WO2014069023A1 - めっき装置、ノズル-アノードユニット、めっき部材の製造方法、および被めっき部材固定装置 - Google Patents
めっき装置、ノズル-アノードユニット、めっき部材の製造方法、および被めっき部材固定装置 Download PDFInfo
- Publication number
- WO2014069023A1 WO2014069023A1 PCT/JP2013/062767 JP2013062767W WO2014069023A1 WO 2014069023 A1 WO2014069023 A1 WO 2014069023A1 JP 2013062767 W JP2013062767 W JP 2013062767W WO 2014069023 A1 WO2014069023 A1 WO 2014069023A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plating
- plated
- plating solution
- ejection
- anode
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Definitions
- the present invention relates to a plating apparatus, and more specifically, a plating apparatus capable of performing uniform plating at high speed, a nozzle-anode unit used in the plating apparatus, a method of manufacturing a plating member using the plating apparatus, and plating thereof
- the present invention relates to an apparatus for fixing a member to be plated that is preferably used in the apparatus.
- a large number of members to be plated are continuously immersed in the plating solution (the plating solution may be sprayed), and the member to be plated is moved in the plating solution (a region where the plating solution is sprayed).
- a line-type plating method has been proposed in which plating is performed while moving the plate. According to this method, although the plating time per one member to be plated is long, a large number of plating members in which a plating film is formed on the surface to be plated of the member to be plated can be obtained in a short time. This method is suitable when the total number of members to be plated such as standard products is large and the members to be plated have a simple shape (for example, a flat plate).
- the member to be plated is basically flat or sufficiently small with respect to the holding mechanism of the rotating member to be plated. No means has yet been provided for performing electroplating at high speed while increasing the uniformity of the thickness of the plating film on a member to be plated having a complicated shape such as an engine block or a pressed part.
- an object of the present invention is to provide a plating apparatus that performs electroplating uniformly and at high speed regardless of the shape of a member to be plated. Another object of the present invention is to provide a nozzle-anode unit used in such a high-speed plating apparatus. Furthermore, this invention makes it a subject to provide the plating member manufactured with this plating apparatus. In addition, an object of the present invention is to provide an apparatus for fixing a member to be plated that is preferably used in such a plating apparatus.
- the present invention provided to solve the above problems is as follows. (1) a plating tank; an insoluble anode disposed in the plating tank; a plating power source capable of applying a voltage between the insoluble anode and a member to be plated; and moving the insoluble anode in the plating tank; An anode displacement mechanism capable of holding the insoluble anode in a predetermined position in the plating tank; and generating a control signal for controlling the operation of the insoluble anode displacement mechanism; A plating apparatus comprising a control device having an anode position control device capable of outputting to a displacement mechanism.
- the above (1) comprising a measuring device capable of measuring at least one of a current flowing through the insoluble anode when a voltage is applied from the plating power source and a potential of the insoluble anode with respect to the member to be plated.
- the plating apparatus as described in.
- the control device generates a control signal for controlling at least one of a current and a voltage applied to the insoluble anode based on a result measured by the measuring instrument, and outputs the control signal to the control device.
- the plating apparatus according to (2) further including an electric output control device capable of outputting to a plating power source.
- the anode position control device generates a control signal for controlling the operation of the insoluble anode displacement mechanism based on a result measured by the measuring instrument, and the control signal is transmitted to the anode displacement mechanism.
- a circulation mechanism having a plating solution intake part, a pump, and a plating solution ejection part for circulating the plating solution in the plating tank; the control device has an operation for controlling the operation of the circulation mechanism
- a circulation control device capable of generating a control signal to output the control signal and outputting the control signal to the circulation mechanism; moving the plating solution ejection part in the plating tank; and the plating solution ejection part
- a jetting part displacement mechanism capable of holding at a predetermined position in the plating tank; and the control device has a control signal for controlling the operation of the jetting part displacement mechanism
- the plating apparatus according to any one of (1) to (4), further including a jet part position control device capable of outputting a control signal to the jet part displacement mechanism.
- the circulation mechanism has an ejection amount adjustment mechanism capable of adjusting a plating solution ejection amount ejected from the plating solution ejection section, and the circulation control device controls the operation of the ejection amount adjustment mechanism.
- the plating apparatus as described in said (5) provided with the ejection amount control apparatus which can generate the control signal for performing, and can output the control signal to the said ejection amount adjustment mechanism.
- a circulation mechanism having a plating solution intake part, a pump, and a plating solution ejection part for circulating the plating solution in the plating tank;
- the control device has an operation for controlling the operation of the circulation mechanism
- a circulation control device capable of generating a control signal to output the control signal and outputting the control signal to the circulation mechanism; moving the plating solution ejection part in the plating tank; and the plating solution ejection part
- a jetting part displacement mechanism capable of holding at a predetermined position in the plating tank; and the control device has a control signal for controlling the operation of the jetting part displacement mechanism ,
- a jet part position control device capable of outputting a control signal to the jet part displacement mechanism, the jet part position control device being measured by the measuring instrument From the above (2) to (4), it is possible to generate a control signal for controlling the operation of the ejection part position control mechanism based on the results, and to output the control signal to the ejection part displacement mechanism.
- the plating apparatus as described in any one of
- the circulation mechanism includes an ejection amount adjustment mechanism capable of adjusting an amount of plating solution ejected from the plating solution ejection portion, and the circulation control device is configured to obtain a result measured by the measuring instrument.
- the plating apparatus as described.
- a member displacement mechanism capable of moving the member to be plated and holding the member to be plated at a position where at least a part of the member to be plated is disposed in the plating tank; and the control
- the apparatus further includes a member position control device capable of generating a control signal for controlling the operation of the member displacement mechanism and outputting the control signal to the member displacement mechanism.
- the plating apparatus according to any one of (1) to (8).
- the member position control device outputs a control signal for controlling the operation of the member displacement mechanism while a voltage is applied from the plating power source between the insoluble anode and the member to be plated.
- the relative position of the insoluble anode with respect to the plating solution ejection portion is controlled, and at least a part of the insoluble anode is disposed at a position facing the ejection hole of the plating solution ejection portion, and the ejection portion displacement mechanism and the anode
- the plating apparatus according to any one of (5) to (10), wherein the ejection mechanism position control device and the anode position control device are integrated with a displacement mechanism.
- the insoluble anode has a guide shape in which a portion disposed at a position facing the ejection hole of the plating solution ejection portion can guide the plating solution ejected from the plating solution ejection portion in a predetermined direction.
- the insoluble anode is obtained by subjecting a structure or a plate-like member formed from a plate-like member having a through hole to a portion arranged at a position facing the ejection hole of the plating solution ejection portion.
- a plurality of position control devices included in the control device provided that the member position control device operates the member displacement mechanism so that at least a part of the member to be plated is immersed in a plating solution.
- At least one of the displacement mechanisms other than the member displacement mechanism controlled by the at least one position control device is a member that is movable in the plating tank by the at least one displacement mechanism.
- the plating apparatus according to any one of (9) to (13), wherein the plating apparatus is operated so as to move in a direction proximal to the member to be plated.
- At least one of the plurality of position control devices included in the control device may include at least one displacement mechanism other than the member displacement mechanism controlled by the at least one position control device, by the at least one displacement mechanism.
- the member position control device On the condition that the member that is movable in the plating tank is operated so as to move in a direction distal to the member to be plated, the member position control device is configured such that the member to be plated is plated.
- the member to be plated on which the plating film is formed is taken out of the plating solution, and a member collecting step is provided for obtaining the member as a plating member.
- the first position is a position where the member to be plated interferes with the insoluble anode when the member to be plated is moved so as to be removed from the plating solution
- the second position is The manufacturing method according to any one of (16) to (18), wherein the member to be plated is located at a position where the member to be plated does not interfere with the insoluble anode when the member to be plated is moved out of the plating solution.
- At least the application step is performed while circulating the plating solution in the plating tank by a circulation mechanism including a plating solution intake unit, a pump, and a plating solution ejection unit, and the application is performed from the start of the member arranging step. It is a process started in a period until the end of the process, and the plating solution ejection part arranged in the plating tank is moved to be more proximal to the member to be plated in the plating solution And a step of starting the application of the plating solution from the start of the application step to the end of the member recovery step.
- the third position is a position where the member to be plated interferes with at least one of the insoluble anode and the plating solution ejection portion when the member to be plated is moved so as to be removed from the plating solution.
- the fourth position is a position where the member to be plated does not interfere with either the insoluble anode or the plating solution ejection part when the member to be plated is moved so as to be taken out from the plating solution (22). ) Manufacturing method.
- the relative position of the insoluble anode with respect to the plating solution ejection portion is controlled, and at least a part of the insoluble anode is disposed at a position facing the ejection hole of the plating solution ejection portion, and the anode arrangement step and the ejection portion.
- the manufacturing method according to any one of (22) to (25), wherein the manufacturing process is integrated with an arrangement process and is integrated with the anode retracting process and the ejection part retracting process.
- a plating solution jetting portion disposed in the plating bath to circulate the plating solution in the plating bath taken in from the plating solution taking-in portion with a pump and return the plating solution to the plating bath, and at least a part thereof is the plating
- a nozzle-anode unit comprising: an insoluble anode disposed at a position facing the ejection hole of the liquid ejection section, wherein the relative position of the insoluble anode with respect to the ejection hole is controlled.
- the insoluble anode has a structure in which a portion disposed at a position facing the ejection hole of the plating solution ejection portion is a plate-shaped member having a through-hole or is obtained by secondary processing of the plate-shaped member.
- the nozzle-anode unit according to the above (27) having the shape of
- the portion disposed at a position facing the ejection hole of the plating solution ejection portion has a guide shape that guides the plating solution ejected from the plating solution ejection portion in a predetermined direction (27 ) Or the nozzle-anode unit according to (28).
- the insoluble anode has a portion made of a cylindrical body in which a first end as one end is arranged at a position facing the ejection hole of the plating solution ejection portion, and the plating solution ejection portion
- the second end portion which is the end portion on the opposite side of the first end portion in the portion made of the cylindrical body, is inscribed in a diameter larger than the circumscribed circle of the opening of the second end portion. It is closed by a plate-like member having a circle, the plating solution ejection part is provided with a through hole, one opening of the through hole is an ejection hole of the plating solution, and the portion made of the cylindrical body is the through hole.
- the nozzle-anode unit according to (30) wherein the nozzle-anode unit is inserted from the other opening side, and the first end portion is disposed at a position facing the ejection hole of the plating solution.
- the first rod-shaped body and the second rod-shaped body are held by the one rod-shaped body and the second rod-shaped body, in the direction in which the other ends thereof are close to each other and in the direction in which they are separated from each other.
- a rod-shaped body movable holding mechanism capable of being held both in a state in which the other end portion is urged toward each other and in a state in which the other end portion is urged away from each other;
- a device for fixing a member to be plated
- the other end of the first rod-shaped body and the other end of the second rod-shaped body can be moved both in a direction away from each other and in a direction closer to each other, and A rod-shaped body drive mechanism having a drive mechanism capable of holding a state in which the other end of the first rod-shaped body and the other end of the second rod-shaped body are biased in the moving direction is provided.
- the shape of the member to be plated is not limited to a flat plate shape, but the insoluble anode and / or the plating solution ejection portion is the shape of the member to be plated even when the member has a complicated three-dimensional shape. Since the electroplating is performed in a state of being arranged at a position matched with the above, it is possible to perform the electroplating at a high speed while improving the uniformity of the thickness of the plating film formed on the member to be plated.
- a plating film having a sufficient thickness can be formed at a high speed even in a portion where it is difficult to form a plating film as compared with other portions according to the prior art. It becomes possible. Furthermore, if the apparatus for fixing a member to be plated according to the present invention is used, the member to be plated can be easily attached and detached, and in a preferred embodiment, a large current can flow to the member to be plated.
- FIG. 6 is a perspective view conceptually showing the structure of the nozzle-anode unit shown in FIG. 5.
- FIG. 6 is a sectional view conceptually showing the structure of the nozzle-anode unit shown in FIG. 5.
- FIG. 6 is a perspective view conceptually showing the structure of each of an insoluble anode including a plating solution ejection portion and a cylindrical shape portion constituting the nozzle-anode unit shown in FIG. 5.
- FIG. 10 is a perspective view conceptually showing the structure of the nozzle-anode unit shown in FIG. 9.
- FIG. 10 is a cross-sectional view conceptually showing the structure of the nozzle-anode unit shown in FIG. 9.
- FIG. 10 is a perspective view conceptually showing each structure of an insoluble anode including a plating solution ejection portion and a cage-shaped portion constituting the nozzle-anode unit shown in FIG. 9.
- FIG. 14 is a perspective view conceptually showing an arrangement state of members in the plating tank of the plating apparatus according to the example shown in FIG. It is a perspective view which shows notionally the arrangement
- FIG. 6 is a perspective view conceptually showing the structure of a NAU displacement mechanism of a nozzle-anode unit of the plating apparatus according to the example shown in FIG. 5.
- 13 holds an insoluble anode, a nozzle-anode unit, a member to be plated, a part of a fixing device for a member to be plated, an anode displacement mechanism, a NAU displacement mechanism, a member displacement mechanism, and each mechanism of the plating apparatus according to the example shown in FIG.
- It is a perspective view which shows notionally the structure of a flame
- FIG. 21 It is a perspective view which shows notionally the structure of the fixing apparatus of the to-be-plated member shown by FIG. It is a perspective view which shows notionally the principal part of the fixing apparatus of the to-be-plated member shown by FIG.
- the rod-shaped body driving mechanism of the fixing device for the member to be plated shown in FIG. 21 is activated, and each rod-shaped body is moved in a direction in which the other ends of the first rod-shaped body and the second rod-shaped body are separated from each other.
- FIG. 24 is a perspective view conceptually showing an operation of the fixing device for the member to be plated shown in FIG. 21, and the fixing device is moved downward from the state shown in FIG. 23 so that the fixing device and the member to be plated are proximal. It shows a state in which one end of the first and second rod-like bodies has been inserted into the hollow part of the member to be plated. It is a perspective view which shows notionally operation
- a rod-shaped body drive mechanism act operates and a 1st rod-shaped body and a 2nd rod-shaped body Each rod-shaped body is moved in the direction in which the other end of the metal plate is separated, and the member to be plated is held by the first and second rod-shaped bodies.
- FIG. 1 is a diagram conceptually showing the configuration of a plating apparatus according to an embodiment of the present invention.
- FIG. 1 the illustration of electrical-related configurations such as a plating power source, a member to be plated, an electrical wiring for applying a voltage to the anode, and a control wiring is omitted, and FIG. 2 is used for the configuration related to the control of these plating apparatuses. I will explain.
- the plating tank 1 provided in the plating apparatus 100 according to the present embodiment contains a plating solution therein.
- the member to be plated 2 is immersed in the plating solution, and the member to be plated 2 is held by the member displacement mechanism 3.
- the member displacement mechanism 3 performs movement of the member to be plated 2 and holding of the member to be plated 2 at a position where at least a part of the member to be plated 2 is disposed in the plating tank 1. Controlled by a position controller.
- the member displacement mechanism 3 guides the vertical movement of the fixing device 3A and the fixing device 3A that directly contacts and holds the member 2 to be plated.
- a vertical linear sliding shaft 3B provided with a fixing device 3A in the vicinity thereof, a horizontal linear sliding shaft 3C for guiding the horizontal movement of the fixing device 3A, and a vertical linear sliding shaft 3B.
- the position of the member to be plated 2 is changed by moving on the upper and horizontal direction linearly moving slide shafts 3C, or at predetermined positions on the vertical direction linearly movable slide shafts 3B and the horizontal direction linearly movable slide shafts 3C.
- the sliding holding device 3D that holds the member 2 to be plated in a predetermined position by maintaining the stopped state.
- a part of the fixing device 3A also serves as a current-carrying part with the member 2 to be plated.
- the specific structure and operation of the fixing device 3A will be described later.
- the specific configurations of the vertical linear sliding shaft 3B and the horizontal linear sliding shaft 3C are not particularly limited. What is suitable for the purpose such as the distance that can be driven by the sliding holding device 3D and the load resistance may be appropriately selected from what is available from the market as a so-called linear guide.
- the specific configuration of the sliding holding device 3D is not particularly limited. As long as the position of the member to be plated 2 can be appropriately controlled, the driving and holding system may be a pneumatic system, a hydraulic system, or an electrical system.
- the plating apparatus 100 includes a plurality of insoluble anodes in the plating tank 1. Specifically, a fixed insoluble anode (hereinafter also referred to as “fixed anode”) 4A attached to the side wall of the plating tank 1 and a movable insoluble anode (hereinafter “movable”) whose position can be changed by the anode displacement mechanism 5. 4B, and an insoluble anode (hereinafter also referred to as “NAU anode”) 4C, which constitutes one component of the nozzle-anode unit (details will be referred to hereinafter as “NAU”).
- the material of the insoluble anode is not particularly limited. A commonly used material may be employed, and a specific example is a material obtained by plating platinum on a titanium material.
- the anode displacement mechanism 5 moves the movable anode 4B in the plating tank 1 and holds the movable anode 4B at a predetermined position in the plating tank 1, and is controlled by an anode position control device described later. .
- the basic configuration of the anode displacement mechanism 5 is the same as that of the member displacement mechanism 3, and is composed of a vertical direction linear slide shaft 5A, a horizontal direction linear slide shaft 5B, and a slide holding device 5C.
- the vertical linear sliding shaft 5A serves as a guide for moving the movable anode 4B in the vertical direction.
- the movable anode 4B is provided at or near the lower end in the vertical direction. Yes.
- the horizontal linear motion sliding shaft 5B guides the horizontal movement of the movable anode 4B.
- the sliding holding device 5C moves on the vertical linear sliding shaft 5A and the horizontal linear sliding shaft 5B to change the position of the movable anode 4B, or the vertical linear sliding shaft 5A and horizontal.
- the movable anode 4B is held at a predetermined position by maintaining a stopped state at a predetermined position on the directional linearly moving slide shaft 5B.
- the specific configurations of the vertical linear sliding shaft 5A and the horizontal linear sliding shaft 5B are not particularly limited. What is suitable for the purpose, such as the distance that can be driven by the sliding holding device 5C and the load resistance, may be appropriately selected from those that are commercially available as so-called linear guides.
- the specific configuration of the sliding holding device 5C is not particularly limited. As long as the position of the movable anode 4B can be appropriately controlled, the driving and holding system may be a pneumatic system, a hydraulic system, or an electrical system. As will be described later, the movable anode 4B may be interlocked with the member to be plated 2 while managing the relative position. In this case, the member displacement mechanism 3 and the anode displacement mechanism 5 are driven in the same manner. It is preferable that
- the plating apparatus 100 has a circulation mechanism 6 for circulating the plating solution in the plating tank 1.
- the circulation mechanism 6 of the plating apparatus 100 according to the present embodiment includes a plating solution intake unit 6A, an outward piping 6B, a pump 6C, a return piping 6D, a first return piping 6E, a fixed plating solution ejection unit 6F, and a first flow rate adjustment.
- Valve 6G second return pipe 6H, second flow rate adjusting valve 6I, movable plating solution jetting part 6J, its injection hole 6K, third return pipe 6L, nozzle-anode unit (NAU) plating solution jetting part ( Hereinafter, it is referred to as “NAU ejection portion”.) 6M, its ejection hole 6N, and a third flow rate adjusting valve 6O.
- the plating solution take-in portion 6A is an area partitioned by the overflow partition plate 1A of the plating tank 1 (hereinafter, this area is referred to as a “take-in area”, and an area other than the take-in area in the plating tank is a “main area”. Also, the plating solution in the plating tank 1 is taken in.
- the plating solution taken in from the plating solution take-in part 6A passes through the forward piping 6B and reaches the pump 6C.
- the return pipe 6D through which the plating solution discharged from the pump 6C flows branches into a first return pipe 6E, a second return pipe 6H, and a third return pipe 6L.
- One end of the first return pipe 6E is connected to a fixed plating solution ejection part 6F provided at the bottom of the main region of the plating tank 1. For this reason, the plating solution overflowed from the main region to the take-in region is taken in from the plating solution take-in unit 6A by the circulation mechanism 6, and the plating solution is pressurized by the pump 6C and returned from the fixed plating solution ejection unit 6F to the main region.
- the amount of the plating solution flowing through the first circulation system is adjusted by a first flow rate adjusting valve 6G installed in the middle of the pump 6C and the first return pipe 6E.
- One end of the second return pipe 6H is connected to a movable plating solution ejection part 6J arranged in the plating tank 1. For this reason, the plating solution overflowed from the main region to the take-in region is taken in from the plating solution take-in portion 6A by the circulation mechanism 6, and the plating solution is pressurized by the pump 6C from the jet hole 6K of the movable plating solution jet portion 6J.
- a circulation system (hereinafter also referred to as “second circulation system”) is constructed in which the main area is ejected and returned. The amount of plating solution flowing through the second circulation system is adjusted by a second flow rate adjustment valve 6I installed in the middle of the pump 6C and the second return pipe 6H.
- the movable plating solution jetting part 6J can vary its arrangement in the plating tank 1 by a jetting part displacement mechanism 7 including a vertical linear motion sliding shaft 7A, a horizontal linear motion sliding shaft 7B, and a sliding holding device 7C. It is said that.
- the vertical linear sliding shaft 7A serves as a guide for moving the movable plating solution ejection part 6J in the vertical direction. In FIG. 1, the movable plating solution is ejected at the lower end of the vertical direction or in the vicinity thereof. Part 6J is provided.
- the horizontal direction linearly sliding shaft 7B guides the horizontal movement of the movable plating solution ejection part 6J.
- the sliding holding device 7C moves on the vertical direction linear sliding shaft 7A and the horizontal direction linear sliding shaft 7B to change the position of the movable plating solution ejection portion 6J, or the vertical direction linear sliding shaft.
- the movable plating solution ejection part 6J is held at a predetermined position by maintaining the state stopped at a predetermined position on 7A and the horizontal direction linearly sliding shaft 7B.
- the specific configurations of the vertical direction linear sliding shaft 7A and the horizontal direction linear sliding shaft 7B are not particularly limited. What is suitable for the purpose, such as the distance that can be driven by the sliding holding device 7C and the load resistance, may be appropriately selected from those that are commercially available as so-called linear guides.
- the specific configuration of the sliding holding device 7C is not particularly limited.
- the driving and holding system may be a pneumatic system, a hydraulic system, or an electrical system.
- the movable plating solution ejection part 6J may be interlocked with the movable anode 4B and / or the member 2 to be plated while the relative position is managed.
- the ejection part displacement mechanism 7 is a member displacement mechanism. 3 and / or is preferably driven in the same manner as the anode displacement mechanism 5.
- One end of the third return pipe 6L is connected to a plating solution ejection portion (NAU ejection portion) 6M of a nozzle-anode unit (NAU) 8 disposed in the plating tank 1.
- the circulation mechanism 6 takes in the plating solution overflowed from the main region to the take-in region from the plating solution take-in portion 6A, pressurizes the plating solution with the pump 6C, and then from the ejection hole 6N of the NAU ejection portion 6M.
- a circulation system (hereinafter also referred to as a “third circulation system”) is constructed to be ejected to the back.
- the amount of the plating solution flowing through the third circulation system is adjusted by a third flow rate adjusting valve 6O installed in the middle of the pump 6C and the third return pipe 6L.
- the nozzle-anode unit (NAU) 8 is managed with respect to the NAU ejection part 6M and the relative position to the NAU ejection part 6M (a specific example of the management is fixed).
- the ejection of the NAU ejection part 6M A NAU anode 4C, at least a part of which is disposed at a position facing the hole 6N, that is, a position facing the ejection hole 6N is provided.
- the NAU anode 4C is disposed so as to contact the ejection hole 6N, and the through hole 4D of the NAU anode 4C and the ejection hole 6N communicate with each other.
- the plating solution discharged from the ejection holes 6N diffuses into the plating tank 1 while at least partly contacting the NAU anode 4C. Therefore, when a positive voltage is applied to the NAU anode 4C, the flowing direction of the plating solution discharged from the through hole 4D of the NAU anode 4C and the direction of the lines of electric force are likely to be parallel, and the surface to be plated of the member 2 to be plated The deposition state of the plated metal tends to be uniform.
- the relative position between the NAU anode 4C and the NAU ejection part 6M may be managed so as to be variable by some displacement mechanism.
- the arrangement of the NAU 8 in the plating tank 1 can be changed by a NAU displacement mechanism 9 including a vertical linear sliding shaft 9A, a horizontal linear sliding shaft 9B, and a sliding holding device 9C.
- the NAU displacement mechanism 9 is positioned as an integrated anode displacement mechanism and ejection portion displacement mechanism.
- the vertical linear sliding shaft 9A serves as a guide for moving the NAU 8 in the vertical direction.
- the NAU 8 is provided at or near the lower end of the vertical direction.
- the horizontal linear motion sliding shaft 9B guides the movement of the NAU 8 in the horizontal direction.
- the slide holding device 9C moves the position of the NAU 8 by moving on the vertical direction linear slide shaft 9A and the horizontal direction linear slide shaft 9B, or moves the vertical direction linear slide shaft 9A and the horizontal direction linear shaft.
- the NAU 8 is held at a predetermined position by maintaining a stopped state at a predetermined position on the dynamic sliding shaft 9B.
- the specific configurations of the vertical direction linear sliding shaft 9A and the horizontal direction linear sliding shaft 9B are not particularly limited. What is suitable for the purpose, such as the distance that can be driven by the sliding holding device 9C and the load resistance, may be appropriately selected from those that are commercially available as so-called linear guides.
- the specific configuration of the sliding holding device 9C is not particularly limited.
- the driving and holding system may be a pneumatic system, a hydraulic system, or an electrical system.
- the NAU 8 may be interlocked with the movable plating solution ejection part 6J, the movable anode 4B and / or the member to be plated 2 while managing the relative positions.
- the NAU displacement mechanism 9 is connected to the ejection part. It is preferable to drive the displacement mechanism 7, the member displacement mechanism 3 and / or the anode displacement mechanism 5 in the same manner.
- the circulation mechanism 6 of the plating apparatus 100 includes only the pump 6C as an apparatus for circulating the plating solution
- the circulation mechanism 6 may include a plurality of pumps.
- the arrangement of the pump in that case is not limited.
- the insoluble anode (specifically, at least one of the fixed anode 4A, the movable anode 4B, and the NAU anode 4C) included in the plating apparatus 100 according to the present embodiment may come into contact with the member 2 to be short-circuited.
- an insulating protective member may be provided on the side proximal to the member 2 to be plated.
- the specific configuration of such a protective member is not particularly limited. As a specific example, there may be mentioned a configuration in which a mesh made of plastic or the like is attached to a side proximal to the member 2 to be plated of an insoluble anode.
- FIG. 2 is a block diagram conceptually showing control of the plating apparatus according to one embodiment of the present invention.
- the fixed anode 4A, the movable anode 4B and the NAU anode 4C arranged in the plating tank 1 are the anode of the plating power source 10 by the fixed anode 4A wiring 11A, the movable anode 4B wiring 11B and the NAU anode 4C wiring 11C, respectively. It is electrically connected to the terminal 10A.
- the plating power source 10 of the plating apparatus 100 shown in FIG. 1 includes the voltage and current output from the fixed anode 4A wiring 11A, the voltage and current output from the movable anode 4B wiring 11B, and the NAU anode 4C wiring 11C. The voltage and current output from can be controlled independently of each other.
- the member to be plated 2 disposed in the plating tank 1 is electrically connected to the cathode terminal 10B of the plating power supply 10 by the member to be plated 11D.
- the plating apparatus 100 has a fixed anode 4A, a movable anode 4B, and a NAU anode 4C when a voltage is applied from the plating power source 10 (these are collectively referred to as “insoluble anodes 4A to 4C”).
- Measuring devices 12A, 12B, and 12C for measuring at least one of the current flowing through each of the electrodes and the potential of the insoluble anodes 4A to 4C with respect to the member 2 to be plated.
- the specific configuration of the measuring device is not particularly limited. It may be an ammeter, may consist of a shunt resistor and a voltmeter, may be a voltmeter, or a combination thereof. In FIG.
- each of the fixed anode 4 ⁇ / b> A wiring 11 ⁇ / b> A, the movable anode 4 ⁇ / b> B wiring 11 ⁇ / b> B, and the NAU anode 4 ⁇ / b> C wiring 11 ⁇ / b> C is provided with a measuring device including an ammeter or a measuring device including a shunt resistor and a voltmeter. Shows the configuration.
- a specific example of measuring the potential of the insoluble anodes 4A to 4C with respect to the member to be plated 2 is a wiring in which each of the insoluble anodes 4A to 4C and the cathode terminal 10B of the plating power source 10 are interposed with a voltmeter.
- the potentials of the insoluble anodes 4A to 4C with respect to the members to be plated 2 can be individually measured with a voltmeter.
- the plating apparatus 100 receives signals as measurement results from the measuring devices 12A, 12B, and 12C, and operates the apparatuses included in the plating apparatus 100 (plating power supply 10, sliding holding device 3D, pump 6C, etc.).
- the control device 13 generates a control signal for controlling the control signal and outputs the control signal to a corresponding device.
- the control device 13 includes a signal input unit 13A for receiving signals from the measuring instruments 12A, 12B, and 12C, and an electric output control device 13B, a position control device 13C, and a circuit that receive the signals received by the signal input unit 13A.
- a control device 13D is provided.
- the plurality of devices included in the control device 13 may be independent, or one control device may perform the functions of the plurality of control devices.
- the control device 13 has a function of generating a control signal for controlling each device based on a predetermined control program and an input signal from an interface device such as a keyboard, and outputting the control signal to a corresponding device. Also have
- the electrical output control device 13B generates a control signal for controlling at least one of the current and the voltage applied to the insoluble anodes 4A to 4C based on the results measured by the measuring devices 12A, 12B, and 12C, and controls the control signal.
- a signal is output to the plating power source 10.
- the plating power source 10 performs an operation (increase or decrease in output current or increase or decrease in output voltage) associated with the input signal on the condition that a control signal is input from the electrical output control device 13B.
- the electric output control device 13B generates a control signal for controlling the plating power source 10 based on a predetermined control program or an input signal from the user interface device, and outputs the control signal to the plating power source 10. It also has a function to
- the position control device 13C generates a control signal for controlling the operation (movement, holding, etc.) of the sliding holding device 3D of the member displacement mechanism 3 and sends the control signal to the sliding holding device 3D.
- the ejection unit position control device that generates a control signal for controlling the operation of the sliding holding device 7C of the ejection unit displacement mechanism 7 and outputs the control signal to the sliding holding device 7C, and the sliding of the NAU displacement mechanism 9
- a control signal for controlling the operation of the moving holding device 9C is generated, and a NAU position control device for outputting the control signal to the sliding holding device 9C and a driving device for operating the fixing device 3A are provided.
- the NAU position control device is an anode position control device for controlling the arrangement of the NAU anode 4C in the plating tank 1, and an ejection for controlling the arrangement of the NAU ejection portion 6M in the plating tank 1. It can be regarded as an integrated part position control device.
- the position control device 13C can generate a control signal for the plurality of position control devices based on the results measured by the measuring devices 12A, 12B, and 12C. Further, the position control device 13C can cause the plurality of position control devices to generate a control signal based on a control program defined in advance or an input signal from the interface device.
- the position control device 13C can individually generate control signals for the plurality of control devices included in the device. Moreover, a some control apparatus can be made to cooperate and a some slide holding
- the circulation control device 13D generates a control signal for controlling the operation of the pump driving device 14A for driving the pump 6C, and outputs the control signal to the pump driving device 14A.
- a first valve that generates a control signal for controlling the operation of the first flow rate adjusting device 14B that operates the flow rate adjusting valve 6G, and outputs the control signal to the first flow rate adjusting device 14B.
- the control device generates a control signal for controlling the operation of the second flow rate adjusting device 14C for operating the second flow rate adjusting valve 6I, and sends the control signal to the second flow rate adjusting device 14C.
- a control signal for controlling the operation of the valve control device and the second flow rate adjusting device 14D for operating the third flow rate adjusting valve 6O is generated, and the control signal is used as the second flow rate.
- the circulation control device 13D can generate control signals for the plurality of position control devices based on the results measured by the measuring devices 12A, 12B, and 12C. Further, the circulation control device 13D can cause the plurality of position control devices to generate a control signal based on a control program defined in advance or an input signal from the interface device. Furthermore, the circulation control device 13D can individually generate control signals for the plurality of control devices included in the device, or can cause the plurality of control devices to cooperate.
- a flow meter is installed in each of the first return pipe 6E, the second return pipe 6H, and the third return pipe 6L, and each control included in the circulation control device 13D is based on information from the flow meters. The operation of the device may be set.
- the control device 13 can cooperate a plurality of control devices provided in the control device 13.
- the member to be plated 2 is disposed in the plating solution in the plating tank 1, a voltage is applied from a plating power source for a predetermined time, and a member to be plated on which a plating film is formed ( A series of processes until the plating member 2 is removed from the plating solution in the plating tank 1 will be described with reference to FIG.
- FIG. 3 is a flowchart showing an example of the operation of the plating apparatus according to one embodiment of the present invention.
- the member attachment process, the member arrangement process, the arrangement process, the ejection start process, the application process, the ejection end process, the retreat process, and the member recovery process are performed in this order.
- the sliding holding device 3D of the member displacement mechanism 3 is operated based on the control signal output from the member position control device provided in the position control device 13C, and the fixing device control provided in the control device 13 is provided.
- the fixing device 3A is operated based on the control signal output from the device, and the member to be plated 2 is fixed to the fixing device 3A. Details of the operation will be described later together with a specific example of the fixing device 3A.
- the sliding holding device 3D of the member displacement mechanism 3 is operated based on the control signal output from the member position control device provided in the position control device 13C, thereby performing the member mounting step on the fixing device 3A. At least a part of the member to be plated 2 fixed in this manner is immersed in the plating solution in the plating tank 1.
- the relationship between the start time of the placement process and the start time of the member placement process is not particularly limited. Either one may be started first, or both may be started simultaneously. When either one is started first, the relationship between the end time of one process and the start time of the other process is not limited. The other process may be started after one process is completed, or the other process may be started before one process is completed.
- an anode arrangement process In the arrangement process according to this example, three processes are performed: an anode arrangement process, an ejection part arrangement process, and a NAU part arrangement process.
- the relationship between the start times of these three steps is not particularly limited, and may be started simultaneously or sequentially.
- the sliding holding device 5C of the anode displacement mechanism 5 is operated based on a control signal output from the anode position control device provided in the position control device 13C, thereby causing a predetermined position (“anode” in the plating tank 1).
- the movable anode 4B in a state of being arranged at the initial position is also brought closer to the member to be plated 2 in a state of being arranged in the plating solution in the plating tank 1 by the member arrangement process, that is, It moves so that it may become more proximal, and it hold
- the first position where the movable anode 4B is arranged in the anode arranging step may be a position where the member to be plated 2 interferes with the movable anode 4B when the member 2 to be plated is moved so as to be removed from the plating solution. .
- the movable anode 4B is arranged at the first position after the member to be plated 2 is immersed in the plating solution to some extent by the member arranging step.
- the insoluble anode is often fixed to the plating tank 1 like the fixed anode 4A. In such a case, it is impossible to place the insoluble anode at a position that interferes with the removal operation of the member to be plated 2 as in the first position.
- the insoluble anode included in the plating apparatus 100 according to the present embodiment can be moved in the plating tank 1 like the movable anode 4B, the insoluble anode is also insoluble at a position where interference with the member to be plated 2 occurs. An anode can be placed. Therefore, according to the plating apparatus 100 which concerns on this embodiment, it is possible to set the arrangement
- the variation in the distance between the surface to be plated and the insoluble anode can be set within a predetermined range (for example, within 20%) for all the surfaces to be plated of the member 2 to be plated.
- the variation in current density during plating on the surface to be plated of the member 2 to be plated varies in solution resistance between the surface to be plated and the insoluble anode based on the variation in the distance between the surface to be plated and the insoluble anode. This is one of the main causes.
- the variation in the distance between the surface to be plated and the insoluble anode can be controlled within a predetermined range, the variation in the current density on the surface to be plated is reduced, and formed on the member 2 to be plated.
- the plating film has excellent thickness and film quality uniformity.
- the use of the additive as described above means that the plating deposition rate is lowered even if the current density is increased, so that the energy utilization efficiency is lowered as compared with the case of no addition. Therefore, by using the plating apparatus 100 according to the present embodiment and performing plating without using an additive or by reducing the amount of use, it is possible to increase the efficiency of energy use in the plating process.
- the sliding holding device 7C of the ejection part displacement mechanism 7 is operated based on a control signal output from the ejection part position control device provided in the position control device 13C, so that a predetermined position in the plating tank 1 is obtained.
- a predetermined position in the plating tank 1 is obtained.
- the plating solution ejection portion 6 ⁇ / b> J in a state of being disposed at a position close to the member to be plated 2 disposed in the plating solution in the plating tank 1 by the member arrangement step. That is, it is moved so as to be more proximal and held at a preset third position.
- the plating solution jetting portion in the plating solution circulation mechanism is fixed at a specific position of the plating solution, like the fixed plating solution jetting portion 6. In the position far from the plating solution ejection part, the flow of the plating solution may be insufficient. If the member to be plated 2 is disposed in such a region where the flow of the plating solution is insufficient, the supply of plating metal ions is insufficient on the surface to be plated in that region, and the plating deposition rate is reduced. Compared with the plating surface, the thickness was lowered, and the thickness of the plating film was likely to vary.
- the plating solution jetting part 6J is movable in the plating tank 1 as in the plating apparatus 100 according to the present embodiment, the plating solution is merely plated from the fixed plating solution jetting part as described above. Even if there is a region where the supply of metal ions is insufficient, the plating solution ejection part 6J is arranged so that the plating solution is ejected in that region, so that the plating film on the surface to be plated of the member to be plated 2 is removed. It becomes easy to make the thickness uniform. Since the problem of insufficient supply of plating metal ions as described above becomes particularly noticeable when the plating deposition rate is high, it is easy to deposit plating at a high speed by using the plating apparatus 100 according to this embodiment.
- this 3rd position is a position where the to-be-plated member 2 interferes with the plating solution ejection part 6J, when moving the to-be-plated member 2 so that it may take out from a plating solution similarly to a 1st position. Also good.
- the sliding holding device 9C of the NAU displacement mechanism 9 is operated based on a control signal output from the NAU position control device provided in the position control device 13C, thereby causing a predetermined position (“The NAU 8 in the state of being placed at the “NAU initial position”) is moved closer to the member to be plated 2 placed in the plating solution in the plating tank 1 by the member placement step, that is, more proximally. And hold at a preset fifth position. Since the NAU 8 is configured such that the NAU anode 4C and the NAU ejection part 6M are integrated and movable, the NAU 8 has both functions of the movable anode 4B and the plating solution ejection part 6J.
- the fifth position is also a position where the member to be plated 2 interferes with the NAU 8 when the member to be plated 2 is moved so as to be removed from the plating solution, like the first position and the third position. May be.
- the pump 6C and the first flow rate adjusting valve 6G are operated from the stage of the member arranging step, so that the plating solution is circulated continuously through the first circulation path, Foreign matter contained in the plating solution is removed by a strainer attached to the outward piping 6B.
