TWI782033B - How to install the cutting blade - Google Patents
How to install the cutting blade Download PDFInfo
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- TWI782033B TWI782033B TW107119320A TW107119320A TWI782033B TW I782033 B TWI782033 B TW I782033B TW 107119320 A TW107119320 A TW 107119320A TW 107119320 A TW107119320 A TW 107119320A TW I782033 B TWI782033 B TW I782033B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Abstract
[課題]提供一種切割刀片的安裝方法,該切割刀片的安裝方法可以抑制在安裝時之基準位置的誤差。 [解決手段]切割刀片的安裝方法具備:安裝位置探索步驟,以相機單元拍攝工作夾台的上表面,以探索未被檢測出傷痕或者異物之上表面的安裝位置;導通檢測步驟,將在安裝位置探索步驟中所探索到的上表面的安裝位置定位到切割刀片的正下方,並使切割單元朝Z軸方向移動,以檢測在安裝位置使切割刀片接觸於上表面之瞬間的電氣導通;以及基準位置設定步驟,將檢測出電氣導通之時的切割刀片的Z軸方向的位置作為基準位置來設定。[Problem] To provide a cutting blade mounting method capable of suppressing errors in reference positions at the time of mounting. [Solution] The installation method of the cutting blade includes: the installation position exploration step, using the camera unit to photograph the upper surface of the work clamp to explore the installation position on the upper surface of the undetected flaw or foreign object; the conduction detection step, which will be performed during the installation The installation position of the upper surface found in the position exploration step is positioned directly below the cutting blade, and the cutting unit is moved toward the Z-axis direction, so as to detect the electrical conduction at the moment when the cutting blade contacts the upper surface at the installation position; and In the reference position setting step, the position in the Z-axis direction of the cutting blade when electrical conduction is detected is set as the reference position.
Description
發明領域 本發明是有關於一種切割刀片的安裝方法。FIELD OF THE INVENTION The present invention relates to a method of mounting a cutting blade.
發明背景 已知有一種切割裝置,是在以切割刀片對形成有半導體元件之晶圓、或封裝基板、陶瓷基板等各種板狀的被加工物進行切割中使用。切割裝置是將切割刀片之前端(下端)與工作夾台之上表面接觸的位置作為基準位置,以控制切割刀片的高度位置(參照例如專利文獻1及專利文獻2)。Background of the Invention There is known a dicing device which is used for dicing various plate-shaped workpieces such as wafers on which semiconductor elements are formed, package substrates, and ceramic substrates with dicing blades. The cutting device uses the position where the front end (lower end) of the cutting blade contacts the upper surface of the work chuck as a reference position to control the height position of the cutting blade (see, for example,
基準位置是藉由基準位置檢測電路而求得,該基準位置檢測電路是在切割刀片接觸於工作夾台之上表面時,即可檢測出電氣導通的檢測電路。使該切割刀片接觸於工作夾台之上表面的動作稱為安裝。因為在每當工作夾台之更換等時就會實施安裝,所以會有在工作夾台的外周形成許多因切割刀片的接觸所形成的傷痕之情況。 先前技術文獻 專利文獻The reference position is obtained by a reference position detection circuit. The reference position detection circuit is a detection circuit that can detect electrical conduction when the cutting blade touches the upper surface of the work clamp. The action of making the cutting blade contact the upper surface of the work clamp is called mounting. Since the mounting is carried out every time the chuck is replaced or the like, many scratches caused by the contact of the cutting blade may be formed on the outer periphery of the chuck. Prior Art Documents Patent Documents
專利文獻1:日本專利特開平09-92711號公報 專利文獻2:日本專利特開2005-142202號公報Patent Document 1: Japanese Patent Laid-Open No. 09-92711 Patent Document 2: Japanese Patent Laid-Open No. 2005-142202
