SG11201807416YA - Substrate holder and plating apparatus - Google Patents

Substrate holder and plating apparatus

Info

Publication number
SG11201807416YA
SG11201807416YA SG11201807416YA SG11201807416YA SG11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA
Authority
SG
Singapore
Prior art keywords
substrate
substrate holder
plating apparatus
holding
plating
Prior art date
Application number
SG11201807416YA
Inventor
Yoshitaka Mukaiyama
Toshio Yokoyama
Junitsu Yamakawa
Takuya Tsushima
Tomonori Hirao
Sho Tamura
Hirotaka Ohashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201807416YA publication Critical patent/SG11201807416YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Abstract

SUBSTRATE HOLDER AND PLATING APPARATUS To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate. Figure 1
SG11201807416YA 2016-03-22 2017-03-07 Substrate holder and plating apparatus SG11201807416YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016057028A JP6596372B2 (en) 2016-03-22 2016-03-22 Substrate holder and plating apparatus
PCT/JP2017/008875 WO2017163849A1 (en) 2016-03-22 2017-03-07 Substrate holder and plating device

Publications (1)

Publication Number Publication Date
SG11201807416YA true SG11201807416YA (en) 2018-10-30

Family

ID=59900180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807416YA SG11201807416YA (en) 2016-03-22 2017-03-07 Substrate holder and plating apparatus

Country Status (7)

Country Link
US (1) US11015261B2 (en)
JP (1) JP6596372B2 (en)
KR (1) KR102074338B1 (en)
CN (1) CN109072475B (en)
SG (1) SG11201807416YA (en)
TW (1) TWI685056B (en)
WO (1) WO2017163849A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019003891A1 (en) * 2017-06-28 2019-01-03 株式会社荏原製作所 Substrate holder and plating device
CN110944758A (en) 2017-09-07 2020-03-31 株式会社Ihi Barrel coating device
JP7122235B2 (en) * 2018-11-26 2022-08-19 上村工業株式会社 holding jig
CN111945212B (en) * 2019-05-15 2021-11-05 颀中科技（苏州）有限公司 Clamp for electroplating equipment
TWI722555B (en) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 Electroplating holder
JP7264780B2 (en) * 2019-09-10 2023-04-25 株式会社荏原製作所 Substrate holder, substrate plating device with same, and electrical contact
KR102292186B1 (en) * 2020-03-10 2021-08-23 주식회사 포엠일렉트로옵틱 Automatic protective tape peeling and film protection holder coupling device
JP6899040B1 (en) * 2020-12-09 2021-07-07 株式会社荏原製作所 Plating equipment and substrate holder operation method
KR20230027215A (en) * 2021-01-08 2023-02-27 가부시키가이샤 에바라 세이사꾸쇼 Substrate holder, plating device, plating method and storage medium
WO2023170163A1 (en) * 2022-03-09 2023-09-14 Octapharma Ag Mold for applying a liquid onto a plasma-based or cryoprecipitate-based film and method for coating a plasma-based or cryoprecipitate-based film

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2633452B1 (en) * 1988-06-28 1990-11-02 Doue Julien SUPPORT DEVICE FOR A THIN SUBSTRATE, PARTICULARLY IN A SEMICONDUCTOR MATERIAL
JPH0677308A (en) 1992-08-25 1994-03-18 Mitsubishi Electric Corp Semiconductor manfacturing device
TW580745B (en) * 1997-12-15 2004-03-21 Ebara Corp Electroplating jig for semiconductor wafers and apparatus for electroplating wafers
JP4037504B2 (en) * 1998-01-09 2008-01-23 株式会社荏原製作所 Semiconductor wafer plating jig
US6783299B2 (en) * 1999-07-26 2004-08-31 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
JP3588777B2 (en) * 2002-04-12 2004-11-17 株式会社山本鍍金試験器 Cathode cartridge for electroplating tester
US7601248B2 (en) * 2002-06-21 2009-10-13 Ebara Corporation Substrate holder and plating apparatus
JP4828959B2 (en) 2006-02-17 2011-11-30 住友重機械工業株式会社 Substrate holder and substrate holder handling method
CN102257186B (en) 2008-11-14 2014-10-15 加布里埃尔·李普曼-公共研究中心 A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof
JP5585238B2 (en) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 Substrate processing equipment
JP5766048B2 (en) * 2010-08-19 2015-08-19 株式会社荏原製作所 Substrate holder and plating apparatus
TWI580814B (en) * 2010-10-21 2017-05-01 荏原製作所股份有限公司 Substrate processing apparatus, and plating apparatus and plating method
US9464362B2 (en) * 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
JP5908266B2 (en) 2011-11-30 2016-04-26 株式会社Ｓｃｒｅｅｎホールディングス Anodizing apparatus, anodizing system including the same, and semiconductor wafer
JP5981534B2 (en) * 2012-04-20 2016-08-31 株式会社Ｊｃｕ Substrate plating jig and plating apparatus using the same
DE102012019389B4 (en) * 2012-10-02 2018-03-29 Atotech Deutschland Gmbh Holding device for a product and treatment method
TWI561683B (en) * 2012-10-18 2016-12-11 Process Automation Int Ltd A hanger and an electroplating system with such a hanger
KR102056050B1 (en) * 2012-11-14 2019-12-16 가부시끼가이샤 제이씨유 Substrate plating jig
JP2016008344A (en) * 2014-06-26 2016-01-18 株式会社村田製作所 Jig for plating

Also Published As

Publication number Publication date
KR20180124039A (en) 2018-11-20
US11015261B2 (en) 2021-05-25
WO2017163849A1 (en) 2017-09-28
TW201735236A (en) 2017-10-01
TWI685056B (en) 2020-02-11
JP2017171966A (en) 2017-09-28
US20190084777A1 (en) 2019-03-21
JP6596372B2 (en) 2019-10-23
KR102074338B1 (en) 2020-02-07
CN109072475A (en) 2018-12-21
CN109072475B (en) 2020-06-09

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