TW202240750A - Transport deviation amount detection method capable of easily obtaining the transport deviation amount of a transport unit - Google Patents

Transport deviation amount detection method capable of easily obtaining the transport deviation amount of a transport unit Download PDF

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TW202240750A
TW202240750A TW111110550A TW111110550A TW202240750A TW 202240750 A TW202240750 A TW 202240750A TW 111110550 A TW111110550 A TW 111110550A TW 111110550 A TW111110550 A TW 111110550A TW 202240750 A TW202240750 A TW 202240750A
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workbench
workpiece
unit
conveyance
transport
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宮田諭
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)

Abstract

An object of the present invention is to provide a transport deviation amount detection method capable of easily obtaining the transport deviation amount of a transport unit. To achieve the object, a transport deviation amount detection method includes the following steps: a first coordinate storing step for holding a work-piece on which a mark M is formed on a first work table, photographing the work-piece with a photograph unit, and storing the coordinates of the mark M as X1 and Y1 coordinates; a 180-degree rotation step, in which the work-piece held on the first work table is transported to and held on the second work table by the transport unit, and the second work table is rotated 180 degrees; a return step for using the transport unit to transport the work-piece held on the second work table to the first work table and hold the work-piece there; a second coordinate storing step for rotating the first work-piece by 180 degrees, photographing the work-piece with the photograph unit, and storing the coordinates of the mark M as X2 and Y2 coordinates; and a transport deviation amount calculation step for calculating (X2-X1)/2 as the transport deviation amount in the X-axis direction and calculating (Y2-Y1)/2 as the Y-axis direction transport deviation amount.

Description

搬送偏離量檢測方法Detection method of conveyance deviation

本發明是有關於一種求出將工件從第1工作台搬送至第2工作台之搬送組件的搬送偏離量之搬送偏離量檢測方法。The present invention relates to a method for detecting the amount of deviation in transport for obtaining the amount of deviation in transport of a transport unit that transports a workpiece from a first workbench to a second workbench.

將IC、LSI等的複數個器件以分割預定線來區劃而形成在正面之晶圓，可藉由切割裝置而被分割成一個個的器件晶片，並且可將已分割之各器件晶片應用在行動電話、個人電腦等的電氣機器上。A wafer formed on the front side by dividing a plurality of devices such as IC, LSI, etc. by dividing predetermined lines can be divided into individual device wafers by a dicing device, and the divided device wafers can be used in mobile Electrical equipment such as telephones and personal computers.

切割裝置大致由工作夾台、切削組件、X軸進給組件、Y軸進給組件、拍攝組件、洗淨組件與搬送組件所構成，且可以高精度地切削晶圓，前述工作夾台會保持晶圓，前述切削組件對已保持在工作夾台之晶圓進行切削，前述X軸進給組件將工作夾台與切削組件在X軸方向上相對地加工進給，前述Y軸進給組件將工作夾台與切削組件在Y軸方向上相對地分度進給，前述拍攝組件對已保持在工作夾台之晶圓進行拍攝而檢測應切削之區域，前述洗淨組件將切削完畢之晶圓洗淨，前述搬送組件將晶圓從工作夾台搬送到洗淨組件(參照例如專利文獻1)。切割裝置的洗淨組件包含可保持並旋轉晶圓之旋轉工作台、及對已保持在旋轉工作台之晶圓噴射洗淨液之洗淨液噴射噴嘴。 先前技術文獻 專利文獻 The cutting device is roughly composed of a work clamp, a cutting unit, an X-axis feed unit, a Y-axis feed unit, a camera unit, a cleaning unit, and a transfer unit, and can cut wafers with high precision. The aforementioned work clamp will maintain Wafer, the aforementioned cutting assembly cuts the wafer that has been held on the work clamp, the aforementioned X-axis feed assembly processes and feeds the work clamp and the cutting assembly in the X-axis direction, and the aforementioned Y-axis feed assembly will The work clamp and the cutting unit are indexed and fed in the Y-axis direction relative to each other. The aforementioned photographing unit photographs the wafer held on the work clamp to detect the area to be cut, and the aforementioned cleaning unit captures the wafer that has been cut. For cleaning, the transfer unit transports the wafer from the chuck to the cleaning unit (see, for example, Patent Document 1). The cleaning unit of the dicing device includes a rotary table capable of holding and rotating wafers, and a cleaning liquid injection nozzle for spraying cleaning liquid on the wafer held on the rotary table. prior art literature patent documents

專利文獻1：日本特開2010-36275號公報Patent Document 1: Japanese Patent Laid-Open No. 2010-36275

發明欲解決之課題The problem to be solved by the invention

但是，在無法藉由搬送組件將已保持在切割裝置的工作夾台的適當的位置之晶圓搬送至洗淨組件的旋轉工作台的適當的位置之情況下，會有因旋轉工作台的高速旋轉而導致晶圓從旋轉工作台飛散之疑慮。因此，必須實測從工作夾台到旋轉工作台的方向以及距離，並微調整搬送組件的搬送方向以及搬送距離，但是會有在像這樣的微調整上較耗工費時而生產性變差之問題。However, when the wafer held at the appropriate position of the work chuck of the dicing device cannot be transferred to the appropriate position of the rotary table of the cleaning assembly by the transfer unit, there will be problems due to the high speed of the rotary table. Concerns about spinning wafers flying off the rotary table. Therefore, it is necessary to measure the direction and distance from the work clamp table to the rotary table, and fine-tune the conveying direction and conveying distance of the conveying unit, but there is a problem that such fine-tuning is time-consuming and labor-intensive, resulting in poor productivity. .