發明概要 發明欲解決之課題 前述之安裝若誤使切割刀片再次接觸於已形成的傷痕時,會導致將比原本之上表面的高度更低的傷痕之底部檢測作為基準位置,恐有導致將基準位置設成比工作夾台的上表面更朝下方偏離了數μm的位置之虞。又,安裝若是透過殘留在工作夾台之上表面的切割水的液滴而導致上表面與切割刀片導通時,恐有導致將基準位置設成比工作夾台的上表面更高相當於滴液之高度的位置之虞。如此,在專利文獻1及專利文獻2所示的方法中,恐有於安裝時的基準位置的誤差變大之虞。Summary of the Invention Problems to be Solved by the Invention If the aforementioned installation mistakenly causes the cutting blade to touch the formed scar again, the bottom of the scar that is lower than the original upper surface will be detected as the reference position, which may lead to the reference There is a possibility that the position is set a few μm below the upper surface of the work chuck. In addition, if the upper surface and the cutting blade are connected through the liquid droplets of cutting water remaining on the upper surface of the work clamp, it may cause the reference position to be set higher than the upper surface of the work clamp, which is equivalent to dripping liquid. The height and location of the risk. In this way, in the methods shown in
本發明是有鑒於所述問題點而作成的發明,其目的在於提供一種可以抑制在安裝時之基準位置的誤差的切割刀片的安裝方法。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and an object of the present invention is to provide a cutting blade mounting method capable of suppressing errors in reference positions during mounting. means to solve problems
為了解決上述之課題並達成目的,本發明之切割刀片的安裝方法是使用切割裝置來設定切割刀片之切入進給方向的基準位置,該切割裝置具備:工作夾台,以上表面保持被加工物;切割單元,以裝設於主軸的該切割刀片對保持於該工作夾台的被加工物進行切割;切入進給單元,使該切割單元於與該上表面正交的切入進給方向上移動;相機單元,對保持於該工作夾台的被加工物進行拍攝,該切割刀片的安裝方法之特徵在於具備: 安裝位置探索步驟,以該相機單元拍攝該工作夾台的該上表面,以探索未被檢測出凹凸或者異物的該上表面的安裝位置; 導通檢測步驟,將在該安裝位置探索步驟中所探索到的該上表面的該安裝位置定位到該切割刀片的正下方,並使該切割單元朝該切入進給方向移動,以檢測在該安裝位置使該切割刀片接觸於該上表面之瞬間的電氣導通;以及 基準位置設定步驟,將檢測出電氣導通之時的該切割刀片的切入進給方向的位置作為該基準位置來設定。In order to solve the above problems and achieve the purpose, the installation method of the cutting blade of the present invention is to use a cutting device to set the reference position of the cutting blade's cutting and feeding direction. The cutting device is equipped with: a work clamp table, and the upper surface holds the workpiece; a cutting unit, which uses the cutting blade installed on the main shaft to cut the workpiece held on the work clamping table; a cut-in feed unit, which moves the cutting unit in a cut-in feed direction perpendicular to the upper surface; The camera unit photographs the workpiece held on the work clamp, and the method for installing the cutting blade is characterized in that it includes: an installation position searching step, in which the camera unit photographs the upper surface of the work clamp to explore future The installation position of the upper surface where unevenness or foreign matter is detected; conducting the detection step, positioning the installation position of the upper surface explored in the installation position exploration step directly below the cutting blade, and making the cutting blade The unit moves toward the cutting feed direction to detect electrical conduction at the moment when the cutting blade is brought into contact with the upper surface at the installation position; The position given the direction is set as this reference position.
在前述切割刀片的安裝方法中,亦可為:該工作夾台的該上表面是由吸引保持被加工物的多孔板、及圍繞該多孔板的金屬框體所構成,且該安裝位置是設定在該金屬框體。In the above-mentioned installation method of the cutting blade, it may also be: the upper surface of the work clamp is composed of a perforated plate that attracts and holds the workpiece, and a metal frame surrounding the perforated plate, and the installation position is set in the metal frame.
在前述切割刀片的安裝方法中,亦可為:該工作夾台之上表面是以平坦的金屬材所形成,且於該上表面形成有吸引口及吸引溝。In the aforementioned method for installing the cutting blade, it is also possible that: the upper surface of the work clamping table is formed of a flat metal material, and a suction opening and a suction groove are formed on the upper surface.
