JP7002295B2 - Processing method and processing equipment for plate-shaped workpieces - Google Patents

Description

The present invention relates to a processing method and a processing apparatus for a plate-shaped work.

As a packaging technology for further integrating and downsizing devices, for example, a chip in which a device is formed is placed on a substrate, an electrode is formed on the chip, and the chip and the electrode are sealed with a mold resin containing a filler. After stopping and protecting the device from impact, moisture, etc., there is a technique of grinding the mold resin with a grinding wheel to expose the electrodes, and further grinding the mold resin to form a plate-shaped workpiece having a desired thickness.

Since the electrode is mainly made of copper, the grinding wheel is likely to be clogged with copper by grinding the electrode. Therefore, dressing (dressing) is required to remove the clogged copper on the ground surface of the grinding wheel. Therefore, dressing is performed while grinding (see, for example, Patent Document 1).

On the other hand, in order to avoid clogging of the grinding wheel due to copper, there is a processing method in which the mold resin is cut with a cutting tool provided with a diamond tip at the tip (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2011-189456 Japanese Unexamined Patent Publication No. 2013-008899

However, as described in Patent Document 1, if dressing is performed while performing the grinding process, there is a problem that the dressing accelerates the consumption of the grinding wheel.
Further, when the mold resin is cut with a bite as described in Patent Document 2, there is a problem that the diamond chip is worn out by the filler contained in the mold resin and cannot be cut.

Therefore, when forming a plate-shaped workpiece having a predetermined thickness by reducing the thickness of the resin layer containing the filler that encloses the chip having the columnar electrodes, it is possible to prevent the grinding wheel from being consumed and the cutting tool from being worn. There is a problem of efficiently forming a plate-shaped work having a predetermined thickness.

Further, in the present invention for solving the above-mentioned problems, the thickness of the resin layer containing the filler arranged on the substrate and having the columnar electrode on the upper surface and sealing the chip is reduced to reduce the thickness of the plate-shaped work having a predetermined thickness. The processing means is provided with a holding table for holding the plate-shaped work and a processing means for reducing the thickness of the resin layer of the plate-shaped work held by the holding table. , A grinding means provided with a grinding wheel in which a grinding wheel is arranged in an annular shape and rotating the grinding wheel around its center, a grinding feeding means for moving the grinding means in a direction approaching or separating from the holding table, and the grinding. It is equipped with a cutting means that cuts the surface to be ground of the plate-shaped work ground by means with a cutting tool, and the processing situation that occurs when the electrodes are exposed to the surface to be ground of the plate-shaped work at a predetermined area ratio during grinding. The switching means includes a switching means for detecting the change in the grinding process and switching to the cutting process by the cutting means , and a height measuring means for measuring the height of the surface to be ground of the plate-shaped workpiece. When the grinding means is fed at a constant speed by the grinding feeding means to grind the plate-shaped work, the height of the surface to be ground of the plate-shaped work measured by the height measuring means is within a preset fixed time. If the value does not change more than the preset value in, it is determined that the electrode is exposed to the surface to be ground of the plate-shaped workpiece at a predetermined area ratio, the grinding process is terminated, and the process is switched to the cutting process by the cutting means to switch to a plate having a predetermined thickness. It is a processing device that forms a shaped work.

Further, in the present invention for solving the above-mentioned problems, the thickness of the resin layer containing the filler arranged on the substrate and having the columnar electrode on the upper surface and sealing the chip is reduced to reduce the thickness of the plate-shaped work having a predetermined thickness. The processing means is provided with a holding table for holding the plate-shaped work and a processing means for reducing the thickness of the resin layer of the plate-shaped work held by the holding table. A grinding means having a grinding wheel in which a grinding wheel is arranged in an annular shape and rotating the grinding wheel around its center, a grinding feeding means for moving the grinding means in a direction approaching or separating from the holding table, and the grinding. It is equipped with a cutting means that cuts the surface to be ground of the plate-shaped work ground by means with a cutting tool, and the processing situation that occurs when the electrodes are exposed to the surface to be ground of the plate-shaped work at a predetermined area ratio during grinding. The grinding feed means includes a guide for guiding the grinding means in the grinding feed direction and a guide extending in parallel with the guide. The existing ball screw, a grinding feed motor for rotating the ball screw, and a grinding feed load current value detecting unit for detecting the load current value of the grinding feed motor are provided, and the switching means is the grinding means by the grinding feed means. When the load current value of the grinding feed motor detected by the grinding feed load current value detection unit exceeds a preset value while grinding a plate-shaped workpiece by feeding at a constant speed, the electrode is a plate-shaped workpiece. It is a processing device that determines that the surface to be ground is exposed to a predetermined area ratio, finishes the grinding process, and switches to the cutting process by the cutting means to form a plate-shaped workpiece having a predetermined thickness.

In the processing apparatus according to the present invention, the processing means is provided with a grinding wheel in which a grinding wheel is arranged in an annular shape, and the grinding means is rotated around the center of the grinding wheel, and the grinding means is moved in a direction toward or away from a holding table. It is equipped with a grinding feed means for grinding and a cutting means for cutting the surface to be ground of the plate-shaped work ground by the grinding means with a cutting tool. It is equipped with a switching means that detects changes in the machining conditions that occur when exposed, terminates grinding, and switches to cutting by cutting means , and a height measuring means that measures the height of the surface to be ground of the plate-shaped workpiece. As the switching means, the height of the surface to be ground of the plate-shaped work measured by the height measuring means is constant when the grinding means is fed at a constant speed by the grinding feed means to grind the plate-shaped work. If the value does not change by more than the preset value within the time, it is judged that the electrode is exposed to the surface to be ground of the plate-shaped work at a predetermined area ratio, and the grinding process is completed and the process is switched to the cutting process by the cutting means. Depending on the judgment, each machining tool can be used properly depending on whether the grinding wheel is effective or the cutting tool is effective to reduce the thickness of the plate-shaped workpiece, which can shorten the machining time and reduce the consumption and cutting of the grinding wheel. It is possible to efficiently form a plate-shaped work having a predetermined thickness while preventing the bite from being worn.

In the processing apparatus according to the present invention, the processing means is provided with a grinding wheel in which a grinding wheel is arranged in an annular shape, and the grinding means is rotated around the center of the grinding wheel, and the grinding means is moved in a direction toward or away from a holding table. It is equipped with a grinding feed means for grinding and a cutting means for cutting the surface to be ground of the plate-shaped work ground by the grinding means with a cutting tool. It is equipped with a switching means that detects changes in the machining conditions that occur when exposed, ends the grinding process, and switches to cutting by the cutting means. The grinding feed means is parallel to the guide that guides the grinding means in the grinding feed direction. It is equipped with a ball screw that extends, a grinding feed motor that rotates the ball screw, and a grinding feed load current value detector that detects the load current value of the grinding feed motor. When the load current value of the grinding feed motor detected by the grinding feed load current value detector exceeds a preset value while the plate-shaped workpiece is being ground by rapid feed, the electrode is placed on the surface of the plate-shaped workpiece to be ground. By judging that the surface is exposed at a predetermined area ratio, terminating the grinding process and switching to the cutting process using the cutting means , the grinding grind is effective and the cutting tool is effective in reducing the thickness of the plate-shaped workpiece. You will be able to use each processing tool individually.

It is a perspective view which shows an example of a processing apparatus. It is sectional drawing which shows an example of the structure of a plate-shaped work. It is sectional drawing which shows the state which the plate-shaped work was sucked and held on the holding table. It is sectional drawing which shows the state which the plate-shaped work is being ground by the grinding means. It is sectional drawing which shows the state which the plate-shaped work is cutting by a cutting means.

The front side (-X direction side) of the processing apparatus 1 shown in FIG. 1 according to the present invention on the base 10 is a region where the plate-shaped work W is carried in and out of the holding table 30, and is on the base 10. The rear side (+ X direction side) is a region where the plate-shaped work W held on the holding table 30 by the processing means 11 is subjected to grinding or cutting.

The plate-shaped work W shown in FIG. 2 has, for example, a rectangular substrate W1 made of a resin such as PCB, and a rectangular chip W2 whose base material is silicon, gallium arsenide, sapphire, or the like. The back surface W2b of the chip W2 is bonded to the front surface W1a of the substrate W1.
A device is formed on the surface W2a of the chip W2. A plurality of columnar electrodes E are provided on the surface of the device, and the electrodes E project upward from the surface W2a of the chip W2. The electrode E is composed of, for example, copper as a main element and further containing a precious metal such as gold or platinum. The area of the cross section (circular cross section) of each electrode E is substantially the same, and the height of each electrode E varies.

The surface W2a of the chip W2 is sealed with a resin layer J such as an epoxy resin, and the upper end of each electrode E is covered with the resin layer J. A filler (fine particles) (not shown) such as silica or SiC is mixed in the resin layer J. The filler brings the thermal expansion coefficient of the resin layer J closer to the thermal expansion coefficient of the chip W2 to prevent damage or deformation of the plate-shaped work W due to heat treatment or the like.

On the front side (-X direction side) of the base 10 shown in FIG. 1, for example, a first cassette mounting portion 150 and a second cassette mounting portion 151 are provided, and a first cassette mounting portion is provided. A first cassette 150a in which the plate-shaped work W before processing is housed is placed in the 150, and a second cassette 151a in which the plate-shaped work W after processing is housed is placed in the second cassette mounting portion 151. It will be placed.

In front of the carry-out port of the first cassette 150a, a robot 155 that carries out the plate-shaped work W before processing from the first cassette 150a and carries the plate-shaped work W after processing into the second cassette 151a is arranged. It is set up. A temporary placement area 152 is provided at a position adjacent to the robot 155, and a positioning means 153 for positioning the plate-shaped work W at a predetermined position is provided in the temporary placement area 152.

A loading arm 154a that swivels while holding the plate-shaped work W is arranged at a position adjacent to the positioning means 153. The loading arm 154a holds the plate-shaped work W aligned by the positioning means 153 and conveys it to the holding table 30 positioned in the vicinity of the loading arm 154a. Next to the loading arm 154a, an unloading arm 154b that swivels while holding the processed plate-shaped work W is provided. A single-wafer spinner cleaning means 156 for cleaning the processed plate-shaped work W conveyed by the unloading arm 154b is arranged at a position close to the unloading arm 154b. The plate-shaped work W cleaned by the spinner cleaning means 156 is carried into the second cassette 151a by the robot 155.

The holding table 30 arranged on the base 10 of the processing apparatus 1 and holding the plate-shaped work W includes, for example, a holding portion 300 made of a porous member or the like, and a frame body 301 for supporting the holding portion 300. The holding portion 300 communicates with the suction source 32, and the suction force generated by the suction source 32 is transmitted to the holding surface 300a which is the exposed surface of the holding portion 300, so that the holding table 30 has the holding surface 300a. The plate-shaped work W is sucked and held on the top. The holding table 30 is rotatable around an axial center in the Z-axis direction and is surrounded by a cover 39 from the surroundings, and is arranged under the cover 39 and the bellows cover 39a connected to the cover 39 (not shown). The X-axis direction moving means makes it possible to reciprocate on the base 10 in the X-axis direction.

The processing apparatus 1 includes a processing means 11 that reduces the thickness of the resin layer J of the plate-shaped work W shown in FIG. 2 held by the holding table 30. The processing means 11 includes a grinding wheel 24 in which the grinding grind 240 is arranged in an annular shape, and the grinding means 2 for rotating the grinding wheel 24 around the center thereof and the grinding means 2 approaching or separating from the holding table 30 in the Z-axis direction. It includes a grinding feed means 41 to be moved, and a cutting means 5 for cutting the surface to be ground of the plate-shaped work W ground by the grinding means 2 with a cutting tool 54.

A column 12 is erected behind the machining area (on the + X direction side), and a Y-axis direction moving means 13 for moving the grinding means 2 in the Y-axis direction is arranged on the front surface of the column 12. .. The Y-axis direction moving means 13 includes a ball screw 130 having an axial center in the Y-axis direction, a pair of guide rails 131 arranged in parallel with the ball screw 130, and a motor 132 connected to the ball screw 130 to rotate the ball screw 130. A movable base 133 in which the internal nut is screwed into the ball screw 130 and the side portion is in sliding contact with the guide rail 131 is provided. When the motor 132 rotates the ball screw 130, the movable base 133 is accompanied by the guide rail 131. The grinding means 2 is guided by the ball and moves in the Y-axis direction, and the grinding means 2 disposed on the movable table 133 via the grinding feed means 41 also moves in the Y-axis direction.

The grinding feed means 41 arranged on the movable table 133 includes a guide 411 that guides the grinding means 2 in the grinding feed direction (Z-axis direction), and a ball screw 410 extending in the Z-axis direction in parallel with the guide 411. , A grinding feed motor 412 that rotates the ball screw 410, an elevating plate 413 whose internal nut is screwed into the ball screw 410 and whose side is in sliding contact with the guide 411, and a holder 414 that is connected to the elevating plate 413 and holds the grinding means 2. When the grinding feed motor 412 rotates the ball screw 410, the elevating plate 413 is guided by the guide 411 and moves in the Z-axis direction, and the grinding means 2 held by the holder 414 is the Z-axis. Grinded in the direction.
For example, the grinding feed load current value detection unit 43 for detecting the load current value of the grinding feed motor 412 is electrically connected to the grinding feed motor 412.

The grinding means 2 is connected to a spindle 20 whose axial direction is vertical (Z-axis direction), a housing 21 that rotatably supports the spindle 20, a motor 22 that rotationally drives the spindle 20, and a lower end of the spindle 20. A circular mount 23 and a grinding wheel 24 that is detachably mounted on the lower surface of the mount 23 with its center aligned with the axis of the spindle 20 are provided.
For example, a load current value detection unit 25 for detecting the load current value of the motor 22 is electrically connected to the motor 22.

The grinding wheel 24 includes a wheel base 241 and a plurality of substantially rectangular parallelepiped grinding wheels 240 arranged in an annular shape on the bottom surface of the wheel base 241. The grinding wheel 240 is formed by fixing diamond abrasive grains or the like with, for example, a resin bond or a metal bond.

As shown in FIG. 1, a movable base 143 is arranged on the front surface of the column 12 along with the movable base 133 of the Y-axis direction moving means 13, and the nut inside the movable base 143 is screwed into the ball screw 130. The side portion is in sliding contact with the guide rail 131. A cutting means 5 is arranged on the movable table 143 via the cutting feeding means 42, and when the motor 132 of the Y-axis direction moving means 13 rotates the ball screw 130, the movable table 143 is accompanied by the rotation of the ball screw 130. Is guided by the guide rail 131 and moves in the Y-axis direction, and the cutting means 5 moves in the Y-axis direction.
The cutting means 5 may be movable in the Y-axis direction by a moving means different from the Y-axis direction moving means 13.

The cutting feed means 42 arranged on the movable base 143 is connected to a ball screw 420 having an axial center in the Z-axis direction, a pair of guide rails 421 arranged in parallel with the ball screw 420, and the ball screw 420, and is connected to the ball screw 420. It is composed of a motor 422 that rotates a motor 422, an elevating plate 423 whose internal nut is screwed into a ball screw 420 and whose side is in sliding contact with a guide rail 421, and a holder 424 that is connected to the elevating plate 423 and holds a cutting means 5. When the motor 422 rotates the ball screw 420, the elevating plate 423 is guided by the guide rail 421 and reciprocates in the Z-axis direction, and the cutting means 5 supported by the holder 424 also reciprocates in the Z-axis direction. do.

The cutting means 5 is connected to a spindle 50 whose axial direction is vertical (Z-axis direction), a housing 51 that rotatably supports the spindle 50, a motor 52 that rotationally drives the spindle 50, and a lower end of the spindle 50. It includes a circular bite wheel 53 and a cutting bite 54 detachably attached to the lower surface of the bite wheel 53.

A prismatic mounting portion 530 extending in the −Z direction is disposed on the lower surface of the bite wheel 53, and the cutting bit 54 has a plate shape fixed to the side surface of the mounting portion 530 by a fixing bolt or the like. It is provided with a shank 540 and a cutting edge 541 formed in a sharp shape at the lower end of the plate-shaped shank 540. The cutting edge 541 is obtained by baking and hardening abrasive grains such as diamond and a predetermined binder.

A thickness measuring means 16 for measuring the thickness of the plate-shaped work W held by the holding table 30 is arranged in the vicinity of the side of the moving path of the holding table 30. The thickness measuring means 16 measures, for example, the height of the first height measuring means 161 for measuring the height of the reference surface of the holding table 30 and the height of the surface to be ground of the plate-shaped work W held by the holding table 30. It is provided with a second height measuring means 162 for measuring.

The first height measuring means 161 and the second height measuring means 162 are provided with contacts at their respective tips that move up and down in the vertical direction and come into contact with each measuring surface, and each contact is attached to each measuring surface. Measure the height while pressing with an appropriate force. Then, the thickness measuring means 16 measures the height of the upper surface of the frame body 301 of the holding table 30 as the reference surface by the first height measuring means 161 and processes it by the second height measuring means 162. By measuring the height of the surface to be ground of the plate-shaped work W and calculating the difference between the measured values, the thickness of the plate-shaped work W can be measured at any time during grinding.

The thickness measuring means 16 is not limited to the configuration including the first height measuring means 161 and the second height measuring means 162 as in the present embodiment, and the thickness measuring means 16 is not limited to the configuration including, for example, the second height measuring means. A plate-shaped work is provided by the second height measuring means 162 as a configuration including 162, a carriage for holding the second height measuring means 162 so as to be movable in the vertical direction, and a displacement detecting means for detecting the position of the carriage. The thickness of the plate-shaped work W may be measured while measuring the height of the surface to be ground W. Further, the first height measuring means 161 and the second height measuring means 162 are not limited to the contact type, and for example, the first height measuring means 161 and the second height measuring means 162 are provided with a light emitting part and a light receiving part to measure the height of the measuring surface in a non-contact manner. It may be a reflective optical sensor that can measure. In this case, the light projecting unit irradiates each measurement surface with the measurement light, and the height of each measurement surface is measured by the principle of triangulation based on the reflected light received by the light receiving unit.

The processing apparatus 1 changes the processing condition that occurs when the electrode E is exposed to the surface to be ground of the plate-shaped work W shown in FIG. 2 at a predetermined area ratio during the grinding of the plate-shaped work W by the grinding means 2. It is provided with a switching means 9 that detects and ends the grinding process and switches to the cutting process by the cutting means 5. The switching means 9 includes a determination unit 93 including a CPU and the like that perform arithmetic processing according to a control program, and a storage unit 90 including a ROM for storing a control program and preset information and a RAM for accommodating arithmetic results and other information. For example, it is electrically connected to a thickness measuring means 16, a grinding feed load current value detecting unit 43, a load current value detecting unit 25, and the like.

Hereinafter, the operation of each step and the processing apparatus 1 when the thickness of the resin layer J shown in FIG. 2 is reduced to form a plate-shaped work W having a predetermined thickness by using the processing apparatus 1 described above will be described.

(1) Holding step In the first holding step, as shown in FIG. 3, the plate-shaped work W has the protective tape T side facing downward, and the center of the holding surface 300a and the center of the plate-shaped work W. Is placed on the holding surface 300a of the holding table 30 so as to substantially match with. Then, the suction force generated by the operation of the suction source 32 connected to the holding table 30 is transmitted to the holding surface 300a, so that the holding table 30 causes the substrate of the plate-shaped work W with the resin layer J facing up. The W1 side is held.

(2-1) Embodiment 1 of the grinding process
In the first embodiment of the grinding process, the switching means 9 measures the change in the processing state that occurs when the electrode E is exposed to the surface to be ground of the plate-shaped work W at a predetermined area ratio during the grinding process. It is detected via the second height measuring means 162 of the above. The predetermined area ratio is the ratio between the area of the entire surface of the plate-shaped work W to be ground and the total area of the cross-sectional areas of each electrode E. As an example thereof, the plate-shaped work W is to be ground. Area of the entire surface: Area = 10: 3 which is the total cross-sectional area of each electrode E.
First, as shown in FIG. 4, the holding table 30 holding the plate-shaped work W is moved in the + X direction to the bottom of the grinding means 2 by an X-axis direction moving means (not shown), and is moved to the grinding wheel 24 and the holding table 30. Alignment with the held plate-shaped work W is made. For alignment, for example, the rotation center of the grinding wheel 24 is displaced in the + X direction by a predetermined distance from the rotation center of the plate-shaped work W, and the rotation locus of the grinding wheel 240 passes through the rotation center of the plate-shaped work W. Will be done.

Further, the motor 22 rotationally drives the spindle 20 in the counterclockwise direction when viewed from the + Z direction, and the grinding wheel 24 rotates accordingly. The grinding means 2 is fed at a constant speed in the −Z direction by the grinding feeding means 41, and the rotating grinding wheel 240 comes into contact with the resin layer J which is the surface to be ground of the plate-shaped work W to perform grinding. Will be. During grinding, as the holding table 30 rotates in the counterclockwise direction when viewed from the + Z direction, the plate-shaped work W held on the holding surface 300a also rotates, so that the grinding wheel 240 is formed on the resin layer J. Grind the entire top surface. Further, the grinding water is supplied to the contact portion between the grinding wheel 240 and the resin layer J, and the contact portion is cooled and washed.

As the grinding process is started, the contact of the second height measuring means 162 descends and comes into contact with the resin layer J which is the surface to be ground of the plate-shaped work W to start measuring the height thereof. Then, the second height measuring means 162 sequentially sends the measured information about the height of the surface to be ground of the plate-shaped work W to the switching means 9. The information sent to the switching means 9 is sequentially stored in the RAM of the storage unit 90 of the switching means 9.

The switching means 9 includes, for example, a timer 91 as a timekeeping means. The timer 91 starts counting the time at the same time as the grinding is started, and notifies the determination unit 93 of the switching means 9 of the passage of the fixed time t1 every time the fixed time t1 elapses. Each time the timer 91 notifies the determination unit 93, the determination unit 93 newly has a second height from the value of the height of the surface to be ground of the plate-shaped work W stored in the RAM of the storage unit 90 before t1 for a certain period of time. The difference (amount of change in height) obtained by subtracting the value of the height of the surface to be ground of the plate-shaped work W after a certain period of time t1 sent from the measuring means 162 is calculated.
For example, in the ROM of the storage unit 90 of the switching means 9, a predetermined threshold value regarding the amount of change in height of the plate-shaped work W measured by the second height measuring means 162 with respect to the surface to be ground is stored in advance. Has been done. This predetermined threshold value is, for example, an experimentally, empirically, or theoretically selected value corresponding to the diameter of the plate-shaped work W, the type of the resin layer J, the type, the number, the diameter, and the like of the electrodes E. It is stored for the determination unit 93 of the switching means 9 to determine the change in the processing state that occurs when the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio.

When the grinding wheel 240 that was grinding only the resin layer J starts grinding the electrode E as well, since the electrode E is mainly made of copper, clogging due to copper occurs and the grinding force of the grinding wheel 240 is increased. It will decline. As a result, there may be a case where the amount of change in the height of the surface to be ground of the plate-shaped work W does not change by a predetermined threshold value set in advance in the storage unit 90 within the fixed time t1 calculated by the determination unit 93. As a result, the determination unit 93 determines that the electrode E is exposed to the surface to be ground of the plate-shaped work W at a predetermined area ratio. When the determination unit 93 makes the determination, the device control of the processing device 1 (switching control between the grinding means 2 and the cutting means 5 by the switching means 9) is performed according to a program set in the ROM of the storage unit 90 in advance, and grinding is performed. The grinding process by the means 2 is completed, and the cutting process by the cutting means 5 is started. That is, for example, the rotation of the spindle 20 by the motor 22 is stopped, the grinding means 2 is pulled up in the + Z direction by the grinding feed means 41, and the grinding wheel 240 is separated from the plate-shaped work W. Further, the grinding means 2 is moved to the + Y direction side by the Y-axis direction moving means 13, and the grinding means 2 is retracted from above the plate-shaped work W held by the holding table 30. Further, as the grinding means 2 moves toward the + Y direction, the grinding means 2 moves toward the movable table 143 + Y direction, and the cutting means 5 is positioned above the moving path of the holding table 30.

(2-2) Embodiment 2 of the grinding process
The grinding process is not limited to the embodiment in which the thickness measuring means 16 and the switching means 9 are operated as described above, and for example, the load current value detecting unit 25 and the switching means 9 are operated and carried out. It may be a thing. That is, in the second embodiment of the grinding process, the determination unit 93 of the switching means 9 determines the change in the processing state that occurs when the electrode is exposed to the surface to be ground of the plate-shaped work W at a predetermined area ratio during the grinding process. , The load current value is detected via the load current value detection unit 25.

In the grinding process of the second embodiment, the grinding means 2 is fed at a constant speed in the −Z direction by the grinding feed means 41, and the rotating grinding wheel 240 is the resin layer J which is the surface to be ground of the plate-shaped work W. It is carried out in the same manner as in the grinding process of the first embodiment until it comes into contact with.

When the rotating grinding wheel 240 abuts on the resin layer J, which is the surface to be ground of the plate-shaped work W, and grinding is started, the load current value detecting unit 25 determines the current value flowing through the motor 22 that rotationally drives the spindle 20. Start detecting. Then, the load current value detection unit 25 sequentially sends information about the detected load current value of the motor 22 to the switching means 9, and the determination unit 93 of the switching means 9 rotates and drives the spindle 20. Start monitoring.

For example, a predetermined threshold value for the load current value of the motor 22 is stored in advance in the ROM of the storage unit 90 of the switching means 9. This predetermined threshold value is, for example, an experimentally, empirically, or theoretically selected value corresponding to the diameter of the plate-shaped work W, the type of the resin layer J, the type, the number, the diameter, and the like of the electrodes E. Yes, it is stored for the determination unit 93 to determine the change in the machining condition that occurs when the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, that is, the change in the load current value of the motor 22. Current value. In the monitoring of the load current value of the motor 22 by the switching means 9, the value of the load current value of the motor 22 detected by the load current value detection unit 25 and the predetermined threshold value are continuously compared.

Since the electrode E is harder than the resin layer J, the grinding wheel 240 that grinds only the resin layer J starts grinding the electrode E as well, so that the load applied to the grinding wheel 240 becomes large. While the grinding wheel 240 is rotating, electric power is continuously supplied to the motor 22 from a power source (not shown), and the grinding wheel 240 is acted upon by starting grinding of each electrode E in addition to the resin layer J. Since the motor 22 is feedback-controlled so as to rotate the spindle 20 at a constant rotation speed even when the load to be applied becomes large, the load of the motor 22 is loaded by grinding each electrode E having a different height. The current value increases and exceeds the threshold value stored in the storage unit 90. As a result, the determination unit 93 of the switching means 9 determines that the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, and the device control of the processing device 1 according to the program is performed, and the grinding means The grinding process by 2 is completed, and the cutting process by the cutting means 5 is started.

(2-3) Embodiment 3 of the grinding process
The grinding process is not limited to the embodiment in which the thickness measuring means 16 and the switching means 9 described above are operated, and for example, the grinding feed load current value detecting unit 43 and the switching means 9 are operated. It may be carried out. That is, in the third embodiment of the grinding process, the switching means 9 grinds the change in the machining condition that occurs when the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio during the grinding process. It is detected via the load current value detecting unit 43.

In the grinding process of the third embodiment, the grinding means 2 is fed at a constant speed in the −Z direction by the grinding feed means 41, and the rotating grinding wheel 240 is the resin layer J which is the surface to be ground of the plate-shaped work W. It is carried out in the same manner as in the grinding process of the first embodiment until it comes into contact with.

When the rotating grinding wheel 240 abuts on the resin layer J which is the surface to be ground of the plate-shaped work W and grinding is started, the grinding feed load current value detecting unit 43 rotates the ball screw 410 and causes the current to flow in the motor 412. Start detecting the value. Then, the grinding feed load current value detection unit 43 sequentially sends information about the detected load current value of the motor 412 to the switching means 9, and the determination unit 93 of the switching means 9 rotates and drives the ball screw 410. Start monitoring the value.

For example, a predetermined threshold value for the load current value of the motor 412 is stored in advance in the ROM of the storage unit 90 of the switching means 9. This predetermined threshold value is, for example, an experimentally, empirically, or theoretically selected value corresponding to the diameter of the plate-shaped work W, the type of the resin layer J, the type, the number, the diameter, and the like of the electrodes E. Yes, it is stored for the determination unit 93 to determine the change in the machining condition that occurs when the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, that is, the change in the load current value of the motor 412. Current value. In the monitoring of the load current value of the motor 412 by the determination unit 93, the value of the load current value of the motor 412 detected by the grinding feed load current value detection unit 43 and the predetermined threshold value are continuously compared.

Since the electrode E is harder than the resin layer J, the grinding wheel 240 that grinds only the resin layer J starts grinding the electrode E as well, so that the load applied to the grinding feed means 41 becomes large. During the grinding process, when the load acting on the grinding means 2 becomes large due to the start of grinding of each electrode E in addition to the resin layer J, that is, the plate-shaped work W is applied to the grinding means 2. Even when the vertical drag force is increased, the motor 412 is feedback-controlled so that the grinding means 2 can be fed at a constant speed at a predetermined speed (so that the ball screw 410 is rotated at a constant rotation speed). There is. Therefore, as the electrodes E having different heights are ground, the load current value of the motor 412 rises and exceeds the threshold value stored in the storage unit 90. As a result, the determination unit 93 determines that the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, and the device control of the processing device 1 according to the program is performed, and the grinding process by the grinding means 2 is performed. Is completed and the cutting process by the cutting means 5 is started.

