WO2019095363A1 - 表面触控压印方法 - Google Patents

表面触控压印方法 Download PDF

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Publication number
WO2019095363A1
WO2019095363A1 PCT/CN2017/111838 CN2017111838W WO2019095363A1 WO 2019095363 A1 WO2019095363 A1 WO 2019095363A1 CN 2017111838 W CN2017111838 W CN 2017111838W WO 2019095363 A1 WO2019095363 A1 WO 2019095363A1
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WO
WIPO (PCT)
Prior art keywords
pressure
imprinted
conductive member
touch
sensitive conductive
Prior art date
Application number
PCT/CN2017/111838
Other languages
English (en)
French (fr)
Inventor
王建华
黄嘉伟
陈鑫
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780096339.8A priority Critical patent/CN111295636A/zh
Priority to PCT/CN2017/111838 priority patent/WO2019095363A1/zh
Publication of WO2019095363A1 publication Critical patent/WO2019095363A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present invention relates to touch forming technology, and more particularly to a surface touch imprinting method.
  • [0002] performed on the surface touching the line are formed using the first embodiment of the touch line formed on the film (Film), made after a touch sensitive sensor (the Sensor) bonded to the surface or the housing cover.
  • the touch line formed on the Film is cut into a shape-required Sensor and attached to the curved cover by using 0CA optical glue.
  • the present invention is to solve the technical problem is to provide a simple fabrication process of the touch surface of the stamping process.
  • the convex portion of the indenter corresponds to a position on the surface to be imprinted to be imprinted, and pressure is applied to press the pressed portion of the pressure sensitive conductive member and the surface to be imprinted to be imprinted The position is pasted, and the portion of the pressure-sensitive conductive member that is embossed forms a touch line.
  • the pressure-sensitive conductive member is a non-conductive material before being pressed, a portion of the pressure-sensitive conductive member that is subjected to pressure becomes conductive, and a portion of the pressure-sensitive conductive member that is not subjected to pressure remains non-conductive. Conductive.
  • the pressure sensitive conductive member comprises an isotropic conductive paste. ⁇ 0 2019/095363 ⁇ (:17 € ⁇ 2017/111838
  • the heteroconductive adhesive contains conductive particles therein, and when the heteroconductive adhesive is subjected to pressure, the conductive particles are turned into a conductor at a position where the pressure is received.
  • the unstressed portion of the pressure-sensitive conductive member remains on the surface to be imprinted.
  • the pressure-sensitive conductive member is a conductive material before being pressed
  • the step of forming the touch-sensitive portion of the pressure-sensitive conductive member to form a touch line further comprises: placing the pressure-sensitive conductive member The portion subjected to the pressure is peeled off from the surface to be imprinted.
  • the surface to be imprinted includes a curved surface.
  • the surface to be imprinted is an inner side surface of the casing.
  • the shape of the end of the raised portion is adapted to the shape of the surface to be stamped that requires an embossed position.
  • the convex portion includes a plurality of grooves formed between adjacent convex portions, and the pressure sensitive conductive member located at the groove position is not under pressure during pressure application. effect.
  • the surface touch imprint method of the present invention has the following beneficial effects:
  • the touch imprint method of the present invention uses a press-fit method to make the pressure-sensitive conductive member electrically conductive after being pressed directly on the casing or the cover material.
  • the surface forms a touch sensing circuit, which realizes the touch function, solves technical problems such as bubbles generated when the glue function sheet is attached to the casing or the cover plate, and simplifies the process and saves cost.
  • FIG. 1 is a surface of the touch imprint method employed in the embodiment indenter anisotropic conductive adhesive laminated to the structural schematic view of the embodiment of the present invention, the surface to be imprinted;
  • FIG. 2 is an anisotropic conductive adhesive in a schematic structural view in FIG. 1 has to be laminated to the embossed surface.
  • the surface touch imprint method in a preferred embodiment of the present invention can press the dissimilar conductive adhesive material on the surface to be imprinted by using a press-fit method.
  • the surface eight forms a touch sensing circuit to realize the touch function.
  • the surface of the touch imprint method comprising the steps of:
  • [0027] 1 provides a ram, the ram provided with a position corresponding to the eight required to be embossed surface of the embossed convex portion 1 1
  • the pressure-sensitive conductive member 2 which is electrically conductive, is attached to the indenter 1 and covers the convex portion 11;
  • the convex portion 11 of the indenter 1 is corresponding to the position on the eight surface to be imprinted to be imprinted, and pressure is applied to adhere the pressed portion of the pressure sensitive conductive member 2 to the position to be imprinted to be imprinted.
