JPH0617299Y2 - Device for fixing processed material to the stage for semiconductor manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of Invention] (Field of Industrial Application) The present invention relates to a device for fixing a material to be processed to a stage of a semiconductor manufacturing apparatus such as an electron beam drawing apparatus or a mask inspection apparatus, and particularly The present invention relates to an apparatus capable of fixing a size-processed material to a stage.

(Prior Art) Conventionally, in a semiconductor manufacturing apparatus of this type, when a material to be processed is a glass substrate, as shown in FIG.
Was placed in the cassette 2, and the cassette 2 was mounted on the stage 3. Incidentally, in FIG.
Is a clamp piece provided on the cassette 2 to fix the cassette 2 to the cassette 2, 5 is a clamp piece provided on the stage 3 to fix the cassette 2 to the stage 3, and 6 and 7 are laser mirrors for measuring the stage position. The outer size of the cassette 2 is set to a fixed size that can accommodate the maximum size of the target material 1, and the inner size that receives the target material 1 is changed to correspond to various sizes of the target material 1. By preparing several types and using them properly, the material 1 to be treated of various sizes was processed by one device.

In addition, when the material 1 to be processed is a wafer, it is generally loaded directly onto the stage, but a vacuum chuck is used for fixing, and the apparatus is a dedicated machine for each size, and it was not possible to support various sizes. .

(Problems to be solved by the invention) Recently, there are strong demands for flow production and low-cost single-unit production.
There is a trend toward high-efficiency production one by one without using cassettes or batch-type processing as in the past. Further, since the electron beam drawing apparatus is expensive, it is not possible to install the apparatus according to size, and since it is processed in a vacuum, a vacuum chuck cannot be used, and it is often mechanically clamped. At this time, if the clamp point is of a movable type, the structure becomes complicated, accuracy is deteriorated, and further, it takes a long time to operate. There is also a method of automatically loading the material to be processed 1 into the cassette 2 as described above and placing the material 1 in a vacuum one by one, but a complicated device for automatic loading is required.

It is an object of the present invention to provide a device which is a simple device and is capable of easily fixing materials to be processed of various sizes on a stage even in a vacuum by a simple operation.

[Constitution of device]

(Means for Solving the Problems) In order to achieve such an object, the present invention is an apparatus for fixing a material to be processed on a stage of a semiconductor manufacturing apparatus, in which a maximum of the material to be processed of various sizes to be fixed is fixed. The stage upper surface is formed with a recess having a size and shape that should support only the edge of the processing target material having a size, and one side edge of the processing target material having a size smaller than the maximum size is formed in the recess. A convex portion that supports at least a part of the edge portion on the other side of the material to be processed when placed on the side edge portion is provided, and one of the material to be processed of various sizes positioned on one side edge portion of the concave portion is provided. Two clamp pieces for pressing two side edge portions from above are provided on the stage, and the material to be processed is pressed on the stage by the clamp pieces.

(Operation) Since the edge of the concave portion or the convex portion of the stage on which the material to be processed is in contact with the upper surface of the stage only, the back surface is less contaminated or damaged and is more stably supported. Since the clamp piece is provided corresponding to the edge portion on one side of the material to be processed, it can be clamped even if the size of the material to be processed changes. Since the material to be processed is a flat plate and the stage only moves along a plane parallel to the upper surface of the flat plate, the two clamp pieces as described above can achieve a sufficient clamp.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Reference numeral 10 denotes a stage, which is moved in the X and Y directions shown in FIG. 1 by a guide and a drive device (not shown). Reference numerals 6 and 7 are laser mirrors for measuring the stage position.

11 and 12 shown by imaginary lines are different sizes of workpieces,
The state of being mounted on the stage 10 is shown.

13,13 is a clamp piece, one side edge portion of the processed material 11,12,
In FIG. 1 and FIG. 2, the guide hole of the stage 10 shown in FIG.
It is engaged with 14 so that it can move up and down. These clamp pieces
A downward clamping force is applied to the compression spring 13 by the compression spring 15. To the lower ends of the clamp pieces 13, 13, a tip of a T-shaped lever 17 having a tip (the left end in FIG. 2) that is swingably attached by a pin 16 extends to the left and right is brought into contact. The unclamp driving device (not shown) pushes down the right end side of the above to push up the clamp piece 13 against the compression spring 15.

The interval l of the clamp pieces 13 is set to be larger than 70% of the length of one side of the material 12 to be processed having the smallest size among the materials 11 and 12 to be mounted on the stage 10. By taking it large, consideration is given so that the workpieces 11 and 12 do not rotate when the stage 10 moves in the Y direction.

The upper surface of the portion of the stage 10 on which the material to be processed 11, 12 is placed is itself the reference surface, and the entire surface may be a flat surface, but in order to suppress damage to the back surface of the material to be processed 11, 12. , Recess 1
Have eight. The concave portion 18 is formed to be slightly smaller than the edge of the workpiece 11 having the maximum size of the placement target, and supports a relatively narrow portion of the edge of the workpiece 11.

