JP2014191892A - 異方導電性シート及び導通接続方法 - Google Patents
異方導電性シート及び導通接続方法 Download PDFInfo
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- JP2014191892A JP2014191892A JP2013064063A JP2013064063A JP2014191892A JP 2014191892 A JP2014191892 A JP 2014191892A JP 2013064063 A JP2013064063 A JP 2013064063A JP 2013064063 A JP2013064063 A JP 2013064063A JP 2014191892 A JP2014191892 A JP 2014191892A
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- conductive
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- particle holding
- conductive sheet
- anisotropic conductive
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Abstract
【解決手段】第1の含有率で絶縁性フィラーを含み、面状に形成される絶縁領域と、絶縁領域の内部に形成される導電性保持領域であって、導電性粒子並びに第1の含有率より低い第2の含有率で絶縁性フィラーを含み、絶縁領域の面方向に離散して配置される導電性粒子保持領域とを有する異方導電性シートによって上記課題を解決する。
【選択図】図5
Description
図1は、従来の異方導電性材料を用いた実装方法を示す模式図である。この実装装置は、被実装部材を載置する載置部20、実装部材を保持する保持部30から構成される。ここでは、異方導電性フィルム(ACF)40を用いて実装基板22にIC(Integrated Circuit)32を実装し、実装基板22に設けられたパッド電極24とIC32に設けられたパッド電極34上に形成されたバンプ36とを電気的に接続する例を説明する。
〔実装装置の構成〕
図2は、本実施形態に係る実装装置10の電気的構成を示すブロック図である。同図に示すように、実装装置10は、載置部20、保持部30、加圧部50、加熱部52、制御部54等を備えて構成される。
図3(a)は、本実施形態に係るACF100(異方導電性シートの一例)の上面図であり、図3(b)はその一部の拡大図、図3(c)は図3(b)のA−A線における断面図である。図3に示すように、ACF100は、ベース基材として平面状(面状の一例)に形成される構造接着部102(絶縁領域の一例)と、ACF100の面方向に離散して配置され、ACF100の厚み方向の内側に形成される導電性粒子保持部104(絶縁領域の内部に形成される導電性粒子保持領域の一例)とから構成される。ACF100は、薄いシート状部材であり、容易に曲げることが可能である。ここでは平面状と表現しているが、曲面状に曲げられた状態を排除しているものではない。
図5は、ACF100を用いた実装方法(導通接続方法の一例)を示す模式図である。図1と同様に、ACF100を用いて実装基板22(第1の部材の一例)にIC32(第2の部材の一例)を実装し、パッド電極24(第1の電極の一例)とバンプ36(第2の電極の一例)とを電気的に接続する例を説明する。
図6は、IC32のパッド電極34及び実装基板22のパッド電極24の配置間隔と、ACF100の導電性粒子保持部104の配置間隔が均等の場合を示す図である。このように導電性粒子保持部104を配置する態様も可能である。
図8は、ACF140の製造方法を示すフローチャートである。また、図9は、図8に示す各工程の断面図である。
まず、鋳型200を作成する(図9(a)参照)。鋳型200は、導電性粒子保持部144を形成するためのものであり、導電性粒子保持部144と同形状、同配置の凹部202を設ける。
鋳型200の上面(凹部202が形成された面)に導電性粒子を含有した樹脂組成物146を塗布し、鋳型200の凹部202を樹脂組成物146で充填する。このとき、導電性粒子の含有量の少ない、又は導電性粒子を含まない樹脂組成物146を凹部202に適量充填し、その後導電性粒子の含有量の多い樹脂組成物146を充填することで、ACF140の厚み方向に導電性粒子の分布を持たせることができる。
仮加熱を行い、鋳型200の凹部202に充填した樹脂組成物146を仮硬化させる。この仮加熱によって硬化した樹脂組成物146により、導電性粒子保持部144が形成される(図9(b)参照)。
鋳型200の上面から剥離シート108を添付する(図9(c)参照)。
剥離シート108を鋳型200から剥離し、導電性粒子保持部144を鋳型200から取り出す(離型)。図9(d)は、離型した剥離シート108の天地を図9(c)とは反転し、導電性粒子保持部144を上側として示している。
剥離シート108上に形成された導電性粒子保持部144の上面に、構造接着用の樹脂組成物148を塗布する。