(3) Cutting Step After any of the grinding steps of the above embodiments 1 to 3 is performed, the electrode E exposed on the surface to be ground of the plate-shaped work W and the resin layer J are cut by a cutting tool 54 to determine a predetermined value. A cutting step of forming a plate-shaped work W having a thickness of the above is carried out.
As shown in FIG. 5, the cutting means 5 is fed in the −Z direction by the cutting feeding means 42, and the height position of the cutting edge 541 of the cutting tool 54 is held by the holding table 30. It is positioned at a predetermined height position of the layer J. The height position is a height position set for the purpose of setting the plate-shaped work W on which the cutting process has been performed to have a desired thickness. Further, the motor 52 rotates the spindle 50 in the counterclockwise direction when viewed from the + Z direction at a predetermined rotational speed, and accordingly, the cutting tool 54 rotates the spindle 50 in the counterclockwise direction around the spindle 50 at a predetermined rotational speed. Go around.

The holding table 30 that sucks and holds the plate-shaped work W moves in the + X direction, and the cutting tool 54 that orbits the holding surface 300a of the holding table 30 cuts into the resin layer J of the plate-shaped work W and the resin layer J. And the electrode E are cut. Then, the holding table 30 is moved in the + X direction to a predetermined position in the X-axis direction, the entire surface of the resin layer J of the plate-shaped work W is cut by the orbiting cutting tool 54, and then the cutting means 5 is pulled up in the + Z direction. Separate from the plate-shaped work W.

As described above, the processing method according to the present invention includes a holding step of holding the substrate W1 of the plate-shaped work W on the holding table 30 with the resin layer J facing up, and grinding the resin layer J with a grinding tool 240. A grinding step in which grinding is completed when the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, and an electrode E and a resin layer J exposed on the surface to be ground in the plate-shaped work W after the grinding step. Is provided with a cutting step of forming a plate-shaped work W having a predetermined thickness by cutting with a cutting tool 54, so that the grinding tool 240 is effective for reducing the thickness of the plate-shaped work W and the cutting tool 54. By properly using each processing tool in the effective state, the processing time can be shortened, and the plate-shaped work W of a predetermined thickness can be efficiently formed while preventing the grinding tool 240 from being consumed and the cutting tool 54 from being worn. It will be possible to do.

In the processing apparatus 1 according to the present invention, the processing means 11 includes a grinding wheel 24 in which a grinding grind 240 is arranged in an annular shape, a grinding means 2 for rotating the grinding wheel 24 around its center, and a table 30 for holding the grinding means 2. It is provided with a grinding feed means 41 for moving in a direction approaching or separating from the grinding means, and a cutting means 5 for cutting the surface to be ground of the plate-shaped work W ground by the grinding means 2 with a cutting tool 54. Since it is provided with a switching means 9 that detects a change in the machining condition that occurs when the electrode E is exposed on the surface to be ground of the work W at a predetermined area ratio, terminates the grinding process, and switches to the cutting process by the cutting means 5. Depending on the judgment of the switching means 9, each machining tool can be used properly depending on whether the grinding grind 240 is effective or the cutting tool 54 is effective for reducing the thickness of the plate-shaped work W, and the machining time can be shortened. It is possible to efficiently form a plate-shaped work W having a predetermined thickness while preventing the grinding wheel 240 from being consumed and the cutting tool 54 from being worn.

The processing device 1 includes, for example, a second height measuring means 162 for measuring the height of the surface to be ground of the plate-shaped work W, and the switching means 9 feeds the grinding means 2 at a constant speed by the grinding feeding means 41. When the plate-shaped work W is being ground, the height of the surface to be ground of the plate-shaped work W measured by the second height measuring means 162 changes by a preset value or more within a preset fixed time. If not, it is determined that the electrode E is exposed on the surface to be ground of the plate-shaped work W at a predetermined area ratio, so that the grinding wheel 240 is effective and the cutting tool 54 is effective in reducing the thickness of the plate-shaped work W. It will be possible to use each processing tool properly depending on the state.

For example, the grinding means 2 includes a load current value detecting unit 25 that detects the load current value of the motor 22, and the switching means 9 feeds the grinding means 2 at a constant speed by the grinding feeding means 41 to grind the plate-shaped work W. When the negative overcurrent value of the motor 22 detected by the load current value detection unit 25 exceeds a preset value, the electrode E is exposed to the surface to be ground of the plate-shaped work W at a predetermined area ratio. By making a judgment, it becomes possible to properly use each processing tool depending on the state in which the grinding wheel 240 is effective and the state in which the cutting tool 54 is effective in reducing the thickness of the plate-shaped work W.

The grinding feed means 41 includes a grinding feed load current value detecting unit 43 that detects the load current value of the grinding feed motor 412, and the switching means 9 feeds the grinding means 2 at a constant speed by the grinding feed means 41 to form a plate. When the load current value of the grinding feed motor 412 detected by the grinding feed load current value detection unit 43 exceeds a preset value while the work W is being ground, the electrode E is designated on the surface to be ground of the plate-shaped work W. By judging that it is exposed by the area ratio of, it is possible to use each processing tool properly in the state where the grinding wheel 240 is effective and the state where the cutting tool 54 is effective in reducing the thickness of the plate-shaped work W. Become.