所述之問題在具備有在2個以上的工作台之間搬送晶圓之機構的各種處理裝置(例如雷射加工裝置、磨削裝置、檢查裝置)上也可能發生。The above-mentioned problems may also occur in various processing apparatuses (for example, laser processing apparatuses, grinding apparatuses, and inspection apparatuses) equipped with mechanisms for transferring wafers between two or more stages.

有鑒於上述事實而作成的本發明之課題在於提供一種可以容易地求出搬送組件的搬送偏離量之搬送偏離量檢測方法。 用以解決課題之手段 The object of this invention made|formed in view of the above-mentioned fact is to provide the conveyance deviation amount detection method which can obtain|require easily the conveyance deviation amount of a conveyance unit. means to solve problems

根據本發明，可提供一種解決上述課題之以下的搬送偏離量檢測方法。亦即，可提供一種搬送偏離量檢測方法，在對工件施行處理之處理裝置中求出搬送組件的搬送偏離量，前述處理裝置至少具備可旋轉的第1工作台、可旋轉的第2工作台、將工件從該第1工作台搬送到該第2工作台之該搬送組件、與對已保持在該第1工作台之工件進行拍攝之拍攝組件，前述搬送偏離量檢測方法包含以下步驟： 第1座標記憶步驟，使形成有標記之工件保持於該第1工作台並以該拍攝組件拍攝且將標記的座標記憶為X1、Y1座標； 180度旋轉步驟，藉由該搬送組件將已保持在該第1工作台之工件搬送到該第2工作台並予以保持，且讓該第2工作台旋轉180度； 返回步驟，藉由該搬送組件將已保持在該第2工作台之工件搬送到該第1工作台並予以保持； 第2座標記憶步驟，使該第1工作台旋轉180度再以該拍攝組件拍攝工件，且將標記的座標記憶為X2、Y2座標；及 搬送偏離量計算步驟，將(X2-X1)/2計算為X軸方向的搬送偏離量，並將(Y2-Y1)/2計算為Y軸方向的搬送偏離量。 According to the present invention, it is possible to provide a method of detecting the amount of deviation in conveyance that solves the following problems. That is, it is possible to provide a method for detecting the amount of deviation in conveyance, in which the amount of deviation in conveyance of the conveyance unit is obtained in a processing device for processing a workpiece, the processing device having at least a first rotatable table and a second rotatable table . The conveying assembly for conveying the workpiece from the first workbench to the second workbench, and the photographing assembly for photographing the workpiece held on the first workbench. The method for detecting the amount of conveyance deviation includes the following steps: The first coordinate memory step is to keep the marked workpiece on the first workbench and take pictures with the camera unit, and memorize the marked coordinates as X1 and Y1 coordinates; The 180-degree rotation step is to transfer the workpiece held on the first workbench to the second workbench by the conveying component and hold it, and rotate the second workbench by 180 degrees; Returning to the step of transporting the workpiece held on the second workbench to the first workbench by the conveying component and keeping it there; In the second coordinate memory step, the first workbench is rotated 180 degrees, and the workpiece is photographed by the photographing unit, and the marked coordinates are memorized as X2 and Y2 coordinates; and In the conveyance deviation calculation step, (X2-X1)/2 is calculated as the conveyance deviation in the X-axis direction, and (Y2-Y1)/2 is calculated as the conveyance deviation in the Y-axis direction.

較佳的是，將(X2-X1)/2與(Y2-Y1)/2和該搬送組件的移動量相加來補正搬送偏離。 發明效果 It is preferable to add (X2-X1)/2 and (Y2-Y1)/2 to the movement amount of the conveyance unit to correct the conveyance deviation. Invention effect

本發明的搬送偏離量檢測方法由於是在對工件施行處理之處理裝置中求出該搬送組件的搬送偏離量，前述處理裝置至少具備可旋轉的第1工作台、可旋轉的第2工作台、將工件從該第1工作台搬送到該第2工作台之搬送組件、與對已保持在該第1工作台之工件進行拍攝之拍攝組件，且前述搬送偏離量檢測方法包含以下步驟：第1座標記憶步驟，使形成有標記之工件保持於該第1工作台並以該拍攝組件拍攝且將標記的座標記憶為X1、Y1座標；180度旋轉步驟，藉由該搬送組件將已保持在該第1工作台之工件搬送到該第2工作台並予以保持，且讓該第2工作台旋轉180度；返回步驟，藉由該搬送組件將已保持在該第2工作台之工件搬送到該第1工作台並予以保持；第2座標記憶步驟，使該第1工作台旋轉180度再以該拍攝組件拍攝工件，且將標記的座標記憶為X2、Y2座標；及搬送偏離量計算步驟，將(X2-X1)/2計算為X軸方向的搬送偏離量，並將(Y2-Y1)/2計算為Y軸方向的搬送偏離量，因此可以在毋須對從第1工作台到第2工作台的方向以及距離進行實測的情形下，容易地從標記的座標之偏離求出搬送組件的搬送偏離量。The method for detecting the amount of conveyance deviation of the present invention is to obtain the amount of conveyance deviation of the conveyance unit in the processing device that processes the workpiece. The processing device at least includes a rotatable first table, a rotatable second table, The conveying unit that transports the workpiece from the first workbench to the second workbench, and the photographing unit that photographs the workpiece held on the first workbench, and the method for detecting the amount of deviation in conveyance includes the following steps: 1. The coordinate memory step is to keep the marked workpiece on the first workbench and take pictures with the shooting unit and memorize the marked coordinates as X1 and Y1 coordinates; the 180-degree rotation step is to use the transport unit to hold the workpiece on the first workbench. The workpiece of the first workbench is transported to the second workbench and held, and the second workbench is rotated 180 degrees; return to the step, and the workpiece held on the second workbench is conveyed to the second workbench by the conveying component The first workbench is maintained; the second coordinate memory step is to rotate the first workbench by 180 degrees and then use the photographing unit to photograph the workpiece, and memorize the marked coordinates as X2 and Y2 coordinates; and the step of calculating the amount of conveyance deviation, Calculate (X2-X1)/2 as the conveying deviation in the X-axis direction, and (Y2-Y1)/2 as the conveying deviation in the Y-axis direction, so it is possible to move from the first table to the second When the direction and distance of the table are actually measured, it is easy to obtain the amount of conveyance deviation of the conveyance unit from the deviation of the marked coordinates.