- the ejection start process is performed after the arrangement process, but the ejection start process may be started before or during the arrangement process, and the first return pipe 6E is not particularly provided without the ejection start process.
- the plating solution may be continuously ejected from the plating solution ejection part 6J and the plating solution ejection part 6M of the NAU8.
- a small amount of the plating solution is continuously ejected from the plating solution ejection portion 6J and the plating solution ejection portion 6M of the NAU 8, and in the ejection start process, from the plating solution ejection portion 6J and the plating solution ejection portion 6M of the NAU 8
- the amount of eruption may be increased.
- the plating power source 10 is operated based on a control signal from the electrical output control device 13B, so that a voltage is applied between the member to be plated 2 and the insoluble anodes 4A to 4C for a predetermined period of time.
- a plating film is formed on 2.
- This voltage value is not particularly limited, and may be appropriately set in consideration of the shape of the member 2 to be plated, the type of plating, the thickness of the plating film to be obtained, and the like. In applying a voltage, the voltage value may be controlled or the current value may be controlled.
- the electrical output control device 13B may perform control such that current or voltage varies during the application process.
- the change may be performed according to a preset program, may be performed by an input operation from a user interface device, or may be performed by feedback control described below.
- the electric output control device 13B included in the control device 13 receives a voltage-related signal as an input, and generates a signal for controlling at least one of a current and a voltage applied to the fixed anode 4A, the movable anode 4B, and the NAU anode 4C.
- the signal is output to the plating power source 10.
- the plating power supply 10 to which such a signal is input varies the current and / or voltage applied to at least one of the fixed anode 4A, the movable anode 4B and the NAU anode 4C according to the signal.
- the NAU when the current value measured by the measuring device 12C on the wiring 11C to the NAU anode 4C decreases from a predetermined value and the deposition rate of the plating metal decreases, the NAU For example, the voltage applied to the anode 4C is increased, and when the current value measured in the measuring device 12C on the wiring 11C to the NAU anode 4C is restored to a predetermined value, the applied voltage is held.
- the position of at least one of the member 2 to be plated, the movable anode 4B, the movable plating solution ejection part 6J and the NAU 8 in the plating tank 1 may be changed.
- the change may be performed according to a preset program, may be performed by an input operation from the user interface device, or may be performed feedback control described below.
- the position control device 13C included in the control device 13 receives a voltage-related signal as an input, generates a signal for controlling at least one of the sliding holding devices 3D, 5C, 7C, and 9C, and outputs the signal to the corresponding slide. Output to the moving holding devices 3D, 5C, 7C and / or 9C.
- the sliding holding devices 3D, 5C, 7C, and / or 9C that have received such a signal are provided in the plating tank 1 of at least one of the member 2 to be plated, the movable anode 4B, the movable plating solution ejection portion 6J, and the NAU 8 according to the signal. Change the position.
- the position control device 13 may swing the member to be plated 2 in the plating tank 1 by interlocking the sliding holding devices 3D, 5C, 7C and 9C.
- the insoluble anode is fixed at a specific position in the plating tank, when the member to be plated is swung in the plating tank, the relative position of the member to be plated with respect to the insoluble anode is determined. The relationship fluctuates due to the swing of the member to be plated in the plating tank.
- the member to be plated 2 is swung in the plating tank 1 while maintaining the relative positional relationship between the member to be plated 2 and the movable anode 4B and the NAU anode 4C. be able to. Therefore, if no voltage is applied to the fixed anode 4A, the member to be plated 2 can be swung in the plating tank 1 with almost no change in the current density distribution on the surface to be plated of the member 2 to be plated.
- the amount of plating solution ejected from at least one of the fixed plating solution ejecting portion 6F, the movable plating solution ejecting portion 6J and the NAU ejecting portion 6M may be varied.
- the change may be performed according to a preset program, may be performed by an input operation from the user interface device, or may be performed feedback control described below.
- the circulation control device 13D included in the control device 13 is configured to control at least one of the first flow rate adjustment valve 6G, the second flow rate adjustment valve 6I, and the third flow rate adjustment valve 6O using a signal related to voltage as an input. Is output to the corresponding first flow rate adjustment valve 6G, second flow rate adjustment valve 6I and / or third flow rate adjustment valve 6O.
- the first flow rate adjustment valve 6G, the second flow rate adjustment valve 6I, and / or the third flow rate adjustment valve 6O that have received such a signal, in accordance with the signal, the fixed plating solution ejection unit 6F, the movable plating solution ejection unit 6J, and The amount of plating solution ejected from at least one of the NAU ejecting portions 6M is varied.
- the plurality of feedback controls described above may be independent or may be performed so as to cooperate with each other.
- ejection stop process In the ejection stop process, the ejection of the plating solution from the movable plating solution ejection part 6J, the NAU ejection part 6M, and the like is stopped. Specifically, control signals are output from the second valve control device and the third valve control device provided in the circulation control device 13D, and the second flow rate adjusting device 14C and the third flow rate input with these control signals.
- the adjusting device 14D operates the second flow rate adjusting valve 6I and the third flow rate adjusting valve 6O in accordance with the control signal, thereby stopping the spraying of the plating solution from the plating solution ejection part 6J and the NAU liquid ejection part 6M.
- the start timing of the ejection stop process is not particularly limited as long as it is after the end of the application process.
- the ejection stopping process may be performed after the evacuation process is completed.
- the ejection of the plating solution from the movable plating solution ejection part 6J, the NAU ejection part 6M, etc. is continuously performed in the same manner as the plating solution ejection from the fixed plating solution ejection part 6F without carrying out the ejection stopping process. Good.
- evacuation process In the retreating process, movable components such as the movable anode 4B arranged in the plating tank 1 are moved so as to be more distal from the member to be plated on which the plating film is formed.
- the execution time of the evacuation process is not particularly limited as long as it is after the application process is completed.
- the relationship of the start time with the above-described ejection stop process is arbitrary.
- positioning process do not interfere with the movement of the to-be-plated member 2 taken out from a plating solution in the member collection process mentioned later, it will evacuate.
- the process may be performed after the member recovery process.
- the sliding holding device 5C of the anode displacement mechanism 5 is operated based on a control signal output from the anode position control device provided in the position control device 13C.
- the movable anode 4B held in a predetermined position (for example, the first position) of the member to be plated (plating member) 2 in a state in which the plating process is formed on the surface after the application process is completed. Move away, that is, more distally, and hold in a preset second position.
- This second position may be an anode initial position that is the position where the movable anode 4B was originally arranged during the anode arranging step.
- the predetermined position in the plating tank 1 is a position where the member to be plated 2 interferes with the movable anode 4B when the member to be plated 2 is moved so as to be removed from the plating solution after the application process is completed. Then, after performing an anode retracting process for moving the movable anode 4B to the second position, a member recovery process described later is performed.
- the application process is completed by operating the sliding holding device 7C of the ejection part displacement mechanism 7 based on the control signal output from the ejection part position control device provided in the position control device 13C, and thereby plating is performed.
- the plating solution ejection part 6J held in a predetermined position (for example, the third position) in the tank 1 is moved away from the plating member 2, that is, moved further to the distal end.
- This fourth position may be an ejection portion initial position that is the position where the plating solution ejection portion 6J was originally arranged during the ejection portion arrangement step.
- the sliding holding device 9C of the NAU displacement mechanism 9 is operated based on a control signal output from the NAU position control device provided in the position control device 13C.
- the NAU 8 held in a predetermined position (for example, the fifth position) is moved away from the plating member 2, that is, moved more distally, to a preset sixth position. Hold.
- This sixth position may be the NAU initial position, which is the position where the NAU 8 was initially placed during the NAU portion placement step.
- the member recovery step at least one in the plating solution in the plating tank 1 is operated by operating the sliding holding device 3D of the member displacement mechanism 3 based on a control signal output from the member position control device provided in the position control device 13C.
- the member 2 to be plated is taken out of the plating tank 1 in a state in which the plating film is formed on the surface of the immersion part, and is obtained as a plating member.
- FIG. 4 is a perspective view conceptually showing an arrangement state of members in a plating tank of a plating apparatus according to an example of the present embodiment.
- the plating apparatus 101 according to this example has a plurality of movable anodes.
- a member to be plated 2 having a complicated three-dimensional shape is held in a predetermined position in a plating tank 1 (not shown) held by a fixing device 3A.
- a method of fixing the member to be plated 2 by the fixing device 3A will be described later.
- the plating apparatus 101 according to this example includes movable anodes 41 to 44 that are flat and have a plurality of through holes.
- movable anodes 41, 42, 43, 44 are individually displaceable by an anode displacement mechanism 5 (not shown), and include connecting bars 41 A, 42 A, 43 A, 44 A that form connections with the anode displacement mechanisms 5.
- the movable anodes 41, 42, 43, 44 enclose the member to be plated 2 and form the largest surface in the smallest rectangular parallelepiped having four sides parallel to the vertical direction. It is arranged to face each of the surfaces.
- this cuboid is also referred to as a circumscribed cuboid.
- the movable anode 43 is disposed above the member to be plated 2. As described above, the member displacement mechanism 3 (not shown) lifts the fixing device 3A upward to take out the member to be plated 2 from the plating solution. Therefore, the movable anode 43 interferes with the removal operation of the member to be plated 2 by the fixing device 3A. It is arranged at the position to do. However, since the movable anode 43 is held by the anode displacement mechanism 5 (not shown) through the connecting bar 43A, the movable anode 43 is retracted to a position where it does not interfere when the fixing device 3A takes out the member 2 to be plated. Can be made. The movable anode 44 is disposed below the member to be plated 2.
- FIG. 5 is a perspective view conceptually showing an arrangement state of members in a plating tank of a plating apparatus according to another example of the present embodiment.
- the plating apparatus 102 according to this example has a plurality of NAUs.
- a member to be plated 2 having a complicated three-dimensional shape is held in a predetermined position in a plating tank 1 (not shown) held by a fixing apparatus 3A.
- Each of the plating apparatuses 102 according to this example includes NAUs 81, 82, 83, and 84 (hereinafter also referred to as “tubular NAU”) in which the NAU anode has a cylindrical shape.
- the cylindrical NAUs 81, 82, 83, and 84 have the same structure.
- cylindrical NAUs 81, 82, 83, 84 are arranged at positions close to the bent portions of the member to be plated 2.
- the cylindrical NAUs 82 and 83 are arranged at positions that interfere with the removal operation of the member to be plated 2 by the fixing device 3A.
- the cylindrical NAUs 81, 82, 83, and 84 are respectively held by the NAU displacement mechanism 9 (not shown) via connection bars (not shown in FIG. 5), the removal operation of the member to be plated 2 by the fixing device 3A is performed.
- the cylindrical NAUs 82 and 83 can be retracted to positions that do not interfere with each other.
- FIG. 6 is a perspective view conceptually showing the structure of the cylindrical NAU.
- FIG. 7 is a sectional view conceptually showing the structure of the cylindrical NAU.
- FIG. 8 is a perspective view conceptually showing the structure of each of the insoluble anodes provided with the plating solution jetting part constituting the cylindrical NAU and the part having a cylindrical shape.
- the cylindrical NAU 81 includes at least a plating solution jetting part 81A disposed in the plating tank 1 for circulating the plating solution in the plating tank 1 taken in from the plating solution intake part 6A by the pump 6C and returning it to the plating tank 1.
- a part thereof includes an insoluble anode 81C disposed at a position facing the ejection hole 81B of the plating solution ejection part 81A.
- the relative position of the NAU anode 4C with respect to the ejection hole 6N of the NAU ejection portion 6M is managed, and in the cylindrical NAU 81 that is an example of the NAU 8, the relative position of the insoluble anode 81C with respect to the ejection hole 81B is fixed.
- a drive device that varies or holds the relative position between the NAU ejection part 6M and the NAU anode 4C is provided separately. The case where this drive device is controlled by the control apparatus 13 is mentioned.
- the insoluble anode 81C according to this example is a cylinder obtained by secondary processing a plate-like member having a plurality of through holes 81D in a portion arranged at a position facing the ejection hole 81B of the plating solution ejection part 81A. It has the shape of a mold structure.
- the cylindrical shape of the insoluble anode 81C is a guide shape for guiding the plating solution in a predetermined direction. That is, when the insoluble anode 81C is not provided, the plating solution is ejected from the ejection hole 81B of the plating solution ejection part 81A, and most of the direction is parallel to the normal of the surface formed by the opening of the ejection hole 81 ( This direction is called “simple ejection direction”).
- the insoluble anode 81C by providing the insoluble anode 81C according to the present example, the plating solution ejected from the plating solution ejection part 81A is first guided into the cylindrical insoluble anode 81C, and further to the insoluble anode 81C.
- the plating solution is ejected from the plurality of through holes 81D provided into the plating tank. For this reason, the plating solution proceeds not only in the simple jetting direction but also in the direction perpendicular thereto. Therefore, when the cylindrical NAUs 81 to 84 are arranged in the arrangement as shown in FIG. 5, the plating solution is ejected in a direction that can directly reach the bent portion of the member to be plated 2. Usually, since the flow of the plating solution tends to be relatively small in the bent portion, plating metal ions are often not supplied. However, if cylindrical NAU 81 to 84 are used, a sufficient amount for such a bent portion is used. The plating metal ion can be supplied.
