JP5656140B2 - 純タングステンコンタクトおよびラインを形成する方法及び半導体基板の製造方法 - Google Patents
純タングステンコンタクトおよびラインを形成する方法及び半導体基板の製造方法 Download PDFInfo
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- JP5656140B2 JP5656140B2 JP2008325333A JP2008325333A JP5656140B2 JP 5656140 B2 JP5656140 B2 JP 5656140B2 JP 2008325333 A JP2008325333 A JP 2008325333A JP 2008325333 A JP2008325333 A JP 2008325333A JP 5656140 B2 JP5656140 B2 JP 5656140B2
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- 239000010937 tungsten Substances 0.000 title claims description 289
- 229910052721 tungsten Inorganic materials 0.000 title claims description 289
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims description 283
- 238000000034 method Methods 0.000 title claims description 96
- 239000000758 substrate Substances 0.000 title claims description 59
- 239000004065 semiconductor Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000000151 deposition Methods 0.000 claims description 71
- 239000002243 precursor Substances 0.000 claims description 46
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 29
- 125000002524 organometallic group Chemical group 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 21
- 239000003638 chemical reducing agent Substances 0.000 claims description 19
- 230000006911 nucleation Effects 0.000 claims description 15
- 238000010899 nucleation Methods 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 150000003658 tungsten compounds Chemical class 0.000 claims description 4
- 239000010408 film Substances 0.000 description 122
- 239000010410 layer Substances 0.000 description 76
- 230000004888 barrier function Effects 0.000 description 53
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 36
- 230000008569 process Effects 0.000 description 30
- 230000008021 deposition Effects 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- 239000010936 titanium Substances 0.000 description 21
- 238000000231 atomic layer deposition Methods 0.000 description 13
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000007789 gas Substances 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- -1 tungsten nitride Chemical class 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000005137 deposition process Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 230000002411 adverse Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229910021332 silicide Inorganic materials 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- RLJUCKFARAQBDA-UHFFFAOYSA-N C(C)C1(C=CC=C1)[W](N=O)(=C=O)=C=O Chemical compound C(C)C1(C=CC=C1)[W](N=O)(=C=O)=C=O RLJUCKFARAQBDA-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005234 chemical deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- MMMVJDFEFZDIIM-UHFFFAOYSA-N 2-$l^{1}-azanyl-2-methylpropane Chemical compound CC(C)(C)[N] MMMVJDFEFZDIIM-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910019001 CoSi Inorganic materials 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 229910005883 NiSi Inorganic materials 0.000 description 1
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical group O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- FQNHWXHRAUXLFU-UHFFFAOYSA-N carbon monoxide;tungsten Chemical group [W].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] FQNHWXHRAUXLFU-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28568—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising transition metals