The processing method according to the present invention is not limited to the above embodiment, and the configuration of the processing apparatus 1 shown in the attached drawings is not limited to this, and the effect of the present invention is exhibited. It can be changed as appropriate within the range that can be done.
To detect a change in the processing condition that occurs when the electrode E is exposed to the surface to be ground of the plate-shaped work W being ground by the switching means 9 at a predetermined area ratio, for example, a line sensor including a CCD sensor or the like is used as a processing device. 1 may be provided, and the image may be implemented by using an image of the surface to be ground of the plate-shaped work W imaged by the line sensor. In this case, in the grinding process, for example, the line sensor is arranged on the surface to be ground of the plate-shaped work W being ground so as to be displaced from the grinding wheel 24, so that the plate-shaped work that rotates during the grinding process is arranged. The surface to be ground of W is continuously imaged, and an image of the entire surface of the plate-shaped work W to be ground is formed by synthesizing the plurality of captured images. Then, the switching means 9 can determine that the electrode E is exposed at a predetermined area ratio by calculating the ratio of the cross-sectional area of the electrode E in the surface to be ground of the plate-shaped work W from this captured image. can.

1: Processing equipment 10: Base 12: Column 150: First cassette mounting part 150a: First cassette 151: Second cassette mounting part 151a: Second cassette 152: Temporary placing area 153: Alignment means 154a: Loading arm
154b: Unloading arm 155: Robot 156: Spinner cleaning means 30: Holding table 300: Holding part 300a: Holding surface 301: Frame body 11: Processing means 2: Grinding means 20: Spindle 21: Housing 22: Motor 23: Mount 24 : Grinding wheel 240: Grinding wheel 241: Wheel base 5: Cutting means 50: Spindle 51: Housing 52: Motor 53: Tool wheel 530: Mounting part 54: Tool bit 540: Shank 541: Cutting edge 13: Y-axis direction movement Means 130: Ball screw 131: Guide rail 132: Motor 133: Movable table 143: Movable table 41: Grinding feed means 410: Ball screw 411: Guide 412: Motor 413: Elevating plate 414: Holder 43: Grinding feed load current value detector
42: Cutting feed means 16: Thickness measuring means 161: First height measuring means 162: Second height measuring means 9: Switching means 90: Storage unit 91: Timer

Claims (2)

A processing device that reduces the thickness of a resin layer containing a filler that is placed on a substrate and has a chip with a columnar electrode on the upper surface to form a plate-shaped workpiece of a predetermined thickness.
A holding table for holding the plate-shaped work and a processing means for reducing the thickness of the resin layer of the plate-shaped work held by the holding table are provided.
The processing means includes a grinding wheel in which a grinding wheel is arranged in an annular shape, a grinding means for rotating the grinding wheel around its center, and a grinding feeding means for moving the grinding means in a direction approaching or separating from the holding table. And a cutting means for cutting the surface to be ground of the plate-shaped workpiece ground by the grinding means with a cutting tool.
A switching means for detecting a change in the machining condition that occurs when an electrode is exposed on the surface to be ground of a plate-shaped workpiece at a predetermined area ratio during grinding, ending the grinding process, and switching to the cutting process by the cutting means , and a plate. A height measuring means for measuring the height of the surface to be ground of the workpiece is provided.
In the switching means, when the grinding means is fed at a constant speed by the grinding feeding means to grind the plate-shaped work, the height of the surface to be ground of the plate-shaped work measured by the height measuring means is in advance. If the value does not change more than the preset value within the set fixed time, it is judged that the electrode is exposed to the surface to be ground of the plate-shaped work at a predetermined area ratio, the grinding process is terminated, and the cutting process is switched to the cutting method. A processing device that forms a plate-shaped workpiece of a predetermined thickness . A processing device that reduces the thickness of a resin layer containing a filler that is placed on a substrate and has a chip with a columnar electrode on the upper surface to form a plate-shaped workpiece of a predetermined thickness.
A holding table for holding the plate-shaped work and a processing means for reducing the thickness of the resin layer of the plate-shaped work held by the holding table are provided.
The processing means includes a grinding wheel in which a grinding wheel is arranged in an annular shape, a grinding means for rotating the grinding wheel around its center, and a grinding feeding means for moving the grinding means in a direction approaching or separating from the holding table. And a cutting means for cutting the surface to be ground of the plate-shaped workpiece ground by the grinding means with a cutting tool.
It is equipped with a switching means that detects a change in the machining condition that occurs when the electrode is exposed on the surface to be ground of the plate-shaped workpiece at a predetermined area ratio during the grinding process, terminates the grinding process, and switches to the cutting process by the cutting method.
The grinding feed means has a guide for guiding the grinding means in the grinding feed direction, a ball screw extending in parallel with the guide, a grinding feed motor for rotating the ball screw, and a load current value of the grinding feed motor. Equipped with a grinding feed load current value detector to detect
In the switching means, the load current value of the grinding feed motor detected by the grinding feed load current value detection unit when the grinding means is fed at a constant speed by the grinding feed means to grind a plate-shaped workpiece is used. When the value exceeds a preset value, it is determined that the electrode is exposed on the surface to be ground of the plate-shaped work at a predetermined area ratio, the grinding process is terminated, and the cutting process is switched to the cutting process to produce a plate-shaped work having a predetermined thickness. Processing equipment to form .

Images