- the tubular insoluble anode 81C has a portion 81F made of a tubular body in which a first end portion 81E as one end portion is disposed at a position facing the ejection hole 81B of the plating solution ejection portion 81A.
- a second end portion 81G which is an end portion on the opposite side of the first end portion 81E in the portion made of the cylindrical body (hereinafter also referred to as “cylindrical portion”) 81F is the second end portion.
- the portion 81G is closed by a plate member 81H having an inscribed circle having a diameter larger than the circumscribed circle of the opening of the portion 81G.
- cylindrical portion 81F and the plate-like member 81H are individually created and integrated by welding. Further, a conductive connecting bar 81I for connecting to the NAU displacement mechanism 9 (not shown) is welded to the plate-like member 81H.
- the plating solution ejection part 81A includes a through hole 81J.
- One opening of the through hole 81J is a plating solution ejection hole 81B, and the cylindrical portion 81F is inserted from the other opening side of the through hole 81J.
- One end 81E is arranged at a position facing the ejection hole 81B.
- a screw hole is provided in the surface including the other opening of the through hole 81J of the plating solution ejection portion 81A, and this screw is also provided in the plate-like member 81H arranged so as to contact this surface.
- a through-hole corresponding to the hole is provided, and by fastening a bolt to the screw hole, the plating solution ejection portion 81A and the cylindrical insoluble anode 81C are fixed.
- the plating solution ejection part 81A is provided with a hollow pipe 81K in a direction orthogonal to the central axis of the through hole 81J, and the hollow part of the hollow pipe 81K and the through hole 81K communicate with each other as shown in FIG.
- the end of the hollow pipe 81K opposite to the end to which the plating solution ejection part 81A is attached is connected to a third return pipe 6L (not shown). Accordingly, the plating solution from the third return pipe 6L passes through the hollow portion of the hollow pipe 81K and reaches the inside of the through hole 81J of the plating solution ejection portion 81A, and further from the ejection hole 81B, the cylindrical insoluble anode 81C. It is guided to the inside of the cylindrical part 81F and is ejected into the plating tank 1 from the through hole 81D of the cylindrical part 81F.
- FIG. 9 is a perspective view conceptually showing an arrangement state of members in a plating tank of a plating apparatus according to another example of the present embodiment.
- the plating apparatus 103 according to this example has a plurality of NAUs.
- the plating apparatus 103 includes NAUs 85 and 86 (hereinafter also referred to as “box type NAU”) in which the NAU anode has a box shape.
- the box-type NAUs 85 and 86 have the same structure.
- the insoluble anodes 85A and 86A enter the inside of the circumscribed cuboid of the member to be plated 2 and are recessed from the circumscribed cuboid of the member to be plated 2 (hereinafter referred to as “dented portions”). ) To be opposed to each other at a proximal position. By being arranged in this manner, a sufficient amount of plating metal ions is supplied also to the recessed portion, and it becomes easy to form a plating film having an appropriate thickness also on the recessed portion. In addition, with such an arrangement, a sufficient amount of plating metal ions is also supplied to the inside of the through hole provided in the member to be plated 2, so that a plating film with an appropriate thickness is also formed inside the through hole. Easy to do.
- FIG. 10 to 12 are diagrams for explaining the structure of the box-shaped NAU 85.
- FIG. 10 is a perspective view conceptually showing the structure of the box-shaped NAU
- FIG. 11 is conceptually showing the structure of the box-shaped NAU.
- FIG. 12 is a perspective view conceptually showing the structure of each of the insoluble anodes including the plating solution jetting portion and the cage-shaped portion constituting the box-shaped NAU.
- the box-shaped NAU 85 has a shape of a cage structure obtained by secondary processing of a plate-like member having a plurality of through holes 85C, and is connected to a NAU displacement mechanism 9 (not shown).
- the cage-shaped portion of the insoluble anode 85A is fixed at a position facing the ejection hole 85E of the plating solution ejection portion 85B.
- the opening opposite to the opening facing the plating solution ejection part 85B of the hollow pipe 85F is connected to the third return pipe 6L. For this reason, the plating solution from the third return pipe 6L passes through the hollow portion of the hollow pipe 85F and reaches the inside of the plating solution ejection portion 85B, and further from the ejection hole 85E to the inside of the cage-type insoluble anode 85A. It is guided and ejected from the through hole 85C of the cage-type insoluble anode 85A into the plating tank.
- FIGS. 13 to 15 are diagrams conceptually showing an arrangement state of members in a plating tank of a plating apparatus according to still another example of the present embodiment.
- FIG. 13 is a perspective view conceptually showing an arrangement state of members in the plating tank of the plating apparatus according to the present example, with the viewpoint being upward
- FIG. 14 is a perspective view with the viewpoint being downward.
- FIG. 15 is a perspective view conceptually showing a plating tank of the plating apparatus according to this example and an arrangement state of members in the plating tank.
- the plating apparatus 104 is a member 2 to be plated held by the fixing apparatus 3A, the same movable anodes 41, 42, 43, 44 as those provided in the plating apparatus 101, and the same NAU81 as the cylindrical type provided in the plating apparatus 102. , 82, 83, 84, and 85, 86 of the same box type NAU as that provided in the plating apparatus 103. As shown in FIG. 15, these are all arranged in the main region of the plating tank 1.
- the movable anodes 41, 42, 43, 44, the cylindrical NAUs 81, 82, 83, 84, and the box type NAUs 85, 86 are collectively referred to as “movable elements”.
- the position of the member to be plated 2 is maintained while maintaining the relative positional relationship between the member to be plated 2 and the movable element by changing the position of the member according to the swinging of the member. It can be swung. Further, the relative positional relationship between the movable element and the member to be plated 2 can be changed while swinging in this manner.
- FIG. 16 is a perspective view conceptually showing the configuration of the anode displacement mechanism 51 of the insoluble anode 44 provided in the plating apparatus 101.
- FIG. 17 is a perspective view conceptually showing the configuration of the NAU displacement mechanism 91 of the cylindrical NAU 81 provided in the plating apparatus 102.
- the displacement mechanism of the movable element includes three axes of a linear motion mechanism using a ball screw driven by a stepping motor.
- the position of the insoluble anode 44 and the cylindrical NAU 81 in the plating tank 1 can be changed by fixing the connecting bar and the hollow pipe to the end of the displacement mechanism.
- FIG. 18 is a perspective view conceptually showing the configuration of a movable element, a displacement mechanism of the movable element, a part of a fixing device for a member to be plated, a member displacement mechanism, and a frame holding each mechanism.
- FIG. 19 is a front view conceptually showing the structure of the member displacement mechanism and the member to be plated fixing device shown in FIG.
- FIG. 20 is a perspective view conceptually showing the structure of the member to be plated fixing device shown in FIG.
- FIG. 21 is a perspective view conceptually showing the main part of the fixing device for the member to be plated shown in FIG.
- FIG. 22 shows that each rod-like body is moved in the direction in which the other end portions of the first rod-like body and the second rod-like body are separated by operating the rod-like body driving mechanism of the fixing member fixing member shown in FIG. It is a perspective view which shows the state which moved conceptually.
- FIG. 19 is a front view conceptually showing the structure of the member displacement mechanism and the member to be plated fixing device shown in FIG.
- FIG. 20 is a perspective view conceptually showing the structure of the member to be plated fixing device shown in FIG.
- FIG. 21 is a perspective view conceptually showing the main part of the fixing device for the member to be plated shown in FIG
- FIG. 23 is a perspective view conceptually showing the operation of the member to be plated fixing device shown in FIG. 21, and shows a state in which the member to be plated is arranged below the fixing device.
- 24 is a perspective view conceptually showing the operation of the fixing device for the member to be plated shown in FIG. 21, and the fixing device and the member to be plated are fixed so as to be proximal from the state shown in FIG. The apparatus moves downward and shows a state in which one end of the first and second rod-shaped bodies is inserted into the hollow portion of the member to be plated.
- FIG. 25 is a perspective view conceptually showing the operation of the fixing device for the member to be plated shown in FIG. 21, and from the state shown in FIG. Each rod-shaped body moves in a direction in which the other end of the two rod-shaped bodies is separated, and the member to be plated is held by the first and second rod-shaped bodies.
- a member displacement mechanism 3 having two axes of a linear motion mechanism using a ball screw driven by a stepping motor is provided on the upper surface of the portal frame 30A.
- the fixing device 3A is held by the gate-shaped member 30B fixed to the lower end portion of the linear motion mechanism in the vertical direction.
- the fixing device 3A is a fixing device for fixing the member to be plated 2 including two hollow portions 2A and 2B each having at least one opening.
- the member 2 to be plated shown in FIGS. 19 and 20 has two through holes 2C and 2D having a central axis in a direction parallel to the vertical direction, and the insides of the through holes 2C and 2D are respectively The hollow portions 2A and 2B are defined.
- the fixing device 3 ⁇ / b> A can insert one end 31 ⁇ / b> A into the hollow portion 2 ⁇ / b> A of the member to be plated 2 from the opening of the hollow portion, that is, the opening above the through hole.
- the 1st rod-shaped body 31 and the 2nd rod-shaped body 32 which can insert one end part 32A into the inside of the hollow part 2B of the to-be-plated member 2 from the opening of the hollow part are provided.
- the first rod-like body 31 and the second rod-like body 32 are for pressing the member to be plated 2 and directly fixing it, and at least one of them, preferably both the hollow portions 2A,
- the contact portion to the member to be plated 2 in 2B forms an electrical contact portion for the member to be plated 2. Therefore, at least one of the first rod-shaped body 31 and the second rod-shaped body 32 is made of a conductive member, and preferably both are made of a conductive member.
- the first rod-shaped body 31 is pressed into at least two places inside the hollow portion 2A of the member 2 to be plated, and the second rod-shaped body 32 is disposed inside the hollow portion 2B of the member 2 to be plated.
- the first rod-shaped body 31 and the second rod-shaped body 32 are held by the first rod-shaped body 31 and the second rod-shaped body 32 by press-contacting at least two places.
- the other end portions 31B and 32B can be moved in directions close to each other or in directions away from each other, and the other end portion 31B of the first rod-shaped body 31 and the other of the second rod-shaped body 32 can be moved.
- the rod-like body movable holding mechanism 33 is provided that holds the end portion 32B in a state in which the end portion 32B is biased in the approaching direction or the separating direction.
- the rod-shaped body movable holding mechanism 33 provided in the fixing device 3A shown in FIG. 21 has a guide member having a slit 34B that is movable in a state where the first rod-shaped body 31 and the second rod-shaped body 32 penetrate the inside thereof. 34, the first rod-shaped body 31 is rotatably held and the first sliding member 35 sliding on the guide member 34, and the second rod-shaped body 32 is rotatably held and the guide member 34 is mounted. And the first sliding member 35 and the second sliding member 36 are moved away from each other on the guide member, and the other of the first rod-like bodies 31 is moved. And a rod-shaped body drive mechanism 37 having a drive mechanism that maintains a state in which the other end portion 32B of the second rod-shaped body 32 and the other end 32B of the second rod-shaped body 32 are urged away from each other.
- the guide member 34 is provided with a slit 34B penetrating in a normal direction of the main surface with a major axis in a direction parallel to the major axis direction of the main surface of the base material 34A having a rectangular flat plate shape in plan view.
- the width of the slit 34B is such that the first rod-shaped body 31 and the second rod-shaped body 32 pass through the slit 34B, and the first rod-shaped body 31 and the second rod-shaped body 32 are stable in this state. It is set to a width that can be slid.
- guide rails 34 ⁇ / b> C and 34 ⁇ / b> D are provided on one of the main surfaces of the guide member 34 so as to protrude from both long sides thereof.
- the first sliding member 35 is arranged on one main surface of the base material 34A in the long side direction of the base material 34A while the movement of the guide member 34 in the short side direction of the base material 34A is regulated by the guide rails 34C and 34D.
- a sliding frame 35A that is slidable and has a U-shape in plan view, and is parallel to the horizontal plane while holding the first rod 31 at a predetermined position in the axial direction of the first rod 31.
- a rotation holding portion 35B that is rotatably held by the slide frame 35A with the direction as a central axis, and a rod-like body provided at an end portion proximal to the second sliding member 36 And a contact portion 35 ⁇ / b> C to the drive mechanism 37.
- the second sliding member 36 is on the two main surfaces of the base material 34A in the long side direction of the base material 34A while the movement of the guide member 34 in the short side direction of the base material 34A is regulated by the guide rails 34C and 34D.
- the sliding frame 36A which is slidable and has a U-shape in plan view, is parallel to the horizontal plane while holding the second rod 32 at a predetermined position in the axial direction of the second rod 32.
- a rotation holding portion 36B that is rotatably held by the sliding frame 36A, and a rod-like shape provided at an end portion proximal to the second sliding member 36, with the center axis as the central axis.
- the rod-shaped body drive mechanism 37 is fixed between the first sliding member 35 and the second sliding member 36 on one main surface of the base material 34A, and as shown in FIG. 22, the base material 34A.
- Extrusion pins 37 ⁇ / b> A and 37 ⁇ / b> B that can be pressed in directions to separate the contact portions 35 ⁇ / b> C and 36 ⁇ / b> C are provided at respective end portions in a direction parallel to the long side direction.
- the extrusion pins 37A and 37B are driven by compressed air in this example.
