JP5633885B2 - 直列接続された集積回路を積層する方法およびその方法で作られたマルチチップデバイス - Google Patents

直列接続された集積回路を積層する方法およびその方法で作られたマルチチップデバイス Download PDF

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JP5633885B2
JP5633885B2 JP2010538299A JP2010538299A JP5633885B2 JP 5633885 B2 JP5633885 B2 JP 5633885B2 JP 2010538299 A JP2010538299 A JP 2010538299A JP 2010538299 A JP2010538299 A JP 2010538299A JP 5633885 B2 JP5633885 B2 JP 5633885B2
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chip
chips
connection
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JP2011507283A5 (enExample
JP2011507283A (ja
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ホン・ボム・ピョン
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Mosaid Technologies Inc
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Conversant Intellectual Property Management Inc
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    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657Stacked arrangements of devices
    • GPHYSICS
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    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
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    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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    • GPHYSICS
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    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
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    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2225/04All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2010538299A 2007-12-20 2008-12-18 直列接続された集積回路を積層する方法およびその方法で作られたマルチチップデバイス Expired - Fee Related JP5633885B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US1534507P 2007-12-20 2007-12-20
US61/015,345 2007-12-20
US3220308P 2008-02-28 2008-02-28
US61/032,203 2008-02-28
US12/168,354 2008-07-07
US12/168,354 US8399973B2 (en) 2007-12-20 2008-07-07 Data storage and stackable configurations
US12/236,874 2008-09-24
US12/236,874 US7791175B2 (en) 2007-12-20 2008-09-24 Method for stacking serially-connected integrated circuits and multi-chip device made from same
PCT/CA2008/002235 WO2009079772A1 (en) 2007-12-20 2008-12-18 Method for stacking serially-connected integrated circuits and multi-chip device made from same

Publications (3)

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JP2011507283A JP2011507283A (ja) 2011-03-03
JP2011507283A5 JP2011507283A5 (enExample) 2012-02-09
JP5633885B2 true JP5633885B2 (ja) 2014-12-03

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US (3) US7791175B2 (enExample)
EP (1) EP2220681B1 (enExample)
JP (1) JP5633885B2 (enExample)
KR (1) KR20100091164A (enExample)
CN (1) CN101842896B (enExample)
ES (1) ES2499392T3 (enExample)
TW (1) TW200941695A (enExample)
WO (1) WO2009079772A1 (enExample)

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US8383514B2 (en) 2013-02-26
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JP2011507283A (ja) 2011-03-03
US20110163423A1 (en) 2011-07-07
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US7791175B2 (en) 2010-09-07
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TW200941695A (en) 2009-10-01
US20090020855A1 (en) 2009-01-22
US20100297812A1 (en) 2010-11-25
KR20100091164A (ko) 2010-08-18
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