Inside the concave portion 18, a convex portion 19 corresponding to an edge portion of the material 12 to be processed having a size smaller than that of the material 11 to be processed is provided.
This convex portion 19 is linearly provided only on the edge portion (on the right side in FIG. 1) opposite to the edge pressed by the clamp piece 13, or along the upper and lower sides from the edge portion. As shown in FIG. 2, the height is set to be lower than the supporting portion of the material 11 to be processed surrounding the recess 18 by a dimension δ. This dimension δ is set so that the back surface of the material to be processed 11 does not come into contact with the surface of the material to be processed 11 due to the deflection of the material to be processed 11 due to its own weight, or slightly contacts the back surface of the material to be processed 11.
~ Several μm. 1 and 2 show the case where there are only two sizes of the processed materials 11 and 12, but there are cases where there are three or more kinds, and in that case, the convex portion 19 is formed. A plurality is provided according to each size, and the height is set to be gradually lower as the size becomes smaller.

Next, the operation of this device will be described. An unclamp drive device (not shown) pushes down the right end of the lever 17 shown in FIG. 2, and the left end of the lever 17 pushes up the clamp pieces 13, 13 against the compression spring 15. In this state, the material 11 or 12 to be processed is placed on the stage 10 as shown in FIG. 1 by a loading device (not shown). At this time, the workpiece 11 having the maximum size is supported only on the edge by the upper surface of the stage 10 surrounding the recess 18, that is, the reference surface, and the height of the protrusion 19 in the recess 18 is also formed slightly lower than the reference surface. Therefore, most of the back surface of the material 11 to be processed is supported in a non-contact manner except for the edge portion. Therefore, the damage on the back surface is suppressed less. Further, the workpiece 12 smaller than the maximum size has the edge portion of the portion where the clamp pieces 13 and 13 are present supported by the upper surface of the stage 10, that is, the reference surface, similarly to the workpiece 11 of the maximum size, but other edges. The part is partially supported by the convex part 19. The height of the convex portion 19 is set to the stage 10 as described above.
The material 11 to be treated is supported with a slight inclination because it is set lower than the upper surface, that is, the reference surface by 1 μm to a few μm, but the amount of inclination is determined within a range that does not hinder the processing. Absent.

The clamp pieces 13 and 13 are urged downward by the spring force of the compression spring 15 by releasing the action of the unclamping device with respect to the lever 17, and the edges of the materials to be treated 11 and 12 are set to the upper surface of the stage 10, that is, the reference. The materials 11 and 12 to be processed are fixed to the stage 10 while being in contact with the surface or the upper surface of the convex portion 19.

The clamp pieces 13 and 13 have an X-axis on which the stage 10 is parallel to the upper surface.
When the workpieces 11 and 12 are moved in the Y plane, it is sufficient to prevent the workpieces 11 and 12 from being moved by the inertial force due to their own weight, and the purpose is sufficiently achieved.

Although the above-described embodiment shows an example in which the processing target materials 11 and 12 are square plates, the present invention can be applied to a processing target material having a circular plate like a wafer.

[Effect of device]

As described above, according to the present invention, various sizes of workpieces can be securely fixed on the stage with a simple device and simple operation, and since it is a mechanical fixing system, it can be used even in a vacuum. And so on.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
FIG. 3 is a sectional view taken along line II-II of FIG. 3, and FIG. 3 is a plan view of a conventional device. 10 …… Stage, 11, 12 …… Processed material, 13 …… Clamping piece, 15 …… Compression spring, 17 …… Lever, 18 …… Recess, 19…
… Convex part.

Claims (3)

[Scope of utility model registration request] 1. In a device for fixing a material to be processed on a stage of a semiconductor manufacturing apparatus, a size to support only an edge portion of a material to be processed having a maximum size among materials to be fixed of various sizes, and A concave portion having a shape is formed on the upper surface of the stage, and when one side edge portion of the material to be processed having a size smaller than the maximum size is placed on the one side edge portion of the concave portion inside the concave portion, A convex portion that supports at least a part of the edge portion is provided, and two clamp pieces that press the two side portions of the one side edge portion of the workpieces of various sizes located on the one side edge portion of the concave portion from above are provided. An apparatus for fixing a material to be processed to a stage for a semiconductor manufacturing apparatus, which is provided on a stage, and the material to be processed is pressed onto the stage by the clamp piece. 2. When the material to be processed is a square plate, the clamp pieces are arranged along one side of the material to be processed and the distance between them is larger than 70% of the length of one side of the minimum size of the material to be fixed. The apparatus for fixing a material to be processed to a stage for a semiconductor manufacturing apparatus according to claim 1, wherein: 3. The height of the convex portion is formed to be slightly lower than the edge portion of the concave portion, and is gradually formed to be slightly lower as the size of the corresponding material to be treated becomes smaller. The apparatus for fixing a material to be processed to a stage for a semiconductor manufacturing apparatus according to claim 1 or 2, which is a utility model registration claim.