JP2012522848A5 - - Google Patents
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- Publication number
- JP2012522848A5 JP2012522848A5 JP2012502432A JP2012502432A JP2012522848A5 JP 2012522848 A5 JP2012522848 A5 JP 2012522848A5 JP 2012502432 A JP2012502432 A JP 2012502432A JP 2012502432 A JP2012502432 A JP 2012502432A JP 2012522848 A5 JP2012522848 A5 JP 2012522848A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- content
- composition according
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 33
- 229920000647 polyepoxide Polymers 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 30
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 10
- 239000003063 flame retardant Substances 0.000 claims description 10
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims 7
- 239000002131 composite material Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- 239000005011 phenolic resin Substances 0.000 claims 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 2
- 239000002318 adhesion promoter Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000003086 colorant Substances 0.000 claims 2
- 239000007822 coupling agent Substances 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000002516 radical scavenger Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- -1 imidazole compound Chemical class 0.000 claims 1
- 229910000000 metal hydroxide Inorganic materials 0.000 claims 1
- 150000004692 metal hydroxides Chemical class 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910048710A CN101851386B (zh) | 2009-04-01 | 2009-04-01 | 一种环氧树脂组合物 |
| CN200910048710.0 | 2009-04-01 | ||
| PCT/CN2010/071268 WO2010111921A1 (zh) | 2009-04-01 | 2010-03-24 | 一种环氧树脂组合物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012522848A JP2012522848A (ja) | 2012-09-27 |
| JP2012522848A5 true JP2012522848A5 (https=) | 2013-05-09 |
| JP5599862B2 JP5599862B2 (ja) | 2014-10-01 |
Family
ID=42803077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012502432A Expired - Fee Related JP5599862B2 (ja) | 2009-04-01 | 2010-03-24 | エポキシ樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8362115B2 (https=) |
| JP (1) | JP5599862B2 (https=) |
| KR (1) | KR20120000077A (https=) |
| CN (2) | CN101851386B (https=) |
| WO (1) | WO2010111921A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101851386B (zh) * | 2009-04-01 | 2012-09-05 | 汉高华威电子有限公司 | 一种环氧树脂组合物 |
| WO2011125753A1 (ja) | 2010-04-02 | 2011-10-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| CN102558769B (zh) * | 2010-12-31 | 2015-11-25 | 第一毛织株式会社 | 用于封装半导体器件的环氧树脂组合物以及由该环氧树脂组合物封装的半导体器件 |
| CN103421272A (zh) * | 2012-05-22 | 2013-12-04 | 汉高华威电子有限公司 | 一种电子封装用环氧树脂组合物及其制备方法 |
| CN104448693B (zh) * | 2014-11-20 | 2020-04-10 | 徐东 | 环氧树脂组合物及其制备方法、应用 |
| CN108026355B (zh) * | 2015-03-19 | 2020-05-12 | 衡所华威电子有限公司 | 环氧树脂组合物、其制备和用途 |
| CN104830261A (zh) * | 2015-06-07 | 2015-08-12 | 安徽华美高分子材料科技有限公司 | 一种高分子粘接材料 |
| CN105038129B (zh) * | 2015-07-13 | 2018-01-19 | 江苏中鹏新材料股份有限公司 | 一种倒装芯片封装的环氧树脂组合物 |
| CN106674911B (zh) * | 2016-12-30 | 2019-06-07 | 科化新材料泰州有限公司 | 一种半导体封装用高粘接环氧塑封料 |
| CN113601926A (zh) * | 2021-07-07 | 2021-11-05 | 江西科昂电子新材料有限公司 | 一种用于5g高频线路板的耐高温散热覆盖膜 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4325000B2 (ja) * | 1998-11-30 | 2009-09-02 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP2000230039A (ja) | 1998-12-08 | 2000-08-22 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2000281874A (ja) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2007092083A (ja) * | 2000-12-28 | 2007-04-12 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び半導体装置 |
| TW200726784A (en) * | 2003-04-07 | 2007-07-16 | Hitachi Chemical Co Ltd | Epoxy resin molding material for sealing use and semiconductor device |
| CN1621479A (zh) * | 2003-11-26 | 2005-06-01 | 江苏中电华威电子股份有限公司 | 一种半导体封装用环氧树脂组合物及其制备方法 |
| JP4470887B2 (ja) * | 2003-12-11 | 2010-06-02 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料および電子部品装置 |
| CN1301296C (zh) * | 2004-06-14 | 2007-02-21 | 江苏中电华威电子股份有限公司 | 一种环氧树脂组合物 |
| MY148463A (en) * | 2004-07-29 | 2013-04-30 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
| JP4736432B2 (ja) * | 2005-01-07 | 2011-07-27 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2006176555A (ja) * | 2004-12-21 | 2006-07-06 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2006278530A (ja) * | 2005-03-28 | 2006-10-12 | Sumitomo Bakelite Co Ltd | ソルダーレジスト用熱硬化性樹脂組成物およびソルダーレジスト |
| CN100335541C (zh) * | 2005-04-15 | 2007-09-05 | 江苏中电华威电子股份有限公司 | 一种用于半导体封装的环氧树脂组合物的制备方法 |
| JP5124808B2 (ja) * | 2005-08-05 | 2013-01-23 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP2008156403A (ja) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP4793277B2 (ja) * | 2007-02-14 | 2011-10-12 | 新神戸電機株式会社 | エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法 |
| JP2008239983A (ja) * | 2007-02-28 | 2008-10-09 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
| CN101851386B (zh) * | 2009-04-01 | 2012-09-05 | 汉高华威电子有限公司 | 一种环氧树脂组合物 |
-
2009
- 2009-04-01 CN CN200910048710A patent/CN101851386B/zh active Active
-
2010
- 2010-03-24 WO PCT/CN2010/071268 patent/WO2010111921A1/zh not_active Ceased
- 2010-03-24 JP JP2012502432A patent/JP5599862B2/ja not_active Expired - Fee Related
- 2010-03-24 CN CN2010800142604A patent/CN102365329A/zh active Pending
- 2010-03-24 KR KR1020117022984A patent/KR20120000077A/ko not_active Ceased
-
2011
- 2011-09-30 US US13/249,416 patent/US8362115B2/en not_active Expired - Fee Related
-
2012
- 2012-12-18 US US13/718,458 patent/US20130109786A1/en not_active Abandoned
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