KR101493380B1 - 도금장치 및 도금방법 - Google Patents

도금장치 및 도금방법 Download PDF

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Publication number
KR101493380B1
KR101493380B1 KR20080122015A KR20080122015A KR101493380B1 KR 101493380 B1 KR101493380 B1 KR 101493380B1 KR 20080122015 A KR20080122015 A KR 20080122015A KR 20080122015 A KR20080122015 A KR 20080122015A KR 101493380 B1 KR101493380 B1 KR 101493380B1
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plating
substrate
holder
anode
paddle
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KR20090058466A (ko
Inventor
노부토시 사이토
준페이 후지카타
다다아키 야마모토
겐지 가미무라
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가부시키가이샤 에바라 세이사꾸쇼
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
KR20080122015A 2007-12-04 2008-12-03 도금장치 및 도금방법 Active KR101493380B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007313730 2007-12-04
JPJP-P-2007-313730 2007-12-04
JP2008292174A JP5184308B2 (ja) 2007-12-04 2008-11-14 めっき装置及びめっき方法
JPJP-P-2008-292174 2008-11-14

Related Child Applications (2)

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KR20140127518A Division KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR1020140127522A Division KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

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KR20090058466A KR20090058466A (ko) 2009-06-09
KR101493380B1 true KR101493380B1 (ko) 2015-02-23

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KR20080122015A Active KR101493380B1 (ko) 2007-12-04 2008-12-03 도금장치 및 도금방법
KR20140127518A Active KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR1020140127522A Active KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

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KR20140127518A Active KR101486441B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법
KR1020140127522A Active KR101515120B1 (ko) 2007-12-04 2014-09-24 도금장치 및 도금방법

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JP (5) JP5184308B2 (enExample)
KR (3) KR101493380B1 (enExample)
CN (5) CN101451264B (enExample)
TW (1) TWI457471B (enExample)

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CN102453944A (zh) * 2010-10-19 2012-05-16 上海嘉捷通电路科技有限公司 一种新型运动式电镀设备
CN103184491A (zh) * 2011-12-28 2013-07-03 北京有色金属研究总院 一种对镀件施加外部磁场的电镀装置及方法
CN104220648B (zh) * 2012-04-20 2017-09-05 株式会社Jcu 基板镀敷夹具以及利用它的镀敷装置
WO2014069023A1 (ja) * 2012-11-01 2014-05-08 ユケン工業株式会社 めっき装置、ノズル－アノードユニット、めっき部材の製造方法、および被めっき部材固定装置
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
JP2014237865A (ja) * 2013-06-06 2014-12-18 株式会社荏原製作所 電解銅めっき装置
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JP6285199B2 (ja) * 2014-02-10 2018-02-28 株式会社荏原製作所 アノードホルダ及びめっき装置
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CN104005077B (zh) * 2014-05-14 2016-11-09 上海交通大学 优化温度场分布的电镀装置及其电镀方法
JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
JP6335777B2 (ja) 2014-12-26 2018-05-30 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
JP6459597B2 (ja) * 2015-02-16 2019-01-30 株式会社村田製作所 電解めっき装置
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
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JP6399973B2 (ja) 2015-06-18 2018-10-03 株式会社荏原製作所 めっき装置の調整方法及び測定装置
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JP6746185B2 (ja) * 2016-02-01 2020-08-26 アスカコーポレーション株式会社 半導体ウェハめっき用治具
CN105648514B (zh) * 2016-03-24 2017-09-12 河南理工大学 一种用于电沉积的搅拌机构
CN105648507A (zh) * 2016-03-24 2016-06-08 河南理工大学 一种用于电沉积平面件的装置
JP6678490B2 (ja) * 2016-03-28 2020-04-08 株式会社荏原製作所 めっき方法
JP6795915B2 (ja) * 2016-06-10 2020-12-02 株式会社荏原製作所 アノードに給電可能な給電体及びめっき装置
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JP2017186677A (ja) * 2017-05-29 2017-10-12 株式会社荏原製作所 電解銅めっき装置
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JP6986921B2 (ja) * 2017-10-12 2021-12-22 株式会社荏原製作所 めっき装置及びめっき方法
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JP2006152415A (ja) * 2004-12-01 2006-06-15 Ebara Corp めっき装置及びめっき方法

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JP5572229B2 (ja) 2014-08-13
KR101486441B1 (ko) 2015-01-28
CN101451264A (zh) 2009-06-10
KR20140130645A (ko) 2014-11-11
CN107604426A (zh) 2018-01-19
JP2013064202A (ja) 2013-04-11
JP2009155727A (ja) 2009-07-16
TWI457471B (zh) 2014-10-21
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JP2009155726A (ja) 2009-07-16
CN108588800A (zh) 2018-09-28
TW200936818A (en) 2009-09-01
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CN101451264B (zh) 2013-01-23
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