JP5216871B2 - インプリント・リソグラフィにおけるはみ出し低減 - Google Patents

インプリント・リソグラフィにおけるはみ出し低減 Download PDF

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Publication number
JP5216871B2
JP5216871B2 JP2010545889A JP2010545889A JP5216871B2 JP 5216871 B2 JP5216871 B2 JP 5216871B2 JP 2010545889 A JP2010545889 A JP 2010545889A JP 2010545889 A JP2010545889 A JP 2010545889A JP 5216871 B2 JP5216871 B2 JP 5216871B2
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Prior art keywords
polymerizable material
pattern
substrate
mesa
feature
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Japanese (ja)
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JP2011521438A5 (enExample
JP2011521438A (ja
Inventor
クスナデノフ，ニヤス
ジョーンズ，クリストファ・イー
ペレス，ジョセフ・ジイ
ラブレイク，ドゥワイン・エル
マックマッキン，イアン・マシュー
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モレキュラー・インプリンツ・インコーポレーテッド
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Publication of JP2011521438A5 publication Critical patent/JP2011521438A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/005—Repairing damaged coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Micromachines (AREA)
JP2010545889A 2008-02-08 2009-02-09 インプリント・リソグラフィにおけるはみ出し低減 Active JP5216871B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US2715308P 2008-02-08 2008-02-08
US61/027,153 2008-02-08
US9409208P 2008-09-04 2008-09-04
US61/094,092 2008-09-04
US12/367,079 2009-02-06
US12/367,079 US8361371B2 (en) 2008-02-08 2009-02-06 Extrusion reduction in imprint lithography
PCT/US2009/000803 WO2009099666A1 (en) 2008-02-08 2009-02-09 Extrusion reduction in imprint lithography

Publications (3)

Publication Number Publication Date
JP2011521438A JP2011521438A (ja) 2011-07-21
JP2011521438A5 JP2011521438A5 (enExample) 2012-03-22
JP5216871B2 true JP5216871B2 (ja) 2013-06-19

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ID=40938224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545889A Active JP5216871B2 (ja) 2008-02-08 2009-02-09 インプリント・リソグラフィにおけるはみ出し低減

Country Status (7)

Country Link
US (2) US8361371B2 (enExample)
EP (1) EP2240826A4 (enExample)
JP (1) JP5216871B2 (enExample)
KR (3) KR102065400B1 (enExample)
CN (1) CN101939704B (enExample)
TW (1) TWI430015B (enExample)
WO (1) WO2009099666A1 (enExample)

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Also Published As

Publication number Publication date
US20130241109A1 (en) 2013-09-19
TW200938949A (en) 2009-09-16
CN101939704A (zh) 2011-01-05
KR102065400B1 (ko) 2020-01-13
US8361371B2 (en) 2013-01-29
US20090200710A1 (en) 2009-08-13
KR102171030B1 (ko) 2020-10-28
KR20160054631A (ko) 2016-05-16
TWI430015B (zh) 2014-03-11
WO2009099666A1 (en) 2009-08-13
JP2011521438A (ja) 2011-07-21
US8641958B2 (en) 2014-02-04
KR20100123698A (ko) 2010-11-24
EP2240826A4 (en) 2012-08-01
CN101939704B (zh) 2014-03-12
KR20190120443A (ko) 2019-10-23
EP2240826A1 (en) 2010-10-20

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