JP5384149B2 - 難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物 - Google Patents

難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物 Download PDF

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JP5384149B2
JP5384149B2 JP2009060537A JP2009060537A JP5384149B2 JP 5384149 B2 JP5384149 B2 JP 5384149B2 JP 2009060537 A JP2009060537 A JP 2009060537A JP 2009060537 A JP2009060537 A JP 2009060537A JP 5384149 B2 JP5384149 B2 JP 5384149B2
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active energy
energy ray
resin composition
curable resin
meth
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JP2009256622A (ja
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和義 山本
透 栗橋
孝治 磯部
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2003/1034—Materials or components characterised by specific properties
    • C09K2003/1062—UV-curable materials

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
JP2009060537A 2008-03-18 2009-03-13 難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物 Active JP5384149B2 (ja)

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JP2009060537A JP5384149B2 (ja) 2008-03-18 2009-03-13 難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008068909 2008-03-18
JP2008068909 2008-03-18
JP2009060537A JP5384149B2 (ja) 2008-03-18 2009-03-13 難燃性を有する反応性化合物を用いた活性エネルギー線硬化型樹脂組成物並びにその硬化物

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JP2009256622A JP2009256622A (ja) 2009-11-05
JP5384149B2 true JP5384149B2 (ja) 2014-01-08

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JP (1) JP5384149B2 (zh)
KR (1) KR101422085B1 (zh)
CN (1) CN101538348B (zh)
TW (1) TWI431049B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10672621B2 (en) 2018-06-27 2020-06-02 Toshiba Memory Corporation Pattern forming material, pattern forming method, and method for manufacturing semiconductor device

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JP5291488B2 (ja) * 2009-02-18 2013-09-18 京セラケミカル株式会社 感光性熱硬化型樹脂組成物、およびフレキシブルプリント配線板
JP5439988B2 (ja) * 2009-07-08 2014-03-12 Ｊｓｒ株式会社 感放射線性樹脂組成物、感放射線性カバーレイおよびフレキシブルプリント配線板
WO2011083554A1 (ja) * 2010-01-05 2011-07-14 日本化薬株式会社 ホスフィンオキサイドを含むポリアミド又はポリイミド樹脂組成物並びにその硬化物
CN102858823A (zh) * 2010-04-09 2013-01-02 日本化药株式会社 光学透镜片用能量射线固化型树脂组合物及其固化物
JP5654259B2 (ja) * 2010-05-11 2015-01-14 株式会社カネカ 新規な感光性樹脂組成物及びその利用
JP5764368B2 (ja) * 2011-04-05 2015-08-19 株式会社カネカ 新規な感光性樹脂組成物及びその利用
JP2012247560A (ja) * 2011-05-26 2012-12-13 Kyocera Chemical Corp アルカリ現像型の感光性樹脂組成物、並びにこれを用いた感光性フィルム及びレジスト
KR101447456B1 (ko) * 2011-12-28 2014-10-06 제일모직주식회사 포스피네이트계 난연제의 제조방법
TWI457353B (zh) * 2012-05-08 2014-10-21 Ind Tech Res Inst 高分子、高分子混摻物、與阻燃材料
JP6123547B2 (ja) * 2013-07-26 2017-05-10 日立化成株式会社 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート
KR101692003B1 (ko) * 2013-12-24 2017-01-03 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
CN108137791A (zh) * 2015-09-30 2018-06-08 太阳油墨制造株式会社 固化性树脂组合物、干膜及使用其的印刷电路板
JP6224188B1 (ja) * 2016-08-08 2017-11-01 太陽インキ製造株式会社 半導体封止材
CN108912174B (zh) * 2018-06-22 2021-02-09 四川东材科技集团股份有限公司 一种阻燃双烷环型多元醇树脂及其制备方法
CN108929524A (zh) * 2018-09-05 2018-12-04 贵州省材料产业技术研究院 一种反应增容阻燃聚酯材料及其制备方法

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DE2558467C3 (de) * 1975-12-23 1978-06-22 Dynamit Nobel Ag, 5210 Troisdorf Kunststoff-Formmasse, insbesondere auf PVC-Basis, mit vermindertem Plate-out Effekt
JP3454544B2 (ja) * 1993-08-02 2003-10-06 日本化薬株式会社 （メタ）アクリル酸エステル、その製造方法、それを用いた硬化性樹脂組成物およびその硬化物
JP4066335B2 (ja) 2002-10-24 2008-03-26 株式会社カネカ 有機リン組成物およびそれを含有する難燃剤、難燃性樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10672621B2 (en) 2018-06-27 2020-06-02 Toshiba Memory Corporation Pattern forming material, pattern forming method, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
KR101422085B1 (ko) 2014-07-23
CN101538348B (zh) 2012-11-07
KR20090100258A (ko) 2009-09-23
TW200946579A (en) 2009-11-16
TWI431049B (zh) 2014-03-21
CN101538348A (zh) 2009-09-23
JP2009256622A (ja) 2009-11-05

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