- the fixing device 3A operates as follows. First, as shown in FIG. 23, the central axis of the through hole 2C of the member to be plated 2 and the central axis of the first rod-shaped body 31 are located on substantially the same axis, and the through hole 2D of the member 2 to be plated is located.
- the central axis and the central axis of the second rod-shaped body 32 are located on substantially the same axis, and further, the hollow portion 2A of the member to be plated 2 (that is, the hollow portion of the through hole 2C) and the hollow portion 2B of the member to be plated 2 A line in a horizontal plane connecting (that is, a hollow portion of the through hole 2D) is substantially parallel to the sliding direction of the first sliding member 35 and the second sliding member 36, that is, the long axis direction of the slit 34B.
- the fixing device 3A is disposed above the member to be plated 2 so as to be substantially parallel to the plate.
- the push-out amounts of the push-out pins 37A and 37B of the rod-like body drive mechanism 37 may be adjusted.
- the hole diameter of the through hole 2C of the member to be plated 2 is larger than the shaft diameter of the first rod-shaped body 31, and the hole diameter of the through-hole 2D of the member to be plated 2 is larger than the shaft diameter of the second rod-shaped body 32.
- the first rod 31 can be inserted into the through hole 2C, and the second rod 32 can be inserted into the through hole 2D.
- the member displacement mechanism 3 (not shown) is operated to move the fixing device 3A so as to be proximal to the member 2 to be plated, so that the first rod 31 is inserted into the through hole 2C.
- the second rod 32 is inserted into the through hole 2D.
- one end 31A of the first rod-shaped body 31 exceeds the through-hole 2C
- one end 32A of the second rod-shaped body 32 exceeds the through-hole 2D. Protruding outside.
- These end portions 31A and 32A may be inside the through holes 2C and 2D.
- the push-out pins 37A and 37B of the rod-shaped body driving mechanism 37 are projected so as to be separated from each other.
- the push pin 37A pushes the contact portion 35C of the first slide member 35
- the push pin 37B pushes the contact portion 36C of the second slide member 36.
- the sliding member 36 slides on the guide member 34 so as to be separated from each other.
- the 1st rod-shaped body 31 and the 2nd rod-shaped body 32 move so that each other edge part 31B and 32B may space apart.
- the first rod-shaped body 31 moves in a direction away from the rod-shaped body driving mechanism 37 in the longitudinal direction of the slit 34B, but one end portion 31A of the first rod-shaped body 31 is a member to be plated. Since it is in 2 hollow parts 2A (namely, the hollow part of 2 C of through-holes), the movement amount is restrict
- the other end 32 ⁇ / b> B of the second rod-like body 32 is arranged around the rotation axis of the rotation holding portion 36 ⁇ / b> B.
- the body 31 rotates away from the other end 31B.
- the first rod-like body 31 has an opening facing the solid device 3A of the through-hole 2A of the member to be plated 2 and the inside of the through-hole 2C, that is, the inside of the hollow portion 2A, on one end 31A side. In contact with the member 2 to be plated.
- a portion fixed by the rotation holding portion 35B in the first rod-shaped body 31 is a power point
- a portion in contact with the opening of the through hole 2C of the member to be plated 2 facing the solid device 3A is a fulcrum, and the through hole 2C.
- the first rod-shaped body 31 is pressure-contacted at the hollow portion 2 ⁇ / b> C, with the portion in contact with the inside (hollow portion 2 ⁇ / b> A) serving as an action point.
- the second rod-like body 32 has an opening facing the solid device 3A of the through-hole 2D of the member to be plated 2 and the inside of the through-hole 2D, that is, the inside of the hollow portion 2B, on the one end portion 32A side.
- the portion fixed by the rotation holding portion 36B in the second rod-like body 32 is a power point
- the portion in contact with the opening of the through hole 2D of the member to be plated 2 facing the solid device 3A is a fulcrum
- the portion in contact with the inside (hollow part 2B) serves as a point of action, and the second rod-like body 32 is pressed into contact with the hollow part 2B.
- the member 2 to be plated is the first rod-shaped body. 31 and the second rod 32 are fixed to the solid device 3A.
- the member to be plated 2 can be detached from the solid state device 3A.
- the fixing device 3A may be moved upward so that the first rod-shaped body 31 and the second rod-shaped body 32 are extracted from the through holes 2C, 2D of the member 2 to be plated.
- Second flow rate adjustment device 14D Third flow rate adjustment device 41, 42, 43, 44 ... movable anode 41A, 42A, 43A, 44A ... movable anode
- the connecting bar 81, 82, 83, 84 ... tubular NAU of 81A ... Plating solution ejection part 81B ... Ejection hole 81C ... Insoluble anode 81D ... Insoluble anode through-hole 81E ... Insoluble anode first end part 81F ... Insoluble anode cylindrical part 81G ... Insoluble anode second end part 81H ... Insoluble anode plate-like member 81I ... Insoluble anode connecting bar 81J ...
- Plating hole ejection hole 81K Hollow pipe 85,86 ... Box type NAU 85A, 86A ... Box-type NAU insoluble anode 85B ... Plating solution jetting part 85C ... Insoluble anode through-hole 85D ... Insoluble anode connecting bar 85E ... Jet hole 85F ... Hollow pipe 51 ... Anode displacement mechanism 91 ... NAU displacement mechanism 30A ... Gate-shaped frame 30B ... Gate-shaped member 31 ... First rod-shaped body 31A ... One end of the first rod-shaped body 31B ... The other end of the first rod-shaped body 32 ... Second rod-shaped body 32A ... First One end portion 32B of the second rod-like body ...
- the other end portion 2A, 2B of the second rod-like body ...
- the rod-like member movable holding mechanism 34 ...
- the guide member 34A ...
- the base material 34B of the guide member ... Slits 34C, 34D ...
- Guide rail 35 ...
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
(1)めっき槽;前記めっき槽内に配置された不溶性アノード;前記不溶性アノードと被めっき部材との間に電圧を印加可能なめっき電源;前記不溶性アノードを前記めっき槽内で移動させること、および前記不溶性アノードを前記めっき槽内の所定の位置で保持することが可能なアノード変位機構;および前記不溶性アノード変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記アノード変位機構に出力することが可能なアノード位置制御装置を有する制御装置を備えることを特徴とするめっき装置。
図1は、本発明の一実施形態に係るめっき装置の構成を概念的に示す図である。なお、図1では、めっき電源、被めっき部材およびアノードに電圧を印加する電気配線、制御配線など電気関連の構成は表示を省略しており、これらのめっき装置の制御に関する構成は図2を用いて説明する。
めっき槽1内に配置される固定アノード4A、可動アノード4BおよびNAUアノード4Cは、それぞれ、固定アノード4A用配線11A、可動アノード4B用配線11BおよびNAUアノード4C用配線11Cによって、めっき電源10の陽極端子10Aに電気的に接続されている。また、図1に示されるめっき装置100のめっき電源10は、固定アノード4A用配線11Aから出力される電圧および電流、可動アノード4B用配線11Bから出力される電圧および電流ならびにNAUアノード4C用配線11Cから出力される電圧および電流はそれぞれ独立に制御可能とされている。また、めっき槽1内に配置される被めっき部材2は、被めっき部材用配線11Dによって、めっき電源10の陰極端子10Bに電気的に接続されている。
本例に係る部材取付工程では、位置制御装置13Cが備える部材位置制御装置から出力される制御信号に基づき部材変位機構3の摺動保持装置3Dを動作させるとともに、制御装置13が備える固定装置制御装置からの出力される制御信号に基づき固定装置3Aを動作させて、被めっき部材2を固定装置3Aに固定させる。その動作の詳細については、固定装置3Aの具体例とともに後述する。
部材配置工程では、位置制御装置13Cが備える部材位置制御装置から出力される制御信号に基づき部材変位機構3の摺動保持装置3Dを動作させることにより、部材取付工程の実施によって固定装置3Aに対して固定された被めっき部材2の少なくとも一部をめっき槽1内のめっき液中に浸漬させる。
配置工程では、可動アノード4Bなどめっき槽1の内部に配置される構成要素を、被めっき部材2により近位となるように移動させる。配置工程の開始時期と部材配置工程の開始時期との関係は特に限定されない。いずれかを先に開始してもよいし、双方を同時に開始してもよい。いずれかを先に開始する場合において、一方の工程の終了時期と他方の工程の開始時期との関係も限定されない。一方の工程が終了した後に他方の工程を開始してもよいし、一方の工程が終了する前に他方の工程を開始してもよい。
配置工程により可動アノード4B、めっき液噴出部6JおよびNAU8を、それぞれ、第一の位置、第三の位置および第五の位置に配置したら、循環制御装置13Dが備える第二のバルブ制御装置および第三のバルブ制御装置から制御信号を出力し、これらの制御信号を入力した第二の流量調整装置14Cおよび第三の流量調整装置14Dが、その制御信号に従って、第二の流量調整バルブ6Iおよび第三の流量調整バルブ6Oを動作させることにより、めっき液噴出部6JおよびNAU噴出部6Mからめっき液を噴出させる。
印加工程では、電気出力制御装置13Bからの制御信号に基づいてめっき電源10を動作させることにより、被めっき部材2と不溶性アノード4A~Cとの間に電圧を所定の時間印加して被めっき部材2上にめっき皮膜を形成する。この電圧値は特に限定されず、被めっき部材2の形状、めっきの種類、求めるめっき皮膜の厚さなどを考慮して適宜設定すればよい。また、電圧を印加するにあたり、電圧値を制御してもよいし、電流値を制御してもよい。
噴出停止工程では、可動めっき液噴出部6JおよびNAU噴出部6Mなどからのめっき液の噴出を停止する。具体的には、循環制御装置13Dが備える第二のバルブ制御装置および第三のバルブ制御装置から制御信号を出力し、これらの制御信号を入力した第二の流量調整装置14Cおよび第三の流量調整装置14Dが、その制御信号に従って、第二の流量調整バルブ6Iおよび第三の流量調整バルブ6Oを動作させることにより、めっき液噴出部6JおよびNAU液噴出部6Mからのめっき液の噴出を停止させる。
退避工程では、可動アノード4Bなどめっき槽1の内部に配置される可動の構成要素を、めっき皮膜が形成された被めっき部材からより遠位となるように移動させる。退避工程の実施時期は、印加工程の終了後であれば、特に限定されない。上記の噴出停止工程との開始時期の関係は任意である。また、前述の配置工程によって所定の位置に配置された可動アノード4Bなどの可動の構成要素が、後述する部材回収工程において、めっき液から取り出される被めっき部材2の移動と干渉しなければ、退避工程は部材回収工程の後に行ってもよい。