用以實施發明之形態form for carrying out the invention

以下，一面參照圖式一面說明本發明的搬送偏離量檢測方法之理想的實施形態。Hereinafter, a preferred embodiment of the conveyance deviation detection method of the present invention will be described with reference to the drawings.

首先，從可實施本發明的搬送偏離量檢測方法之處理裝置開始說明。圖1所示之處理裝置2至少具備可旋轉的第1工作台4、可旋轉的第2工作台6、將工件從第1工作台4搬送到第2工作台6之搬送組件8、與對已保持在第1工作台4之工件進行拍攝的拍攝組件10。First, the description will start with a processing device capable of implementing the method for detecting the amount of conveyance deviation of the present invention. The processing device 2 shown in Fig. 1 at least comprises a rotatable first workbench 4, a rotatable second workbench 6, a transfer assembly 8 for transferring workpieces from the first workbench 4 to the second workbench 6, and the corresponding The photographing unit 10 for photographing the workpiece held on the first workbench 4.

圓形的第1工作台4形成為：藉由X軸搬送組件(未圖示)而在圖1中以箭頭X所示之X軸方向上被搬送，並且藉由第1工作台用馬達(未圖示)而以第1工作台4的中心C1(參照圖3)作為軸心來旋轉。X軸搬送組件亦可為例如以下之構成：具有連結於第1工作台4且在X軸方向上延伸之滾珠螺桿、及使此滾珠螺桿旋轉之馬達。再者，於圖1中以箭頭Y表示之Y軸方向是和X軸方向正交之方向，X軸方向以及Y軸方向所規定之XY平面實質上是水平的。The circular first workbench 4 is formed to be conveyed in the X-axis direction shown by arrow X in FIG. not shown) and rotates around the center C1 (see FIG. 3 ) of the first table 4 as an axis. The X-axis conveyance unit may have, for example, a configuration including a ball screw connected to the first table 4 and extending in the X-axis direction, and a motor that rotates the ball screw. Furthermore, the Y-axis direction indicated by the arrow Y in FIG. 1 is a direction perpendicular to the X-axis direction, and the XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

如圖1所示，在第1工作台4的上端部分配置有已連接到吸引組件(未圖示)之多孔質的圓形狀吸附夾頭4a。並且，第1工作台4形成為藉由以吸引組件在吸附夾頭4a生成吸引力，而吸引保持圓板狀的半導體晶圓等之工件W(參照圖2)。再者，圖示之實施形態的處理裝置2是對工件W施行切削加工之切割裝置，第1工作台4在對工件W施行切削加工時會吸引保持工件W。As shown in FIG. 1 , a porous circular suction chuck 4 a connected to a suction unit (not shown) is disposed on the upper end portion of the first table 4 . Furthermore, the first table 4 is formed to suck and hold a workpiece W such as a disc-shaped semiconductor wafer by generating a suction force on the suction chuck 4a with a suction unit (see FIG. 2 ). Furthermore, the processing device 2 of the illustrated embodiment is a cutting device for cutting the workpiece W, and the first table 4 attracts and holds the workpiece W when the workpiece W is cut.

圖示之實施形態的第2工作台6是在將已施行切削加工且附著有切削屑之工件W洗淨時，吸引保持工件W之旋轉工作台。圓形的第2工作台6形成為藉由第2工作台用馬達(未圖示)而以第2工作台6的中心C2(參照圖3)作為軸心來旋轉。The second table 6 in the illustrated embodiment is a rotary table for sucking and holding the workpiece W when cleaning the workpiece W that has been machined and to which cutting chips are attached. The circular second table 6 is formed to be rotated around the center C2 (see FIG. 3 ) of the second table 6 by a second table motor (not shown).

如圖1所示，在第2工作台6的上端部分和第1工作台4同樣地，配置有已連接到吸引組件(未圖示)之多孔質的圓形狀吸附夾頭6a。並且，在第2工作台6中，也是藉由以吸引組件在吸附夾頭6a生成吸引力來吸引保持工件W。又，可以藉由一邊使吸引保持有工件W之第2工作台6旋轉，一邊從洗淨液噴射噴嘴(未圖示)對工件W噴射洗淨液，來洗淨工件W。As shown in FIG. 1, on the upper end portion of the second table 6, similarly to the first table 4, a porous circular suction chuck 6a connected to a suction unit (not shown) is arranged. In addition, also in the second table 6, the workpiece W is sucked and held by generating a suction force on the suction chuck 6a by the suction unit. Further, the workpiece W can be cleaned by spraying a cleaning solution from a cleaning solution injection nozzle (not shown) onto the workpiece W while rotating the second table 6 holding the workpiece W by suction.

