JP5714631B2 - 異方導電性シート及び導通接続方法 - Google Patents

異方導電性シート及び導通接続方法 Download PDF

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Publication number
JP5714631B2
JP5714631B2 JP2013064063A JP2013064063A JP5714631B2 JP 5714631 B2 JP5714631 B2 JP 5714631B2 JP 2013064063 A JP2013064063 A JP 2013064063A JP 2013064063 A JP2013064063 A JP 2013064063A JP 5714631 B2 JP5714631 B2 JP 5714631B2
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conductive
acf
conductive sheet
particle holding
conductive particle
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Expired - Fee Related
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Japanese (ja)
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JP2014191892A5 (enExample
JP2014191892A (ja
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丈明 川島
丈明 川島
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2013064063A priority Critical patent/JP5714631B2/ja
Priority to US14/224,003 priority patent/US20140290059A1/en
Priority to EP20140161541 priority patent/EP2784141A3/en
Publication of JP2014191892A publication Critical patent/JP2014191892A/ja
Publication of JP2014191892A5 publication Critical patent/JP2014191892A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
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    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01304—Manufacture or treatment of die-attach connectors using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
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    • Y10T29/00—Metal working
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    • Y10T29/49204—Contact or terminal manufacturing
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2013064063A 2013-03-26 2013-03-26 異方導電性シート及び導通接続方法 Expired - Fee Related JP5714631B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013064063A JP5714631B2 (ja) 2013-03-26 2013-03-26 異方導電性シート及び導通接続方法
US14/224,003 US20140290059A1 (en) 2013-03-26 2014-03-24 Anisotropic conductive film and method of making conductive connection
EP20140161541 EP2784141A3 (en) 2013-03-26 2014-03-25 Anisotropic conductive film and method of making conductive connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013064063A JP5714631B2 (ja) 2013-03-26 2013-03-26 異方導電性シート及び導通接続方法

Publications (3)

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JP2014191892A JP2014191892A (ja) 2014-10-06
JP2014191892A5 JP2014191892A5 (enExample) 2014-11-13
JP5714631B2 true JP5714631B2 (ja) 2015-05-07

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US (1) US20140290059A1 (enExample)
EP (1) EP2784141A3 (enExample)
JP (1) JP5714631B2 (enExample)

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WO2016068083A1 (ja) * 2014-10-31 2016-05-06 デクセリアルズ株式会社 異方性導電フィルム
US10629557B2 (en) * 2016-12-30 2020-04-21 Intel Corporation Improving mechanical and thermal reliability in varying form factors
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
WO2019074060A1 (ja) * 2017-10-12 2019-04-18 富士フイルム株式会社 複合材
CN111295636A (zh) * 2017-11-20 2020-06-16 深圳市柔宇科技有限公司 表面触控压印方法
JP7185252B2 (ja) * 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
KR102254467B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 이방도전성 접착필름의 제조방법
US10910336B2 (en) * 2019-01-29 2021-02-02 Shih-Chi Chen Chip package structure
CN113436786A (zh) * 2021-05-21 2021-09-24 苏州鑫导电子科技有限公司 一种具有扩张孔的acf胶膜层、胶膜结构及其制备方法
CN114302302B (zh) * 2021-12-30 2024-02-02 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN114882790B (zh) * 2022-04-24 2023-06-16 绵阳惠科光电科技有限公司 异方性导电胶和显示装置

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