最後に、仮加熱を行い、構造接着用の樹脂組成物148を仮硬化させる。この仮加熱によって硬化した樹脂組成物148により、構造接着部142が形成される(図9(e)参照)。
〔ACFの構成〕
図10は、第2の実施形態に係るACFを示す拡大断面図である。ここでは、構造接着部、導電性粒子保持部を構成する樹脂やフィラー、導電性粒子は第1の実施形態と同様であり、構造接着部及び導電性粒子保持部の形状が異なっている。
図11は、図10(a)に示したACF150の製造方法を示すフローチャートである。また、図12は、図11に示す各工程の断面図である。ここでは、鋳型200を用いずに製造する方法を説明する。
製造するACF150と同サイズの剥離シート108の全面に、界面活性剤を含有する親水性材料を塗布し、親水性皮膜210を生成する。ここで、剥離シート108は、疎水性を有する材料を用いている。
ステップS11においてパターンを転写した親水性皮膜210を現像し、純水で洗浄する。これにより、UV露光により硬化した親水性皮膜210によって親水性部パターン212が形成される。したがって、親水性部パターン212は、形成しようとする導電性粒子保持部154の底面と同形状、及び同ピッチで形成される(図12(b)参照)。
親水性部パターン212が形成された剥離シート108の上面に、導電性粒子を含有した樹脂組成物156を塗布する(図12(c)参照)。塗布後、自重により導電性粒子が下部に集まることで、ACF150の厚み方向に導電性粒子の分布を持たせることができる。なお、導電性粒子の含有量の多い樹脂組成物156を適量塗布し、その後導電性粒子の含有量の少ない、又は導電性粒子を含まない樹脂組成物156を塗布することで、ACF150の厚み方向に導電性粒子の分布を持たせてもよいし、磁気力や静電力を用いて導電性粒子を下部に引き寄せてもよい。
剥離シート108の上面に塗布された樹脂組成物156は、自己組織化によって、親水性部パターン212以外の領域に半球形状の構造体を形成する。
仮加熱を行い、自己組織化によって形成された構造体を仮硬化させる。この仮加熱によって硬化した樹脂組成物156により、導電性粒子保持部154が形成される(図12(d)参照)。
剥離シート108上に形成された導電性粒子保持部154の上面に、構造接着用の樹脂組成物158を塗布する。
最後に、仮加熱を行い、構造接着用の樹脂組成物158を仮硬化させる。この仮加熱によって硬化した樹脂組成物158により、構造接着部152が形成される(図12(e)参照)。
図13は、図10(b)に示したACF160の製造方法を示すフローチャートである。また、図14は、図13に示す各工程の断面図である。
製造するACF160と同サイズの剥離シート108の全面に、界面活性剤を含有する疎水性材料を塗布し、疎水性皮膜230を生成する。ここで、剥離シート108は、親水性を有する材料を用いている。
ステップS21においてパターンを転写した疎水性皮膜230を現像し、純水で洗浄する。これにより、UV露光により硬化した疎水性皮膜230によって疎水性部パターン232が形成される。したがって、疎水性部パターン232は、形成しようとする導電性粒子保持部164の底面と同形状、及び同ピッチで形成される(図14(b)参照)。
疎水性部パターン232が形成された剥離シート108の上面に、導電性粒子を含有した樹脂組成物166を塗布する(図14(c)参照)。ACF160の厚み方向に導電性粒子の分布を持たせる方法については、ACF150の場合と同様である。
剥離シート108の上面に塗布された樹脂組成物166は、自己組織化によって、疎水性部パターン232の領域に半球形状の構造体を形成する。
仮加熱を行い、自己組織化によって形成された構造体を仮硬化させる。この仮加熱によって硬化した樹脂組成物166により、導電性粒子保持部164が形成される(図14(d)参照)。
剥離シート108上に形成された導電性粒子保持部164の上面に、構造接着用の樹脂組成物168を塗布する。
最後に、仮加熱を行い、構造接着用の樹脂組成物168を仮硬化させる。この仮加熱によって硬化した樹脂組成物168により、構造接着部152が形成される(図14(e)参照)。
図15は、図10(c)に示したACF170の製造方法を示すフローチャートである。また、図16は、図15に示す各工程の断面図である。
製造するACF170と同サイズの剥離シート108の全面に、界面活性剤を含有する疎水性材料を塗布し、疎水性皮膜240を生成する。ここで、剥離シート108は、親水性を有する材料を用いている。
ステップS31においてパターンを転写した疎水性皮膜240を現像し、純水で洗浄する。これにより、UV露光により硬化した疎水性皮膜240によって疎水性部パターン242が形成される。したがって、疎水性部パターン242が形成されていない領域は、形成しようとする導電性粒子保持部174の底面と同形状、及び同ピッチとなる(図16(b)参照)。
疎水性部パターン242が形成された剥離シート108の上面に、構造接着用の樹脂組成物176を塗布する(図16(c)参照)。ACF170の厚み方向に導電性粒子の分布を持たせる方法については、ACF150の場合と同様である。
剥離シート108の上面に塗布された樹脂組成物176は、自己組織化によって、疎水性部パターン242の領域に半球形状の構造体を形成する。
仮加熱を行い、自己組織化によって形成された構造体を仮硬化させる。この仮加熱によって硬化した樹脂組成物176により、構造接着部172が形成される(図16(d)参照)。
