B CN 102107340 B CN102107340 B CN 102107340B CN 200910215134 A CN200910215134 A CN 200910215134A CN 102107340 B CN102107340 B CN 102107340B
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CN
China
Prior art keywords
scaling powder
powder
paste
scaling
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200910215134.4A
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English (en)
Chinese (zh)
Other versions
CN102107340A (zh
Inventor
杨慧英
吕道强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Halima Chemicals Group Co ltd
Original Assignee
Henkel AG and Co KGaA
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200910215134.4A priority Critical patent/CN102107340B/zh
Application filed by Henkel AG and Co KGaA, Henkel Corp filed Critical Henkel AG and Co KGaA
Priority to PL10799017T priority patent/PL2516104T3/pl
Priority to HUE10799017A priority patent/HUE042953T2/hu
Priority to EP10799017.8A priority patent/EP2516104B1/en
Priority to DK10799017.8T priority patent/DK2516104T3/en
Priority to PCT/EP2010/070329 priority patent/WO2011076770A2/en
Priority to ES10799017T priority patent/ES2712549T3/es
Priority to JP2012545285A priority patent/JP5717147B2/ja
Priority to CN201080059039.0A priority patent/CN102666001B/zh
Publication of CN102107340A publication Critical patent/CN102107340A/zh
Priority to US13/530,751 priority patent/US9511453B2/en
Application granted granted Critical
Publication of CN102107340B publication Critical patent/CN102107340B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200910215134.4A 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂 Active CN102107340B (zh)

Priority Applications (10)

Application Number Priority Date Filing Date Title
CN200910215134.4A CN102107340B (zh) 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂
CN201080059039.0A CN102666001B (zh) 2009-12-24 2010-12-21 焊膏组合物、焊膏和助焊剂
EP10799017.8A EP2516104B1 (en) 2009-12-24 2010-12-21 A solder paste composition, a solder paste and a soldering flux
DK10799017.8T DK2516104T3 (en) 2009-12-24 2010-12-21 LOSSE PASTA COMPOSITION, LOSSE PASTA AND LOSSE FLUID
PCT/EP2010/070329 WO2011076770A2 (en) 2009-12-24 2010-12-21 A solder paste composition, a solder paste and a soldering flux
ES10799017T ES2712549T3 (es) 2009-12-24 2010-12-21 Una composición de pasta de soldadura, una pasta de soldadura y un fundente de soldadura
PL10799017T PL2516104T3 (pl) 2009-12-24 2010-12-21 Kompozycja pasty lutowniczej, pasta lutownicza i topnik do lutowania
HUE10799017A HUE042953T2 (hu) 2009-12-24 2010-12-21 Forrasztópaszta készítmény, forrasztópaszta és forrasztófolyadék
JP2012545285A JP5717147B2 (ja) 2009-12-24 2010-12-21 はんだペースト組成物、はんだペーストおよびはんだ付用フラックス
US13/530,751 US9511453B2 (en) 2009-12-24 2012-06-22 Solder paste composition, a solder paste and a soldering flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910215134.4A CN102107340B (zh) 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂

Publications (2)

Publication Number Publication Date
CN102107340A CN102107340A (zh) 2011-06-29
CN102107340B true CN102107340B (zh) 2015-10-21

Family

ID=43836664

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200910215134.4A Active CN102107340B (zh) 2009-12-24 2009-12-24 一种焊膏组合物、焊膏及一种助焊剂
CN201080059039.0A Active CN102666001B (zh) 2009-12-24 2010-12-21 焊膏组合物、焊膏和助焊剂

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201080059039.0A Active CN102666001B (zh) 2009-12-24 2010-12-21 焊膏组合物、焊膏和助焊剂

Country Status (9)

Country Link
US (1) US9511453B2 (https=)
EP (1) EP2516104B1 (https=)
JP (1) JP5717147B2 (https=)
CN (2) CN102107340B (https=)
DK (1) DK2516104T3 (https=)
ES (1) ES2712549T3 (https=)
HU (1) HUE042953T2 (https=)
PL (1) PL2516104T3 (https=)
WO (1) WO2011076770A2 (https=)

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CA2842762A1 (en) * 2011-08-02 2013-02-07 Alpha Metals, Inc. Solder compositions
JP5218686B2 (ja) * 2011-08-08 2013-06-26 Ｊｓｒ株式会社 フラックス組成物、電気的接続構造の形成方法、電気的接続構造および半導体装置
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
JP6088204B2 (ja) * 2012-10-29 2017-03-01 株式会社タムラ製作所 はんだ組成物
KR102156373B1 (ko) 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
CN104646862A (zh) * 2013-11-26 2015-05-27 刘现梅 一种含有松油醇副产松油烯衍生物的助焊剂
CN104476018B (zh) * 2014-11-17 2016-06-01 如皋市大昌电子有限公司 一种贴片二极管焊接专用焊锡膏
WO2017086335A1 (ja) * 2015-11-17 2017-05-26 積水化学工業株式会社 はんだ接合材料、接続構造体及び接続構造体の製造方法
CN107731434B (zh) * 2017-09-25 2019-07-19 江苏时恒电子科技有限公司 一种热敏电阻铜电极多功能防护膜层及其制备方法
JP6824208B2 (ja) * 2018-02-26 2021-02-03 株式会社タムラ製作所 フラックス及びソルダペースト
CN111660037B (zh) * 2019-03-05 2022-04-15 潮州三环（集团）股份有限公司 助焊剂及包含该助焊剂的锡膏
CN110369818B (zh) * 2019-08-05 2022-03-04 大连爱碧克空调配件有限公司 铝合金支架焊接方法
JP6764123B1 (ja) * 2019-10-04 2020-09-30 千住金属工業株式会社 ソルダペースト
JP7194141B2 (ja) * 2020-03-25 2022-12-21 株式会社タムラ製作所 レーザーはんだ付け用はんだ組成物、および電子基板の製造方法
CN111777944A (zh) * 2020-07-01 2020-10-16 云南锡业锡材有限公司 一种芯片封装用焊锡球表面处理剂及其制备方法
JP6928295B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 フラックス及びソルダペースト
JP6928296B1 (ja) * 2020-10-02 2021-09-01 千住金属工業株式会社 ソルダペースト
WO2022266839A1 (zh) * 2021-06-22 2022-12-29 京东方科技集团股份有限公司 一种助焊剂、基板及其制作方法、装置
CN115870660A (zh) * 2021-09-29 2023-03-31 比亚迪股份有限公司 活性金属焊膏组合物、焊膏及焊接陶瓷与金属的方法
JP7037103B1 (ja) 2021-10-06 2022-03-16 千住金属工業株式会社 フラックス及びソルダペースト
CA3253015A1 (en) * 2022-02-25 2023-08-31 Hubbell Incorporated EXOTHORMIC REACTION METAL WELDING ASSEMBLIES AND METHODS OF USE
KR102882331B1 (ko) * 2022-05-10 2025-11-06 한국화학연구원 솔더 페이스트
JP7208579B1 (ja) * 2022-07-22 2023-01-19 千住金属工業株式会社 フラックス及びソルダペースト
CN119635086A (zh) * 2025-02-10 2025-03-18 安徽固晶新材料有限公司 一种用于不锈钢焊接焊料及其焊接方法

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JP2005152912A (ja) * 2003-11-21 2005-06-16 Nof Corp はんだ付け用フラックス組成物、はんだペーストおよびはんだ付け方法
JP2008111004A (ja) * 2006-10-06 2008-05-15 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置
CN101374886A (zh) * 2006-01-26 2009-02-25 昭和电工株式会社 含有硫醇化合物的固化性组合物

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FR2845024B1 (fr) * 2002-10-01 2005-06-10 Ind Des Poudres Spheriques Preformes de soudure comportant un revetement de surface et procede de production de telles preformes.
JP2005152912A (ja) * 2003-11-21 2005-06-16 Nof Corp はんだ付け用フラックス組成物、はんだペーストおよびはんだ付け方法
CN101374886A (zh) * 2006-01-26 2009-02-25 昭和电工株式会社 含有硫醇化合物的固化性组合物
JP2008111004A (ja) * 2006-10-06 2008-05-15 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置

Also Published As

Publication number Publication date
JP5717147B2 (ja) 2015-05-13
CN102666001A (zh) 2012-09-12
JP2013515611A (ja) 2013-05-09
CN102666001B (zh) 2016-09-14
ES2712549T3 (es) 2019-05-13
PL2516104T3 (pl) 2019-08-30
WO2011076770A3 (en) 2011-09-09
EP2516104A2 (en) 2012-10-31
HUE042953T2 (hu) 2019-07-29
EP2516104B1 (en) 2019-01-30
US9511453B2 (en) 2016-12-06
CN102107340A (zh) 2011-06-29
US20130042946A1 (en) 2013-02-21
WO2011076770A2 (en) 2011-06-30
DK2516104T3 (en) 2019-04-08

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