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76876—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for deposition from the gas phase, e.g. CVD
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53257—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a refractory metal
- H01L23/53266—Additional layers associated with refractory-metal layers, e.g. adhesion, barrier, cladding layers
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Description
以下の説明では、本発明の完全なる理解をもたらすべく、タングステン膜の形成に関する多数の具体的な詳細が記載される。好適な方法は、以下に詳細に説明するタングステン核生成層を還元剤パルスにさらす工程を含む。本願明細書中に示される特定の方法および構造の修正、改造、または、変更も当業者にとっては明らかであり、本発明の範囲に含まれる。
有機金属タングステン(OMW)前駆物質
タングステンリッチ膜の組成および特性
1)低温のCVDまたはALD方法による堆積が可能: 高スループットで運用費が低いCVD TiN方法、および、低温のALD TiN方法は、実現することができない。PVD方法は、ステップカバレッジが悪い。
2)ハロゲンフリーの化学堆積 従来のTi/TiN: CVDまたはALD化学堆積は、塩素系(TiCl4)を用いる。従来のWN化学堆積は、フッ素系(WF6)を用いる。フッ素および塩素は、特定のコンタクトに悪影響を及ぼすという問題がある。WNのフッ素フリーのソースでは、よい膜を得られなかった。
3)良好な接着性: 先に示すように、タングステンリッチ膜(W/WC)は、10から15オングストロームほどの薄さで優れた接着性を有する。このことは非常に重要であり、例えば、特定の用途では、WNバリア膜は、良好な接着性を得るためには少なくとも60オングストロームの厚みを必要とする。とりわけ、サイズが小さいと、バリア層が薄くなるほど、全体の抵抗も低くなる。TiNは、接着性が悪く、多くの場合、接着性を向上させるためにTi層が必要になる。
4)薄さの連続性: タングステンリッチバリアは、連続しており、10から15オングストロームの薄さで良好なステップカバレッジを得ることができる。
5)低抵抗率、低抵抗: タングステンリッチバリアは、同様の厚みのTiNおよびWN以下の抵抗率を有する。タングステンリッチバリア膜は、非常に薄く(WNおよびTiNより薄く)堆積できるので、従来の膜より全体の抵抗が低い。
[他の実施形態]
[装置]
なお、本明細書に記載された実施形態によれば、以下の構成もまた開示される。
[項目1]
純タングステンプラグを形成する方法であって、
導電領域を露出するコンタクトホールを誘電層内に有する半導体基板を提供する段階と、
前記基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、少なくとも前記露出した導電領域上にタングステンリッチ膜を堆積する段階と、
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記ホールをタングステンで実質的にふさぎ、タングステンプラグを形成する段階と、
を備える方法。
[項目2]
前記タングステンリッチ膜は、金属タングステンと、少なくとも1つのタングステン化合物との混合物を含む、項目1に記載の方法。
[項目3]
前記タングステンリッチ膜は、金属タングステンと、タングステン・カーバイドとの混合物を含む、項目1に記載の方法。
[項目4]
金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、約2:1から10:1までの範囲である、項目3に記載の方法。
[項目5]
金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、約2:1から4:1までの範囲である、項目3に記載の方法。
[項目6]
前記タングステンリッチ膜は、少なくとも約60原子百分率のタングステンを含む、項目1に記載の方法。
[項目7]
前記タングステンリッチ膜は、約25%以下の炭素を含む、項目1に記載の方法。
[項目8]
前記タングステンリッチ膜の厚みは、約10オングストロームから100オングストロームまでの範囲である、項目1に記載の方法。
[項目9]
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記基板をWF 6 にさらす段階を含む、項目1に記載の方法。
[項目10]
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記タングステンリッチ膜上にタングステン核生成層を堆積し、前記タングステン核生成層上にバルクタングステン膜を堆積する段階を含む、項目1に記載の方法。
[項目11]
前記コンタクトホールをタングステンで実質的にふさぐ段階の後に、前記タングステンをエッチバックして前記タングステンプラグを形成する段階をさらに備える、項目1に記載の方法。
[項目12]
純タングステンラインを形成する方法であって、
ビットライントレンチを誘電層内に有する半導体基板を提供する段階と、
前記基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、少なくとも前記トレンチ内にタングステンリッチ膜を堆積する段階と、
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記トレンチをタングステンで実質的にふさぐ段階と、
を備え、
前記トレンチは、前記半導体基板における異なる領域を接続する、方法。
[項目13]
前記タングステンリッチ膜は、金属タングステンと、少なくとも1つのタングステン化合物との混合物を含む、項目12に記載の方法。
[項目14]
前記タングステンリッチ膜は、金属タングステンと、タングステン・カーバイドとの混合物を含む、項目12に記載の方法。
[項目15]
金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、約2:1から10:1までの範囲である、項目14に記載の方法。
[項目16]
金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、約2:1から4:1までの範囲である、項目14に記載の方法。
[項目17]
前記タングステンリッチ膜は、少なくとも約70原子百分率のタングステンを含む、項目12に記載の方法。
[項目18]