剥離シート108上に形成された構造接着部172の上面に、導電性粒子を含有した導電性粒子保持用の樹脂組成物178を塗布する。この樹脂組成物178により形成される導電性粒子保持部174は、それぞれ独立した(離散した)領域とする必要があるため、樹脂組成物178の塗布は、すでに形成されている構造接着部172の高さを超えない量で行う。
仮加熱を行い、導電性粒子保持用の樹脂組成物178を仮硬化させる。この仮加熱によって硬化した樹脂組成物178により、導電性粒子保持部174が形成される(図16(e)参照)。
本態様に係るACFは、一例として、インクジェットヘッド周辺の回路基板のIC実装に用いることができる。特に、水性インクを用いるインクジェット記録装置では、インクジェットヘッド周りが高湿度環境に晒されるため、インクジェットヘッドの駆動IC等の実装基板の耐湿性を向上させる必要がある。
Claims (13)
- 第1の含有率で絶縁性フィラーを含み、面状に形成される絶縁領域と、
前記絶縁領域の内部に形成される導電性保持領域であって、導電性粒子並びに前記第1の含有率より低い第2の含有率で絶縁性フィラーを含み、前記絶縁領域の面方向に離散して配置される導電性粒子保持領域と、
を有する異方導電性シート。 - 第1の電極が設けられた第1の部材と第2の電極が設けられた第2の部材との間に配置され、前記厚み方向に加圧されることで、前記第1の部材と前記第2の部材とを前記絶縁領域で接着し、かつ前記第1の電極と前記第2の電極とを前記導電性粒子によって電気的に導通させる請求項1に記載の異方導電性シート。
- 前記絶縁領域は、前記導電性粒子保持領域よりも粘度が高い請求項1又は2に記載の異方導電性シート。
- 前記絶縁領域は、構造接着剤を含む請求項1から3のいずれか1項に記載の異方導電性シート。
- 前記構造接着剤は、熱架橋反応を用いる請求項4に記載の異方導電性シート。
- 前記導電性粒子保持領域は、前記厚み方向に導電性粒子の分布を有する請求項1から5のいずれか1項に記載の異方導電性シート。
- 前記導電性粒子保持領域は、前記絶縁領域が形成する上面及び下面の少なくとも一方の面において露出している請求項1から6のいずれか1項に記載の異方導電性シート。
- 前記導電性粒子保持領域は、前記露出している面を底面とする円柱形、円錐台形、円錐形、糸巻き形、及び半球形のいずれかの形状で形成される請求項7に記載の異方導電性シート。
- 前記導電性粒子保持領域は、30000〜60000個/mm2の濃度で前記導電性粒子を含む請求項1から8のいずれか1項に記載の異方導電性シート。
- 前記導電性粒子は、金属単体の粒子又は樹脂の核を有したコアシェル構造の粒子である請求項1から9のいずれか1項に記載の異方導電性シート。
- 前記絶縁性フィラーはシリカである請求項1から10のいずれか1項に記載の異方導電性シート。
- 前記導電性粒子保持領域は、前記絶縁領域の面に含まれるX方向及び該X方向に直交し前記面に含まれるY方向に沿って一定の間隔で配置される請求項1から11のいずれか1項に記載の異方導電性シート。
- 第1の電極が設けられた第1の部材に請求項1から10のいずれか1項に記載の異方導電性シートを仮接着する仮接着工程と、
前記異方導電性シートが仮接着された第1の部材の第1の電極と、第2の部材に設けられた第2の電極とを対向させて保持する保持工程と、
前記第1の部材と前記第2の部材とを押圧する押圧工程と、
前記異方導電性シートを加熱する加熱工程と、
を備えた導通接続方法。
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US14/224,003 US20140290059A1 (en) | 2013-03-26 | 2014-03-24 | Anisotropic conductive film and method of making conductive connection |
EP20140161541 EP2784141A3 (en) | 2013-03-26 | 2014-03-25 | Anisotropic conductive film and method of making conductive connection |
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JP2016092004A (ja) * | 2014-10-31 | 2016-05-23 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN108574158A (zh) * | 2017-03-14 | 2018-09-25 | 群创光电股份有限公司 | 显示装置及其制造方法 |
WO2019074060A1 (ja) * | 2017-10-12 | 2019-04-18 | 富士フイルム株式会社 | 複合材 |
JP2022544451A (ja) * | 2018-07-12 | 2022-10-19 | エイチアンドエス ハイ テック コーポレーション | 異方性導電接着フィルムの製造方法 |
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