JP5104687B2 - 接合シート及び電子回路装置並びに製造方法 - Google Patents
接合シート及び電子回路装置並びに製造方法 Download PDFInfo
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- JP5104687B2 JP5104687B2 JP2008241045A JP2008241045A JP5104687B2 JP 5104687 B2 JP5104687 B2 JP 5104687B2 JP 2008241045 A JP2008241045 A JP 2008241045A JP 2008241045 A JP2008241045 A JP 2008241045A JP 5104687 B2 JP5104687 B2 JP 5104687B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29075—Plural core members
- H01L2224/29076—Plural core members being mutually engaged together, e.g. through inserts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/811—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/81101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector the bump connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a bump connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Description
図1(a)は、本発明の実施形態に係る接合シート20の構造を示す斜視図であり、図1(b)は、同じく上面図であり、図1(c)は、同じく横断面図である。
図2は、接合シート20を用いた電子回路装置30の構成を説明する図であり、図2(a)は電子回路30の横断面図を、図2(b)は図2(a)のAA線で切断した断面図を、図2(c)は図2(a)のB部の拡大図をそれぞれ示している。
次に、電子回路装置30の製造方法を図3を参照しながら説明する。
2 接着剤充填部
3 導電性接着剤
4 ICパッケージ
5 端子電極
6 電極バンプ
7 回路基板
8 凹部
9 電極パッド
10 熱源
20 接合シート
30 電子回路装置
Claims (14)
- 電子部品と回路基板の間に介在して、前記電子部品を前記回路基板に固定するとともに、前記電子部品の端子電極と前記回路基板の電極パッドを電気的に接続する接合シートにおいて、
絶縁性素材からなるシート状の基材の内部に導電性接着剤を充填した接着剤充填部を有し、
前記接着剤充填部は、前記電子部品の端子電極に対応する位置に前記端子電極ごとに独立に配置されている
ことを特徴とする接合シート。 - 前記電子部品はICパッケージである
ことを特徴とする請求項1に記載の接合シート。 - 前記基材は弾性材料からなる
ことを特徴とする請求項1に記載の接合シート。 - 前記基材はゴムからなる
ことを特徴とする請求項3に記載の接合シート。 - 前記導電性接着剤は、接着樹脂と導電性粒子の混合物である
ことを特徴とする請求項1に記載の接合シート。 - 前記導電性粒子は、Ag、Pd、Ni、Au、Cu、C、Pt、Fe、Tiの少なくとも1つを含有する
ことを特徴とする請求項5に記載の接合シート。 - 前記接着樹脂は熱硬化性樹脂である
ことを特徴とする請求項5に記載の接合シート。 - 前記熱硬化性樹脂は、フェノール樹脂、ポリイミド樹脂、メラミン樹脂、あるいは尿素樹脂のいずれかである
ことを特徴とする請求項7に記載の接合シート。 - 前記接着樹脂は熱可塑性樹脂である
ことを特徴とする請求項5に記載の接合シート。 - 前記熱可塑性樹脂は、スチレン樹脂、アクリル樹脂、あるいはEVA樹脂のいずれかである
ことを特徴とする請求項9に記載の接合シート。 - 請求項1に記載の接合シートを電子部品と回路基板の間に介在させて、前記電子部品を前記回路基板に固定するとともに、前記電子部品の端子電極と前記回路基板の電極パッドを電気的に接続してなる電子回路装置において、
前記電子部品は、前記端子電極から突出する電極バンプを有し、
前記電極パッドは、前記回路基板に前記電極パッド毎に独立して設けられた凹部の底面に配置され、
前記電極バンプは、前記接着剤充填部を通って前記接合シートの裏面に突出し、さらに前記凹部に進入していて、
前記電極バンプと前記電極パッドの間の隙間は、前記接着剤充填部から前記凹部に流出した前記導電性接着剤で埋められている
ことを特徴とする電子回路装置。 - 請求項11に記載の電子回路装置を製造する電子回路装置の製造方法において、
前記接着剤充填部が、それに対応する前記凹部の真上に来るように位置を合わせて、前記接合シートを前記回路基板の上に載置するシート載置工程と、
前記電極バンプが、それに対応する前記接着剤充填部の真上に来るように位置を合わせて、前記電子部品を前記接合シートの上に載置して、さらに、前記電子部品を押圧して前記電極バンプを、前記接合シートの裏面から突出させる電子回路部品取付工程と、
前記接着剤充填部から前記凹部に流入した前記導電性接着剤を固化させる固定工程を備える
ことを特徴とする電子回路装置の製造方法。 - 前記導電性接着剤の接着樹脂は熱硬化性樹脂であって、
前記固定工程は、前記回路基板を加熱する加熱工程を有する
ことを特徴とする請求項12に記載の電子回路装置の製造方法。 - 前記導電性接着剤の接着樹脂は熱可塑性樹脂であって、
前記シート載置工程に先立って、前記接合シートを加熱する加熱工程を有するとともに、
前記固定工程は、前記回路基板を冷却する冷却工程を有する
ことを特徴とする請求項12に記載の電子回路装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008241045A JP5104687B2 (ja) | 2008-09-19 | 2008-09-19 | 接合シート及び電子回路装置並びに製造方法 |
US12/556,061 US8822836B2 (en) | 2008-09-19 | 2009-09-09 | Bonding sheet, electronic circuit device and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008241045A JP5104687B2 (ja) | 2008-09-19 | 2008-09-19 | 接合シート及び電子回路装置並びに製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2010073972A JP2010073972A (ja) | 2010-04-02 |
JP5104687B2 true JP5104687B2 (ja) | 2012-12-19 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2008241045A Expired - Fee Related JP5104687B2 (ja) | 2008-09-19 | 2008-09-19 | 接合シート及び電子回路装置並びに製造方法 |
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US (1) | US8822836B2 (ja) |
JP (1) | JP5104687B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2687704C2 (ru) * | 2014-03-28 | 2019-05-15 | Секисуй Кемикал Ко., Лтд. | Прокладочная пленка для многослойного стекла и многослойное стекло |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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ITMI20111777A1 (it) * | 2011-09-30 | 2013-03-31 | St Microelectronics Srl | Sistema elettronico per saldatura ad onda |
JP5714631B2 (ja) * | 2013-03-26 | 2015-05-07 | 富士フイルム株式会社 | 異方導電性シート及び導通接続方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6386322A (ja) * | 1986-09-30 | 1988-04-16 | ソニ−ケミカル株式会社 | 導電異方性接着剤シ−ト |
JP3923248B2 (ja) * | 1996-12-27 | 2007-05-30 | 松下電器産業株式会社 | 回路基板への電子部品の実装方法及び回路基板 |
JP3954177B2 (ja) * | 1997-01-29 | 2007-08-08 | 日本碍子株式会社 | 金属部材とセラミックス部材との接合構造およびその製造方法 |
JP2001189337A (ja) | 1999-12-28 | 2001-07-10 | Matsushita Electric Ind Co Ltd | 電極バンプおよびそれを用いた半導体素子並びに半導体装置 |
US6759596B1 (en) * | 2000-05-12 | 2004-07-06 | Shipley Company | Sequential build circuit board |
JP3549017B2 (ja) | 2000-07-21 | 2004-08-04 | 松下電器産業株式会社 | フリップチップ実装方法 |
JP3874062B2 (ja) * | 2000-09-05 | 2007-01-31 | セイコーエプソン株式会社 | 半導体装置 |
JP2005184022A (ja) * | 2000-12-14 | 2005-07-07 | Hitachi Chem Co Ltd | 接続用熱・電気伝導性フィルム及びその用途 |
JP3782753B2 (ja) * | 2001-04-25 | 2006-06-07 | 松下電器産業株式会社 | 半導体装置の製造方法および半導体装置 |
MY140754A (en) * | 2001-12-25 | 2010-01-15 | Hitachi Chemical Co Ltd | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof |
JP2006032632A (ja) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | 実装構造およびその製造方法 |
JP4970767B2 (ja) * | 2005-10-26 | 2012-07-11 | リンテック株式会社 | 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法 |
-
2008
- 2008-09-19 JP JP2008241045A patent/JP5104687B2/ja not_active Expired - Fee Related
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2009
- 2009-09-09 US US12/556,061 patent/US8822836B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2687704C2 (ru) * | 2014-03-28 | 2019-05-15 | Секисуй Кемикал Ко., Лтд. | Прокладочная пленка для многослойного стекла и многослойное стекло |
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Publication number | Publication date |
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US8822836B2 (en) | 2014-09-02 |
US20100071945A1 (en) | 2010-03-25 |
JP2010073972A (ja) | 2010-04-02 |
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