部材回収工程では、位置制御装置13Cが備える部材位置制御装置から出力される制御信号に基づき部材変位機構3の摺動保持装置3Dを動作させることにより、めっき槽1内のめっき液中に少なくとも一部が浸漬し、浸漬部分の表面にめっき皮膜が形成された状態にある被めっき部材2をめっき槽1から取り出し、めっき部材として得る。
図19は、図18に示される部材変位機構および被めっき部材の固定装置の構造を概念的に示す正面図である。図20は、図19に示される被めっき部材の固定装置の構成を概念的に示す斜視図である。図21は、図20に示される被めっき部材の固定装置の主要部分を概念的に示す斜視図である。図22は、図21に示される被めっき部材の固定装置の棒状体駆動機構が作動して、第一の棒状体および第二の棒状体の他方の端部が離間する方向に各棒状体が移動した状態を概念的に示す斜視図である。図23は、図21に示される被めっき部材の固定装置の動作を概念的に示す斜視図であり、固定装置の下方に被めっき部材が配置された状態を示している。図24は、図21に示される被めっき部材の固定装置の動作を概念的に示す斜視図であり、図23に示される状態から、固定装置と被めっき部材とが近位になるように固定装置が下方に移動して、被めっき部材の中空部内に第一および第二の棒状体の一方の端部が挿入された状態を示している。図25は、図21に示される被めっき部材の固定装置の動作を概念的に示す斜視図であり、図24に示される状態から、棒状体駆動機構が作動して第一の棒状体および第二の棒状体の他方の端部が離間する方向に各棒状体が移動し、第一および第二の棒状体によって被めっき部材が保持された状態を示している。
まず、図23に示されるように、被めっき部材2の貫通孔2Cの中心軸と第一の棒状体31の中心軸とがほぼ同一軸上に位置し、被めっき部材2の貫通孔2Dの中心軸と第二の棒状体32の中心軸とがほぼ同一軸上に位置し、さらに、被めっき部材2の中空部2A(すなわち貫通孔2Cの中空部)および被めっき部材2の中空部2B(すなわち貫通孔2Dの中空部)を結ぶ水平面内の線が、第一の摺動部材35および第二の摺動部材36の摺動方向にほぼ平行となる、すなわち、スリット34Bの長軸方向とほぼ平行となるように、被めっき部材2の上方に固定装置3Aを配置する。このような配置を可能とするには、棒状体駆動機構37の押出ピン37A,37Bの押し出し量を調節すればよい。なお、被めっき部材2の貫通孔2Cの孔径は第一の棒状体31の軸径よりも大きく、被めっき部材2の貫通孔2Dの孔径は第二の棒状体32の軸径よりも大きいため、貫通孔2Cの内部に第一の棒状体31を、貫通孔2Dの内部に第二の棒状体32を挿入可能である。
1…めっき槽
1A…オーバフロー用仕切板
2…被めっき部材
3…部材変位機構
3A…固定装置
3B…垂直方向直動摺動軸
3C…水平方向直動摺動軸
3D…摺動保持装置
4A…固定アノード
4B…可動アノード
4C…NAUアノード
4D…NAUアノードの貫通孔
5…アノード変位機構
5A…垂直方向直動摺動軸
5B…水平方向直動摺動軸
5C…摺動保持装置
6…循環機構
6A…めっき液取り込み部
6B…往路配管
6C…ポンプ
6D…復路配管
6E…第一の復路配管
6F…固定めっき液噴出部
6G…第一の流量調整バルブ
6H…第二の復路配管
6I…第二の流量調整バルブ
6J…可動めっき液噴出部
6K…噴出孔
6L…第三の復路配管
6M…NAU噴出部
6N…噴出孔
6O…第三の流量調整バルブ
7…噴出部変位機構
7A…垂直方向直動摺動軸
7B…水平方向直動摺動軸
7C…摺動保持装置
8…アノード-ノズルユニット(NAU)
9…NAU変位機構
9A…垂直方向直動摺動軸
9B…水平方向直動摺動軸
9C…摺動保持装置
10…めっき電源
10A…陽極端子
10B…陰極端子
11A…固定アノード用配線
11B…可動アノード用配線
11C…NAUの不溶性アノード用配線
11D…被めっき部材用配線
12A…固定アノードへの配線上の測定機器
12B…可動アノードへの配線上の測定機器
12C…NAUのアノードへの配線上の測定機器
13…制御装置
13A…信号入力部
13B…電気出力制御装置
13C…位置制御装置
13D…循環制御装置
14A…ポンプ駆動装置
14B…第一の流量調整装置
14C…第二の流量調整装置
14D…第三の流量調整装置
41,42,43,44…可動アノード
41A,42A,43A,44A…可動アノードの連結バー
81,82,83,84…筒型NAU
81A…めっき液噴出部
81B…噴出孔
81C…不溶性アノード
81D…不溶性アノードの貫通孔
81E…不溶性アノードの第一の端部
81F…不溶性アノードの筒状部分
81G…不溶性アノードの第二の端部
81H…不溶性アノードの板状部材
81I…不溶性アノードの連結バー
81J…めっき液噴出部の貫通孔
81K…中空パイプ
85,86…箱型NAU
85A,86A…箱型NAUの不溶性アノード
85B…めっき液噴出部
85C…不溶性アノードの貫通孔
85D…不溶性アノードの連結バー
85E…噴出孔
85F…中空パイプ
51…アノード変位機構
91…NAU変位機構
30A…門型のフレーム
30B…門型部材
31…第一の棒状体
31A…第一の棒状体の一方の端部
31B…第一の棒状体の他方の端部
32…第二の棒状体
32A…第二の棒状体の一方の端部
32B…第二の棒状体の他方の端部
2A,2B…被めっき部材の中空部
33…棒状体可動保持機構
34…ガイド部材
34A…ガイド部材の基材
34B…スリット
34C,34D…ガイドレール
35…第一の摺動部材
35A…摺動フレーム
35B…回動保持部
35C…接触部
36…第二の摺動部材
36A…摺動フレーム
36B…回動保持部
36C…接触部
37…棒状体駆動機構
37A,37B…押出ピン
Claims (34)
- めっき槽;
前記めっき槽内に配置された不溶性アノード;
前記不溶性アノードと被めっき部材との間に電圧を印加可能なめっき電源;
前記不溶性アノードを前記めっき槽内で移動させること、および前記不溶性アノードを前記めっき槽内の所定の位置で保持することが可能なアノード変位機構;および
前記不溶性アノード変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記アノード変位機構に出力することが可能なアノード位置制御装置を有する制御装置を備えること
を特徴とするめっき装置。 - 前記めっき電源から電圧を印加しているときの前記不溶性アノードを流れる電流および前記不溶性アノードの前記被めっき部材に対する電位の少なくとも一方を測定することが可能な測定機器を備える請求項1に記載のめっき装置。
- 前記制御装置は、前記測定機器により測定された結果に基づいて、前記不溶性アノードに印加する電流および電圧の少なくとも一方を制御するための制御信号を発生させること、およびその制御信号を前記めっき電源に出力することが可能な電気出力制御装置を備える請求項2に記載のめっき装置。
- 前記アノード位置制御装置は、前記測定機器により測定された結果に基づいて、前記不溶性アノード変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記アノード変位機構に出力することが可能である請求項2または3に記載のめっき装置。
- めっき液取り込み部とポンプとめっき液噴出部とを有し前記めっき槽内のめっき液を循環させるための循環機構;
前記制御装置が有するものであって、前記循環機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記循環機構に出力することが可能な循環制御装置;
前記めっき液噴出部を前記めっき槽内で移動させること、および前記めっき液噴出部を前記めっき槽内の所定の位置で保持することが可能な噴出部変位機構;および
前記制御装置が有するものであって、前記噴出部変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記噴出部変位機構に出力することが可能な噴出部位置制御装置
をさらに備える請求項1から4のいずれか一項に記載のめっき装置。 - 前記循環機構は、前記めっき液噴出部から噴出するめっき液噴出量を調整することが可能な噴出量調整機構を有し、
前記循環制御装置は、前記噴出量調整機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記噴出量調整機構に出力することが可能な噴出量制御装置を備える請求項5に記載のめっき装置。 - めっき液取り込み部とポンプとめっき液噴出部とを有し前記めっき槽内のめっき液を循環させるための循環機構;
前記制御装置が有するものであって、前記循環機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記循環機構に出力することが可能な循環制御装置;
前記めっき液噴出部を前記めっき槽内で移動させること、および前記めっき液噴出部を前記めっき槽内の所定の位置で保持することが可能な噴出部変位機構;および
前記制御装置が有するものであって、前記噴出部変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記噴出部変位機構に出力することが可能な噴出部位置制御装置
をさらに備え、
前記噴出部位置制御装置は、前記測定機器により測定された結果に基づいて、前記噴出部位置制御機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記噴出部変位機構に出力することが可能である請求項2から4のいずれか一項に記載のめっき装置。 - 前記循環機構は、前記めっき液噴出部から噴出するめっき液噴出量を調整することが可能な噴出量調整機構を有し、
前記循環制御装置は、前記測定機器により測定された結果に基づいて、前記噴出量調整機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記噴出量調整機構に出力することが可能な噴出量制御装置を備える請求項7に記載のめっき装置。 - 被めっき部材を移動させることおよび前記被めっき部材の少なくとも一部が前記めっき槽内に配置されるような位置で前記被めっき部材を保持することが可能な部材変位機構;および
前記制御装置が有するものであって、前記部材変位機構の動作を制御するための制御信号を発生させること、およびその制御信号を前記部材変位機構に出力することが可能な部材位置制御装置をさらに備える請求項1から8のいずれか一項に記載のめっき装置。 - 前記部材位置制御装置は、前記不溶性アノードと前記被めっき部材との間に前記めっき電源から電圧が印加されている間も、前記部材変位機構の動作を制御するための制御信号を前記部材変位機構に出力可能である請求項9に記載のめっき装置。
- 前記不溶性アノードは前記めっき液噴出部に対する相対位置が管理され、前記不溶性アノードの少なくとも一部は前記めっき液噴出部の噴出孔を臨む位置に配置され、前記噴出部変位機構と前記アノード変位機構とは統合され、前記噴出部位置制御装置と前記アノード位置制御装置とは統合されている請求項5から10のいずれか一項に記載のめっき装置。
- 前記不溶性アノードは、前記めっき液噴出部の噴出孔を臨む位置に配置された部分が、前記めっき液噴出部から噴出するめっき液を所定の方向に導くことが可能なガイドの形状を有する請求項11に記載のめっき装置。
- 前記不溶性アノードは、前記めっき液噴出部の噴出孔を臨む位置に配置された部分が、貫通孔を有する板状部材から形成された構造体または板状部材を二次加工して得られる構造体の形状を有する請求項11または12に記載のめっき装置。
- 前記部材位置制御装置が、前記被めっき部材の少なくとも一部がめっき液中に浸漬するように前記部材変位機構を動作させたことを条件として、
前記制御装置が有する複数の位置制御装置の少なくとも一つは、当該少なくとも一つの位置制御装置によって制御される前記部材変位機構以外の変位機構の少なくとも一つを、当該少なくとも一つの変位機構により前記めっき槽内で移動可能とされる部材が前記被めっき部材に近位な向きに移動するように、動作させる請求項9から13のいずれか一項に記載のめっき装置。 - 前記制御装置が有する複数の位置制御装置の少なくとも一つが、当該少なくとも一つの位置制御装置によって制御される前記部材変位機構以外の変位機構の少なくとも一つを、当該少なくとも一つの変位機構により前記めっき槽内での移動可能とされる部材を前記被めっき部材から遠位な向きに移動するように、動作させたことを条件として、
前記部材位置制御装置は、前記被めっき部材が前記めっき液中から取り出されるように前記部材変位機構を動作させる請求項14に記載のめっき装置。 - めっき槽内のめっき液に被めっき部材の少なくとも一部を浸漬させる部材配置工程;
めっき槽内に配置される不溶性アノードを、前記めっき液中の前記被めっき部材に対してより近位となるように移動させ、前記不溶性アノードを第一の位置にて保持するアノード配置工程;
前記被めっき部材と前記不溶性アノードとの間に電圧を所定の時間印加して前記被めっき部材上にめっき皮膜を形成する印加工程;
前記不溶性アノードを、前記めっき皮膜が形成された前記被めっき部材からより遠位となるように移動させ、前記不溶性アノードを第二の位置にて保持するアノード退避工程;および
前記めっき皮膜が形成された被めっき部材を前記めっき液から取り出し、当該部材をめっき部材として得る部材回収工程
を備えるめっき部材の製造方法。 - 前記部材配置工程の終了前に前記アノード配置工程は開始される請求項16に記載の製造方法。
- 前記アノード退避工程の終了前に前記部材回収工程は開始される請求項16または17に記載の製造方法。
- 前記第一の位置は、前記被めっき部材を前記めっき液から取り出すように移動させたときに前記被めっき部材が前記不溶性アノードと干渉する位置であり、前記第二の位置は、前記被めっき部材を前記めっき液から取り出すように移動させたときに前記被めっき部材が前記不溶性アノードと干渉しない位置である請求項16から18のいずれか一項に記載の製造方法。
- 前記印加工程中に、前記被めっき部材の前記めっき槽内の配置および前記不溶性アノードの前記めっき槽内の配置の少なくとも一つを変更させる請求項16から19のいずれか一項に記載の製造方法。
- 前記被めっき部材と前記不溶性アノードとの相対的な位置関係を管理しつつ、前記被めっき部材の前記めっき槽内の配置および前記不溶性アノードの前記めっき槽内の配置を変更させる請求項20に記載の製造方法。
- 少なくとも前記印加工程は、めっき液取り込み部とポンプとめっき液噴出部とを備える循環機構により前記めっき槽内の前記めっき液を循環させながら行われ、
前記部材配置工程の開始から前記印加工程の終了までの期間に開始される工程であって、前記めっき槽内に配置される前記めっき液噴出部を、前記めっき液中の前記被めっき部材に対してより近位となるように移動させ、前記めっき液噴出部を第三の位置にて保持する噴出部配置工程;および
前記印加工程の開始から前記部材回収工程の終了までの期間に開始される工程であって、前記めっき液噴出部を、前記めっき皮膜が形成された被めっき部材からより遠位となるように移動させ、第四の位置にて保持する噴出部退避工程をさらに備える請求項16から21のいずれか一項に記載の製造方法。 - 前記第三の位置は、前記被めっき部材を前記めっき液から取り出すように移動させたときに前記被めっき部材が前記不溶性アノードおよび前記めっき液噴出部の少なくとも一方と干渉する位置であり、前記第四の位置は、前記被めっき部材を前記めっき液から取り出すように移動させたときに前記被めっき部材が前記不溶性アノードおよび前記めっき液噴出部のいずれとも干渉しない位置である請求項22に記載の製造方法。
- 前記印加工程中に、前記被めっき部材の前記めっき槽内の配置、前記不溶性アノードの前記めっき槽内の配置、前記めっき液噴出部の前記めっき槽内の配置および前記めっき液噴出部から噴出させるめっき液量の少なくとも一つを変更させる請求項22または23に記載の製造方法。
- 前記被めっき部材、前記不溶性アノードおよび前記めっき液噴出部の相対的な位置関係を管理しつつ、前記被めっき部材の前記めっき槽内の配置、前記不溶性アノードの前記めっき槽内の配置および前記めっき液噴出部の前記めっき槽内の配置を変更させる請求項24に記載の製造方法。
- 前記不溶性アノードは前記めっき液噴出部に対する相対位置が管理され、前記不溶性アノードの少なくとも一部は前記めっき液噴出部の噴出孔を臨む位置に配置され、前記アノード配置工程と前記噴出部配置工程とは統合され、前記アノード退避工程と前記噴出部退避工程とも統合されている請求項22から25のいずれか一項に記載の製造方法。
- めっき液取り込み部から取り込んだめっき槽内のめっき液をポンプで循環させて前記めっき槽に戻すために前記めっき槽内に配置されるめっき液噴出部と、
少なくともその一部が前記めっき液噴出部の噴出孔を臨む位置に配置された不溶性アノードとを備え、
前記不溶性アノードは前記噴出孔に対する相対位置が管理されていること
を特徴とするノズル-アノードユニット。 - 前記不溶性アノードは、前記めっき液噴出部の噴出孔を臨む位置に配置された部分が、貫通孔を有する板状部材からなるまたは当該板状部材を二次加工して得られる構造体の形状を有する請求項27に記載のノズル-アノードユニット。
- 前記不溶性アノードは、前記めっき液噴出部の噴出孔を臨む位置に配置された部分が、前記めっき液噴出部から噴出するめっき液を所定の方向に導くガイドの形状を有する請求項27または28に記載のノズル-アノードユニット。
- 前記不溶性アノードは、前記めっき液噴出部の噴出孔を臨む位置に一方の端部である第一の端部が配置された筒状体からなる部分を有し、前記めっき液噴出部の噴出孔から噴出しためっき液は前記筒状体からなる部分の内部を通って、めっき槽内へと供給される請求項28または29に記載のノズル-アノードユニット。
- 前記筒状体からなる部分における前記第一の端部の反対側の端部である第二の端部は、当該第二の端部の開口の外接円よりも大きな直径の内接円を有する板状部材により閉塞され、
前記めっき液噴出部は貫通孔を備え、当該貫通孔の一方の開口は前記めっき液の噴出孔であり、前記筒状体からなる部分は前記貫通孔の他方の開口側から貫装されて、前記第一の端部は前記めっき液の噴出孔を臨む位置に配置される請求項30に記載のノズル-アノードユニット。 - いずれも少なくとも1つの開口を有する2つの中空部を備える被めっき部材を固定するための固定装置であって、
前記2つの中空部の一方の内部に当該中空部の前記開口から一方の端部を挿入可能とされる第一の棒状体;
