JPH0677308A - Semiconductor manfacturing device - Google Patents

Abstract

PURPOSE:To provide a semiconductor manufacturing device capable of eliminating dusting from the main surface of wafer, reducing pattern defects and improving yield when fixing wafer inside the device. CONSTITUTION:A recessed portion 2a for placing a wafer 1 is formed on a frame 2 and also a hole 5 is drilled. Piping 4 is connected to this hole 5. At the upper portion of the frame 2, a holding jig 6 is attached around the recessed portion 2a. At the inner peripheral wall end of this holding jig 6, a contact surface 6b slanted from the main surface of the wafer 1 is formed. Thus, by supplying a gas to the inside of the recessed portion 2a through the piping 4 and the hole 5, the wafer 1 is pushed up from the rear surface side, and the outer peripheral end surface of wafer is contacted to and fixed to the contact surface 6b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, for example, a semiconductor substrate fixing structure in a plasma etching apparatus.

[0002]

2. Description of the Related Art FIG. 4 is a cross-sectional view showing a wafer fixing structure in a conventional semiconductor manufacturing apparatus. In the figure, 1 is a wafer as a semiconductor substrate, and 2 is a wafer placed in the semiconductor manufacturing apparatus. The pedestal 2 is formed with a recess 2a larger than the outer diameter of the wafer 1.
Reference numeral 3 is a holding jig for fixing the wafer 1 housed in the recess 2a of the pedestal 2. The holding jig 3 has a ring-shaped contact surface 3a parallel to the main surface of the wafer 1. . Reference numeral 4 denotes a pipe connected to a hole 5 formed in the pedestal 2, so that gas is supplied into the recess 2a through the pipe 4 and the hole 5 so that the wafer 1 can be pressed against the holding jig 3. It is configured.

Next, the operation of the above conventional semiconductor manufacturing apparatus will be described. First, the wafer 1 having a resist film (not shown) having a desired pattern formed on its main surface is placed in the recess 2a of the pedestal 2 with the main surface facing upward.
Then, the holding jig 3 is set on the wafer 1, and gas is supplied into the recess 2a through the pipe 4 and the hole 5. At this time, the wafer 1 is pressed against the contact surface 3a of the holding jig 3 by pressing the outer peripheral portion of the main surface of the wafer 1 with the gas supplied from the back surface side, and the vertical movement of the wafer 1 is restricted, and by the recess 2a. Lateral movement is restricted and fixed in the semiconductor device. After that, the inside of the semiconductor manufacturing apparatus is set to a predetermined gas pressure, and the wafer 1 is subjected to plasma etching.

[0004]

As described above, the conventional semiconductor manufacturing apparatus fixes the wafer 1 by pressing the outer peripheral portion of the main surface of the wafer 1 against the ring-shaped contact surface 3a of the holding jig 3. Therefore, when fixing the wafer 1, there is a problem that the pattern of the resist film or the wiring pattern formed on the main surface of the wafer 1 is destroyed or dust is generated to contaminate the surface of the wafer 1. . Further, in order to solve the above problem, it is conceivable to remove the resist film on the peripheral portion of the main surface of the wafer 1, but it is necessary to newly install a mechanism for removing the resist film, and There is also a problem that it is necessary to accurately control the removal range, and work efficiency is reduced.

The present invention has been made to solve the above problems. When the wafer is fixed, the outer peripheral end face of the wafer is pressed by a holding jig to form a resist film pattern or wiring on the main surface of the wafer. It is an object of the present invention to obtain a semiconductor manufacturing apparatus which prevents the destruction of the pattern of (1) and eliminates dust generation to prevent contamination of the wafer surface.

[0006]

A semiconductor manufacturing apparatus according to the present invention comprises a holding jig for fixing a semiconductor substrate placed on a pedestal and a pressing means for pressing the semiconductor substrate and the holding jig. In the provided semiconductor manufacturing apparatus, the holding jig has a contact surface that is inclined with respect to the main surface of the semiconductor substrate, and the outer peripheral end surface of the semiconductor substrate is pressed against the contact surface of the holding jig by the pressing means. The semiconductor substrate is fixed.

[0007]

According to the present invention, when the semiconductor substrate is fixed, the contact surface of the holding jig inclined with respect to the main surface of the semiconductor substrate comes into contact with the outer peripheral end surface of the semiconductor substrate.
It is possible to prevent the pattern formed on the main surface of the semiconductor substrate from being broken and damaged, and to prevent contamination of the surface of the semiconductor substrate without causing dust. Furthermore, since the contact surface of the holding jig is inclined with respect to the main surface of the semiconductor substrate,
Variations in outer diameter and thickness of the semiconductor substrate can be absorbed, and the semiconductor substrate can be reliably fixed.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. 1 is a sectional view of a wafer fixing structure in a semiconductor manufacturing apparatus showing Embodiment 1 of the present invention, and FIG. 2 is an enlarged sectional view of an essential part of FIG. 1, which is the same as the conventional semiconductor manufacturing apparatus shown in FIG. Alternatively, the corresponding parts are designated by the same reference numerals, and the description thereof will be omitted. In the figure, 6 is a holding jig for fixing the wafer 1 housed in the recess 2a of the pedestal 2. The holding jig 6 is a ring-shaped contact surface that contacts the surface of the pedestal 2 on the outer periphery of the recess 2a. 6a, and a contact surface 6b formed with an inclination on the inner peripheral wall end surface of the contact surface 6a.