  • the portion of the pressure-sensitive conductive member 2 that is embossed forms a touch line.
  • the pressure-sensitive conductive member 2 may not be attached to the indenter 1 , but the pressure-sensitive conductive member that is electrically conductive after being pressed may be attached to the surface to be imprinted. Further, the convex portion 11 of the indenter 1 is corresponding to the position on the eight surfaces to be imprinted to be imprinted, and pressure is applied to adhere the pressed portion of the pressure sensitive conductive member 2 to the position to be imprinted on the surface to be imprinted. The portion where the pressure-sensitive conductive member 2 is embossed forms a touch line.
  • the touch imprint method according to the present invention allows the use of sensitive conductive manner nip member 2 is formed directly on the surface of the casing of the touch sensing circuit 3, to achieve the touch function, the gum solution functional sheet 3 bonded to the surface of the housing It creates technical problems such as bubbles and simplifies the process to save costs.
  • the material properties of the pressure-sensitive conductive member 2 is non-conductive material, the second portion by the pressure-sensitive conductive element becomes conductive, 2 were not pressure sensitive conductive member holding portion before compression Non-conductive.
  • the pressure-sensitive conductive member 2 is in the form of a sheet, which is convenient for covering and covering the indenter 1 , and also makes the thickness of the pressure-sensitive conductive member 2 not too thick, and it is easy to control the strength of the pressing to obtain the touch line.
  • the pressure-sensitive conductive member 2 may be a unitary piece, integrally attached to the indenter 1 , covered by the convex portion 11 , or divided into a plurality of pieces, and respectively covered with corresponding positions of the convex portions 11 .
  • the pressure-sensitive conductive member 2 may also be in the form of a plate, and the thickness may be slightly thicker to increase the strength, which facilitates the integral fit covering the indenter 1.
  • the pressure-sensitive conductive member 2 comprises an isotropic conductive adhesive.
  • the portion of the conductive paste that is embossed forms a touch. line. ⁇ 0 2019/095363 ⁇ (:17 € ⁇ 2017/111838
  • the heterogeneous conductive adhesive material contains a large amount of conductive particles.
  • the conductive particles When the heteroconductive conductive adhesive material receives sufficient pressure, the conductive particles are turned into a conductor at a position where the pressure is received, and the conductive particles are not subjected to pressure. The position remains insulated and the uncompressed portion remains unbonded.
  • the isotropic conductive adhesive is a brittle material, and after the step of pressing and pressing the isotropic conductive adhesive to form the touch line by the portion of the pressure sensitive conductive member 2 , the method further comprises:
  • the unstressed portion of the pressure-sensitive conductive member 2 is peeled off from the surface to be imprinted, so that the pressed position has a touch function.
  • the pressure-sensitive conductive member 2 may also be selected from a pressure-sensitive conductive rubber or a pressure-sensitive adhesive tape, and the conductive property of the pressure-sensitive conductive member 2 after being pressed is pressed by the convex portion 11 in the shell.
  • the surface of the body 3 forms a touch line.
  • the housing 3 is the housing of electronic products, including eight curved surface to be imprinted, and within the side of the housing 3, using a ram projects into the inner side surface of the housing 3, the The pressure sensitive conductive member 2 is pressed to the surface to be embossed
  • the housing 3 may also be a display panel, a cover, etc., which need to have a touch function structure, and the surface to be stamped may also be located on the outer side of the housing 3.
  • the surface to be embossed on the casing 3 may also include a flat surface, and may also include a profiled surface, and the shape of the convex portion 11 matching the plane and the deformed surface on the embossed surface 8 is to be embossed.
  • the upper press forms a touch line, which is not affected by the special shape.
  • the surface to be embossed on the casing 3 may also be a combination of two or more of a curved surface, a flat surface, and a deformed surface, by forming the convex portion 11 into a shape matching the surface to be embossed in advance, thereby Touch lines can be made on some special irregular shapes.
  • the surface to be imprinted is generally an inner side surface of the housing 3 and the like, which is inconvenient to be imprinted.
  • the imprint method of the present invention facilitates imprinting of the inner side surface, and in other embodiments, The imprint method of the present invention performs imprinting on the outer surface of the structure of the casing 3 or the like.
