MX352269B - Aparato de chapado, unidad de boquilla-anodo, metodo de fabricacion de elemento chapado, y aparato de fijacion para que el elemento sea chapado. - Google Patents

Aparato de chapado, unidad de boquilla-anodo, metodo de fabricacion de elemento chapado, y aparato de fijacion para que el elemento sea chapado.

Info

Publication number
MX352269B
MX352269B MX2014001514A MX2014001514A MX352269B MX 352269 B MX352269 B MX 352269B MX 2014001514 A MX2014001514 A MX 2014001514A MX 2014001514 A MX2014001514 A MX 2014001514A MX 352269 B MX352269 B MX 352269B
Authority
MX
Mexico
Prior art keywords
plating
anode
insoluble anode
plating tank
anode unit
Prior art date
Application number
MX2014001514A
Other languages
English (en)
Other versions
MX2014001514A (es
Inventor
Norikazu Kojima
Yoshiharu Kikuchi
Original Assignee
Yuken Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuken Ind Co Ltd filed Critical Yuken Ind Co Ltd
Publication of MX2014001514A publication Critical patent/MX2014001514A/es
Publication of MX352269B publication Critical patent/MX352269B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Como un medio para realizar electrochapado uniformemente y a alta velocidad independientemente de la forma de un elemento que ha de ser chapado, se provee un aparato de chapado que comprende: un baño de chapado; un ánodo insoluble colocado en el baño de chapado; un suministro de energía eléctrica para chapado que es capaz de aplicar un voltaje entre el ánodo insoluble y el elemento que ha de ser chapado; un mecanismo de desplazamiento de ánodo que es capaz de mover el ánodo insoluble en el baño de chapado y de contener el ánodo insoluble en una posición predeterminada en el baño de chapado; y un controlador que tiene un controlador de la posición del ánodo que es capaz de generar una señal de control para controlar una acción del mecanismo de desplazamiento de ánodo y de emitir la señal de control al mecanismo de desplazamiento de ánodo.
MX2014001514A 2012-11-01 2013-05-02 Aparato de chapado, unidad de boquilla-anodo, metodo de fabricacion de elemento chapado, y aparato de fijacion para que el elemento sea chapado. MX352269B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012241445 2012-11-01
PCT/JP2013/062767 WO2014069023A1 (ja) 2012-11-01 2013-05-02 めっき装置、ノズル－アノードユニット、めっき部材の製造方法、および被めっき部材固定装置

Publications (2)

Publication Number Publication Date
MX2014001514A MX2014001514A (es) 2014-07-03
MX352269B true MX352269B (es) 2017-11-16

Family

ID=50626957

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014001514A MX352269B (es) 2012-11-01 2013-05-02 Aparato de chapado, unidad de boquilla-anodo, metodo de fabricacion de elemento chapado, y aparato de fijacion para que el elemento sea chapado.

Country Status (5)

Country Link
US (1) US9187837B2 (es)
JP (1) JP5515056B1 (es)
CN (1) CN104024490B (es)
MX (1) MX352269B (es)
WO (1) WO2014069023A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9303328B2 (en) * 2014-01-09 2016-04-05 Teledyne Instruments, Inc. System and method for electroplating of hole surfaces
CN106048693B (zh) * 2014-08-20 2018-06-08 江苏理工学院 一种基于移动阳极的超临界复合电镀加工钻头方法
JP5861145B1 (ja) * 2014-09-25 2016-02-16 ユケン工業株式会社 ノズルアノードユニットの製造方法
CN105350062B (zh) * 2015-12-07 2018-01-19 依力柏电能有限公司 一种电镀装置
CN106835218B (zh) * 2017-02-27 2018-11-27 中钢集团西安重机有限公司 一种阳极变速运动式电镀装置
KR101913171B1 (ko) * 2017-03-10 2018-11-26 (주)애니캐스팅 선택적 전기화학 전착을 이용한 3ｄ 프린팅 장치
GB201711472D0 (en) * 2017-07-17 2017-08-30 Univ London Queen Mary Electrodeposition from multiple electrolytes
US20190127869A1 (en) * 2017-10-26 2019-05-02 Unison Industries, Llc Device and method for forming electroformed component
EP3540098A3 (en) 2018-03-16 2019-11-06 Airbus Defence and Space GmbH Apparatus and method for the continuous metallization of an object
KR102124406B1 (ko) * 2018-03-28 2020-06-18 주식회사 익스톨 수평 도금 장치 및 방법
JP6971915B2 (ja) * 2018-06-05 2021-11-24 株式会社荏原製作所 めっき方法、めっき装置、及び限界電流密度を推定する方法
TWI668335B (zh) * 2018-08-22 2019-08-11 華紹國際有限公司 電鍍裝置及電鍍方法
US11174564B2 (en) * 2018-10-31 2021-11-16 Unison Industries, Llc Electroforming system and method
KR102639119B1 (ko) 2018-12-31 2024-02-20 엘지디스플레이 주식회사 전기 도금 장치 및 이를 이용한 전기 도금 방법
CA3141101C (en) 2021-08-23 2023-10-17 Unison Industries, Llc Electroforming system and method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306596A (ja) * 1988-06-06 1989-12-11 Eagle Ind Co Ltd 鍍金装置
JPH0274000A (ja) * 1988-09-09 1990-03-13 Permelec Electrode Ltd プリント基板の銅メッキ方法及び使用する装置
JPH0336292A (ja) * 1989-06-29 1991-02-15 Kawasaki Steel Corp めっき槽
GB2247468B (en) * 1990-08-17 1994-10-05 Omi International Electroplating process
JP3894669B2 (ja) * 1998-07-16 2007-03-22 株式会社シンク・ラボラトリー カセット形ロール自動脱着装置
JP3547336B2 (ja) 1999-03-11 2004-07-28 大日本スクリーン製造株式会社 基板メッキ装置及び基板メッキ方法
US6344123B1 (en) * 2000-09-27 2002-02-05 International Business Machines Corporation Method and apparatus for electroplating alloy films
JP2003221700A (ja) * 2002-01-31 2003-08-08 Toppan Printing Co Ltd 電気めっき装置及びめっき膜の形成方法
JP2004300462A (ja) 2003-03-28 2004-10-28 Ebara Corp めっき方法及びめっき装置
JP4586423B2 (ja) * 2004-02-27 2010-11-24 Ｊｆｅスチール株式会社 電気めっき鋼板の製造方法
US20060081478A1 (en) * 2004-10-19 2006-04-20 Tsuyoshi Sahoda Plating apparatus and plating method
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
JP2010059449A (ja) * 2008-09-02 2010-03-18 Toshiba Corp 電解加工装置、電解加工方法、および構造体の製造方法

Also Published As

Publication number Publication date
WO2014069023A1 (ja) 2014-05-08
MX2014001514A (es) 2014-07-03
CN104024490A (zh) 2014-09-03
JPWO2014069023A1 (ja) 2016-09-08
JP5515056B1 (ja) 2014-06-11
CN104024490B (zh) 2018-03-16
US20140190835A1 (en) 2014-07-10
US9187837B2 (en) 2015-11-17

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