圖示之實施形態的搬送組件8包含：將已保持在第1工作台4之工件W朝X軸方向搬送之上述X軸搬送組件、及將已保持在第1工作台4之工件W保持並使其升降，並且朝Y軸方向搬送之Y軸搬送組件11。The transfer unit 8 of the illustrated embodiment includes: the above-mentioned X-axis transfer unit for transferring the workpiece W held on the first table 4 in the X-axis direction; Make it go up and down, and the Y-axis conveying unit 11 that is conveyed in the Y-axis direction.

Y軸搬送組件11包含在Y軸方向上移動自如之臂12、使臂12在Y軸方向上移動之臂移動組件(未圖示)、裝設在臂12的前端下表面之托架片14、固定在托架片14的下表面之H形狀的板件16、及配置在板件16的下表面之複數個吸引墊18。臂移動組件亦可為例如具有滾珠螺桿與馬達之構成，前述滾珠螺桿連結於臂12且在Y軸方向上延伸，前述馬達使此滾珠螺桿旋轉。托架片14是藉由氣缸等之合宜的致動器而構成為朝上下方向伸縮自如。又，各吸引墊18已連接到吸引組件(未圖示)。The Y-axis conveying unit 11 includes an arm 12 that can move freely in the Y-axis direction, an arm moving unit (not shown) that moves the arm 12 in the Y-axis direction, and a bracket piece 14 installed on the lower surface of the front end of the arm 12. , an H-shaped plate 16 fixed to the lower surface of the bracket piece 14 , and a plurality of suction pads 18 disposed on the lower surface of the plate 16 . The arm moving unit may also include, for example, a ball screw that is connected to the arm 12 and extends in the Y-axis direction, and a motor that rotates the ball screw. The bracket piece 14 is configured to be freely expandable and contractible in the vertical direction by an appropriate actuator such as an air cylinder. Also, each suction pad 18 has been connected to a suction assembly (not shown).

在搬送組件8中，是在以X軸搬送組件將第1工作台4定位到預定的搬送開始位置後，以Y軸搬送組件11的吸引墊18吸引保持第1工作台4上之工件W，而從第1工作台4接收工件W。並且，接收到工件W之Y軸搬送組件11形成為：使臂12以及托架片14移動，而將工件W從第1工作台4搬送到第2工作台6。In the transport unit 8, after the first workbench 4 is positioned to the predetermined transport start position by the X-axis transport unit, the workpiece W on the first workbench 4 is sucked and held by the suction pad 18 of the Y-axis transport unit 11, On the other hand, the workpiece W is received from the first table 4 . Furthermore, the Y-axis transfer unit 11 that receives the workpiece W is configured to move the arm 12 and the carrier piece 14 to transfer the workpiece W from the first table 4 to the second table 6 .

拍攝組件10形成為：對已藉由X軸搬送組件而被定位到預定的拍攝位置之第1工作台4上之工件W進行拍攝。可將藉由此拍攝組件10所拍攝到的圖像資料傳送到處理裝置2的控制組件(未圖示)。The imaging unit 10 is formed to photograph the workpiece W on the first table 4 positioned to a predetermined imaging position by the X-axis transfer unit. The image data captured by the photographing component 10 can be sent to the control component (not shown) of the processing device 2 .

由電腦所構成之控制組件包含依照控制程式進行運算處理之中央處理裝置(CPU)、保存控制程式等之唯讀記憶體(ROM)與保存運算結果等之可讀寫的隨機存取記憶體(RAM)。並且，在控制組件中形成為對從拍攝組件10所傳送來之圖像資料執行圖像解析，而取得並記憶例如形成於工件W之標記M(參照圖2)的X座標以及Y座標。又，控制組件是形成為控制處理裝置2的作動，且作為其中一例，是因應於預先輸入控制組件之條件來控制搬送組件8的移動量。The control unit composed of a computer includes a central processing unit (CPU) that performs calculation processing according to the control program, a read-only memory (ROM) that stores the control program, etc., and a readable and writable random access memory ( that stores the calculation results, etc. RAM). In addition, the control unit is configured to perform image analysis on the image data sent from the imaging unit 10 to obtain and store, for example, the X and Y coordinates of the mark M (see FIG. 2 ) formed on the workpiece W. In addition, the control unit is formed to control the operation of the processing device 2, and as an example, controls the movement amount of the transport unit 8 in response to the conditions input to the control unit in advance.

如圖1所示，處理裝置2更具備切削組件20、片匣台24、搬出入組件28與移動組件30，前述切削組件20對已保持在第1工作台4之工件W進行切削，前述片匣台24升降自如且供容置有複數個工件W之片匣22放置，前述搬出入組件28從片匣22將加工前的工件W拉出並搬出至暫置工作台26，並且將已定位在暫置工作台26之加工完畢的工件W搬入片匣22，前述移動組件30使已從片匣22搬出至暫置工作台26之加工前的工件W移動到第1工作台4。As shown in FIG. 1 , the processing device 2 further includes a cutting assembly 20, a cassette table 24, a loading/unloading assembly 28, and a moving assembly 30. The cutting assembly 20 cuts the workpiece W held on the first workbench 4. Cassette table 24 is free to lift and is used for placing cassettes 22 containing a plurality of workpieces W. The aforementioned carry-in/out component 28 pulls out workpieces W before processing from cassette 22 and carries them out to temporary workbench 26, and places them The processed workpiece W on the temporary table 26 is loaded into the cassette 22 , and the moving unit 30 moves the unprocessed workpiece W from the cassette 22 to the temporary table 26 to the first table 4 .

