JP5184308B2 - めっき装置及びめっき方法 - Google Patents

めっき装置及びめっき方法 Download PDF

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Publication number
JP5184308B2
JP5184308B2 JP2008292174A JP2008292174A JP5184308B2 JP 5184308 B2 JP5184308 B2 JP 5184308B2 JP 2008292174 A JP2008292174 A JP 2008292174A JP 2008292174 A JP2008292174 A JP 2008292174A JP 5184308 B2 JP5184308 B2 JP 5184308B2
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substrate
plating
paddle
holder
anode
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Japanese (ja)
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JP2009155726A (ja
JP2009155726A5 (enExample
Inventor
信利 齋藤
淳平 藤方
忠明 山本
健司 上村
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Ebara Corp
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Ebara Corp
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Priority to JP2008292174A priority Critical patent/JP5184308B2/ja
Priority to KR20080122015A priority patent/KR101493380B1/ko
Priority to CN201510813398.5A priority patent/CN105420778A/zh
Priority to CN201710733595.5A priority patent/CN107604426B/zh
Priority to CN2008101788929A priority patent/CN101451264B/zh
Priority to TW097147071A priority patent/TWI457471B/zh
Priority to CN201210570167.2A priority patent/CN103060871B/zh
Priority to US12/314,143 priority patent/US8177944B2/en
Priority to CN201710733577.7A priority patent/CN108588800B/zh
Publication of JP2009155726A publication Critical patent/JP2009155726A/ja
Publication of JP2009155726A5 publication Critical patent/JP2009155726A5/ja
Priority to US13/443,149 priority patent/US8486234B2/en
Application granted granted Critical
Publication of JP5184308B2 publication Critical patent/JP5184308B2/ja
Priority to US14/272,891 priority patent/USRE45687E1/en
Priority to KR1020140127522A priority patent/KR101515120B1/ko
Priority to KR20140127518A priority patent/KR101486441B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2008292174A 2007-12-04 2008-11-14 めっき装置及びめっき方法 Active JP5184308B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2008292174A JP5184308B2 (ja) 2007-12-04 2008-11-14 めっき装置及びめっき方法
KR20080122015A KR101493380B1 (ko) 2007-12-04 2008-12-03 도금장치 및 도금방법
CN201710733577.7A CN108588800B (zh) 2007-12-04 2008-12-04 电镀装置及电镀方法
CN201710733595.5A CN107604426B (zh) 2007-12-04 2008-12-04 电镀装置及电镀方法
CN2008101788929A CN101451264B (zh) 2007-12-04 2008-12-04 电镀装置及电镀方法
TW097147071A TWI457471B (zh) 2007-12-04 2008-12-04 鍍覆裝置及鍍覆方法
CN201210570167.2A CN103060871B (zh) 2007-12-04 2008-12-04 电镀装置及电镀方法
US12/314,143 US8177944B2 (en) 2007-12-04 2008-12-04 Plating apparatus and plating method
CN201510813398.5A CN105420778A (zh) 2007-12-04 2008-12-04 电镀装置及电镀方法
US13/443,149 US8486234B2 (en) 2007-12-04 2012-04-10 Plating apparatus and plating method
US14/272,891 USRE45687E1 (en) 2007-12-04 2014-05-08 Plating apparatus and plating method
KR1020140127522A KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR20140127518A KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007313730 2007-12-04
JP2007313730 2007-12-04
JP2008292174A JP5184308B2 (ja) 2007-12-04 2008-11-14 めっき装置及びめっき方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2013004854A Division JP5726921B2 (ja) 2007-12-04 2013-01-15 めっき装置
JP2013004855A Division JP5572229B2 (ja) 2007-12-04 2013-01-15 めっき装置

Publications (3)

Publication Number Publication Date
JP2009155726A JP2009155726A (ja) 2009-07-16
JP2009155726A5 JP2009155726A5 (enExample) 2010-11-04
JP5184308B2 true JP5184308B2 (ja) 2013-04-17

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Application Number Title Priority Date Filing Date
JP2008292174A Active JP5184308B2 (ja) 2007-12-04 2008-11-14 めっき装置及びめっき方法
JP2008305978A Active JP5213669B2 (ja) 2007-12-04 2008-12-01 めっき装置
JP2013004854A Active JP5726921B2 (ja) 2007-12-04 2013-01-15 めっき装置
JP2013004855A Active JP5572229B2 (ja) 2007-12-04 2013-01-15 めっき装置
JP2015075016A Active JP5980983B2 (ja) 2007-12-04 2015-04-01 めっき装置

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2008305978A Active JP5213669B2 (ja) 2007-12-04 2008-12-01 めっき装置
JP2013004854A Active JP5726921B2 (ja) 2007-12-04 2013-01-15 めっき装置
JP2013004855A Active JP5572229B2 (ja) 2007-12-04 2013-01-15 めっき装置
JP2015075016A Active JP5980983B2 (ja) 2007-12-04 2015-04-01 めっき装置

Country Status (4)

Country Link
JP (5) JP5184308B2 (enExample)
KR (3) KR101493380B1 (enExample)
CN (5) CN101451264B (enExample)
TW (1) TWI457471B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180113156A (ko) 2017-04-05 2018-10-15 가부시키가이샤 에바라 세이사꾸쇼 반도체 제조 장치, 반도체 제조 장치의 고장 예지 방법 및 반도체 제조 장치의 고장 예지 프로그램

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JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
CN102453944A (zh) * 2010-10-19 2012-05-16 上海嘉捷通电路科技有限公司 一种新型运动式电镀设备
CN103184491A (zh) * 2011-12-28 2013-07-03 北京有色金属研究总院 一种对镀件施加外部磁场的电镀装置及方法
CN104220648B (zh) * 2012-04-20 2017-09-05 株式会社Jcu 基板镀敷夹具以及利用它的镀敷装置
WO2014069023A1 (ja) * 2012-11-01 2014-05-08 ユケン工業株式会社 めっき装置、ノズル－アノードユニット、めっき部材の製造方法、および被めっき部材固定装置
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
JP2014237865A (ja) * 2013-06-06 2014-12-18 株式会社荏原製作所 電解銅めっき装置
CN104562162B (zh) * 2013-10-21 2018-03-23 欣兴电子股份有限公司 隔膜装置
CN105980611B (zh) 2014-02-06 2019-04-09 株式会社荏原制作所 基板保持器、镀覆装置、及镀覆方法
JP6285199B2 (ja) * 2014-02-10 2018-02-28 株式会社荏原製作所 アノードホルダ及びめっき装置
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JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
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JP6459597B2 (ja) * 2015-02-16 2019-01-30 株式会社村田製作所 電解めっき装置
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
JP6407093B2 (ja) * 2015-04-28 2018-10-17 株式会社荏原製作所 電解処理装置
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JP6986921B2 (ja) * 2017-10-12 2021-12-22 株式会社荏原製作所 めっき装置及びめっき方法
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KR20180113156A (ko) 2017-04-05 2018-10-15 가부시키가이샤 에바라 세이사꾸쇼 반도체 제조 장치, 반도체 제조 장치의 고장 예지 방법 및 반도체 제조 장치의 고장 예지 프로그램
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KR20230006786A (ko) 2017-04-05 2023-01-11 가부시키가이샤 에바라 세이사꾸쇼 반도체 제조 장치, 반도체 제조 장치의 고장 예지 방법 및 기억 매체
US12191178B2 (en) 2017-04-05 2025-01-07 Ebara Corporation Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus

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JP2013122091A (ja) 2013-06-20
JP5572229B2 (ja) 2014-08-13
KR101486441B1 (ko) 2015-01-28
CN101451264A (zh) 2009-06-10
KR20140130645A (ko) 2014-11-11
CN107604426A (zh) 2018-01-19
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JP2009155727A (ja) 2009-07-16
TWI457471B (zh) 2014-10-21
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JP2009155726A (ja) 2009-07-16
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TW200936818A (en) 2009-09-01
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CN108588800B (zh) 2020-07-07
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KR20090058466A (ko) 2009-06-09

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