前記タングステンリッチ膜は、約25%以下の炭素を含む、項目12に記載の方法。
[項目19]
前記タングステンリッチ膜の厚みは、約10オングストロームから100オングストロームまでの範囲である、項目12に記載の方法。
[項目20]
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記基板をWF 6 にさらす段階を含む、項目12に記載の方法。
[項目21]
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記タングステンリッチ膜上にタングステン核生成層を堆積し、前記タングステン核生成層上にバルクタングステン膜を堆積する段階を含む、項目12に記載の方法。
[項目22]
純タングステンビットラインを形成する方法であって、
半導体基板を提供する段階と、
前記基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、前記基板の少なくとも一部の上にタングステンリッチ膜を堆積する段階と、
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上にタングステンビットライン膜を堆積する段階と、
前記タングステンビットライン膜をフォトパターニングし、かつ、エッチングして前記ビットラインを形成する段階と、
を備える方法。
[項目23]
純タングステンプラグまたはラインを形成する方法であって、
導電領域を露出させるコンタクトホールまたはトレンチを誘電層内に有する半導体基板を提供する段階と、
前記基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらす
ことによって、前記コンタクトホールまたはトレンチ内にコンフォーマルな連続したタングステンリッチ膜を堆積する段階と、
前記基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記ホールまたはトレンチをタングステンで実質的にふさぎ、前記タングステンプラグまたはラインを形成する段階と、
を備え、
前記タングステンリッチ膜は、金属タングステンと、タングステン・カーバイドとの混合物を含む、
方法。
Claims (16)
- 純タングステンプラグを形成する方法であって、
導電領域を露出するコンタクトホールを誘電層内に有する半導体基板を提供する段階と、
前記半導体基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、少なくとも前記露出した導電領域上にタングステンリッチ膜を堆積する段階と、
前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記コンタクトホールをタングステンでふさぎ、タングステンプラグを形成する段階と、
を備え、
前記タングステンリッチ膜は、少なくとも50%(原子)タングステンを有する、方法。 - 前記タングステンリッチ膜は、少なくとも60原子百分率のタングステンを含む、請求項1に記載の方法。
- 前記コンタクトホールをタングステンでふさぐ段階の後に、前記タングステンをエッチバックして前記タングステンプラグを形成する段階をさらに備える、請求項1または2に記載の方法。
- 純タングステンラインを形成する方法であって、
トレンチを誘電層内に有する半導体基板を提供する段階と、
前記半導体基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、少なくとも前記トレンチ内にタングステンリッチ膜を堆積する段階と、
前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記トレンチをタングステンでふさぐ段階と、
を備え、
前記タングステンリッチ膜は、少なくとも50%(原子)タングステンを有する、方法。 - 前記タングステンリッチ膜は、70原子百分率より多くのタングステンを含む、請求項4に記載の方法。
- 前記タングステンリッチ膜は、金属タングステンと、少なくとも1つのタングステン化合物との混合物を含む、請求項1から5の何れか1項に記載の方法。
- 前記タングステンリッチ膜は、金属タングステンと、タングステン・カーバイドとの混合物を含む、請求項1から6の何れか1項に記載の方法。
- 金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、2:1から9:1までの範囲である、請求項7に記載の方法。
- 金属タングステン(W)とタングステン・カーバイド(WC)との分子比率は、3:1から5:1までの範囲である、請求項7または8に記載の方法。
- 前記タングステンリッチ膜は、25%以下の炭素を含む、請求項1から9の何れか1項に記載の方法。
- 前記タングステンリッチ膜の厚みは、10オングストロームから500オングストロームまでの範囲である、請求項1から10の何れか1項に記載の方法。
- 前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記半導体基板をWF6にさらす段階を含む、請求項1から11の何れか1項に記載の方法。
- 前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階は、前記タングステンリッチ膜上にタングステン核生成層を堆積し、前記タングステン核生成層上にバルクタングステン膜を堆積する段階を含む、請求項1から12の何れか1項に記載の方法。
- 純タングステンビットラインを形成する方法であって、
半導体基板を提供する段階と、
前記半導体基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、前記半導体基板の少なくとも一部の上にタングステンリッチ膜を堆積する段階と、
前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上にタングステンビットライン膜を堆積する段階と、
前記タングステンビットライン膜をフォトパターニングし、かつ、エッチングして前記純タングステンビットラインを形成する段階と、
を備え、
前記タングステンリッチ膜は、少なくとも50%(原子)タングステンを有する、方法。 - 純タングステンプラグまたはラインを形成する方法であって、
導電領域を露出させるコンタクトホールまたはトレンチを誘電層内に有する半導体基板を提供する段階と、
前記半導体基板をハロゲンフリーの有機金属タングステン前駆物質、および、還元剤にさらすことによって、前記コンタクトホールまたはトレンチ内にコンフォーマルな連続したタングステンリッチ膜を堆積する段階と、
前記半導体基板をタングステン含有前駆物質にさらすことによって、前記タングステンリッチ膜上に1つ以上のタングステン層を堆積する段階と、
前記コンタクトホールまたはトレンチをタングステンでふさぎ、前記タングステンプラグまたはラインを形成する段階と、
を備え、
前記タングステンリッチ膜は、金属タングステンと、タングステン・カーバイドとの混合物を含み、
前記タングステンリッチ膜は、少なくとも50%(原子)タングステンを有する、方法。 - 請求項1から15の何れか1項に記載の方法によって、前記半導体基板上に純タングステンプラグまたはラインを形成する、半導体基板の製造方法。
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