其次，說明在上述的處理裝置2中求出搬送組件8的搬送偏離量之搬送偏離量檢測方法。在圖示之實施形態中，首先是實施第1座標記憶步驟，前述第1座標記憶步驟是將形成有標記M之工件W保持於第1工作台4並以拍攝組件10拍攝且將標記M的座標記憶為X1、Y1座標。Next, a method for detecting the amount of deviation in transport for obtaining the amount of deviation in transport of the transport unit 8 in the processing device 2 described above will be described. In the illustrated embodiment, firstly, the first coordinate memory step is implemented. The aforementioned first coordinate memory step is to hold the workpiece W on which the mark M is formed on the first workbench 4 and use the imaging unit 10 to photograph the work W of the mark M. Coordinate memory is X1, Y1 coordinates.

在第1座標記憶步驟中，首先是以將形成有標記M之面朝向上方之狀態，來將工件W載置於第1工作台4。接著，藉由X軸搬送組件使第1工作台4移動，並將第1工作台4定位到預定的拍攝位置，且以拍攝組件10對已保持在第1工作台4之工件W進行拍攝。然後，藉由控制組件對以拍攝組件10所拍攝到的圖像執行圖像解析，並將標記M的座標取得並記憶為X1、Y1座標(參照圖4)。In the first coordinate memorizing step, first, the workpiece W is placed on the first table 4 with the surface on which the mark M is formed facing upward. Next, the first worktable 4 is moved by the X-axis conveying unit, and the first workbench 4 is positioned to a predetermined shooting position, and the workpiece W held on the first workbench 4 is photographed by the photographing unit 10 . Then, the control unit performs image analysis on the image captured by the photographing unit 10, and obtains and stores the coordinates of the mark M as X1 and Y1 coordinates (refer to FIG. 4 ).

在實施第1座標記憶步驟後，實施180度旋轉步驟，前述180度旋轉步驟是藉由搬送組件8將已保持在第1工作台4之工件W搬送到第2工作台6並予以保持，且讓第2工作台6旋轉180度。After the first coordinate memorization step is implemented, the 180-degree rotation step is implemented. The aforementioned 180-degree rotation step is to transport the workpiece W held on the first workbench 4 to the second workbench 6 by the transport assembly 8 and hold it there, and Let the second table 6 rotate 180 degrees.

在180度旋轉步驟中，首先是藉由X軸搬送組件使第1工作台4移動，並將第1工作台4定位到預定的搬送開始位置。將第1工作台4定位到搬送開始位置後，使Y軸搬送組件11的臂12以及托架片14作動，而使吸引墊18密合於第1工作台4上之工件W的上表面。接著，以各吸引墊18吸引保持工件W，並且解除第1工作台4的吸引力。In the 180-degree rotation step, first, the first workbench 4 is moved by the X-axis conveyance assembly, and the first workbench 4 is positioned to a predetermined conveyance start position. After positioning the first workbench 4 to the conveyance start position, the arm 12 and the bracket piece 14 of the Y-axis conveyance unit 11 are actuated to make the suction pad 18 closely adhere to the upper surface of the workpiece W on the first workbench 4 . Next, the workpiece W is sucked and held by the suction pads 18, and the suction force of the first table 4 is released.

接著，藉由使Y軸搬送組件11的臂12以及托架片14作動，而從第1工作台4將工件W搬送到第2工作台6，並使工件W的下表面接觸於第2工作台6的上表面。接著，藉由第2工作台6吸引保持工件W，並且解除吸引墊18的吸引力。如此進行，而將工件W從Y軸搬送組件11交接至第2工作台6(參照圖5)。然後，已將工件W交接至第2工作台6後，使第2工作台用馬達作動，而如圖6所示，使吸引保持有工件W之第2工作台6旋轉180度。Next, by actuating the arm 12 and the bracket piece 14 of the Y-axis conveying unit 11, the workpiece W is transferred from the first table 4 to the second table 6, and the lower surface of the workpiece W is brought into contact with the second table. The upper surface of platform 6. Next, the workpiece W is sucked and held by the second table 6, and the suction force of the suction pad 18 is released. In this way, the workpiece W is transferred from the Y-axis transfer unit 11 to the second table 6 (see FIG. 5 ). Then, after the workpiece W has been delivered to the second table 6, the motor for the second table is activated to rotate the second table 6 holding the workpiece W by 180 degrees as shown in FIG. 6 .

實施了180度旋轉步驟後，實施返回步驟，前述返回步驟是藉由搬送組件8將已保持在第2工作台6之工件W搬送至第1工作台4並予以保持。After the 180-degree rotation step is performed, the return step is performed. The aforementioned return step is to transport the workpiece W held on the second workbench 6 to the first workbench 4 by the transport unit 8 and hold it there.

