MX2015016099A - Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo. - Google Patents
Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo.Info
- Publication number
- MX2015016099A MX2015016099A MX2015016099A MX2015016099A MX2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A MX 2015016099 A MX2015016099 A MX 2015016099A
- Authority
- MX
- Mexico
- Prior art keywords
- power
- supply member
- same
- device provided
- plating device
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
Se provee un miembro de suministro de potencia de manera que es posible llevar a cabo favorablemente el platinado durante un largo tiempo. Un segundo miembro de suministro de potencia (30) se pone en contacto con un artículo (1) que será platinado, que se posiciona de manera que forma un espacio a través del cual fluye una solución de platinado entre el artículo y un ánodo (10), y aplica un voltaje negativo al mismo. El segundo miembro de suministro de potencia (30) comprende un miembro de núcleo de cobre (34), y un miembro de revestimiento de titanio (32) que está presente en la periferia del miembro de núcleo de cobre (31) y por lo menos cubre el área que se pone en contacto con el fluido de platinado.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013125556A JP6189656B2 (ja) | 2013-06-14 | 2013-06-14 | 給電部材及びそれを備えた高速めっき装置 |
PCT/JP2014/065050 WO2014199908A1 (ja) | 2013-06-14 | 2014-06-06 | 給電部材及びそれを備えた高速めっき装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2015016099A true MX2015016099A (es) | 2017-08-24 |
Family
ID=52022204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015016099A MX2015016099A (es) | 2013-06-14 | 2014-06-06 | Miembro de suministro de potencia, y dispositivo de platinado de alta velocidad provisto con el mismo. |
Country Status (8)
Country | Link |
---|---|
US (1) | US10006143B2 (es) |
EP (1) | EP3009536A4 (es) |
JP (1) | JP6189656B2 (es) |
CN (1) | CN105308222B (es) |
BR (1) | BR112015029937A8 (es) |
MX (1) | MX2015016099A (es) |
TW (1) | TWI646224B (es) |
WO (1) | WO2014199908A1 (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6193005B2 (ja) | 2013-06-14 | 2017-09-06 | Kyb株式会社 | 保持装置及びそれを備えた高速めっき装置 |
JP7101229B2 (ja) * | 2019-12-10 | 2022-07-14 | エスケー ネクシリス カンパニー リミテッド | メッキ設備用陰極アセンブリ |
JP7394678B2 (ja) * | 2020-03-26 | 2023-12-08 | 日立Astemo株式会社 | ロッドの製造方法および陰極部材 |
JP2021165423A (ja) * | 2020-04-08 | 2021-10-14 | オムロン株式会社 | 部分めっき装置 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649477A (en) * | 1968-05-14 | 1972-03-14 | Bart Mfg Co | Electroplating large cylindrical tanks |
US3960675A (en) * | 1975-04-17 | 1976-06-01 | Motter Printing Press Co. | Method for deplating and replating rotogravure cylinders |
JPS6046195B2 (ja) | 1979-04-13 | 1985-10-15 | ヤマハ発動機株式会社 | 高速メツキ装置 |
DE3011643A1 (de) * | 1980-03-26 | 1981-10-01 | Metallgesellschaft Ag, 6000 Frankfurt | Elektrolysezelle |
US4543172A (en) * | 1981-03-03 | 1985-09-24 | Toshiyuki Suzuki | High speed plating apparatus |
JPS57145999A (en) | 1981-03-03 | 1982-09-09 | Yamaha Motor Co Ltd | Plating device |
JPS57158396A (en) * | 1981-03-24 | 1982-09-30 | Riken Corp | Simultaneous plating method for inside and outside circumference of ring |
CH666697A5 (de) * | 1985-12-16 | 1988-08-15 | Daetwyler Ag | Vorrichtung zur galvanischen behandlung von druckzylindern. |
JPS62164899A (ja) * | 1986-01-14 | 1987-07-21 | Tanaka Kikinzoku Kogyo Kk | 導電用複合ブスバ− |
DE58904418D1 (de) * | 1988-09-01 | 1993-06-24 | Siemens Nixdorf Inf Syst | Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten. |
DE3938160A1 (de) | 1989-11-16 | 1991-05-23 | Peroxid Chemie Gmbh | Elektrolysezelle zur herstellung von peroxo- und perhalogenatverbindungen |
EP0597428B1 (en) | 1992-11-09 | 1997-07-30 | Canon Kabushiki Kaisha | Anodization apparatus with supporting device for substrate to be treated |
US5516415A (en) | 1993-11-16 | 1996-05-14 | Ontario Hydro | Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube |
US5476578A (en) * | 1994-01-10 | 1995-12-19 | Electroplating Technologies, Ltd. | Apparatus for electroplating |
JP3606932B2 (ja) * | 1994-12-30 | 2005-01-05 | 石福金属興業株式会社 | 電解用複合電極 |
JPH0931686A (ja) * | 1995-07-21 | 1997-02-04 | Toshiba Corp | 電気メッキ装置および電気メッキ方法 |
US6547936B1 (en) * | 1996-11-22 | 2003-04-15 | Chema Technology, Inc. | Electroplating apparatus having a non-dissolvable anode |
JP2000073197A (ja) | 1998-08-31 | 2000-03-07 | Dainippon Screen Mfg Co Ltd | 基板メッキ装置 |
IT1303889B1 (it) * | 1998-12-01 | 2001-03-01 | Giovanna Angelini | Procedimento ed apparecchiatura per la cromatura in continuo di barree relativa struttura di anodo |
EP1031647A3 (en) | 1999-02-19 | 2002-03-06 | Solid State Equipment Corporation | Apparatus and method for plating a wafer |
JP3409003B2 (ja) * | 1999-12-10 | 2003-05-19 | 新日本製鐵株式会社 | 電極及びそれを用いたSnメッキ装置 |
DE10102145B4 (de) | 2000-01-19 | 2008-04-03 | Suzuki Motor Corp., Hamamatsu | Galvanisiervorbehandlungsvorrichtung und Galvanisierbehandlungsvorrichtung |
US20020003092A1 (en) | 2000-06-16 | 2002-01-10 | Thomas Engert | Process for the production of refractory metal plates and expanded metal grids platinized on one side |
DE10029837B4 (de) | 2000-06-16 | 2005-02-17 | Degussa Galvanotechnik Gmbh | Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen |
US6547945B2 (en) * | 2000-07-31 | 2003-04-15 | United Technologies Corporation | Method and apparatuses for electrochemically treating an article |
JP3513657B2 (ja) | 2001-03-05 | 2004-03-31 | ダイソー株式会社 | 不溶性陽極 |
JP4595046B2 (ja) * | 2001-03-27 | 2010-12-08 | 日本パーカライジング株式会社 | りん酸塩皮膜処理装置及び化成皮膜処理装置 |
JP4038194B2 (ja) * | 2004-03-03 | 2008-01-23 | 野▲崎▼工業株式会社 | 不溶性電極及びそれに使用される電極板並びにその使用方法 |
JP2006016651A (ja) | 2004-06-30 | 2006-01-19 | Shinko Electric Ind Co Ltd | ウエハめっき用治具 |
JP2006131969A (ja) | 2004-11-08 | 2006-05-25 | Toshiba Ceramics Co Ltd | 陽極化成方法及びその装置 |
ITMI20050373A1 (it) | 2005-03-09 | 2006-09-10 | Nora Elettrodi S P A | Elettrodo cilindrico |
JP4873695B2 (ja) | 2006-04-14 | 2012-02-08 | ダイソー株式会社 | 電着塗装用膜付き中空電極 |
CN201495306U (zh) * | 2009-04-10 | 2010-06-02 | 竞铭机械股份有限公司 | 电镀槽阴极导电铜板改进结构 |
CN201473614U (zh) * | 2009-04-29 | 2010-05-19 | 张国庆 | 生箔机阴极辊新型结构 |
IT1393960B1 (it) * | 2009-05-05 | 2012-05-17 | Plating Innovations S R L | Finitura superficiale elettrolitica di barre in continuo. |
JP5768995B2 (ja) | 2010-03-26 | 2015-08-26 | アイシン精機株式会社 | 部分表面処理装置 |
JP5467374B2 (ja) | 2011-08-25 | 2014-04-09 | ユケン工業株式会社 | 軸体に電気めっきを形成するための装置、めっき皮膜を有する軸体の製造方法および軸体上に亜鉛系めっき皮膜を形成するためのめっき液 |
JP6189655B2 (ja) | 2013-06-14 | 2017-08-30 | Kyb株式会社 | アノードの製造方法 |
JP6193005B2 (ja) | 2013-06-14 | 2017-09-06 | Kyb株式会社 | 保持装置及びそれを備えた高速めっき装置 |
-
2013
- 2013-06-14 JP JP2013125556A patent/JP6189656B2/ja active Active
-
2014
- 2014-06-06 MX MX2015016099A patent/MX2015016099A/es unknown
- 2014-06-06 US US14/897,186 patent/US10006143B2/en not_active Expired - Fee Related
- 2014-06-06 WO PCT/JP2014/065050 patent/WO2014199908A1/ja active Application Filing
- 2014-06-06 EP EP14810276.7A patent/EP3009536A4/en not_active Withdrawn
- 2014-06-06 CN CN201480033950.2A patent/CN105308222B/zh active Active
- 2014-06-06 BR BR112015029937A patent/BR112015029937A8/pt not_active Application Discontinuation
- 2014-06-13 TW TW103120485A patent/TWI646224B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW201510289A (zh) | 2015-03-16 |
JP6189656B2 (ja) | 2017-08-30 |
CN105308222B (zh) | 2018-03-13 |
WO2014199908A1 (ja) | 2014-12-18 |
EP3009536A4 (en) | 2017-03-22 |
EP3009536A1 (en) | 2016-04-20 |
TWI646224B (zh) | 2019-01-01 |
US20160108540A1 (en) | 2016-04-21 |
JP2015001006A (ja) | 2015-01-05 |
BR112015029937A2 (pt) | 2017-07-25 |
US10006143B2 (en) | 2018-06-26 |
BR112015029937A8 (pt) | 2019-12-31 |
CN105308222A (zh) | 2016-02-03 |
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