JP3340151B2 - Wafer mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer mounting apparatus for mounting and holding a wafer in a template provided on a flat plate for polishing a semiconductor wafer (hereinafter, referred to as a wafer).

[0002]

2. Description of the Related Art In a polishing apparatus for polishing a wafer, a plurality of wafers are held on a flat polishing plate, and the wafer holding surface of the polishing plate is turned down to contact a polishing platen on which a polishing cloth is stuck. The wafer is pressed against the polishing pad by applying a load from above, and the polishing is performed while the slurry is supplied and the platen and the polishing plate holding the wafer are relatively rotated.

Conventionally, as a means for holding a wafer on a polishing plate, a method of bonding via a wax has been generally used. However, in this method, since a wax is provided in the middle, processing accuracy can be improved. Difficult, and
Since a wafer bonding apparatus and a peeling apparatus are required, and there are drawbacks such as an increase in scale of ancillary equipment and a complicated process, there are many methods of holding a wafer on a polishing plate without using wax. In this method, for example, a plurality of recesses, which are larger than the outer diameter of the wafer and are shallower than the thickness of the wafer, are formed on the wafer holding surface of the polishing plate, and the wafer is put into this and pressed and held. I have.

[0004]

In general, it is known that the inner diameter of the template is preferably as close as possible to the outer diameter of the wafer to be held. The distance from the inner peripheral edge is required to be 1 mm or less. For this reason, it is extremely difficult to mechanize the process until the wafer is placed in the template. Conventionally, the wafer is placed by hand, but the risk of contaminating the wafer and damaging it is great.

[0005]

SUMMARY OF THE INVENTION In view of the above problems, the present invention accurately places a wafer on the center of a polishing plate in a template, that is, an arc portion of an outer peripheral edge of a wafer and an inner peripheral edge of the template. The purpose of the present invention is to provide a wafer mounting apparatus capable of maintaining an equal distance of 1 mm or less with respect to a semiconductor wafer mounted on a template provided on a polishing plate. In order to correctly place the semiconductor wafer in the center of the template, the positions of the semiconductor wafer and the template are numerically analyzed using an image processing apparatus, and the arc of the outer peripheral edge of the semiconductor wafer and the inner peripheral edge of the template are equally spaced. Fine-tuning the position of the semiconductor wafer to keep it
It is a device configured to be able to perform. That is, the present invention
The wafer mounting device is a wafer mounting device that mounts a semiconductor wafer in a template provided on a polishing plate. In the wafer mounting device, an index table that rotates while holding the polishing plate, and a horizontal and vertical And a wafer transfer arm for placing a wafer in the template, a template detection camera provided above the template on which the wafer is placed, and an inner peripheral edge of the template and an outer peripheral edge of the wafer provided for detection.
And an image processing apparatus comprising one or more wafer detection cameras . The index table can be moved in the horizontal direction.

[0006]

The operation of the wafer mounting apparatus according to the present invention will be described below with reference to FIGS. 1 (a) and 1 (b). In addition,
FIG. 1A is a schematic plan view for explaining the device of the present invention, and FIG. 1B is a side view. 1. Insert circular polishing plate 1 into index table 2
Hold it in the upper predetermined position. Six circular templates 3 are provided on the polishing plate 1 at equal intervals on the same circumference. 2. The position of the template 3 on the polishing plate 1 is analyzed by the template detection camera 4, and the index table 2 is rotated so that they are at predetermined positions. 3. The wafer 7 is sucked and held on the lower surface of the wafer transfer arm 5 with the orientation flat portion 6 oriented in a predetermined direction, and transferred to a predetermined position on the template 3 placed at the predetermined position. The wafer transfer arm 5 expands and contracts in the Y direction,
It is possible to move in the X direction by traveling on the top, and to move in the Z direction by expansion and contraction of the column 9. 4. The position of the wafer 7 is detected by three wafer detection cameras 10, 11, and 12, and the wafer transfer arm 5
Is moved in the horizontal direction (X, Y directions), and fine adjustment is performed so that the wafer 7 is at a predetermined origin position. 5. The positional relationship between the wafer 7 and the template 3 is determined by the wafer detection cameras 10, 11, and 12, and the wafer 7 is detected.
Is finely adjusted by the wafer transfer arm 5 so that the arc 13 on the outer peripheral edge of the wafer 7 and the inner peripheral edge of the template 3 are kept at equal intervals. 6. The suction of the wafer transfer arm 5 is released, and the wafer 7 is loaded and placed in the template 3. 7. The index table 2 is rotated to place a new wafer 7 on the adjacent template 3 by the above-described method. When there is a template that is not on the same circumference, for example, when there is also a template at the center of rotation of the polishing plate, the index table is moved in the horizontal direction (X, Y directions) to load and place the wafer. Do.

[0007]

According to the present invention, since the relative positional relationship between the wafer and the template is analyzed, and then the wafer is placed in the template, the wafer is accurately stored in a predetermined position in the template, so that the wafer rides on the edge of the template. Never. Because the camera analyzes the positional relationship between the template and the wafer, it is desirable that the template detection camera and the wafer detection camera are arranged at positions near the object to be detected within a range that does not interfere with the wafer transfer arm and the like.

[Brief description of the drawings]

FIG. 1A is a plan view for explaining an apparatus of the present invention,
(B) is a side view.

[Explanation of symbols]

1 polishing plate, 2 index table, 3
Template, 4 Template detection camera, 5
Wafer transfer arm, 6 orientation flats, 7 wafers, 8 rails, 9 columns, 10 wafer detection camera, 11 wafer detection camera, 12 wafer detection camera, 13 arc section.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-138933 (JP, A) JP-A-63-144956 (JP, A) JP-A-62-123509 (JP, A) JP-A-2- 290040 (JP, A) JP-A-63-191589 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B24B 37/00-37/04 H01L 21/304 H01L 21/68 B23P 19/02 H05K 13/08

Claims (2)

(57) [Claims] A semiconductor wafer is mounted on a polishing plate.
In the wafer loading device placed in the beam template
Index table that rotates while holding the polishing plate.
To move the wafer horizontally and vertically
Wafer transfer arm for placing wafers in template
And a template above the template on which the wafer is placed.
Digit detection camera and inner edge of template
And three provided so that the outer peripheral edge of the wafer can be detected or
An image processing device consisting of more wafer detection cameras
A wafer mounting device, comprising: 2. The method according to claim 1, wherein the index table is in a horizontal direction.
3. The wafer mounting device according to claim 2, wherein the wafer mounting device is movable .