在返回步驟中，首先是使Y軸搬送組件11的吸引墊18密合於第2工作台6上的工件W的上表面，並以各吸引墊18吸引保持工件W，並且解除第2工作台6的吸引力。接著，藉由使臂12以及托架片14作動，而從第2工作台6將工件W搬送到第1工作台4，且使工件W的下表面接觸於第1工作台4的上表面。然後，如圖7所示，藉由第1工作台4吸引保持工件W，並且解除吸引墊18的吸引力。如此進行，而讓工件W從第2工作台6返回到第1工作台4。In the return step, firstly, the suction pads 18 of the Y-axis conveying unit 11 are brought into close contact with the upper surface of the workpiece W on the second table 6, and the workpiece W is sucked and held by each suction pad 18, and the second table is released. 6 attractions. Next, the workpiece W is transferred from the second table 6 to the first table 4 by actuating the arm 12 and the bracket piece 14 , and the lower surface of the workpiece W is brought into contact with the upper surface of the first table 4 . Then, as shown in FIG. 7 , the workpiece W is suction-held by the first table 4 , and the suction force of the suction pad 18 is released. In this way, the workpiece W is returned from the second table 6 to the first table 4 .

已實施返回步驟後，實施第2座標記憶步驟，前述第2座標記憶步驟是使第1工作台4旋轉180度再以拍攝組件10拍攝工件W，且將標記M的座標記憶為X2、Y2座標。After the return step has been implemented, the second coordinate memory step is implemented. The aforementioned second coordinate memory step is to rotate the first workbench 4 by 180 degrees and then use the imaging unit 10 to photograph the workpiece W, and store the coordinates of the mark M as X2 and Y2 coordinates .

在第2座標記憶步驟中，首先是如圖8所示，使第1工作台用馬達作動，而使吸引保持有工件W之第1工作台4旋轉180度。接著，藉由X軸搬送組件使第1工作台4移動，並將第1工作台4定位到預定的拍攝位置，且以拍攝組件10對已保持在第1工作台4之工件W進行拍攝。然後，藉由控制組件對以拍攝組件10所拍攝到的圖像執行圖像解析，並將標記M的座標取得且記憶為X2、Y2座標(參照圖8)。In the second coordinate memory step, first, as shown in FIG. 8 , the motor for the first table is activated to rotate the first table 4 holding the workpiece W by 180 degrees. Next, the first worktable 4 is moved by the X-axis conveying unit, and the first workbench 4 is positioned to a predetermined shooting position, and the workpiece W held on the first workbench 4 is photographed by the photographing unit 10 . Then, the control unit performs image analysis on the image captured by the photographing unit 10, and obtains and stores the coordinates of the mark M as X2 and Y2 coordinates (refer to FIG. 8 ).

實施第2座標記憶步驟後，實施搬送偏離量計算步驟，前述搬送偏離量計算步驟是將(X2-X1)/2計算為X軸方向的搬送偏離量，並將(Y2-Y1)/2計算為Y軸方向的搬送偏離量。在圖示之實施形態中，搬送偏離量之計算是藉由控制組件來進行。After implementing the second coordinate memory step, carry out the calculation step of the conveyance deviation amount. The aforementioned calculation step of the conveyance deviation amount is to calculate (X2-X1)/2 as the conveyance deviation amount in the X-axis direction, and calculate (Y2-Y1)/2 It is the amount of conveyance deviation in the Y-axis direction. In the illustrated embodiment, the calculation of the conveyance deviation is performed by the control unit.

在圖示之實施形態中，如上述，由於是使已從第1工作台4搬送到第2工作台6之工件W在第2工作台6旋轉180度，並且使已從第2工作台6搬送(返回)至第1工作台4之工件W在第1工作台4旋轉180度，因此在由搬送組件8所形成之搬送偏離存在的情況下，搬送前之標記M的座標(X1﹐Y1)與搬送後之標記M的座標(X2﹐Y2)之距離會成為搬送組件8的搬送偏離量的2倍。因此，可以藉由執行(X2-X1)/2以及(Y2-Y1)/2之運算，來求出X軸方向以及Y軸方向的每一個方向的搬送偏離量。再者，在沒有由搬送組件8所形成之搬送偏離的情況下，搬送前之標記M的座標(X1﹐Y1)與搬送後之標記M的座標(X2﹐Y2)會一致。In the illustrated embodiment, as described above, since the workpiece W that has been transferred from the first workbench 4 to the second workbench 6 is rotated by 180 degrees on the second workbench 6, and the workpiece W that has been transferred from the second workbench 6 The workpiece W transported (returned) to the first table 4 is rotated by 180 degrees on the first table 4. Therefore, in the case of a transport deviation formed by the transport unit 8, the coordinates of the mark M before transport (X1, Y1 ) and the coordinates (X2, Y2) of the mark M after conveyance will be twice the conveyance deviation amount of the conveyance unit 8 . Therefore, by performing calculations of (X2-X1)/2 and (Y2-Y1)/2, the amount of conveyance deviation in each of the X-axis direction and the Y-axis direction can be obtained. Furthermore, if there is no transport deviation caused by the transport unit 8, the coordinates (X1, Y1) of the mark M before transport and the coordinates (X2, Y2) of the mark M after transport will coincide.

