JP5599862B2 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

Info

Publication number
JP5599862B2
JP5599862B2 JP2012502432A JP2012502432A JP5599862B2 JP 5599862 B2 JP5599862 B2 JP 5599862B2 JP 2012502432 A JP2012502432 A JP 2012502432A JP 2012502432 A JP2012502432 A JP 2012502432A JP 5599862 B2 JP5599862 B2 JP 5599862B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
formula
content
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012502432A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012522848A (ja
JP2012522848A5 (https=
Inventor
広超 謝
興明 成
Original Assignee
漢高（中国）投資有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 漢高（中国）投資有限公司 filed Critical 漢高（中国）投資有限公司
Publication of JP2012522848A publication Critical patent/JP2012522848A/ja
Publication of JP2012522848A5 publication Critical patent/JP2012522848A5/ja
Application granted granted Critical
Publication of JP5599862B2 publication Critical patent/JP5599862B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012502432A 2009-04-01 2010-03-24 エポキシ樹脂組成物 Expired - Fee Related JP5599862B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN200910048710A CN101851386B (zh) 2009-04-01 2009-04-01 一种环氧树脂组合物
CN200910048710.0 2009-04-01
PCT/CN2010/071268 WO2010111921A1 (zh) 2009-04-01 2010-03-24 一种环氧树脂组合物

Publications (3)

Publication Number Publication Date
JP2012522848A JP2012522848A (ja) 2012-09-27
JP2012522848A5 JP2012522848A5 (https=) 2013-05-09
JP5599862B2 true JP5599862B2 (ja) 2014-10-01

Family

ID=42803077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502432A Expired - Fee Related JP5599862B2 (ja) 2009-04-01 2010-03-24 エポキシ樹脂組成物

Country Status (5)

Country Link
US (2) US8362115B2 (https=)
JP (1) JP5599862B2 (https=)
KR (1) KR20120000077A (https=)
CN (2) CN101851386B (https=)
WO (1) WO2010111921A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101851386B (zh) * 2009-04-01 2012-09-05 汉高华威电子有限公司 一种环氧树脂组合物
WO2011125753A1 (ja) 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
CN103421272A (zh) * 2012-05-22 2013-12-04 汉高华威电子有限公司 一种电子封装用环氧树脂组合物及其制备方法
CN104448693B (zh) * 2014-11-20 2020-04-10 徐东 环氧树脂组合物及其制备方法、应用
CN108026355B (zh) * 2015-03-19 2020-05-12 衡所华威电子有限公司 环氧树脂组合物、其制备和用途
CN104830261A (zh) * 2015-06-07 2015-08-12 安徽华美高分子材料科技有限公司 一种高分子粘接材料
CN105038129B (zh) * 2015-07-13 2018-01-19 江苏中鹏新材料股份有限公司 一种倒装芯片封装的环氧树脂组合物
CN106674911B (zh) * 2016-12-30 2019-06-07 科化新材料泰州有限公司 一种半导体封装用高粘接环氧塑封料
CN113601926A (zh) * 2021-07-07 2021-11-05 江西科昂电子新材料有限公司 一种用于5g高频线路板的耐高温散热覆盖膜

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4325000B2 (ja) * 1998-11-30 2009-09-02 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP2000230039A (ja) 1998-12-08 2000-08-22 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2000281874A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2007092083A (ja) * 2000-12-28 2007-04-12 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
CN1621479A (zh) * 2003-11-26 2005-06-01 江苏中电华威电子股份有限公司 一种半导体封装用环氧树脂组合物及其制备方法
JP4470887B2 (ja) * 2003-12-11 2010-06-02 日立化成工業株式会社 封止用エポキシ樹脂成形材料および電子部品装置
CN1301296C (zh) * 2004-06-14 2007-02-21 江苏中电华威电子股份有限公司 一种环氧树脂组合物
MY148463A (en) * 2004-07-29 2013-04-30 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
JP4736432B2 (ja) * 2005-01-07 2011-07-27 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2006176555A (ja) * 2004-12-21 2006-07-06 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006278530A (ja) * 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd ソルダーレジスト用熱硬化性樹脂組成物およびソルダーレジスト
CN100335541C (zh) * 2005-04-15 2007-09-05 江苏中电华威电子股份有限公司 一种用于半导体封装的环氧树脂组合物的制备方法
JP5124808B2 (ja) * 2005-08-05 2013-01-23 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2008156403A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4793277B2 (ja) * 2007-02-14 2011-10-12 新神戸電機株式会社 エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法
JP2008239983A (ja) * 2007-02-28 2008-10-09 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
CN101851386B (zh) * 2009-04-01 2012-09-05 汉高华威电子有限公司 一种环氧树脂组合物

Also Published As

Publication number Publication date
US8362115B2 (en) 2013-01-29
CN101851386B (zh) 2012-09-05
US20120077904A1 (en) 2012-03-29
JP2012522848A (ja) 2012-09-27
CN101851386A (zh) 2010-10-06
CN102365329A (zh) 2012-02-29
KR20120000077A (ko) 2012-01-03
WO2010111921A1 (zh) 2010-10-07
US20130109786A1 (en) 2013-05-02

Similar Documents

Publication Publication Date Title
JP5599862B2 (ja) エポキシ樹脂組成物
JP2012522848A5 (https=)
CN107429039A (zh) 环氧模塑化合物、其制备方法和用途
KR101081723B1 (ko) 에폭시 수지 조성물 및 반도체장치
CN102352090B (zh) 阻燃性环氧树脂组成物与其用途
CN102108184B (zh) 一种环氧树脂组合物及其应用
CN102993638B (zh) 半导体封装用环氧树脂组合物及利用其的半导体装置
CN111153631A (zh) 一种高导热高可靠性环氧树脂组合物及其应用
JP2012067252A (ja) 封止用エポキシ樹脂組成物および半導体装置
CN103665775A (zh) 一种硅微粉高填充的环氧模塑料及其制备方法
JP2011258603A (ja) 半導体封止装置および封止用樹脂組成物
CN1301296C (zh) 一种环氧树脂组合物
CN101974206A (zh) 环氧树脂组合物
JP4691886B2 (ja) エポキシ樹脂組成物及び半導体装置
JP3980701B2 (ja) 半導体封止用樹脂組成物およびそれを用いた半導体装置
KR101758448B1 (ko) 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
CN110791052A (zh) 一种高可靠性环氧树脂组合物及其应用
KR101127933B1 (ko) 밀착성 및 금형 오염 방지능이 우수한 환경친화적 반도체 소자 봉지용 에폭시 수지 조성물
CN108384195B (zh) 一种对镍高粘结性环氧树脂组成物及其应用
KR100679491B1 (ko) 반도체소자 봉지용 친환경 에폭시수지 조성물
CN116178903A (zh) 一种环氧塑封料及其制备方法与应用
JP4513136B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2003261646A (ja) エポキシ樹脂組成物と樹脂封止型半導体装置
KR20130128984A (ko) 반도체 봉지용 에폭시 수지 조성물 및 이를 이용하여 봉지된 반도체 장치
CN120173370A (zh) 一种环氧树脂组合物及其制备方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130319

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130319

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130814

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130820

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140715

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140813

R150 Certificate of patent or registration of utility model

Ref document number: 5599862

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313114

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees