CN111295636A - 表面触控压印方法 - Google Patents

表面触控压印方法 Download PDF

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Publication number
CN111295636A
CN111295636A CN201780096339.8A CN201780096339A CN111295636A CN 111295636 A CN111295636 A CN 111295636A CN 201780096339 A CN201780096339 A CN 201780096339A CN 111295636 A CN111295636 A CN 111295636A
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CN
China
Prior art keywords
pressure
stamped
pressed
sensitive conductive
touch
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Pending
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CN201780096339.8A
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English (en)
Inventor
王建华
黄嘉伟
陈鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN111295636A publication Critical patent/CN111295636A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Push-Button Switches (AREA)

Abstract

本发明涉及一种表面触控压印方法，包括以下步骤：提供一种压头，压头上设有与待压印表面上需要压印的位置对应的凸起部；将受压后可导电的压敏导电件贴合到压头上，并覆盖凸起部；或者将受压后可导电的压敏导电件贴合到待压印表面A上；让压头的凸起部与待压印表面上需要压印的位置对应，施加压力使压敏导电件受压部位与待压印表面需要压印的位置黏贴，使压敏导电件受压印的部分形成触控线路。本发明的触控压印方法使用压合方式让受压后可导电的压敏导电件直接在机壳或者盖板材料内表面形成触控感应线路，实现触控功能，解决胶质功能片贴合于机壳或者盖板时产生气泡等技术难题，简化工序节约成本。

Description

PCT国内申请，说明书已公开。

Claims (1)

  1. PCT国内申请，权利要求书已公开。
CN201780096339.8A 2017-11-20 2017-11-20 表面触控压印方法 Pending CN111295636A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/111838 WO2019095363A1 (zh) 2017-11-20 2017-11-20 表面触控压印方法

Publications (1)

Publication Number Publication Date
CN111295636A true CN111295636A (zh) 2020-06-16

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ID=66538469

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780096339.8A Pending CN111295636A (zh) 2017-11-20 2017-11-20 表面触控压印方法

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CN (1) CN111295636A (zh)
WO (1) WO2019095363A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770675A (zh) * 2020-06-19 2020-10-13 深圳市联得自动化装备股份有限公司 制作曲面模组的热压方法和热压设备、曲面模组和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1554971A (zh) * 2003-12-19 2004-12-15 友达光电股份有限公司 各向异性导电胶膜贴附装置及方法
CN1826048A (zh) * 2006-03-21 2006-08-30 信利半导体有限公司 在平板显示器上绑定集成线路芯片和软性线路板的工艺方法
EP2784141A2 (en) * 2013-03-26 2014-10-01 FUJIFILM Corporation Anisotropic conductive film and method of making conductive connection

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101995677B (zh) * 2009-08-20 2012-05-30 友达光电(厦门)有限公司 各向异性导电膜贴附装置及贴附方法
CN105984198B (zh) * 2015-02-12 2018-01-12 南昌欧菲光科技有限公司 各向异性导电薄膜贴合机、贴合件的制作方法及触控显示产品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1554971A (zh) * 2003-12-19 2004-12-15 友达光电股份有限公司 各向异性导电胶膜贴附装置及方法
CN1826048A (zh) * 2006-03-21 2006-08-30 信利半导体有限公司 在平板显示器上绑定集成线路芯片和软性线路板的工艺方法
EP2784141A2 (en) * 2013-03-26 2014-10-01 FUJIFILM Corporation Anisotropic conductive film and method of making conductive connection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111770675A (zh) * 2020-06-19 2020-10-13 深圳市联得自动化装备股份有限公司 制作曲面模组的热压方法和热压设备、曲面模组和应用

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WO2019095363A1 (zh) 2019-05-23

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Application publication date: 20200616