已實施搬送偏離量計算步驟後，宜將(X2-X1)/2與(Y2-Y1)/2和搬送組件8的移動量相加來補正搬送偏離。在圖示之實施形態中，由於在從第1工作台4將工件W搬送至第2工作台6時，X軸搬送組件會將工件W朝X軸方向搬送，且Y軸搬送組件11會將工件W朝Y軸方向以及上下方向搬送，所以將X軸方向的搬送偏離量和X軸搬送組件的移動量相加，並將Y軸方向的搬送偏離量和Y軸搬送組件11的移動量相加。藉此，可以防止從第1工作台4將工件W搬送至第2工作台6時發生搬送偏離之情形，且可以將工件W載置在第2工作台6的適當的位置。After the calculation of the amount of conveyance deviation has been carried out, it is preferable to add (X2-X1)/2 and (Y2-Y1)/2 and the movement amount of the conveyance assembly 8 to correct the conveyance deviation. In the illustrated embodiment, when the workpiece W is transferred from the first table 4 to the second table 6, the X-axis conveying assembly will convey the workpiece W in the X-axis direction, and the Y-axis conveying assembly 11 will transfer the workpiece W to the second table 6. The workpiece W is conveyed in the Y-axis direction and the up-and-down direction, so the conveyance deviation in the X-axis direction is added to the movement amount of the X-axis conveyance assembly, and the conveyance deviation in the Y-axis direction is compared with the movement amount of the Y-axis conveyance assembly 11. add. Thereby, it is possible to prevent the workpiece W from being transported from the first table 4 to the second table 6 and to place the workpiece W at an appropriate position on the second table 6 while the workpiece W is transferred from the second table 6 to the second table 6 .

如以上所述，在圖示之實施形態中，由於包含以下步驟：第1座標記憶步驟，使形成有標記M之工件W保持於第1工作台4並以拍攝組件10拍攝且將標記M的座標記憶為X1、Y1座標；180度旋轉步驟，藉由搬送組件8將已保持在第1工作台4之工件W搬送到第2工作台6並予以保持，且讓第2工作台6旋轉180度；返回步驟，藉由搬送組件8將已保持在第2工作台6之工件W搬送到第1工作台4並予以保持；第2座標記憶步驟，使第1工作台4旋轉180度再以拍攝組件10拍攝工件W，且將標記M的座標記憶為X2、Y2座標；及搬送偏離量計算步驟，將(X2-X1)/2計算為X軸方向的搬送偏離量，並將(Y2-Y1)/2計算為Y軸方向的搬送偏離量，因此可以容易地求出搬送組件8的搬送偏離量。As mentioned above, in the illustrated embodiment, since the following steps are included: the first coordinate memory step, the workpiece W formed with the mark M is held on the first workbench 4 and photographed by the imaging unit 10 and the position of the mark M is captured. The coordinates are stored as X1 and Y1 coordinates; the 180-degree rotation step is to transport the workpiece W held on the first workbench 4 to the second workbench 6 by the conveying component 8 and keep it, and let the second workbench 6 rotate 180° degree; the return step, the workpiece W that has been held on the second workbench 6 is transported to the first workbench 4 by the transport assembly 8 and held; the second coordinate memory step is to rotate the first workbench 4 by 180 degrees and then use The photographing assembly 10 photographs the workpiece W, and memorizes the coordinates of the mark M as X2 and Y2 coordinates; and the calculation step of the amount of conveyance deviation, calculates (X2-X1)/2 as the amount of conveyance deviation in the X-axis direction, and (Y2- Y1)/2 is calculated as the amount of conveyance deviation in the Y-axis direction, so the amount of conveyance deviation of the conveyance unit 8 can be easily obtained.

再者，針對X軸方向以及Y軸方向的搬送偏離量，亦可和圖示之實施形態為相反而設為(X1-X2)/2、(Y1-Y2)/2。這是因為X1與X2之差的一半、以及Y1與Y2之差的一半為搬送偏離量，且所計算出之數值的符號為正(加號)、或為負(減號)，是表示產生有搬送偏離之方向。Furthermore, the amount of conveyance deviation in the X-axis direction and the Y-axis direction may be set as (X1-X2)/2, (Y1-Y2)/2 in reverse to the illustrated embodiment. This is because half of the difference between X1 and X2, and half of the difference between Y1 and Y2 is the conveying deviation, and the sign of the calculated value is positive (plus sign) or negative (minus sign), which means There is a direction in which the conveyance deviates.

又，在圖示之實施形態中，雖然說明了作為對工件W施行切削加工之切割裝置而構成有處理裝置2的例子，但本發明只要是具備在2個以上的工作台之間搬送半導體晶圓等工件之搬送組件的構成即可，且可放在包含以下裝置之各種處理裝置中實施：對工件施行雷射加工之雷射加工裝置、對工件施行磨削加工之磨削裝置、檢查工件之檢查裝置。In addition, in the illustrated embodiment, although the example in which the processing device 2 is configured as a cutting device for performing cutting processing on the workpiece W has been described, the present invention only needs to be able to transport semiconductor wafers between two or more work tables. The composition of the conveying unit for workpieces such as circles is enough, and it can be implemented in various processing devices including the following devices: laser processing equipment for laser processing on workpieces, grinding equipment for grinding workpieces, inspection of workpieces The inspection device.

