TW202128349A - Processing device capable of reducing the number of transferring and holding a workpiece when transporting the workpiece to a chuck table - Google Patents

Processing device capable of reducing the number of transferring and holding a workpiece when transporting the workpiece to a chuck table Download PDF

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Publication number
TW202128349A
TW202128349A TW109147200A TW109147200A TW202128349A TW 202128349 A TW202128349 A TW 202128349A TW 109147200 A TW109147200 A TW 109147200A TW 109147200 A TW109147200 A TW 109147200A TW 202128349 A TW202128349 A TW 202128349A
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Taiwan
Prior art keywords
wafer
center
component
holding surface
held
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TW109147200A
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Chinese (zh)
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宮本弘樹
山中聰
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日商迪思科股份有限公司
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Publication of TW202128349A publication Critical patent/TW202128349A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/04—Protective covers for the grinding wheel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Manipulator (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention can reduce the number of transferring and holding a workpiece when transporting the workpiece to a chuck table. The solution of the invention is that the wafer is held on the holding surface in a way that the center of the wafer held by the robot and the center of the holding surface of the chuck table are aligned with each other based on the center coordinates of a wafer recognized by a center coordinate recognition assembly. Thus, the wafer can be appropriately held on the holding surface without using a temporary table. Therefore, since the number of transferring and holding the wafer is reduced and equivalent to the amount of not using the temporary table, the risk of contamination and breakage of the wafer can be reduced and the time required for holding the wafer on the holding surface can be reduced.

Description

加工裝置Processing device

本發明是有關於一種加工裝置。The present invention relates to a processing device.

在專利文獻1及專利文獻2所揭示之全自動磨削裝置中，是以磨削磨石對已吸引保持在工作夾台之被加工物進行磨削。In the fully automatic grinding devices disclosed in Patent Document 1 and Patent Document 2, a grinding stone is used to grind the workpiece that has been sucked and held on the work clamp.

在全自動磨削裝置中，是藉由機器人將收納於片匣之被加工物搬送至暫置工作台來暫置。使用搬入組件的搬送墊對已暫置在暫置工作台之被加工物進行保持，來搬送至工作夾台。以磨削磨石對已吸引保持在工作夾台之被加工物進行磨削。又，藉由搬出組件之搬送墊對已磨削之被加工物進行保持，並從工作夾台搬送至旋轉洗淨組件。藉由機器人將已被旋轉洗淨組件洗淨之被加工物收納到片匣。藉此，磨削加工即結束。 先前技術文獻 專利文獻In the automatic grinding device, the workpiece stored in the cassette is transported to the temporary worktable by a robot for temporary placement. Use the transfer mat of the loaded component to hold the processed objects temporarily placed on the temporary workbench and transport them to the work clamping platform. Grind the workpiece that has been sucked and held on the work chuck with a grinding grindstone. In addition, the ground workpiece is held by the transfer pad of the unloaded unit, and is transferred from the work chuck table to the rotating cleaning unit. The processed objects that have been cleaned by the rotating cleaning assembly are stored in the cassette by the robot. This completes the grinding process. Prior art literature Patent literature

專利文獻1：日本特開2018-027594號公報 專利文獻2：日本特開2019-084646號公報Patent Document 1: Japanese Patent Application Publication No. 2018-027594 Patent Document 2: Japanese Patent Application Publication No. 2019-084646

發明欲解決之課題The problem to be solved by the invention

在以往的全自動磨削裝置中，如上述，因為以暫置工作台來交接保持被加工物，所以產生有交接保持時間。又，由於藉由交接保持被加工物，而使被加工物與暫置工作台接觸，因此會有以下情形：污物附著於被加工物、或被加工物破損。In the conventional fully automatic grinding device, as described above, because the workpiece is transferred and held by the temporary table, there is a transfer holding time. In addition, since the object to be processed is brought into contact with the temporary table by handing over and holding the object, there are cases where dirt adheres to the object to be processed or the object to be processed is damaged.

從而，本發明之目的在於：在將被加工物從片匣朝工作夾台搬送時，讓交接保持被加工物的次數變少，來抑制污物對被加物之附著、以及被加工物的破損。 用以解決課題之手段Therefore, the object of the present invention is to reduce the number of transfers and holding of the workpiece when the workpiece is transported from the cassette to the work chuck table, so as to suppress the adhesion of dirt to the workpiece and the prevention of the workpiece. damaged. Means to solve the problem

本發明之加工裝置(本加工裝置)具備：片匣，具有朝上下方向配置的複數個層架；片匣載台，載置該片匣；工作夾台，藉由保持面保持被加工物；搬送組件，保持已收納於該片匣之被加工物，並從該片匣將被加工物朝該工作夾台搬送；及加工組件，對已保持於該工作夾台之被加工物進行加工，前述加工裝置更具備：拍攝組件，對藉由該搬送組件所保持的被加工物進行拍攝；中心座標辨識組件，依據以該拍攝組件所進行的拍攝而取得的拍攝圖像來辨識被加工物的中心座標；及控制組件，依據藉由該中心座標辨識組件所辨識出的該中心座標來控制該搬送組件，並以藉由該搬送組件所保持的被加工物的中心、與該工作夾台的該保持面的中心一致的方式，來讓被加工物保持於該保持面。The processing device (this processing device) of the present invention is provided with: a cassette with a plurality of shelves arranged in an up-and-down direction; a cassette carrier for placing the cassette; a working clamp table for holding the processed object by a holding surface; The conveying component, which holds the processed object stored in the cassette, and transports the processed object from the cassette to the work clamping table; and the processing component, processes the processed object that has been held in the work clamping table, The aforementioned processing device further includes: a photographing component that photographs the workpiece held by the conveying component; a center coordinate recognition component that identifies the workpiece based on the photographed image obtained by photographing the photographing component The center coordinate; and the control component, which controls the conveying component according to the center coordinate recognized by the center coordinate recognizing component, and uses the center of the workpiece held by the conveying component and the work clamp table The center of the holding surface is aligned so that the workpiece is held on the holding surface.

又，在本加工裝置中，該搬送組件亦可具備：機器人，裝設有機械手，前述機械手可保持已收納於該片匣之被加工物；及搬入機構，將已保持於該機械手之被加工物接收，並搬入該工作夾台的該保持面，該拍攝組件亦可對已保持於該機械手之被加工物進行拍攝，該控制組件亦可依據藉由該中心座標辨識組件所辨識出的該中心座標，而藉由該搬入機構，以該保持面的中心與被加工物的中心一致的方式，來讓被加工物保持於該保持面。In addition, in this processing device, the transport assembly may also include: a robot equipped with a manipulator, the manipulator can hold the processed object that has been stored in the cassette; and a carry-in mechanism, which holds the manipulator. The object to be processed is received and moved into the holding surface of the work chuck table. The photographing component can also photograph the object to be processed that has been held in the manipulator. The control component can also be identified by the central coordinate identification component. With the recognized center coordinates, the carrying-in mechanism allows the workpiece to be held on the holding surface in such a way that the center of the holding surface coincides with the center of the workpiece.

又，在本加工裝置中，被加工物亦可具備有作為表示結晶方位之標記的凹口或定向平面(orientation flat)，該保持面亦可具有轉印了被加工物之形狀，且具備有對應於該標記的標記對應部。在此情況下，本加工裝置亦可更具備：標記辨識組件，從藉由該拍攝組件所進行的拍攝而得到的該拍攝圖像中辨識該標記的位置；旋轉組件，以該保持面的中心為軸來使該工作夾台旋轉；及標記對位控制組件，控制該旋轉組件，以使該保持面的該標記對應部、與藉由該搬送組件所保持之被加工物的該標記一致。 發明效果In addition, in this processing device, the workpiece may be provided with a notch or an orientation flat as a mark indicating the crystal orientation, and the holding surface may have a shape in which the workpiece is transferred, and may be provided with Corresponding to the mark corresponding part of the mark. In this case, the processing device may be further equipped with: a mark recognition component, which recognizes the position of the mark from the photographed image obtained by the photographing by the photographing component; and a rotating component to center the holding surface A shaft is used to rotate the work clamp table; and a mark alignment control component that controls the rotation component so that the mark corresponding portion of the holding surface is consistent with the mark of the processed object held by the conveying component. Invention effect

在本加工裝置中，控制組件依據藉由中心座標辨識組件所辨識出的被加工物的中心座標，來控制搬送組件，而以藉由搬送組件所保持之被加工物的中心、與工作夾台的保持面的中心一致的方式，來讓被加工物保持於保持面。像這樣，在本加工裝置中，可以在不使用暫置工作台的情形下，使被加工物適當地保持於保持面。從而，由於使交接保持被加工物的次數減少相當於不使用暫置工作台的量，因此可以讓被加工物附著有污物而被污染、或被加工物破損之風險變少。此外，變得可減少將被加工物自片匣取出直到載置於保持面為止的時間。In this processing device, the control unit controls the conveying unit based on the center coordinates of the workpiece recognized by the center coordinate recognition unit, and the center of the workpiece held by the conveying unit and the work clamp table The center of the holding surface is consistent to keep the workpiece on the holding surface. In this way, in this processing device, the workpiece can be appropriately held on the holding surface without using a temporary table. Therefore, since the number of transfers and holdings of the workpiece is reduced by the amount equivalent to not using the temporary table, the risk of the workpiece being contaminated with dirt and contaminants or the workpiece being damaged can be reduced. In addition, it becomes possible to reduce the time required for the workpiece to be taken out from the cassette until it is placed on the holding surface.

用以實施發明之形態The form used to implement the invention

[實施形態1] 圖1所示之本實施形態的加工裝置即磨削裝置1構成為對晶圓100實施包含搬入處理、磨削處理、洗淨處理及搬出處理之一連串的處理。[Embodiment 1] The grinding apparatus 1 which is the processing apparatus of the present embodiment shown in FIG. 1 is configured to perform a series of processing including carrying-in processing, grinding processing, cleaning processing, and carrying-out processing on the wafer 100.

圖1所示之晶圓100是被加工物之一例，且是例如圓形的半導體晶圓。於晶圓100的正面101形成有未圖示之器件。晶圓100的正面101在圖1中是朝向下方，且藉由貼附保護膠帶103而受到保護。晶圓100的背面102是施行磨削處理的被磨削面。The wafer 100 shown in FIG. 1 is an example of a processed object, and is, for example, a circular semiconductor wafer. A device not shown in the figure is formed on the front surface 101 of the wafer 100. The front surface 101 of the wafer 100 faces downward in FIG. 1 and is protected by attaching a protective tape 103. The back surface 102 of the wafer 100 is the surface to be ground on which the grinding process is performed.

磨削裝置1具備有大致矩形之第1裝置基座11、連結於第1裝置基座11的後方(+Y方向側)之第2裝置基座12、及朝上方延伸之支柱13。The grinding device 1 includes a substantially rectangular first device base 11, a second device base 12 connected to the rear (+Y direction side) of the first device base 11, and a pillar 13 extending upward.

於第1裝置基座11之正面側(-Y方向側)設置有第2片匣載台152。在第2片匣載台152載置有可容置加工後之晶圓100之第2片匣154。又，在第2片匣載台152的+X側，相鄰於第2片匣載台152而安裝有第1片匣載台151。在第1片匣載台151載置有可容置加工前之晶圓100的第1片匣153。A second cassette stage 152 is provided on the front side (-Y direction side) of the first device base 11. A second cassette 154 capable of accommodating the processed wafer 100 is placed on the second cassette stage 152. In addition, on the +X side of the second cassette stage 152, the first cassette stage 151 is attached adjacent to the second cassette stage 152. A first cassette 153 capable of accommodating the wafer 100 before processing is placed on the first cassette stage 151.

在圖2，從+Y方向顯示第1片匣153。如圖2所示，第1片匣153具有朝向+Y方向之開口511。又，第1片匣153具備有在其內部朝上下方向即Z軸方向隔著預定的間隔而配置之複數個層架513。層架513形成於第1片匣153的側壁512的內表面。層架513是由將其中央區域切除成圓形狀或矩形狀之缺口的平板所構成。從而，各層架513將1片晶圓100以支撐其外周區域之狀態來容置。又，第2片匣154也具有與第1片匣153同樣的構成。 再者，在圖2所示的例子中，晶圓100是以其背面102朝向下方的方式來容置於第1片匣153。In FIG. 2, the first cassette 153 is shown from the +Y direction. As shown in FIG. 2, the first cassette 153 has an opening 511 facing the +Y direction. In addition, the first cassette 153 includes a plurality of shelves 513 arranged at predetermined intervals in the vertical direction, that is, in the Z-axis direction. The shelf 513 is formed on the inner surface of the side wall 512 of the first cassette 153. The shelf 513 is composed of a flat plate whose central area is cut into a circular or rectangular notch. Therefore, each shelf 513 accommodates one wafer 100 in a state of supporting its outer peripheral area. In addition, the second cassette 154 also has the same structure as the first cassette 153. Furthermore, in the example shown in FIG. 2, the wafer 100 is housed in the first cassette 153 with its back surface 102 facing downward.

又，如圖1所示，在第1片匣153及第2片匣154的+Y方向側配設有機器人155。Moreover, as shown in FIG. 1, the robot 155 is arrange|positioned at the +Y direction side of the 1st cassette 153 and the 2nd cassette 154. As shown in FIG.

機器人155是搬送組件之一例，且裝設有保持已收納於第1片匣153之晶圓100的機械手156。機器人155會搬送已保持於機械手156之晶圓100。機械手156具備有用於吸附保持晶圓100的吸附面。The robot 155 is an example of a transport unit, and is equipped with a robot hand 156 that holds the wafer 100 stored in the first cassette 153. The robot 155 transfers the wafer 100 held by the robot 156. The robot hand 156 is provided with a suction surface for sucking and holding the wafer 100.

又，機器人155具有驅動機械手156的驅動部157。驅動部157會控制(調整)機械手156的位置。詳細而言，驅動部157具備有上下移動組件158及水平移動組件159。上下移動組件158使機械手156沿著Z軸方向在上下方向上移動。水平移動組件159使機械手156在水平方向上移動。In addition, the robot 155 has a driving unit 157 that drives the manipulator 156. The driving unit 157 controls (adjusts) the position of the manipulator 156. Specifically, the driving unit 157 includes a vertical movement unit 158 and a horizontal movement unit 159. The up-and-down moving component 158 moves the manipulator 156 in the up-down direction along the Z-axis direction. The horizontal moving component 159 moves the manipulator 156 in the horizontal direction.

機器人155將已保持於機械手156之加工後的晶圓100搬入第2片匣154。又，機器人155藉由機械手156，而將容置在第1片匣153的層架513之加工前的晶圓100，以吸附背面102的方式來保持，並從第1片匣153取出。此外，機器人155使機械手156翻轉，以讓晶圓100的背面102成為向上。之後，機器人155將晶圓100搬送至配置在機器人155的+Y側的工作夾台30上。並且，機器人155將晶圓100設成背面102朝上來載置到工作夾台30的保持面32。The robot 155 carries the processed wafer 100 held by the robot 156 into the second cassette 154. In addition, the robot 155 uses the robot 156 to hold the wafer 100 before processing contained in the shelf 513 of the first cassette 153 by sucking the back surface 102 and take it out from the first cassette 153. In addition, the robot 155 turns the robot hand 156 so that the back surface 102 of the wafer 100 becomes upward. After that, the robot 155 transports the wafer 100 to the work chuck table 30 arranged on the +Y side of the robot 155. In addition, the robot 155 places the wafer 100 on the holding surface 32 of the work chuck table 30 with the back surface 102 facing upward.

在第2裝置基座12的上表面側設置有開口部14。並且，在開口部14內配置有工作夾台30。工作夾台30是構成為藉由保持面32來保持晶圓100。保持面32是連通於吸引源(未圖示)，並隔著保護膠帶103來吸引保持晶圓100。工作夾台30可藉由作為旋轉組件的馬達34(參照圖12)，以已藉由保持面32保持晶圓100的狀態，將通過保持面32的中心之朝Z軸方向延伸的中心軸作為中心來旋轉。An opening 14 is provided on the upper surface side of the second device base 12. In addition, a work clamp 30 is arranged in the opening 14. The work chuck table 30 is configured to hold the wafer 100 by the holding surface 32. The holding surface 32 communicates with a suction source (not shown), and sucks and holds the wafer 100 through the protective tape 103. The work chuck 30 can use the motor 34 (refer to FIG. 12) as a rotating unit to hold the wafer 100 by the holding surface 32, and use the center axis extending in the Z-axis direction passing through the center of the holding surface 32 as Rotate from the center.

工作夾台30的周圍被罩蓋39所包圍。在此罩蓋39連結有朝Y軸方向伸縮之蛇腹蓋40。並且，在罩蓋39及蛇腹蓋40的下方，配設有未圖示之Y軸方向移動組件。工作夾台30藉由此Y軸方向移動組件，而變得可在Y軸方向上往返移動。The periphery of the work chuck table 30 is surrounded by a cover 39. Here, the cover 39 is connected with a bellows cover 40 that expands and contracts in the Y-axis direction. In addition, under the cover 39 and the accordion cover 40, a Y-axis direction moving unit not shown is arranged. The work clamp table 30 can move back and forth in the Y-axis direction by moving the components in the Y-axis direction.

在本實施形態中，若粗略地說，工作夾台30是在-Y方向側的晶圓載置區域與+Y方向側的磨削區域之間移動，前述晶圓載置區域是用於將晶圓100載置於保持面32之區域，前述磨削區域是磨削晶圓100之區域。In this embodiment, roughly speaking, the work chuck 30 moves between the wafer mounting area on the -Y direction side and the grinding area on the +Y direction side. 100 is placed on the area of the holding surface 32, and the aforementioned grinding area is the area where the wafer 100 is ground.

在第2裝置基座12上的後方(+Y方向側)豎立設置有支柱13。在支柱13的前表面設置有磨削晶圓100的磨削組件5、及使磨削組件5在磨削進給方向即Z軸方向上移動的磨削進給組件2。A pillar 13 is erected on the rear side (+Y direction side) of the second device base 12. A grinding unit 5 for grinding the wafer 100 and a grinding feed unit 2 for moving the grinding unit 5 in the Z-axis direction, which is the grinding feed direction, are provided on the front surface of the support 13.

磨削進給組件2具備有：平行於Z軸方向的一對Z軸導軌21、在此Z軸導軌21上滑動的Z軸移動工作台23、與Z軸導軌21平行的Z軸滾珠螺桿20、Z軸伺服馬達22、及安裝於Z軸移動工作台23的前表面(正面)的支持器24。支持器24保持有磨削組件5。The grinding feed assembly 2 includes a pair of Z-axis guide rails 21 parallel to the Z-axis direction, a Z-axis moving table 23 sliding on the Z-axis guide 21, and a Z-axis ball screw 20 parallel to the Z-axis guide 21 , The Z-axis servo motor 22, and the supporter 24 installed on the front surface (front surface) of the Z-axis moving table 23. The holder 24 holds the grinding assembly 5.

Z軸移動工作台23是以可在Z軸導軌21上滑動的方式設置。未圖示之螺帽部是固定於Z軸移動工作台23的後表面側(背面側)。於此螺帽部螺合有Z軸滾珠螺桿20。Z軸伺服馬達22連結於Z軸滾珠螺桿20的一端部。The Z-axis moving table 23 is installed in such a way that it can slide on the Z-axis guide rail 21. The nut part which is not shown in figure is fixed to the back surface side (back side) of the Z-axis moving table 23. As shown in FIG. The Z-axis ball screw 20 is screwed to the nut portion. The Z-axis servo motor 22 is connected to one end of the Z-axis ball screw 20.

在磨削進給組件2中，藉由Z軸伺服馬達22使Z軸滾珠螺桿20旋轉，而讓Z軸移動工作台23沿著Z軸導軌21在Z軸方向上移動。藉此，已安裝於Z軸移動工作台23的支持器24、及保持於支持器24的磨削組件5也和Z軸移動工作台23一起在Z軸方向上移動。In the grinding feed assembly 2, the Z-axis ball screw 20 is rotated by the Z-axis servo motor 22, and the Z-axis moving table 23 is moved in the Z-axis direction along the Z-axis guide 21. Thereby, the holder 24 attached to the Z-axis moving table 23 and the grinding unit 5 held by the holder 24 also move in the Z-axis direction together with the Z-axis moving table 23.

磨削組件5是加工組件之一例，且對已保持於工作夾台30之晶圓100進行加工。磨削組件5具備有：固定於支持器24的主軸殼體51、可旋轉地保持在主軸殼體51的主軸50、旋轉驅動主軸50的馬達52、安裝於主軸50的下端的輪座53、及被輪座53所支撐的磨削輪54。The grinding unit 5 is an example of a processing unit, and processes the wafer 100 held on the work chuck 30. The grinding assembly 5 includes: a spindle housing 51 fixed to the holder 24, a spindle 50 rotatably held in the spindle housing 51, a motor 52 for rotationally driving the spindle 50, a wheel base 53 attached to the lower end of the spindle 50, And the grinding wheel 54 supported by the wheel seat 53.

主軸殼體51以朝Z軸方向延伸的方式保持於支持器24。主軸50以和工作夾台30的保持面32正交的方式於Z軸方向上延伸，且可旋轉地被主軸殼體51所支撐。The spindle housing 51 is held by the holder 24 so as to extend in the Z-axis direction. The main shaft 50 extends in the Z-axis direction so as to be orthogonal to the holding surface 32 of the work chuck table 30 and is rotatably supported by the main shaft housing 51.

馬達52連結於主軸50的上端側。主軸50藉由此馬達52，而以在Z軸方向上延伸的旋轉軸作為中心來旋轉。The motor 52 is connected to the upper end side of the main shaft 50. The main shaft 50 is rotated by the motor 52 with a rotation axis extending in the Z-axis direction as a center.

輪座53形成為圓板狀，且固定於主軸50的下端(前端)。輪座53是支撐磨削輪54。The wheel base 53 is formed in a disc shape, and is fixed to the lower end (front end) of the main shaft 50. The wheel base 53 supports the grinding wheel 54.

磨削輪54形成為具有與輪座53大致相同直徑。磨削輪54包含由不鏽鋼等金屬材料所形成之圓環狀的輪基台(環狀基台)540。在輪基台540的下表面，是涵蓋全周而固定有環狀地配置的複數個磨削磨石541。磨削磨石541對保持於工作夾台30之晶圓100的背面102進行磨削。The grinding wheel 54 is formed to have approximately the same diameter as the wheel seat 53. The grinding wheel 54 includes an annular wheel base (annular base) 540 formed of a metal material such as stainless steel. On the lower surface of the wheel base 540, a plurality of grinding stones 541 arranged annularly covering the entire circumference are fixed. The grinding stone 541 grinds the back surface 102 of the wafer 100 held on the work chuck 30.

在相鄰於工作夾台30的位置配設有厚度測定器38。厚度測定器38可以在磨削中藉由例如接觸式來測定晶圓100的厚度。A thickness measuring device 38 is arranged at a position adjacent to the work clamp table 30. The thickness measuring device 38 can measure the thickness of the wafer 100 by, for example, a contact type during grinding.

磨削後的晶圓100可被機器人155搬出。亦即，機器人155將載置於工作夾台30之磨削處理後的晶圓100的背面102吸引保持，並從工作夾台30搬出，且搬送到單片式的旋轉洗淨單元26的旋轉工作台27。The wafer 100 after grinding can be carried out by the robot 155. That is, the robot 155 sucks and holds the back surface 102 of the wafer 100 after the grinding process placed on the work chuck table 30, carries it out from the work chuck table 30, and transports it to the single-piece rotary cleaning unit 26. Workbench 27.

旋轉洗淨單元26是旋轉洗淨組件之一例。旋轉洗淨單元26具備有保持晶圓100的旋轉工作台27、及朝向旋轉工作台27噴射洗淨水的噴嘴25。The rotating washing unit 26 is an example of a rotating washing unit. The rotating cleaning unit 26 includes a rotating table 27 that holds the wafer 100 and a nozzle 25 that sprays washing water toward the rotating table 27.

在旋轉洗淨單元26中，可藉由未圖示之旋轉機構來將旋轉工作台27高速旋轉。與此同時，可朝向已保持在旋轉工作台27之晶圓100的背面102噴射洗淨水，而對晶圓100的背面102進行旋轉洗淨。之後，對晶圓100噴附乾燥空氣，來將晶圓100乾燥。In the rotating washing unit 26, the rotating table 27 can be rotated at a high speed by a rotating mechanism not shown. At the same time, washing water can be sprayed toward the back surface 102 of the wafer 100 that has been held on the rotating table 27, and the back surface 102 of the wafer 100 can be rotated and washed. After that, dry air is sprayed on the wafer 100 to dry the wafer 100.

在已藉由旋轉洗淨單元26洗淨晶圓100後，機器人155藉由機械手156將已保持在旋轉工作台27之晶圓100吸引保持，並從旋轉洗淨單元26搬出，且搬入第2片匣154。After the wafer 100 has been cleaned by the rotary cleaning unit 26, the robot 155 sucks and holds the wafer 100 held on the rotary table 27 by the manipulator 156, moves it out from the rotary cleaning unit 26, and carries it into the first 2 piece cassette 154.

又，在機器人155的上方設置有第1相機41。第1相機41是拍攝組件之一例，且對藉由機器人155的機械手156所保持的晶圓100進行拍攝。In addition, a first camera 41 is installed above the robot 155. The first camera 41 is an example of an imaging unit, and images the wafer 100 held by the manipulator 156 of the robot 155.

又，磨削裝置1具備有控制磨削裝置1的各構件的控制組件70。控制組件70控制上述之磨削裝置1的各構件，並對晶圓100實施作業人員所期望的磨削加工。又，控制組件70具備有中心座標辨識組件72。In addition, the grinding device 1 is provided with a control unit 70 that controls each member of the grinding device 1. The control unit 70 controls the various components of the grinding device 1 described above, and performs the grinding process desired by the operator on the wafer 100. In addition, the control unit 70 includes a center coordinate recognition unit 72.

以下，與中心座標辨識組件72的功能一起來說明藉由控制組件70所控制之磨削裝置1的動作。Hereinafter, together with the function of the center coordinate recognition unit 72, the operation of the grinding device 1 controlled by the control unit 70 will be described.

在本實施形態中，控制組件70控制機器人155，而藉由機械手156將已容置於第1片匣153的晶圓100，以吸附背面102的方式來保持，並從第1片匣153取出。之後，控制組件70藉由第1相機41，而如圖3所示地對已保持於機械手156的晶圓100進行拍攝。In this embodiment, the control unit 70 controls the robot 155, and the wafer 100 contained in the first cassette 153 is held by the robot 156 by sucking the back surface 102, and the first cassette 153 take out. After that, the control unit 70 uses the first camera 41 to photograph the wafer 100 held by the robot 156 as shown in FIG. 3.

如圖3所示，有時通過機械手156的中心202之直線302、與通過已保持於機械手156的晶圓100的中心201之直線301會偏離。 機器人155構成為：保持有晶圓100後，藉由水平移動組件159將機械手156移動，以成為在通過機械手156的中心202之直線302上配置有第1相機41。在此狀態下，第1相機41對已保持於機械手156的晶圓100進行拍攝。藉此，可取得如圖4所示之對應於拍攝區110的拍攝圖像。As shown in FIG. 3, the straight line 302 passing through the center 202 of the robot hand 156 may deviate from the straight line 301 passing through the center 201 of the wafer 100 held by the robot hand 156. The robot 155 is configured to move the robot 156 by the horizontal movement unit 159 after holding the wafer 100 so that the first camera 41 is arranged on a straight line 302 passing through the center 202 of the robot 156. In this state, the first camera 41 images the wafer 100 held by the robot 156. In this way, the photographed image corresponding to the photographing area 110 as shown in FIG. 4 can be obtained.

然後，控制組件70的中心座標辨識組件72依據藉由第1相機41所進行的拍攝而取得的拍攝圖像，來辨識晶圓100的中心201之座標即中心座標。 例如，中心座標辨識組件72從拍攝圖像取得晶圓100的外周中的3點座標，並依據此等3點座標來取得晶圓100的中心201之座標即中心座標。Then, the center coordinate recognition unit 72 of the control unit 70 recognizes the coordinate of the center 201 of the wafer 100, that is, the center coordinate, based on the photographed image obtained by the photographing by the first camera 41. For example, the center coordinate recognition component 72 obtains the 3 point coordinates of the outer periphery of the wafer 100 from the captured image, and obtains the coordinates of the center 201 of the wafer 100 based on these 3 point coordinates, that is, the center coordinates.

控制組件70已預先辨識拍攝時的機械手156的中心202之座標。然後，控制組件70依據藉由中心座標辨識組件72所取得的晶圓100的中心座標，來計算機械手156的中心202與晶圓100的中心201之位置關係(偏離之量及方向)。The control unit 70 has previously recognized the coordinates of the center 202 of the manipulator 156 at the time of shooting. Then, the control unit 70 calculates the positional relationship (the amount and direction of deviation) between the center 202 of the robot 156 and the center 201 of the wafer 100 based on the center coordinates of the wafer 100 obtained by the center coordinate identification unit 72.

之後，控制組件70使機械手156翻轉，以將晶圓100配置於下側(晶圓100的背面102成為向上)。然後，控制組件70依據藉由中心座標辨識組件72所辨識出的晶圓100的中心座標來控制機器人155，而以藉由機械手156所保持的晶圓100的中心201、與工作夾台30的保持面32的中心一致的方式，來讓晶圓100保持於保持面32。After that, the control unit 70 turns the robot hand 156 over to arrange the wafer 100 on the lower side (the back surface 102 of the wafer 100 becomes upward). Then, the control unit 70 controls the robot 155 according to the center coordinates of the wafer 100 recognized by the center coordinate recognition unit 72, and uses the center 201 of the wafer 100 held by the robot 156 and the work chuck 30 The center of the holding surface 32 is aligned so that the wafer 100 is held on the holding surface 32.

亦即，在磨削裝置1中，保持有晶圓100的機械手156構成為：在初始設定中，以如圖5所示地使通過其中心202之直線302、與通過工作夾台30的保持面32的中心203之直線303一致的方式，來朝向工作夾台30移動。That is, in the grinding apparatus 1, the robot hand 156 holding the wafer 100 is configured such that in the initial setting, a straight line 302 passing through the center 202 and a line 302 passing through the work chuck table 30 are set as shown in FIG. The straight line 303 of the center 203 of the holding surface 32 is moved toward the work chuck table 30 so that the straight line 303 is aligned.

像這樣移動機械手156之後，控制組件70依據如上述所計算出的機械手156的中心202與晶圓100的中心201之位置關係(偏離之量及方向)來控制機器人155的水平移動組件159，而如圖6所示地將機械手156的水平方向上的位置稍微調整成：通過晶圓100的中心201之直線301、與通過保持面32的中心203之直線303一致。在此圖所示的例子中，控制組件70是將機械手156稍微朝箭頭120的方向錯開。After moving the robot 156 like this, the control unit 70 controls the horizontal movement unit 159 of the robot 155 according to the positional relationship (the amount and direction of deviation) between the center 202 of the robot 156 and the center 201 of the wafer 100 calculated as described above. , And as shown in FIG. 6, the position of the robot 156 in the horizontal direction is slightly adjusted such that the straight line 301 passing through the center 201 of the wafer 100 coincides with the straight line 303 passing through the center 203 of the holding surface 32. In the example shown in this figure, the control assembly 70 slightly staggers the manipulator 156 in the direction of the arrow 120.

之後，控制組件70控制機器人155的上下移動組件158，使機械手156下降，而將晶圓100移交到保持面32來保持。藉此，可以在晶圓100的中心201與工作夾台30的保持面32的中心203已一致的狀態下，藉由保持面32來保持晶圓100。After that, the control unit 70 controls the up and down movement unit 158 of the robot 155 to lower the robot hand 156 and transfer the wafer 100 to the holding surface 32 to be held. Thereby, the wafer 100 can be held by the holding surface 32 in a state where the center 201 of the wafer 100 and the center 203 of the holding surface 32 of the work chuck 30 have been aligned.

如以上，在本實施形態中，控制組件70依據藉由中心座標辨識組件72所辨識出的晶圓100的中心座標來控制機器人155，而以藉由機器人155所保持的晶圓100的中心201、與工作夾台30的保持面32的中心203一致的方式，來讓晶圓100保持於保持面32。像這樣，在本實施形態中，可以在不使用暫置工作台的情形下，使晶圓100適當地保持在保持面32。從而，由於使交接保持晶圓100的次數減少相當於不使用暫置工作台的量，因此可以讓晶圓100附著有污物而被污染或使晶圓100破損之風險變少，並且變得可讓將晶圓100從第1片匣153取出直到載置於保持面32為止的時間減少。 再者，對機械手156進行拍攝之第1相機41亦可配置於機械手156之上，亦可配置在下。As described above, in this embodiment, the control unit 70 controls the robot 155 based on the center coordinates of the wafer 100 recognized by the center coordinate recognition unit 72, and the center 201 of the wafer 100 held by the robot 155 , The wafer 100 is held on the holding surface 32 in a manner consistent with the center 203 of the holding surface 32 of the work chuck 30. In this way, in this embodiment, the wafer 100 can be appropriately held on the holding surface 32 without using a temporary table. Therefore, since the number of transfers and holdings of the wafer 100 is reduced by the amount equivalent to not using the temporary table, it is possible to make the wafer 100 adhere to dirt and be contaminated or to reduce the risk of damage to the wafer 100 and become The time required for the wafer 100 to be taken out from the first cassette 153 until it is placed on the holding surface 32 can be reduced. Furthermore, the first camera 41 for taking pictures of the manipulator 156 may also be arranged on the manipulator 156, or may be arranged under the manipulator 156.

[實施形態2] 如圖7所示，本實施形態之加工裝置即磨削裝置10是在圖1所示之磨削裝置1的構成中，更具有搬入機構60及搬出機構65，並且具備第2相機42來取代第1相機41。 再者，亦可具備有第1相機41與第2相機42之雙方。 再者，第1相機41亦可形成為：於對機械手156從旋轉工作台27接收到之晶圓100的中心、與機械手156的中心之位置關係進行辨識時使用，並於晶圓100已偏離到無法將晶圓100收納於片匣時，通知作業人員。 又，在磨削裝置10中，控制組件70除了中心座標辨識組件72之外，還具備有標記辨識組件73及標記對位控制組件74。[Embodiment 2] As shown in FIG. 7, the grinding device 10, which is the processing device of this embodiment, is in the configuration of the grinding device 1 shown in FIG. The first camera 41. Furthermore, both the first camera 41 and the second camera 42 may be provided. Furthermore, the first camera 41 may also be formed to be used when recognizing the positional relationship between the center of the wafer 100 received by the robot 156 from the rotating table 27 and the center of the robot 156, and is used in the wafer 100 When it has deviated to such an extent that the wafer 100 cannot be stored in the cassette, the operator is notified. In addition, in the grinding device 10, the control unit 70 includes a mark recognition unit 73 and a mark alignment control unit 74 in addition to the center coordinate recognition unit 72.

搬入機構60與機器人155一起構成搬送組件。搬入機構60會將已保持於機械手156的晶圓100接收，並搬入到工作夾台30的保持面32。 搬入機構60具有搬送墊61、及使搬送墊61在水平方向及上下方向上移動的移動組件62。搬入機構60將已保持於機器人155的晶圓100藉由搬送墊61來吸引保持，並搬送至工作夾台30，且設成背面102朝上來載置於該保持面32。The carry-in mechanism 60 and the robot 155 constitute a transport unit. The carrying mechanism 60 receives the wafer 100 that has been held by the robot 156 and carries it into the holding surface 32 of the work chuck table 30. The carry-in mechanism 60 has a transport pad 61 and a moving unit 62 that moves the transport pad 61 in the horizontal direction and the vertical direction. The carry-in mechanism 60 sucks and holds the wafer 100 held by the robot 155 by the transport pad 61, and transports it to the work chuck table 30, and is placed on the holding surface 32 with the back surface 102 facing upward.

又，在磨削裝置10中，是將磨削後之晶圓100藉由搬出機構65從工作夾台30的保持面32搬出。搬出機構65具有搬出墊66、及使搬出墊66在水平方向及上下方向上移動的移動組件67。搬出機構65藉由搬出墊66將已載置於保持面32之磨削處理後的晶圓100的背面102吸引保持，並從工作夾台30搬出，且搬送到單片式的旋轉洗淨單元26的旋轉工作台27。In addition, in the grinding device 10, the wafer 100 after grinding is carried out from the holding surface 32 of the work chuck table 30 by the carrying out mechanism 65. The unloading mechanism 65 has an unloading pad 66 and a moving unit 67 that moves the unloading pad 66 in the horizontal direction and the vertical direction. The unloading mechanism 65 sucks and holds the back surface 102 of the wafer 100 after the grinding process placed on the holding surface 32 by the unloading pad 66, moves it out from the work chuck table 30, and conveys it to the single-piece rotary cleaning unit 26 of the rotating table 27.

第2相機42透過支撐柱43而配置在機器人155與搬入機構60之間的上方。第2相機42是拍攝組件之一例，且對藉由機器人155所保持的晶圓100進行拍攝。 以下，與標記辨識組件73及標記對位控制組件74的功能一起來說明藉由控制組件70所控制之磨削裝置10的動作。The second camera 42 is arranged above the robot 155 and the carry-in mechanism 60 through the support column 43. The second camera 42 is an example of an imaging unit, and images the wafer 100 held by the robot 155. Hereinafter, together with the functions of the mark recognition unit 73 and the mark alignment control unit 74, the operation of the grinding device 10 controlled by the control unit 70 will be described.

在本實施形態中，將晶圓100以例如正面101朝向下方的方式來容置於第1片匣153(參照圖2)。控制組件70控制機器人155，而藉由機械手156將已容置於第1片匣153的層架513之加工前的晶圓100，以吸附正面101的方式來保持，並從第1片匣153取出。之後，控制組件70藉由第2相機42而如圖8所示地對藉由機械手156所保持的晶圓100進行拍攝。In this embodiment, the wafer 100 is housed in the first cassette 153 (see FIG. 2) with the front surface 101 facing downward, for example. The control unit 70 controls the robot 155, and the wafer 100 before processing contained in the shelf 513 of the first cassette 153 is held by the robot 156 by sucking the front side 101, and the first cassette is removed from the wafer 100. 153 removed. After that, the control unit 70 uses the second camera 42 to photograph the wafer 100 held by the robot 156 as shown in FIG. 8.

再者，在本實施形態中，也是如圖8所示，有時通過機械手156的中心202之直線302、與通過已保持於機械手156的晶圓100的中心201之直線301會偏離。 機器人155構成為：保持有晶圓100後，藉由水平移動組件159將機械手156移動，以成為在通過機械手156的中心202之直線302上配置有第2相機42。在此狀態下，第2相機42對已保持於機械手156的晶圓100進行拍攝。藉此，可取得如圖9所示之對應於拍攝區111的拍攝圖像。Furthermore, in this embodiment, as shown in FIG. 8 as well, the straight line 302 passing through the center 202 of the robot 156 may deviate from the straight line 301 passing through the center 201 of the wafer 100 held by the robot 156. The robot 155 is configured to move the robot 156 by the horizontal movement unit 159 after holding the wafer 100 so that the second camera 42 is arranged on a straight line 302 passing through the center 202 of the robot 156. In this state, the second camera 42 images the wafer 100 held by the robot 156. In this way, a photographed image corresponding to the photographing area 111 as shown in FIG. 9 can be obtained.

並且，控制組件70的中心座標辨識組件72依據藉由第2相機42所進行的拍攝而取得之拍攝圖像，而例如藉由和實施形態1所示的方法同樣的方法，來辨識晶圓100的中心201之座標即中心座標。In addition, the center coordinate recognition unit 72 of the control unit 70 recognizes the wafer 100 based on the photographed image obtained by the photographing by the second camera 42, for example, by the same method as the method shown in the first embodiment. The coordinates of the center 201 are the center coordinates.

控制組件70已預先辨識拍攝時的機械手156的中心202之座標。然後，控制組件70依據藉由中心座標辨識組件72所取得的晶圓100的中心座標，來計算機械手156的中心202與晶圓100的中心201之位置關係(偏離之量及方向)。The control unit 70 has previously recognized the coordinates of the center 202 of the manipulator 156 at the time of shooting. Then, the control unit 70 calculates the positional relationship (the amount and direction of deviation) between the center 202 of the robot 156 and the center 201 of the wafer 100 based on the center coordinates of the wafer 100 obtained by the center coordinate identification unit 72.

之後，控制組件70依據藉由中心座標辨識組件72所辨識出的晶圓100的中心座標，而藉由搬入機構60以保持面32的中心203與晶圓100的中心201一致的方式，來讓晶圓100保持於保持面32。After that, the control unit 70 uses the center coordinate of the wafer 100 recognized by the center coordinate recognition unit 72 to keep the center 203 of the surface 32 consistent with the center 201 of the wafer 100 by the loading mechanism 60. The wafer 100 is held on the holding surface 32.

亦即，首先，控制組件70控制搬入機構60的移動組件62，而將搬送墊61配置在機器人155的機械手156上。搬送墊61構成為如圖10所示，以使通過機械手156的中心202之直線302、與通過搬入機構60的搬送墊61的中心204之直線304一致的方式，來配置在機器人155上。That is, first, the control unit 70 controls the movement unit 62 of the carry-in mechanism 60 and arranges the transport mat 61 on the manipulator 156 of the robot 155. The transfer pad 61 is configured to be arranged on the robot 155 such that the straight line 302 passing through the center 202 of the robot 156 and the straight line 304 passing through the center 204 of the transfer pad 61 of the carry-in mechanism 60 coincide as shown in FIG. 10.

像這樣配置了搬送墊61之後，控制組件70依據如上述所計算出的機械手156的中心202與晶圓100的中心201之位置關係(偏離之量及方向)來控制機器人155的水平移動組件159，而如圖11所示，將機械手156的水平方向上的位置稍微調整成：通過晶圓100的中心201之直線301、與通過搬送墊61的中心204之直線304一致。在此圖所示的例子中，控制組件70是將機械手156稍微朝箭頭121的方向錯開。After arranging the transfer pad 61 in this way, the control unit 70 controls the horizontal movement unit of the robot 155 based on the positional relationship (the amount and direction of deviation) between the center 202 of the robot 156 and the center 201 of the wafer 100 calculated as described above. 159, and as shown in FIG. 11, the position of the robot 156 in the horizontal direction is slightly adjusted such that the straight line 301 passing through the center 201 of the wafer 100 coincides with the straight line 304 passing through the center 204 of the transfer pad 61. In the example shown in this figure, the control assembly 70 slightly staggers the manipulator 156 in the direction of the arrow 121.

之後，控制組件70控制例如搬入機構60的移動組件62來使搬送墊61下降，而將機械手156上的晶圓100移交到搬送墊61來保持。藉此，可以在晶圓100的中心201與搬送墊61的中心204已一致的狀態下，藉由搬送墊61來保持晶圓100。After that, the control unit 70 controls, for example, the moving unit 62 of the carry-in mechanism 60 to lower the transfer pad 61 and transfer the wafer 100 on the robot 156 to the transfer pad 61 and hold it. Thereby, in a state where the center 201 of the wafer 100 and the center 204 of the transfer pad 61 have been aligned, the wafer 100 can be held by the transfer pad 61.

之後，控制組件70控制搬入機構60的移動組件62，使保持有晶圓100的搬送墊61移動，而配置在工作夾台30的保持面32上。搬送墊61構成為：以使通過搬送墊61的中心204之直線304、與通過工作夾台30的保持面32的中心203之直線303(參照圖6)一致的方式，來朝向工作夾台30移動。After that, the control unit 70 controls the moving unit 62 of the carry-in mechanism 60 to move the transfer pad 61 holding the wafer 100 and arrange it on the holding surface 32 of the work chuck table 30. The transport pad 61 is configured to face the work chuck table 30 so that the straight line 304 passing through the center 204 of the transport pad 61 and the straight line 303 (see FIG. 6) passing through the center 203 of the holding surface 32 of the work chuck table 30 coincide move.

從而，控制組件70可以在此狀態下控制搬入機構60的移動組件62，並使搬送墊61下降，而將晶圓100移交到保持面32來保持，藉此而在晶圓100的中心201、與工作夾台30的保持面32的中心203已一致的狀態下，藉由保持面32來保持晶圓100。Therefore, the control unit 70 can control the moving unit 62 of the carry-in mechanism 60 in this state, and lower the transfer pad 61, and transfer the wafer 100 to the holding surface 32 to be held, thereby making the wafer 100 in the center 201, In a state where the center 203 of the holding surface 32 of the work chuck table 30 has been aligned, the wafer 100 is held by the holding surface 32.

如以上，在本實施形態中，控制組件70依據藉由中心座標辨識組件72所辨識出的晶圓100的中心座標，來將晶圓100從機器人155移交至搬入機構60。然後，控制組件70藉由搬入機構60，以保持面32的中心203與晶圓100的中心201一致的方式，來讓晶圓100保持於保持面32。從而，在本實施形態中，也可以在不使用暫置工作台的情形下，使晶圓100適當地保持在保持面32。從而，可以將晶圓100之污染及破損的風險、以及直到使晶圓100保持在保持面32為止所花費的時間減少。As described above, in this embodiment, the control unit 70 transfers the wafer 100 from the robot 155 to the carry-in mechanism 60 based on the center coordinates of the wafer 100 recognized by the center coordinate recognition unit 72. Then, the control unit 70 uses the carry-in mechanism 60 to hold the wafer 100 on the holding surface 32 in such a manner that the center 203 of the holding surface 32 coincides with the center 201 of the wafer 100. Therefore, in this embodiment, the wafer 100 can be appropriately held on the holding surface 32 without using a temporary table. Therefore, the risk of contamination and breakage of the wafer 100 and the time taken until the wafer 100 is held on the holding surface 32 can be reduced.

再者，晶圓100也有具備有作為表示其結晶方位之標記的凹口或定向平面的情況。在此情況下，在本實施形態中，可以藉由保持面32來將晶圓100保持在對應於該標記的方向上。Furthermore, the wafer 100 may be provided with a notch or an orientation plane as a mark indicating the crystal orientation. In this case, in this embodiment, the wafer 100 can be held in the direction corresponding to the mark by the holding surface 32.

在圖12所示的例子中，在藉由機器人155的機械手156所保持的晶圓100上具備有凹口105。又，工作夾台30的保持面32具有轉印了晶圓100之形狀，且具備有對應於凹口105之形狀的標記對應部33。In the example shown in FIG. 12, the wafer 100 held by the manipulator 156 of the robot 155 is provided with a notch 105. In addition, the holding surface 32 of the work chuck table 30 has a shape in which the wafer 100 is transferred, and is provided with a mark corresponding portion 33 corresponding to the shape of the notch 105.

在此情況下，也可藉由第2相機42來取得如圖12所示之對應於拍攝區111的拍攝圖像，並且控制組件70的中心座標辨識組件72(參照圖7)如上述地取得晶圓100的中心201的座標。此外，控制組件70的標記辨識組件73依據拍攝圖像來辨識晶圓100的凹口105的位置(座標)。In this case, the second camera 42 can also be used to obtain the captured image corresponding to the shooting area 111 as shown in FIG. The coordinates of the center 201 of the wafer 100. In addition, the mark recognition unit 73 of the control unit 70 recognizes the position (coordinates) of the notch 105 of the wafer 100 based on the captured image.

之後，如圖13所示，控制組件70藉由上述之手法，在晶圓100的中心201與搬送墊61的中心204已一致的狀態下，藉由搬送墊61來保持晶圓100。此外，控制組件70如圖14所示地使機器人155退避。After that, as shown in FIG. 13, the control unit 70 uses the aforementioned method to hold the wafer 100 by the transfer pad 61 in a state where the center 201 of the wafer 100 and the center 204 of the transfer pad 61 have been aligned. In addition, the control unit 70 retracts the robot 155 as shown in FIG. 14.

接著，控制組件70的標記對位控制組件74(參照圖7)依據藉由標記辨識組件73所辨識出的凹口105的位置，將使工作夾台30旋轉的馬達34控制成：使保持面32的標記對應部33、與藉由搬送墊61所保持的晶圓100的凹口105一致。亦即，標記對位控制組件74控制馬達34而使工作夾台30旋轉成：將保持面32的標記對應部33配置在藉由搬送墊61搬送至保持面32之晶圓100的凹口105的位置。Next, the mark alignment control assembly 74 (refer to FIG. 7) of the control assembly 70 controls the motor 34 that rotates the work chuck table 30 according to the position of the notch 105 identified by the mark identification assembly 73 to: The mark corresponding portion 33 of 32 coincides with the notch 105 of the wafer 100 held by the transfer pad 61. That is, the mark alignment control unit 74 controls the motor 34 to rotate the work chuck table 30 so that the mark corresponding portion 33 of the holding surface 32 is arranged in the notch 105 of the wafer 100 that is transported to the holding surface 32 by the transport pad 61 s position.

藉此，控制組件70可以在晶圓100的中心201與工作夾台30的保持面32的中心203已一致的狀態，且如圖15所示，晶圓100的凹口105與保持面32的標記對應部33已一致的狀態下，藉由保持面32來保持晶圓100。Thereby, the control assembly 70 can be in a state where the center 201 of the wafer 100 is consistent with the center 203 of the holding surface 32 of the work chuck 30, and as shown in FIG. In a state where the mark corresponding portions 33 are aligned, the wafer 100 is held by the holding surface 32.

再者，在圖1所示之磨削裝置1中，也可讓控制組件70具備圖7所示之標記辨識組件73及標記對位控制組件74，並且使保持面32具備標記對應部33。並且，亦可讓控制組件70在晶圓100的中心201與工作夾台30的保持面32的中心203已一致的狀態下，且晶圓100的凹口105與保持面32的標記對應部33已一致的狀態下，使晶圓100保持於保持面32。Furthermore, in the grinding device 1 shown in FIG. 1, the control unit 70 may be provided with the mark recognition unit 73 and the mark alignment control unit 74 shown in FIG. 7, and the holding surface 32 may be provided with the mark corresponding portion 33. In addition, the control unit 70 may be in a state where the center 201 of the wafer 100 and the center 203 of the holding surface 32 of the work chuck table 30 have been aligned, and the notch 105 of the wafer 100 corresponds to the mark 33 of the holding surface 32. In the aligned state, the wafer 100 is held on the holding surface 32.

又，也有晶圓100具有定向平面來取代凹口105之情況。在此情況下，工作夾台30的保持面32是構成為例如在保持晶圓100時，將來自於對應於該定向平面的部分之吸引切斷。 亦即，在此構成中，是保持面32中的吸引晶圓100的部分具有轉印了晶圓100之形狀。並且，保持面32中的切斷吸引的部分會成為對應於定向平面的標記對應部。標記對位控制組件74是控制馬達34而使工作夾台30旋轉成：將保持面32中的切斷吸引的部分配置在藉由搬送墊61搬送至保持面32之晶圓100的定向平面的位置。In addition, there are cases where the wafer 100 has an orientation plane instead of the notch 105. In this case, the holding surface 32 of the work chuck table 30 is configured to, for example, when holding the wafer 100, suction and cut the portion corresponding to the orientation plane. That is, in this configuration, the portion of the holding surface 32 that attracts the wafer 100 has a shape in which the wafer 100 is transferred. In addition, the cut-and-sucked portion of the holding surface 32 becomes a mark corresponding portion corresponding to the orientation plane. The mark alignment control unit 74 controls the motor 34 to rotate the work chuck table 30 to arrange the cut and sucked portion of the holding surface 32 on the orientation plane of the wafer 100 that is transported to the holding surface 32 by the transport pad 61 Location.

又，實施形態1及2之技術並不限於磨削裝置1及磨削裝置10，而是對於藉由搬送組件來將被加工物搬送至工作夾台的所有加工裝置，都可以合宜地適用。In addition, the techniques of the first and second embodiments are not limited to the grinding device 1 and the grinding device 10, but can be suitably applied to all processing devices that convey the workpiece to the work chuck by the conveying unit.

1,10:磨削裝置 100:晶圓 101:正面 102:背面 103:保護膠帶 105:凹口 11:第1裝置基座 110,111:拍攝區 12:第2裝置基座 120,121:箭頭 13:支柱 14:開口部 151:第1片匣載台 152:第2片匣載台 153:第1片匣 154:第2片匣 155:機器人 156:機械手 157:驅動部 158:上下移動組件 159:水平移動組件 2:磨削進給組件 20:Z軸滾珠螺桿 201,202,203,204:中心 21:Z軸導軌 22:Z軸伺服馬達 23:Z軸移動工作台 24:支持器 25:噴嘴 26:旋轉洗淨單元 27:旋轉工作台 30:工作夾台 301,302,303,304:直線 32:保持面 33:標記對應部 34:馬達 38:厚度測定器 39:罩蓋 40:蛇腹蓋 41:第1相機 42:第2相機 5:磨削組件 50:主軸 51:主軸殼體 511:開口 512:側壁 513:層架 52:馬達 53:輪座 54:磨削輪 540:輪基台 541:磨削磨石 60:搬入機構 61:搬送墊 62:移動組件 65:搬出機構 66:搬出墊 67:移動組件 70:控制組件 72:中心座標辨識組件 73:標記辨識組件 74:標記對位控制組件 +X,-X,+Y,-Y,+Z,-Z:方向1,10: Grinding device 100: Wafer 101: front 102: back 103: protective tape 105: Notch 11: The first device base 110, 111: shooting area 12: The second device base 120, 121: Arrow 13: Pillar 14: Opening 151: The first cassette stage 152: 2nd cassette stage 153: first cassette 154: second cassette 155: Robot 156: Robot 157: Drive 158: Move components up and down 159: Horizontally moving components 2: Grinding feed assembly 20: Z-axis ball screw 201, 202, 203, 204: Center 21: Z axis guide 22: Z axis servo motor 23: Z-axis moving table 24: Supporter 25: Nozzle 26: Rotating washing unit 27: Rotating table 30: work clamp 301,302,303,304: straight line 32: keep noodles 33: Mark the corresponding part 34: Motor 38: Thickness Tester 39: cover 40: Snake belly cover 41: 1st camera 42: 2nd camera 5: Grinding components 50: Spindle 51: Spindle housing 511: open 512: Sidewall 513: Shelf 52: Motor 53: wheel seat 54: Grinding wheel 540: Wheel Abutment 541: Grinding Stone 60: Move into the organization 61: transport mat 62: mobile components 65: Move out of the organization 66: move out the pad 67: mobile components 70: control components 72: Center coordinate recognition component 73: mark recognition component 74: Mark registration control assembly +X, -X, +Y, -Y, +Z, -Z: direction

圖1是顯示一實施形態之磨削裝置的構成的立體圖。 圖2是顯示容置有加工前的晶圓的第1片匣的正面圖。 圖3是顯示對已保持於機械手的晶圓進行拍攝之情形的說明圖。 圖4是顯示拍攝區的說明圖。 圖5是顯示已搬送到工作夾台上之晶圓的說明圖。 圖6是顯示晶圓的中心與工作夾台的保持面的中心為一致之狀態的說明圖。 圖7是顯示其他實施形態之磨削裝置的構成的立體圖。 圖8是顯示對已保持於機械手的晶圓進行拍攝之情形的說明圖。 圖9是顯示拍攝區的說明圖。 圖10是顯示已將搬送墊配置到保持有晶圓的機械手上之狀態的說明圖。 圖11是顯示晶圓的中心與搬送墊的中心為一致之狀態的說明圖。 圖12是顯示晶圓已保持於機械手之狀態的說明圖。 圖13是顯示已將搬送墊配置到保持有晶圓的機械手上之狀態的說明圖。 圖14是顯示將晶圓保持於搬送墊，且機器人已退避之狀態的說明圖。 圖15是顯示已將晶圓藉由搬送墊搬送至保持面，而被保持面保持之狀態的說明圖。Fig. 1 is a perspective view showing the configuration of a grinding device according to an embodiment. Fig. 2 is a front view showing a first cassette containing wafers before processing. Fig. 3 is an explanatory diagram showing a situation in which a wafer that has been held by a robot is photographed. Fig. 4 is an explanatory diagram showing a shooting area. FIG. 5 is an explanatory diagram showing the wafers that have been transferred to the work chuck table. FIG. 6 is an explanatory diagram showing a state where the center of the wafer and the center of the holding surface of the work chuck are aligned. Fig. 7 is a perspective view showing the configuration of a grinding device according to another embodiment. FIG. 8 is an explanatory diagram showing a situation in which a wafer that has been held by a robot is photographed. Fig. 9 is an explanatory diagram showing a shooting area. Fig. 10 is an explanatory diagram showing a state in which the transfer pad has been arranged on the robot holding the wafer. FIG. 11 is an explanatory diagram showing a state where the center of the wafer and the center of the transfer pad are aligned. FIG. 12 is an explanatory diagram showing a state in which the wafer has been held in the robot hand. FIG. 13 is an explanatory diagram showing a state in which the transfer pad has been arranged on the robot holding the wafer. FIG. 14 is an explanatory diagram showing a state where the wafer is held on the transfer pad and the robot has retreated. 15 is an explanatory diagram showing a state in which the wafer has been transported to the holding surface by the transfer pad and held by the holding surface.

100:晶圓100: Wafer

101:正面101: front

102:背面102: back

120:箭頭120: Arrow

155:機器人155: Robot

156:機械手156: Robot

158:上下移動組件158: Move components up and down

159:水平移動組件159: Horizontally moving components

201,202,203:中心201, 202, 203: Center

30:工作夾台30: work clamp

301,302,303:直線301,302,303: straight line

32:保持面32: keep noodles

Claims (3)

一種加工裝置，具備：片匣，具有朝上下方向配置的複數個層架；片匣載台，載置該片匣；工作夾台，藉由保持面保持被加工物；搬送組件，保持已收納於該片匣之被加工物，並從該片匣將被加工物朝該工作夾台搬送；及加工組件，對已保持於該工作夾台之被加工物進行加工，前述加工裝置更具備： 拍攝組件，對藉由該搬送組件所保持的被加工物進行拍攝； 中心座標辨識組件，依據以該拍攝組件所進行的拍攝而取得的拍攝圖像來辨識被加工物的中心座標；及 控制組件，依據藉由該中心座標辨識組件所辨識出的該中心座標來控制該搬送組件，並以藉由該搬送組件所保持的被加工物的中心、與該工作夾台的該保持面的中心一致的方式，來讓被加工物保持於該保持面。A processing device comprising: a cassette with a plurality of shelves arranged in the up and down direction; a cassette carrier table for placing the cassette; a work clamping table for holding a processed object by a holding surface; and a conveying assembly to keep the stored The processed object in the cassette, and the processed object is transported from the cassette toward the work chuck table; and the processing component, which processes the processed object that has been held on the work chuck table, and the aforementioned processing device is further equipped with: The photographing component, which photographs the processed object held by the conveying component; The center coordinate recognition component recognizes the center coordinate of the processed object according to the photographed image obtained by the photographing performed by the photographing component; and The control component controls the conveying component according to the center coordinate recognized by the center coordinate recognizing component, and the center of the workpiece held by the conveying component and the holding surface of the work clamp The center is aligned to keep the workpiece on the holding surface. 如請求項1之加工裝置，其中該搬送組件具備：機器人，裝設有機械手，前述機械手可保持已收納於該片匣之被加工物；及搬入機構，將已保持於該機械手之被加工物接收，並搬入該工作夾台的該保持面， 該拍攝組件對已保持於該機械手之被加工物進行拍攝， 該控制組件依據藉由該中心座標辨識組件所辨識出的該中心座標，而藉由該搬入機構，以該保持面的中心與被加工物的中心一致的方式，來讓被加工物保持於該保持面。For example, the processing device of claim 1, wherein the transport component is provided with: a robot equipped with a manipulator, the manipulator can hold the processed object that has been stored in the cassette; and a carry-in mechanism that holds the manipulator The object to be processed is received and moved into the holding surface of the work clamping table, The photographing component photographs the processed object that has been held by the manipulator, The control component is based on the center coordinate recognized by the center coordinate recognition component, and by the loading mechanism, the center of the holding surface is consistent with the center of the processed object to keep the processed object in the Keep noodles. 如請求項1之加工裝置，其中被加工物具備作為表示結晶方位之標記的凹口或定向平面， 該保持面具有轉印了被加工物之形狀，且具備有對應於該標記的標記對應部， 前述加工裝置更具備： 標記辨識組件，從藉由該拍攝組件所進行的拍攝而得到的該拍攝圖像中辨識該標記的位置； 旋轉組件，以該保持面的中心為軸來使該工作夾台旋轉；及 標記對位控制組件，控制該旋轉組件，以使該保持面的該標記對應部、與藉由該搬送組件所保持之被加工物的該標記一致。Such as the processing device of claim 1, wherein the processed object is provided with a notch or an orientation plane as a mark indicating the crystal orientation, The holding surface has a shape in which the object to be processed is transferred, and is provided with a mark corresponding portion corresponding to the mark, The aforementioned processing device is further equipped with: A mark recognition component, which recognizes the position of the mark from the photographed image obtained by the photographing performed by the photographing component; A rotating assembly, which rotates the work clamp table with the center of the holding surface as an axis; and The mark alignment control component controls the rotating component so that the mark corresponding part of the holding surface is consistent with the mark of the processed object held by the conveying component.
TW109147200A 2020-01-16 2020-12-31 Processing device capable of reducing the number of transferring and holding a workpiece when transporting the workpiece to a chuck table TW202128349A (en)

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