  • the position of the contour surface to be imprinted and needs eight embossed projections on a ram portion 11 may include one or more, to meet the ram to achieve an eight-time stamping surface treated to achieve embossing Just fine.
  • the shape of the end surface of the convex portion 11 is adapted to the shape of the surface to be embossed which requires an embossed position. ⁇ 0 2019/095363 ⁇ (:17 € ⁇ 2017/111838 can ensure that the force is more uniform at each point of the corresponding area of the raised portion 11 when pressing.
  • the pressure-sensitive conductive member 2 In order to ensure that the pressure-sensitive conductive member 2 can be smoothly attached to the indenter 1, the pressure-sensitive conductive member 2 is attached to the indenter 1 or the surface to be imprinted using a three-dimensional bonding device, and is not attached after the bonding.
  • the pressure-sensitive conductive member 2 causes problems such as wrinkles and deformation.
  • portion 11 includes a plurality of projections, each projection portions 11 separated from each other and form a groove between adjacent raised portions 11.
  • the pressure sensitive conductive member 2 such as the opposite conductive adhesive is embossed by the indenter 1 , only the pressure sensitive conductive member 2 at the position where it is attached to the convex portion 11 is subjected to pressure and changes from a non-conductive state to a conductive state, and is located in the groove.
  • the pressure-sensitive conductive member 2 at the position is substantially not subjected to pressure and thus remains in a non-conductive state.
  • the pressure-sensitive conductive member 2 can also be electrically conductive before being imprinted, that is, a conductive colloid.
  • a conductive colloid When the pressure-sensitive conductive member 2 is embossed by the indenter 1 , only the convex portion 11 is used. The pressure-sensitive conductive member 2 at the bonding position is pressed and thus firmly adhered to the casing, and the pressure-sensitive conductive member 2 at the position of the groove is substantially not subjected to pressure, and thus is interposed with the casing 3 .
  • the adhesive force is weak.