2:處理裝置 4:第1工作台 4a,6a:吸附夾頭 6:第2工作台 8:搬送組件 10:拍攝組件 11:Y軸搬送組件 12:臂 14:托架片 16:板件 18:吸引墊 20:切削組件 22:片匣 24:片匣台 26:暫置工作台 28:搬出入組件 30:移動組件 C1,C2:中心 M:標記 W:工件 X1,X2,Y1,Y2:座標 X,Y:方向 2: Processing device 4: The first workbench 4a, 6a: adsorption chuck 6: The second workbench 8: Moving components 10: Shooting components 11: Y-axis conveying component 12: arm 14: bracket piece 16: board 18: Attraction pad 20: Cutting components 22: Cassette 24: Cassette table 26: Temporary workbench 28: Moving in and out of components 30: Mobile components C1, C2: center M: mark W: Workpiece X1, X2, Y1, Y2: coordinates X, Y: direction

圖1是可實施本發明的搬送偏離量檢測方法之處理裝置的立體圖。 圖2是形成有標記之工件的平面圖。 圖3是圖1所示之第1/第2工作台的示意的平面圖。 圖4是第1座標記憶步驟中的第1/第2工作台的示意的平面圖。 圖5是顯示藉由搬送組件將已保持在第1工作台之工件搬送到第2工作台並予以保持之狀態的示意的平面圖。 圖6是顯示從圖5所示之狀態使第2工作台旋轉了180度之狀態的示意的平面圖。 圖7是顯示藉由搬送組件將已保持在第2工作台之工件搬送到第1工作台並予以保持之狀態的示意的平面圖。 圖8是顯示從圖7所示之狀態使第1工作台旋轉了180度之狀態的示意的平面圖。 FIG. 1 is a perspective view of a processing device capable of implementing the method for detecting the amount of conveyance deviation of the present invention. Fig. 2 is a plan view of a workpiece on which marks are formed. Fig. 3 is a schematic plan view of the first/second workbench shown in Fig. 1 . Fig. 4 is a schematic plan view of a first/second table in a first coordinate memorizing step. Fig. 5 is a schematic plan view showing a state in which a workpiece held on the first table is transferred to and held by the transfer unit on the second table. Fig. 6 is a schematic plan view showing a state in which the second table has been rotated 180 degrees from the state shown in Fig. 5 . Fig. 7 is a schematic plan view showing a state in which a workpiece held on the second table is transferred to and held by the transfer unit on the first table. Fig. 8 is a schematic plan view showing a state in which the first table has been rotated 180 degrees from the state shown in Fig. 7 .

2:處理裝置 2: Processing device

4:第1工作台 4: The first workbench

4a,6a:吸附夾頭 4a, 6a: adsorption chuck

6:第2工作台 6: The second workbench

8:搬送組件 8: Moving components

10:拍攝組件 10: Shooting components

11:Y軸搬送組件 11: Y-axis conveying components

12:臂 12: arm

14:托架片 14: bracket piece

16:板件 16: board

18:吸引墊 18: Attraction pad

20:切削組件 20: Cutting components

22:片匣 22: Cassette

24:片匣台 24: Cassette table

26:暫置工作台 26: Temporary workbench

28:搬出入組件 28: Moving in and out of components

30:移動組件 30: Mobile components

X,Y:方向 X, Y: direction

Claims (2)

一種搬送偏離量檢測方法，在對工件施行處理之處理裝置中求出搬送組件的搬送偏離量，前述處理裝置至少具備可旋轉的第1工作台、可旋轉的第2工作台、將工件從該第1工作台搬送到該第2工作台之該搬送組件、與對已保持在該第1工作台之工件進行拍攝之拍攝組件，前述搬送偏離量檢測方法包含以下步驟： 第1座標記憶步驟，使形成有標記之工件保持於該第1工作台並以該拍攝組件拍攝且將標記的座標記憶為X1、Y1座標； 180度旋轉步驟，藉由該搬送組件將已保持在該第1工作台之工件搬送到該第2工作台並予以保持，且讓該第2工作台旋轉180度； 返回步驟，藉由該搬送組件將已保持在該第2工作台之工件搬送到該第1工作台並予以保持； 第2座標記憶步驟，使該第1工作台旋轉180度再以該拍攝組件拍攝工件，且將標記的座標記憶為X2、Y2座標；及 搬送偏離量計算步驟，將(X2-X1)/2計算為X軸方向的搬送偏離量，並將(Y2-Y1)/2計算為Y軸方向的搬送偏離量。 A method for detecting the amount of deviation in conveyance, in which the amount of deviation in conveyance of the conveyance assembly is obtained in a processing device that processes workpieces, the aforementioned processing device at least includes a rotatable first workbench, a rotatable second workbench, and moves the workpiece from the The conveying unit that transports the first workbench to the second workbench, and the photographing unit that photographs the workpiece held on the first workbench, the aforementioned method for detecting the amount of deviation in conveyance includes the following steps: The first coordinate memory step is to keep the marked workpiece on the first workbench and take pictures with the camera unit, and memorize the marked coordinates as X1 and Y1 coordinates; The 180-degree rotation step is to transfer the workpiece held on the first workbench to the second workbench by the conveying component and hold it, and rotate the second workbench by 180 degrees; Returning to the step of transporting the workpiece held on the second workbench to the first workbench by the conveying component and keeping it there; In the second coordinate memory step, the first workbench is rotated 180 degrees, and the workpiece is photographed by the photographing unit, and the marked coordinates are memorized as X2 and Y2 coordinates; and In the conveyance deviation calculation step, (X2-X1)/2 is calculated as the conveyance deviation in the X-axis direction, and (Y2-Y1)/2 is calculated as the conveyance deviation in the Y-axis direction. 如請求項1之搬送偏離量檢測方法，其是將(X2-X1)/2與(Y2-Y1)/2和該搬送組件的移動量相加來補正搬送偏離。The method for detecting the amount of conveyance deviation as claimed in Claim 1 is to correct the conveyance deviation by adding (X2-X1)/2 and (Y2-Y1)/2 to the movement amount of the conveying assembly.
TW111110550A 2021-04-07 2022-03-22 Transport deviation amount detection method capable of easily obtaining the transport deviation amount of a transport unit TW202240750A (en)

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