Next, the operation of the first embodiment will be described. First, the wafer 1 having a resist film having a desired pattern formed on its main surface is placed in the recess 2a of the pedestal 2 with the main surface facing upward. Then, the ring-shaped contact surface 6a is brought into contact with the pedestal 2 so as to surround the recess 2a,
The holding jig 6 is set, and gas is supplied into the recess 2a through the pipe 4 and the hole 5. The wafer 1 is pushed up by the gas supplied from the back surface side, the outer peripheral end face thereof is pressed against the contact surface 6a of the holding jig 6, its vertical movement is restricted, and the wafer 2 is moved laterally by the concave portion 2a. Are regulated and fixed in the semiconductor manufacturing apparatus. After that, the inside of the semiconductor manufacturing apparatus is set to a predetermined gas pressure, and the wafer 1 is subjected to plasma etching.

As described above, according to the first embodiment, the holding jig 6 has the contact surface 6b which is inclined with respect to the main surface of the wafer 1, and the gas supplied from the back surface of the wafer 1 Since the outer peripheral end surface of the wafer 1 is pressed against and fixed to the contact surface 6b by the pushing-up force, the contact surface 6b comes into line contact with the outer peripheral end surface of the wafer 1 on the circumference, and the pressing jig 6 moves the wafer 1 It is possible to prevent the resist film pattern and the wiring pattern formed on the main surface from being destroyed or damaged when the wafer 1 is fixed, without contacting the main surface. As a result, no dust is generated due to the breakage or damage of the resist film pattern or the wiring pattern, the surface of the wafer 1 is not contaminated, and pattern defects are reduced to improve the yield.

Further, the contact surface 6b of the holding jig 6 is the wafer 1
Since it is formed so as to be inclined with respect to the main surface of the wafer 1, even if the outer diameter or thickness of the wafer 1 varies, the contact position of the contact surface 6b of the outer peripheral end surface of the wafer 1 is displaced, and the wafer 1 is securely fixed. it can.

Here, the thickness d of the contact surface 6b is determined by the wafer 1
If the variation of the outer diameter of the wafer 1 is ± 1%, it is 2.5 m for a 5-inch wafer.
m or more, 3 mm or more for a 6 inch wafer.

Further, in consideration of the size and thickness of the wafer 1 and their variations, the length of the inclined surface portion of the contact surface 6b is 2 to several tens of mm, and its inclination angle is 20 with respect to the main surface of the wafer 1. It is good to set it to 70 degrees.

Example 2. 3 is a sectional view of a wafer fixing structure in a semiconductor manufacturing apparatus showing a second embodiment of the present invention. In the figure, 7 is a pedestal on which the wafer 1 is placed, 8 is rotatably mounted on the pedestal 7, and the wafer 1 is mounted on one end side. Is a holding jig having a contact surface 8a formed with and a spring 9 as a pressing means attached to the other end side. The holding jig 8 surrounds the wafer 1 placed on the pedestal 7. Are installed on four sides of the wafer 1.

In the second embodiment, first, the holding jig 8 is spread out against the urging force of the spring 9, and the wafer 1 is placed on the pedestal 7.
To place. After that, the pressing jig 8 is pressed by the biasing force of the spring 9.
The wafer 1 is fixed to the pedestal 7 by pressing the contact surface 8 a of the above to the outer peripheral end surface of the wafer 1.

As described above, according to the second embodiment, the contact surface 8a of the holding jig 8 tilted with respect to the main surface of the wafer 1 placed on the pedestal 7 is urged by the spring 9. Since the outer peripheral end surface of the wafer 1 is pressed and fixed, the contact surface 8
Since a comes into line contact with the outer peripheral end face of the wafer 1 on the circumference, the same effect as that of the first embodiment is obtained.

Although the above embodiments have been described as being applied to a plasma etching apparatus, the present invention is not limited to this and is applicable to any semiconductor manufacturing apparatus in which the wafer 1 is fixed and processed in the apparatus. It goes without saying that you can do it.

[0018]

As described above, according to the present invention, the semiconductor provided with the holding jig for fixing the semiconductor substrate placed on the frame and the pressing means for pressing the semiconductor substrate and the holding jig against each other. In the manufacturing apparatus, the holding jig has a contact surface that is inclined with respect to the main surface of the semiconductor substrate, and the outer peripheral end surface of the semiconductor substrate is pressed against the contact surface of the holding jig by the pressing means to hold the semiconductor substrate. Since the semiconductor substrate is fixed, the main surface of the semiconductor substrate is fixed without coming into contact with the pressing jig, dust is not generated on the main surface of the semiconductor substrate, pattern defects are reduced, and the yield is improved. There is an effect that can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer fixing structure in a semiconductor manufacturing apparatus showing a first embodiment of the present invention.

FIG. 2 is an enlarged perspective view of an essential part of the wafer fixing structure in the semiconductor manufacturing apparatus showing the first embodiment of the present invention.

FIG. 3 is a perspective view of a wafer fixing structure in a semiconductor manufacturing apparatus showing Embodiment 2 of the present invention.

FIG. 4 is a perspective view showing a wafer fixing structure in a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 Wafer (Semiconductor Substrate) 2 Stand 4 Piping (Pressure Means) 5 Holes (Pressure Means) 6 Holding Jig 6b Contact Surface 7 Stand 8 Holding Jig 8a Contact Surface 9 Spring (Pressure Means)

Claims (1)

[Claims] 1. A holding jig for a semiconductor manufacturing apparatus, comprising: a holding jig for fixing a semiconductor substrate placed on a pedestal; and a pressing means for holding the semiconductor substrate and the holding jig against each other. Has a contact surface inclined with respect to the main surface of the semiconductor substrate, and fixes the semiconductor substrate by pressing the outer peripheral end surface of the semiconductor substrate against the contact surface of the holding jig by the pressing means. A semiconductor manufacturing apparatus characterized by: