CN101851386B - 一种环氧树脂组合物 - Google Patents

一种环氧树脂组合物 Download PDF

Info

Publication number
CN101851386B
CN101851386B CN200910048710A CN200910048710A CN101851386B CN 101851386 B CN101851386 B CN 101851386B CN 200910048710 A CN200910048710 A CN 200910048710A CN 200910048710 A CN200910048710 A CN 200910048710A CN 101851386 B CN101851386 B CN 101851386B
Authority
CN
China
Prior art keywords
epoxy resin
resin composition
formula
grams
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200910048710A
Other languages
English (en)
Chinese (zh)
Other versions
CN101851386A (zh
Inventor
谢广超
杜新宇
成兴明
张成中
韩江龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hysol Huawei Electronics Co Ltd
Original Assignee
Henkel China Investment Co Ltd
Hysol Huawei Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200910048710A priority Critical patent/CN101851386B/zh
Application filed by Henkel China Investment Co Ltd, Hysol Huawei Electronics Co Ltd filed Critical Henkel China Investment Co Ltd
Priority to KR1020117022984A priority patent/KR20120000077A/ko
Priority to PCT/CN2010/071268 priority patent/WO2010111921A1/zh
Priority to CN2010800142604A priority patent/CN102365329A/zh
Priority to JP2012502432A priority patent/JP5599862B2/ja
Publication of CN101851386A publication Critical patent/CN101851386A/zh
Priority to US13/249,416 priority patent/US8362115B2/en
Application granted granted Critical
Publication of CN101851386B publication Critical patent/CN101851386B/zh
Priority to US13/718,458 priority patent/US20130109786A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200910048710A 2009-04-01 2009-04-01 一种环氧树脂组合物 Active CN101851386B (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN200910048710A CN101851386B (zh) 2009-04-01 2009-04-01 一种环氧树脂组合物
PCT/CN2010/071268 WO2010111921A1 (zh) 2009-04-01 2010-03-24 一种环氧树脂组合物
CN2010800142604A CN102365329A (zh) 2009-04-01 2010-03-24 一种环氧树脂组合物
JP2012502432A JP5599862B2 (ja) 2009-04-01 2010-03-24 エポキシ樹脂組成物
KR1020117022984A KR20120000077A (ko) 2009-04-01 2010-03-24 에폭시 수지 조성물
US13/249,416 US8362115B2 (en) 2009-04-01 2011-09-30 Epoxy resin composition
US13/718,458 US20130109786A1 (en) 2009-04-01 2012-12-18 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910048710A CN101851386B (zh) 2009-04-01 2009-04-01 一种环氧树脂组合物

Publications (2)

Publication Number Publication Date
CN101851386A CN101851386A (zh) 2010-10-06
CN101851386B true CN101851386B (zh) 2012-09-05

Family

ID=42803077

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200910048710A Active CN101851386B (zh) 2009-04-01 2009-04-01 一种环氧树脂组合物
CN2010800142604A Pending CN102365329A (zh) 2009-04-01 2010-03-24 一种环氧树脂组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010800142604A Pending CN102365329A (zh) 2009-04-01 2010-03-24 一种环氧树脂组合物

Country Status (5)

Country Link
US (2) US8362115B2 (https=)
JP (1) JP5599862B2 (https=)
KR (1) KR20120000077A (https=)
CN (2) CN101851386B (https=)
WO (1) WO2010111921A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101851386B (zh) * 2009-04-01 2012-09-05 汉高华威电子有限公司 一种环氧树脂组合物
WO2011125753A1 (ja) 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
CN102558769B (zh) * 2010-12-31 2015-11-25 第一毛织株式会社 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件
CN103421272A (zh) * 2012-05-22 2013-12-04 汉高华威电子有限公司 一种电子封装用环氧树脂组合物及其制备方法
CN104448693B (zh) * 2014-11-20 2020-04-10 徐东 环氧树脂组合物及其制备方法、应用
CN108026355B (zh) * 2015-03-19 2020-05-12 衡所华威电子有限公司 环氧树脂组合物、其制备和用途
CN104830261A (zh) * 2015-06-07 2015-08-12 安徽华美高分子材料科技有限公司 一种高分子粘接材料
CN105038129B (zh) * 2015-07-13 2018-01-19 江苏中鹏新材料股份有限公司 一种倒装芯片封装的环氧树脂组合物
CN106674911B (zh) * 2016-12-30 2019-06-07 科化新材料泰州有限公司 一种半导体封装用高粘接环氧塑封料
CN113601926A (zh) * 2021-07-07 2021-11-05 江西科昂电子新材料有限公司 一种用于5g高频线路板的耐高温散热覆盖膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1583876A (zh) * 2004-06-14 2005-02-23 江苏中电华威电子股份有限公司 一种环氧树脂组合物
CN1621479A (zh) * 2003-11-26 2005-06-01 江苏中电华威电子股份有限公司 一种半导体封装用环氧树脂组合物及其制备方法
CN1687229A (zh) * 2005-04-15 2005-10-26 江苏中电华威电子股份有限公司 一种用于半导体封装的环氧树脂组合物的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4325000B2 (ja) * 1998-11-30 2009-09-02 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP2000230039A (ja) * 1998-12-08 2000-08-22 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2000281874A (ja) * 1999-03-31 2000-10-10 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2007092083A (ja) * 2000-12-28 2007-04-12 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
JP4470887B2 (ja) * 2003-12-11 2010-06-02 日立化成工業株式会社 封止用エポキシ樹脂成形材料および電子部品装置
MY148463A (en) * 2004-07-29 2013-04-30 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
JP4736432B2 (ja) * 2005-01-07 2011-07-27 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2006176555A (ja) * 2004-12-21 2006-07-06 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006278530A (ja) * 2005-03-28 2006-10-12 Sumitomo Bakelite Co Ltd ソルダーレジスト用熱硬化性樹脂組成物およびソルダーレジスト
US20070029682A1 (en) 2005-08-05 2007-02-08 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
JP2008156403A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4793277B2 (ja) * 2007-02-14 2011-10-12 新神戸電機株式会社 エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法
JP2008239983A (ja) * 2007-02-28 2008-10-09 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
CN101851386B (zh) * 2009-04-01 2012-09-05 汉高华威电子有限公司 一种环氧树脂组合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1621479A (zh) * 2003-11-26 2005-06-01 江苏中电华威电子股份有限公司 一种半导体封装用环氧树脂组合物及其制备方法
CN1583876A (zh) * 2004-06-14 2005-02-23 江苏中电华威电子股份有限公司 一种环氧树脂组合物
CN1687229A (zh) * 2005-04-15 2005-10-26 江苏中电华威电子股份有限公司 一种用于半导体封装的环氧树脂组合物的制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-176555A 2006.07.06

Also Published As

Publication number Publication date
WO2010111921A1 (zh) 2010-10-07
KR20120000077A (ko) 2012-01-03
US8362115B2 (en) 2013-01-29
CN101851386A (zh) 2010-10-06
JP2012522848A (ja) 2012-09-27
JP5599862B2 (ja) 2014-10-01
CN102365329A (zh) 2012-02-29
US20130109786A1 (en) 2013-05-02
US20120077904A1 (en) 2012-03-29

Similar Documents

Publication Publication Date Title
CN101851386B (zh) 一种环氧树脂组合物
TWI527854B (zh) 環氧樹脂組成物及半導體裝置
CN102108184B (zh) 一种环氧树脂组合物及其应用
CN102352090B (zh) 阻燃性环氧树脂组成物与其用途
TWI388620B (zh) 半導體密封用環氧樹脂組成物及半導體裝置
JP2012522848A5 (https=)
WO2005116104A1 (ja) 半導体封止用樹脂組成物および半導体装置
JP5164076B2 (ja) 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
CN1301296C (zh) 一种环氧树脂组合物
JP2003277477A (ja) エポキシ樹脂組成物と樹脂封止型半導体装置
JP2005089486A (ja) エポキシ樹脂組成物及び半導体装置
JP3980701B2 (ja) 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2003213084A (ja) エポキシ樹脂組成物及び半導体装置
JP2005225971A (ja) エポキシ樹脂組成物及び半導体装置
CN101208386B (zh) 一种用于封装半导体设备的环氧树脂组合物
JP4946030B2 (ja) エポキシ樹脂組成物及び半導体装置
KR101127933B1 (ko) 밀착성 및 금형 오염 방지능이 우수한 환경친화적 반도체 소자 봉지용 에폭시 수지 조성물
KR101337247B1 (ko) 반도체 봉지용 에폭시 수지 조성물 및 이를 이용하여 봉지된 반도체 장치
JP2003261646A (ja) エポキシ樹脂組成物と樹脂封止型半導体装置
CN120173370A (zh) 一种环氧树脂组合物及其制备方法
JP2005082666A (ja) 封止用樹脂組成物および樹脂封止型半導体装置
JP2002317102A (ja) エポキシ樹脂組成物及び半導体装置
JP5673613B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2003096159A (ja) エポキシ樹脂組成物及び半導体装置
KR20120103896A (ko) 반도체 봉지용 에폭시 수지 조성물 및 이를 이용하여 봉지된 반도체 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: YANG WENYONG

Effective date: 20120627

Owner name: HENKEL HUAWEI ELECTRONICS CO., LTD.

Free format text: FORMER OWNER: YANG WENYONG

Effective date: 20120627

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 222006 LIANYUNGANG, JIANGSU PROVINCE

TA01 Transfer of patent application right

Effective date of registration: 20120627

Address after: 222006 song Jump Development Zone, Jiangsu, Lianyungang

Applicant after: Henkel Warwick Electronics Co.,Ltd.

Co-applicant after: HENKEL (CHINA) INVESTMENT Co.,Ltd.

Address before: 201203, Zhang Heng road 928, Zhangjiang hi tech park, Shanghai, Pudong New Area

Applicant before: HENKEL (CHINA) INVESTMENT Co.,Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151216

Address after: 222006 8 Zhenhua Road, song jumping Industrial Zone, Lianyungang Development Zone, Jiangsu, China

Patentee after: Henkel Warwick Electronics Co.,Ltd.

Address before: 222006 song Jump Development Zone, Jiangsu, Lianyungang

Patentee before: Henkel Warwick Electronics Co.,Ltd.

Patentee before: HENKEL (CHINA) INVESTMENT Co.,Ltd.

CP03 Change of name, title or address

Address after: 222006 Zhenhua Road, Lianyungang hi tech Industrial Development Zone, Jiangsu, 8

Patentee after: HYSOL HUAWEI ELECTRONICS CO., LTD

Address before: 222006 8 Zhenhua Road, song jumping Industrial Zone, Lianyungang Development Zone, Jiangsu, China

Patentee before: Henkel Warwick Electronics Co.,Ltd.

CP03 Change of name, title or address
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: An epoxy resin composition

Granted publication date: 20120905

Pledgee: Shanghai Pudong Development Bank Co., Ltd. Lianyungang Branch

Pledgor: HYSOL HUAWEI ELECTRONICS CO., LTD

Registration number: Y2025980051796