前記2つの中空部の他方の内部に当該中空部の前記開口から一方の端部を挿入可能とされる第二の棒状体;および
前記第一の棒状体が前記一方の中空部の少なくとも2か所に圧接するとともに、前記第二の棒状体が前記他方の中空部の少なくとも2か所に圧接することにより、前記被めっき部材が前記第一の棒状体および前記第二の棒状体により保持されるように、前記第一の棒状体および前記第二の棒状体が、それぞれの他方の端部を互いに近接する方向および互いに離間する方向の双方に移動すること、および前記他方の端部が互いに近接する向きに付勢された状態および前記他方の端部が互いに離間する向きに付勢された状態の双方で保持されることを可能とする棒状体可動保持機構を備える被めっき部材の固定装置。 - 前記第一の棒状体および前記第二の棒状体の少なくとも一方の前記中空部における前記被めっき部材への接触部が、前記被めっき部材に対する電気接点部をなす請求項32に記載の固定装置。
- 前記第一の棒状体の他方の端部および前記第二の棒状体の他方の端部を、互いに離間する向きおよび互いに近接する向きの双方に移動させることが可能であるとともに、前記第一の棒状体の他方の端部および前記第二の棒状体の他方の端部が移動した向きに付勢された状態を保持することが可能である駆動機構を有する棒状体駆動機構を備える請求項32または33に記載の固定装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MX2014001514A MX352269B (es) | 2012-11-01 | 2013-05-02 | Aparato de chapado, unidad de boquilla-anodo, metodo de fabricacion de elemento chapado, y aparato de fijacion para que el elemento sea chapado. |
CN201380001884.6A CN104024490B (zh) | 2012-11-01 | 2013-05-02 | 一种电镀装置、喷嘴‑阳极单元、电镀构件的制造方法以及被镀构件固定装置 |
JP2013521690A JP5515056B1 (ja) | 2012-11-01 | 2013-05-02 | めっき装置、ノズル−アノードユニット、めっき部材の製造方法、および被めっき部材固定装置 |
US14/155,175 US9187837B2 (en) | 2012-11-01 | 2014-01-14 | Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012241445 | 2012-11-01 | ||
JP2012-241445 | 2012-11-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/155,175 Continuation US9187837B2 (en) | 2012-11-01 | 2014-01-14 | Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014069023A1 true WO2014069023A1 (ja) | 2014-05-08 |
Family
ID=50626957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/062767 WO2014069023A1 (ja) | 2012-11-01 | 2013-05-02 | めっき装置、ノズル-アノードユニット、めっき部材の製造方法、および被めっき部材固定装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9187837B2 (ja) |
JP (1) | JP5515056B1 (ja) |
CN (1) | CN104024490B (ja) |
MX (1) | MX352269B (ja) |
WO (1) | WO2014069023A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5861145B1 (ja) * | 2014-09-25 | 2016-02-16 | ユケン工業株式会社 | ノズルアノードユニットの製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9303328B2 (en) * | 2014-01-09 | 2016-04-05 | Teledyne Instruments, Inc. | System and method for electroplating of hole surfaces |
CN106048693B (zh) * | 2014-08-20 | 2018-06-08 | 江苏理工学院 | 一种基于移动阳极的超临界复合电镀加工钻头方法 |
CN105350062B (zh) * | 2015-12-07 | 2018-01-19 | 依力柏电能有限公司 | 一种电镀装置 |
CN106835218B (zh) * | 2017-02-27 | 2018-11-27 | 中钢集团西安重机有限公司 | 一种阳极变速运动式电镀装置 |
KR101913171B1 (ko) * | 2017-03-10 | 2018-11-26 | (주)애니캐스팅 | 선택적 전기화학 전착을 이용한 3d 프린팅 장치 |
GB201711472D0 (en) * | 2017-07-17 | 2017-08-30 | Univ London Queen Mary | Electrodeposition from multiple electrolytes |
US20190127869A1 (en) * | 2017-10-26 | 2019-05-02 | Unison Industries, Llc | Device and method for forming electroformed component |
EP3540098A3 (en) | 2018-03-16 | 2019-11-06 | Airbus Defence and Space GmbH | Apparatus and method for the continuous metallization of an object |
KR102124406B1 (ko) * | 2018-03-28 | 2020-06-18 | 주식회사 익스톨 | 수평 도금 장치 및 방법 |
JP6971915B2 (ja) * | 2018-06-05 | 2021-11-24 | 株式会社荏原製作所 | めっき方法、めっき装置、及び限界電流密度を推定する方法 |
TWI668335B (zh) * | 2018-08-22 | 2019-08-11 | 華紹國際有限公司 | 電鍍裝置及電鍍方法 |
US11174564B2 (en) * | 2018-10-31 | 2021-11-16 | Unison Industries, Llc | Electroforming system and method |
KR102639119B1 (ko) | 2018-12-31 | 2024-02-20 | 엘지디스플레이 주식회사 | 전기 도금 장치 및 이를 이용한 전기 도금 방법 |
CA3141101C (en) | 2021-08-23 | 2023-10-17 | Unison Industries, Llc | Electroforming system and method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306596A (ja) * | 1988-06-06 | 1989-12-11 | Eagle Ind Co Ltd | 鍍金装置 |
JPH0336292A (ja) * | 1989-06-29 | 1991-02-15 | Kawasaki Steel Corp | めっき槽 |
JP2000034597A (ja) * | 1998-07-16 | 2000-02-02 | Think Laboratory Co Ltd | カセット形ロール自動脱着装置 |
JP2003221700A (ja) * | 2002-01-31 | 2003-08-08 | Toppan Printing Co Ltd | 電気めっき装置及びめっき膜の形成方法 |
JP2005272999A (ja) * | 2004-02-27 | 2005-10-06 | Jfe Steel Kk | 電気めっき鋼板の製造方法及び電気めっき装置 |
JP2010059449A (ja) * | 2008-09-02 | 2010-03-18 | Toshiba Corp | 電解加工装置、電解加工方法、および構造体の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0274000A (ja) * | 1988-09-09 | 1990-03-13 | Permelec Electrode Ltd | プリント基板の銅メッキ方法及び使用する装置 |
GB2247468B (en) * | 1990-08-17 | 1994-10-05 | Omi International | Electroplating process |
JP3547336B2 (ja) | 1999-03-11 | 2004-07-28 | 大日本スクリーン製造株式会社 | 基板メッキ装置及び基板メッキ方法 |
US6344123B1 (en) * | 2000-09-27 | 2002-02-05 | International Business Machines Corporation | Method and apparatus for electroplating alloy films |
JP2004300462A (ja) | 2003-03-28 | 2004-10-28 | Ebara Corp | めっき方法及びめっき装置 |
US20060081478A1 (en) * | 2004-10-19 | 2006-04-20 | Tsuyoshi Sahoda | Plating apparatus and plating method |
JP5184308B2 (ja) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
-
2013
- 2013-05-02 JP JP2013521690A patent/JP5515056B1/ja active Active
- 2013-05-02 CN CN201380001884.6A patent/CN104024490B/zh active Active
- 2013-05-02 WO PCT/JP2013/062767 patent/WO2014069023A1/ja active Application Filing
- 2013-05-02 MX MX2014001514A patent/MX352269B/es active IP Right Grant
-
2014
- 2014-01-14 US US14/155,175 patent/US9187837B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306596A (ja) * | 1988-06-06 | 1989-12-11 | Eagle Ind Co Ltd | 鍍金装置 |
JPH0336292A (ja) * | 1989-06-29 | 1991-02-15 | Kawasaki Steel Corp | めっき槽 |
JP2000034597A (ja) * | 1998-07-16 | 2000-02-02 | Think Laboratory Co Ltd | カセット形ロール自動脱着装置 |
JP2003221700A (ja) * | 2002-01-31 | 2003-08-08 | Toppan Printing Co Ltd | 電気めっき装置及びめっき膜の形成方法 |
JP2005272999A (ja) * | 2004-02-27 | 2005-10-06 | Jfe Steel Kk | 電気めっき鋼板の製造方法及び電気めっき装置 |
JP2010059449A (ja) * | 2008-09-02 | 2010-03-18 | Toshiba Corp | 電解加工装置、電解加工方法、および構造体の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5861145B1 (ja) * | 2014-09-25 | 2016-02-16 | ユケン工業株式会社 | ノズルアノードユニットの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
MX2014001514A (es) | 2014-07-03 |
CN104024490A (zh) | 2014-09-03 |
JPWO2014069023A1 (ja) | 2016-09-08 |
JP5515056B1 (ja) | 2014-06-11 |
CN104024490B (zh) | 2018-03-16 |
MX352269B (es) | 2017-11-16 |
US20140190835A1 (en) | 2014-07-10 |
US9187837B2 (en) | 2015-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5515056B1 (ja) | めっき装置、ノズル−アノードユニット、めっき部材の製造方法、および被めっき部材固定装置 | |
Mithu et al. | The effect of high frequency and duty cycle in electrochemical microdrilling | |
US20160237588A1 (en) | Surface treatment system and workpiece-holding jig | |
TW201625963A (zh) | 包含用於測試頭的複數個接觸式探針的半完成產品及相關製造方法 | |
DE102004030377B3 (de) | Translatorischer Manipulator, Behandlungsanlage und Verfahren zum Behandeln von Behandlungsgut | |
WO2006066920A1 (de) | Elektrotauchlackieranlage | |
EP3277504A2 (de) | Verfahren zur herstellung mindestens eines federkontaktstifts oder einer federkontaktstift-anordnung sowie entsprechende vorrichtungen | |
US20100133237A1 (en) | Wire-Discharge Machining Apparatus | |
DE19925217A1 (de) | Verfahren zum Bestücken von Substraten mit Bauelementen | |
DE102008009017A1 (de) | Verfahren zur Messung eines Halbleitersubstrats | |
DE102017122878A1 (de) | Versorgungssstecker für eine elektronische Ausrüstung, die von einer Einbaugehäuseanordnung gehalten wird | |
CN102373497A (zh) | 电镀装置及电镀方法 | |
DE10228323A1 (de) | Verfahren zum Elektroplattieren von metallischen und Metallmatrix-Komposit Folien, Beschichtungen und Mikrokomponenten | |
US11396129B2 (en) | Increasing electrical conductivity at selected locations of a 3D object | |
CN106001808A (zh) | 磁电联动式电化学加工间隙自动反馈控制装置及使用方法 | |
EP3738415B1 (de) | Backplane und verfahren zu deren herstellung | |
JP7438578B2 (ja) | 回路基板のスルーホールの充填方法及びこれを用いた回路基板 | |
CN114921839A (zh) | 一种用于探针针尾镀金的方法及定位治具 | |
KR20210123611A (ko) | 이동형 수직애노드가 장착된 도금장치 | |
CN202543371U (zh) | 一种无接触式水平电镀线 | |
WO2020233753A1 (de) | Zweiachspositioniervorrichtung | |
Shengyuan et al. | Research on “slice” layer height and width additive manufacturing by maskless localized electrodeposition method | |
DE3109755A1 (de) | Verfahren und vorrichtung zur galvanischen abscheidung | |
JPH01502517A (ja) | 電気鍍金装置 | |
Habib et al. | Analysis of electrolyte flow in localized electrochemical deposition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2013521690 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: MX/A/2014/001514 Country of ref document: MX |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13851127 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13851127 Country of ref document: EP Kind code of ref document: A1 |