JPH05318310A - Wafer placing method and placing device - Google Patents

Abstract

PURPOSE:To offer a method and device for placing a wafer inside a template of a polishing plate automatically and very accurately without requiring human labor. CONSTITUTION:When a semiconductor wafer 7 is placed for polishing inside a template 3 provided on a polishing plate 1, respective positions are numerically analyzed for fine adjustment in order to correctly place the semiconductor wafer 7 at the center of the template 3. In a wafer placing device for placing the semiconductor wafer 7 inside the template 3 provided on the polishing plate 1, an index table 2 for holding the polishing plate 1 and rotating, a wafer carrying arm 5 for attracting the wafer 7, moving in the horizontal and vertical directions and placing the wafer 7 inside the template 3, and an image processing device provided above the template 3 for placing the wafer 7 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer placing method and a placing apparatus for placing and holding a wafer in a template provided on a flat plate for polishing a semiconductor wafer (hereinafter referred to as "wafer"). Regarding

[0002]

2. Description of the Related Art In a polishing apparatus for polishing wafers, a plurality of wafers are held on a flat polishing plate, and the wafer holding surface of the polishing plate faces down to make contact with a polishing platen having a polishing cloth attached thereto. A load is applied from above to press the wafer against the polishing cloth, and while the slurry is being supplied, the surface plate and the polishing plate holding the wafer are relatively rotated to perform polishing.

Conventionally, as a means for holding a wafer on a polishing plate, a method of adhering via a wax has been generally used. However, in this method, since a wax is interposed in the middle, the processing accuracy can be improved. Difficult and also
Since there are drawbacks such as a wafer adhering device and a peeling device, a large scale of ancillary equipment, and a complicated process, there are many methods of holding a wafer on a polishing plate without using wax. In this method, for example, on the wafer holding surface of the polishing plate, a plurality of recesses called templates, which are larger than the outer diameter of the wafer and are shallower than the thickness of the wafer, are formed, and the wafer is put into this, pressure-bonded and held. There is.

[0004]

It is generally known that it is desirable that the inner diameter of the template is as close as possible to the outer diameter of the wafer to be held. In practice, the arc portion of the outer peripheral edge of the wafer and the template are The distance from the inner peripheral edge is required to be 1 mm or less. For this reason, it is very difficult to mechanize the process until the wafer is placed in the template. Conventionally, the wafer is mostly placed by hand, but there is a great risk of contaminating or damaging the wafer.

[0005]

In view of the above problems, the present invention accurately mounts a wafer at the center of the template of the polishing plate, that is, the arc portion of the outer peripheral edge of the wafer and the inner peripheral edge of the template. SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer mounting method and an apparatus therefor capable of keeping an equal value of 1 mm or less with a semiconductor, and a first invention is to place a semiconductor in a template provided on a polishing plate. A second aspect of the present invention provides a wafer placing method characterized in that when a wafer is placed and polished, a semiconductor wafer is placed exactly in the center of a template, so that each position is numerically analyzed and finely adjusted. In a wafer placing device for placing a semiconductor wafer in a template provided on a polishing plate, an index table for holding and rotating the polishing plate A wafer mounting device that is equipped with a wafer transfer arm that attracts a wafer and moves in the horizontal and vertical directions to place the wafer in the template, and an image processing device provided above the template on which the wafer is placed. The equipment is the main point.

[0006]

The operation of the wafer mounting device according to the present invention will be described below with reference to FIGS. 1 (a) and 1 (b). 1. Round polishing plate 1 to index table 2
Hold in place above. On the polishing plate 1, six circular templates 3 are provided on the same circumference at equal intervals. 2. The position of the template 3 on the polishing plate 1 is analyzed by the template detection camera 4, and the index table 2 is rotated so that these are at predetermined positions. 3. The wafer 7 is sucked and held on the lower surface of the wafer transfer arm 5 with the orientation flat portion 6 directed in a fixed direction, and transferred to a predetermined position on the template 3 placed at the predetermined position. The wafer transfer arm 5 expands and contracts to extend in the Y direction and rail 8.
It is possible to move in the Z direction by traveling upward and expanding and contracting the X-direction support 9. 4. The position of the wafer 7 is detected by the three wafer detection cameras 10, 11 and 12, and the wafer transfer arm 5
Is moved in the horizontal direction (X and Y directions), and the wafer 7 is finely adjusted so as to come to a predetermined origin position. 5. The positional relationship between the wafer 7 and the template 3 is determined by the wafer detection cameras 10, 11 and 12, and the wafer 7 is detected.
The position of 1 is finely adjusted by the wafer transfer arm 5 so that the arcuate portion 13 of the outer peripheral edge of the wafer 7 and the inner peripheral edge of the template 3 are kept at equal intervals. 6. The suction of the wafer transfer arm 5 is released, and the wafer 7 is loaded and placed in the template 3. 7. The index table 2 is rotated and a new wafer 7 is placed on the adjacent template 3 by the above method. When there is a template that is not on the same circumference, for example, when the template is also at the center of rotation of the polishing plate, the index table is moved in the horizontal direction (X, Y directions) to load and place the wafer. To do.

[0007]

Since the relative positional relationship between the wafer and the template is analyzed and then the wafer is placed in the template, the wafer is accurately stored at a predetermined position in the template and is mounted on the edge of the template. There is no such thing. From the viewpoint of analyzing the positional relationship between the template and the wafer by the camera, it is desirable that the template detection camera and the wafer detection camera are arranged at positions close to the object to be detected within a range that does not interfere with the wafer transfer arm and the like.

[Brief description of drawings]

FIG. 1A is a plan view for explaining an apparatus of the present invention, and FIG.
Is a side view.

[Explanation of symbols]

1 Polishing Plate 9 Support 2 Index Table 10 Wafer Detection Camera 3 Template 11 Wafer Detection Camera 4 Template Detection Camera 12 Wafer Detection Camera 5 Wafer Transfer Arm 13 Arc Part 6 Orient Flat Part 7 Wafer 8 Rail

Claims (5)

[Claims] 1. When placing and polishing a semiconductor wafer in a template provided on a polishing plate, the position of each semiconductor wafer is numerically analyzed and finely adjusted in order to properly place the semiconductor wafer at the center of the template. A wafer mounting method characterized by the above. 2. The method according to claim 1, wherein the numerical analysis is performed by an image processing device. 3. A wafer mounting device for mounting a semiconductor wafer in a template provided on a polishing plate, an index table which holds and rotates the polishing plate, and sucks the wafer to move the wafer horizontally and vertically. A wafer placing apparatus comprising: a wafer transfer arm for placing a wafer in the template; and an image processing apparatus provided above the template for placing the wafer. 4. The image processing apparatus comprises a template detection camera provided above a template on which a wafer is mounted, and three or more wafer detection units provided so as to detect an inner peripheral edge of the template and an outer peripheral edge of the wafer. The apparatus of claim 3, comprising a camera. 5. The apparatus according to claim 3, wherein the index table is horizontally movable.