  • the region where the pressure-sensitive conductive member 2 is not subjected to pressure can be directly removed by peeling or other means, so that only the pressure-sensitive conductive corresponding to the convex portion 11 remains on the casing 3 . Item 2 .
  • the pressure-sensitive conductive member 2 may be previously attached to a three-dimensional bonding apparatus 3 provided on the surface of the housing, then imprinted by ram 1, as compared to a directly attached to the surface of the ram 1, bonded The process is much simpler.
  • the shape of the convex portion 11 of the indenter 1 or the surface to be imprinted is relatively regular, such as on the same plane, or without a special profiled surface, a concave structure, etc., it is also possible to manually
  • the pressure sensitive conductive member 2 is attached to the indenter 2 .

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Abstract

本发明涉及一种表面触控压印方法，包括以下步骤：提供一种压头，压头上设有与待压印表面上需要压印的位置对应的凸起部；将受压后可导电的压敏导电件贴合到压头上，并覆盖凸起部；或者将受压后可导电的压敏导电件贴合到待压印表面A上；让压头的凸起部与待压印表面上需要压印的位置对应，施加压力使压敏导电件受压部位与待压印表面需要压印的位置黏贴，使压敏导电件受压印的部分形成触控线路。本发明的触控压印方法使用压合方式让受压后可导电的压敏导电件直接在机壳或者盖板材料内表面形成触控感应线路，实现触控功能，解决胶质功能片贴合于机壳或者盖板时产生气泡等技术难题，简化工序节约成本。

Description

\¥0 2019/095363 ?€1^2017/111838 说明书
发明名称:表面触控压印方法
技术领域
0001] 本发明涉及触控成型技术， 更具体地说， 涉及一种表面触控压印方法。
背景技术
[0002] 曲面上进行触控线路成型方案均采用先在胶片 (Film) 上触控线路成型， 制成 触摸感应传感器 (Sensor) 后贴合于曲面机壳或者盖板上。
[0003] 工艺步骤通常为：
[0004] 在 Film上触控线路成型 切割成需要形状的 Sensor 使用 0CA光学胶贴合于曲 面盖板。
[0005] 在将 Sensor贴合于曲面盖板时， 贴合工艺困难， 同时工艺复杂。
技术问题
[0006] 本发明要解决的技术问题在于， 提供一种制作工艺简单的表面触控压印方法。
问题的解决方案
技术解决方案
[0007] 本发明解决其技术问题所采用的技术方案是： 构造一种表面触控压印方法， 包 括以下步骤：
[0008] 提供一种压头， 所述压头上设有与待压印表面上需要压印的位置对应的凸起部
[0009] 将受压后可导电的压敏导电件贴合到所述压头上， 并覆盖所述凸起部； 或者将 受压后可导电的压敏导电件贴合到所述待压印表面上；
[0010] 让所述压头的凸起部与所述待压印表面上需要压印的位置对应， 施加压力使所 述压敏导电件受压部位与所述待压印表面需要压印的位置黏贴， 使所述压敏导 电件受压印的部分形成触控线路。
[0011] 优选地， 所述压敏导电件在受压之前为非导电材料， 所述压敏导电件受压力作 用的部分变成导电， 所述压敏导电件未受压力作用的部分保持非导电。
[0012] 优选地， 所述压敏导电件包括异方导电胶。 \¥0 2019/095363 卩（：17€\2017/111838
[0013] 优选地， 所述异方导电胶里面包含导电微粒， 当所述异方导电胶受到压力时， 导电微粒在接受到压力的位置导通变成导体。
[0014] 优选地， 所述压敏导电件未受压力的部分保留在所述待压印表面上。
[0015] 优选地， 所述压敏导电件在受压之前为导电材料， 使所述压敏导电件受压印的 部分形成触控线路的步骤之后还包括： 将所述压敏导电件未受压力的部位从所 述待压印表面上剥离。
[0016] 优选地， 所述待压印表面包括曲面。
[0017] 优选地， 所述待压印表面为壳体的内侧面。
[0018] 优选地， 所述凸起部的端部外形与所述待压印表面上需要压印位置的外形相适 配。
[0019] 优选地， 所述凸起部包括多个， 相邻所述凸起部之间形成沟槽， 在施加压力的 过程中， 位于沟槽位置处的所述压敏导电件未受压力作用。
发明的有益效果
有益效果
[0020] 实施本发明的表面触控压印方法， 具有以下有益效果： 本发明的触控压印方法 使用压合方式让受压后可导电的压敏导电件直接在机壳或者盖板材料表面形成 触控感应线路， 实现触控功能， 解决胶质功能片贴合于机壳或者盖板时产生气 泡等技术难题， 简化工序节约成本。
对附图的简要说明
附图说明
[0021] 下面将结合附图及实施例对本发明作进一步说明， 附图中：
[0022] 图 1是本发明实施例中的表面触控压印方法采用压头将异方导电胶压合到待压 印表面时的结构示意图；
[0023] 图 2是图 1中的异方导电胶已经压合到待压印表面时的结构示意图。
实施该发明的最佳实施例
本发明的最佳实施方式
[0024] 为了对本发明的技术特征、 目的和效果有更加清楚的理解， 现对照附图详细说 \¥0 2019/095363 卩（：17€\2017/111838 明本发明的具体实施方式。
[0025] 如图 1、 图 2所示， 本发明一个优选实施例中的表面触控压印方法可以使用压合 方式将异方导电胶材料在待压印表面八压印， 在待压印表面八形成触控感应线路 ， 实现触控功能。
[0026] 在一些实施例中， 表面触控压印方法包括以下步骤：
[0027] 提供一种压头 1， 压头 1上设有与待压印表面八上需要压印的位置对应的凸起部 1
1
[0028] 将受压后可导电的压敏导电件 2贴合到压头 1上， 并覆盖凸起部 11;
[0029] 让压头 1的凸起部 11与待压印表面八上需要压印的位置对应， 施加压力使压敏导 电件 2受压部位与待压印表面八需要压印的位置黏贴， 使压敏导电件 2受压印的部 分形成触控线路。
[0030] 在其他实施例中， 也可不将压敏导电件 2贴合到压头 1上， 而是将受压后可导电 的压敏导电件贴合到所述待压印表面八上， 再另外让压头 1的凸起部 11与待压印 表面八上需要压印的位置对应， 施加压力使压敏导电件 2受压部位与待压印表面八 需要压印的位置黏贴， 使压敏导电件 2受压印的部分形成触控线路。
[0031] 本发明的触控压印方法使用压合方式让压敏导电件 2直接在壳体 3表面形成触控 感应线路， 实现触控功能， 解决胶质功能片贴合于壳体 3表面时产生气泡等技术 难题， 简化工序节约成本。
[0032] 进一步地， 压敏导电件 2的材料特性为在受压之前为非导电材料， 压敏导电件 2 受压力作用的部分变成导电， 压敏导电件 2未受压力作用的部分保持非导电。
[0033] 优选地， 压敏导电件 2为片状， 便于贴合覆盖到压头 1上， 也让压敏导电件 2的 厚度不会太厚， 容易控制压合的力度来得到触控线路。 压敏导电件 2可以为整体 的一块， 整体贴合到压头 1， 将凸起部 11覆盖， 也可以分为多块， 分别将各凸起 部 11对应的位置覆盖住。
[0034] 在其他实施例中， 压敏导电件 2也可为板状， 厚度可以稍厚， 提升强度， 利于 整体贴合覆盖到压头 1上。
[0035] 优选地， 压敏导电件 2包括异方导电胶， 在被凸起部 11压合到待压印表面八需 要压印的位置时， 异方导电胶受压印的部分形成触控线路。 \¥0 2019/095363 卩（：17€\2017/111838
[0036] 异方导电胶材料里面包含大量的导电微粒， 当异方导电胶材料接受到足够的压 力时， 导电微粒在接受到压力的位置导通变成导体， 导电微粒在未接受到压力 的位置仍旧保持绝缘， 且未受压部分保持未粘结状态。
[0037] 进一步地， 异方导电胶为脆性材料， 在异方导电胶受压压合， 使压敏导电件 2 受压印的部分形成触控线路的步骤之后还包括：
[0038] 将压敏导电件 2未受力的部位从待压印表面八剥离， 从而让受压位置带有触控功 能。
[0039] 由于未受压力的位置仍是绝缘的， 因此在后续的制程中也可以不必剥离， 仍旧 可以保留在待压印表面八。
[0040] 在其他实施例中， 压敏导电件 2也可选用压敏导电橡胶或压敏胶带， 利用压敏 导电件 2受压后导电的特性， 被凸起部 11压合后， 在壳体 3表面形成触控线路。
[0041] 在本实施例中， 壳体 3为电子产品的机壳， 待压印表面八包括曲面， 且位于壳体 3的内侧面， 利用压头 1伸入到壳体 3内侧面， 将压敏导电件 2压合到待压印表面八
[0042] 在其他实施例中， 壳体 3也可为显示面板、 盖板等需要带有触控功能结构件， 待压印表面八则也可以位于壳体 3的外侧面。
[0043] 进一步地， 壳体 3上的待压印面八也可包括平面， 也可包括异形面， 利用凸起部 11与待压印面八上的平面、异形面匹配的外形在待压印面八上压合形成触控线路 ， 不受特殊外形的影响。
[0044] 另外， 壳体 3上的待压印面也可为曲面、平面、异形面中的两种或多种的组合 ， 通过预先将凸起部 11制作成与待压印面匹配的形状， 从而可以在一些特殊的 不规则的外形面上制作触控线路。
[0045] 进一步地， 待压印表面八通常为壳体 3等结构不方便进行压印的内侧面， 采用本 发明的压印方法便于对内侧面压印， 在其他实施例中， 也可采用本发明的压印 方法在壳体 3等结构的外表面上进行压印。
[0046] 根据待压印表面八的外形和需要压印的位置， 压头 1上的凸起部 11可以包括一个 或多个， 能满足压头 1对待压印表面八实现一次性实现压印即可。
[0047] 优选地， 凸起部 11的端面外形与待压印表面八上需要压印位置的外形相适配， \¥0 2019/095363 卩（：17€\2017/111838 能保证在压合时， 凸起部 11对应区域的各点上受力更加均匀。
[0048] 为了保证压敏导电件 2能平稳的贴合到压头 1上， 压敏导电件 2使用三维贴合设 备贴合到压头 1或待压印表面八上， 在贴合后不会使压敏导电件 2产生褶皱、 变形 等问题。
[0049] 进一步地， 本实施例中， 凸起部 11包括多个， 各凸起部 11相互分离， 且相邻凸 起部 11之间形成沟槽。 采用压头 1压印异方导电胶等压敏导电件 2时， 只有与凸 起部 11贴合位置处的压敏导电件 2会受到压力而由不导电状态变成导电状态， 位 于沟槽位置处的压敏导电件 2基本不会受到压力因而仍然保持不导电状态。
[0050] 当然， 在其他实施方式当中， 压敏导电件 2在压印之前本身也可导电， 即为导 电性胶体， 采用压头 1压印压敏导电件 2时， 只有与凸起部 11贴合位置处的压敏 导电件 2受到压力， 因而会牢固地粘贴于壳体上， 而位于沟槽位置处的压敏导电 件 2由于基本没有受到压力的作用， 因而与壳体 3之间的粘力较弱， 在后续的制 程中， 可采用剥离或其他方式直接将压敏导电件 2没有受到压力的区域去除， 使 得壳体 3上仅留下与凸起部 11对应的压敏导电件 2。
[0051] 进一步地， 压敏导电件 2也可以预先使用三维贴合设备贴设在壳体 3表面， 然后 再通过压头 1进行压印， 相比于直接贴在压头 1表面， 贴合过程更为简单。
[0052] 若压头 1的凸起部 11或待压印表面八的外形比较规则， 如在同一平面上， 或没有 特殊异形面、 内凹结构等难贴合的外形时， 也可采用手动的方式将压敏导电件 2 贴合到压头 2上。
[0053] 可以理解地， 上述各技术特征可以任意组合使用而不受限制。
[0054] 以上所述仅为本发明的实施例， 并非因此限制本发明的专利范围， 凡是利用本 发明说明书及附图内容所作的等效结构或等效流程变换， 或直接或间接运用在 其他相关的技术领域， 均同理包括在本发明的专利保护范围内。

Claims

\¥0 2019/095363 卩（：17€\2017/111838 权利要求书
[权利要求 1] 一种表面触控压印方法， 其特征在于， 包括以下步骤：
提供一种压头 （1） ， 所述压头 （1） 上设有与待压印表面 （ ） 上需 要压印的位置对应的凸起部 （11）
将受压后可导电的压敏导电件 （2） 贴合到所述压头 （1） 上， 并覆盖 所述凸起部 （11） 或者将受压后可导电的压敏导电件贴合到所述待 压印表面 （八） 上；
让所述压头 （1） 的凸起部 （11） 与所述待压印表面 （八） 上需要压 印的位置对应， 施加压力使所述压敏导电件 （2） 受压部位与所述待 压印表面 （八） 需要压印的位置黏贴， 使所述压敏导电件 （2） 受压 印的部分形成触控线路。
[权利要求 2] 根据权利要求 1所述的表面触控压印方法， 其特征在于， 所述压敏导 电件 （2） 在受压之前为非导电材料， 所述压敏导电件 （2） 受压力作 用的部分变成导电， 所述压敏导电件 （2） 未受压力作用的部分保持 非导电。
[权利要求 3] 根据权利要求 2所述的表面触控压印方法， 其特征在于， 所述压敏导 电件 （2） 包括异方导电胶。
[权利要求 4] 根据权利要求 3所述的表面触控压印方法， 其特征在于， 所述异方导 电胶 （2） 里面包含导电微粒， 当所述异方导电胶 （2） 受到压力时， 导电微粒在接受到压力的位置导通变成导体。
[权利要求 5] 根据权利要求 1至 4任一项所述的表面触控压印方法， 其特征在于， 所 述压敏导电件 （2） 未受压力的部分保留在所述待压印表面 （八） 上
[权利要求 6] 根据权利要求 1至 4任一项所述的表面触控压印方法， 其特征在于， 所 述压敏导电件 （2） 在受压之前为导电材料， 使所述压敏导电件 （2） 受压印的部分形成触控线路的步骤之后还包括： 将所述压敏导电件 （ 2） 未受压力的部位从所述待压印表面 （八） 上剥离。
[权利要求 7] 根据权利要求 1至 4任一项所述的表面触控压印方法， 其特征在于， 所 \¥0 2019/095363 卩（：17€\2017/111838 述待压印表面 （八） 包括曲面。
[权利要求 8] 根据权利要求 7所述的表面触控压印方法， 其特征在于， 所述待压印 表面 （八） 为壳体 （3） 的内侧面。
[权利要求 9] 根据权利要求 7所述的表面触控压印方法， 其特征在于， 所述凸起部 （11） 的端部外形与所述待压印表面 （八） 上需要压印位置的外形相 适配。
[权利要求 10] 根据权利要求 1至 4任一项所述的表面触控压印方法， 其特征在于， 所 述凸起部 （11） 包括多个， 相邻所述凸起部 （11） 之间形成沟槽， 在 施加压力的过程中， 位于沟槽位置处的所述压敏导电件 （2） 未受压 力作用。
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