在前述切割刀片的安裝方法中,亦可為:在該安裝位置探索步驟中,在拍攝而取得之圖像的規定範圍檢測出傷痕或者異物的情況下,使該工作夾台旋轉直到在該規定範圍未被檢測出傷痕或者異物的位置為止。In the above-mentioned method for installing the cutting blade, in the step of searching for the installation position, when a flaw or a foreign object is detected in a predetermined range of the captured image, the work chuck may be rotated until it is within the predetermined range. up to the position where no scratches or foreign objects are detected.
在前述切割刀片的安裝方法中,亦可為:該安裝位置探索步驟具備有吹氣步驟,該吹氣步驟是在以該相機單元拍攝該上表面之前,以吹氣單元於進行拍攝之該上表面的範圍噴附空氣。 發明效果In the above-mentioned method for installing the cutting blade, it may also be that: the step of searching for the installation position includes an air blowing step, and the air blowing step is to use the air blowing unit on the upper surface for photographing before photographing the upper surface with the camera unit. The range of surfaces is sprayed with air. Invention effect
本發明之切割刀片的安裝方法會發揮下述效果:可以抑制在安裝時之基準位置的誤差。The mounting method of the cutting blade of the present invention exhibits the effect that the error of the reference position at the time of mounting can be suppressed.
用以實施發明之形態 針對用於實施本發明之形態(實施形態),一邊參照圖式一邊詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又,在以下所記載之構成要素中,包含所屬技術領域中具有通常知識者可輕易設想得到的或實質上是相同的。此外,以下所記載之構成是可以適當組合的。又,在不脫離本發明之要旨的範圍內,可進行各種構成之省略、置換或變更。Modes for Carrying Out the Invention Modes for carrying out the present invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily imagined by those skilled in the art or are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, omissions, substitutions, or changes of various configurations can be made without departing from the gist of the present invention.
[實施形態1] 依據圖式來說明本發明的實施形態1之切割刀片的安裝方法。圖1是顯示實施形態1之實施切割刀片的安裝方法的切割裝置之構成例的立體圖。圖2是將圖1所示之切割裝置的主要部位以局部截面顯示的側面圖。圖3是顯示圖1所示之切割裝置的修整板用之副工作夾台的立體圖。[Embodiment 1] A method of mounting a cutting blade according to
實施形態1之切割刀片的安裝方法是藉由圖1所示之切割裝置1來實施。切割裝置1是對被加工物200進行切割(加工)的裝置。在實施形態1中,被加工物200是以矽、藍寶石、鎵等作為母材的圓板狀的半導體晶圓或光元件晶圓。被加工物200是在正面藉由形成為格子狀的複數條分割預定線201而被區劃成格子狀的區域中形成有元件202。本發明之被加工物200可為將中央部薄化且在外周部形成有厚壁部之所謂的TAIKO(註冊商標)晶圓,除了晶圓外,亦可為具有複數個藉由樹脂密封之元件的矩形狀的封裝基板、陶瓷板、玻璃板等。被加工物200於背面貼附有保護構件即黏著膠帶210。黏著膠帶210於外周組裝有環狀框架211。The installation method of the cutting blade of
圖1所示之切割裝置1是以工作夾台10保持被加工物200,並以裝設於主軸22的切割刀片21沿著分割預定線201進行切割的裝置。如圖1所示,切割裝置1具備工作夾台10、切割單元20、相機單元30及控制單元100,該工作夾台10是以上表面11吸引保持被加工物200,該切割單元20是以切割刀片21對保持於工作夾台10的被加工物200進行切割,該相機單元30是對保持於工作夾台10的被加工物200進行拍攝。The
又,如圖1所示,切割裝置1具備圖未示的加工進給單元、分度進給單元40及切入進給單元50,該加工進給單元是將工作夾台10朝與水平方向平行的加工進給方向即X軸方向加工進給、該分度進給單元40是將切割單元20朝與水平方向平行且正交於X軸方向的分度進給方向即Y軸方向分度進給,該切入進給單元50是將切割單元20朝與上表面11正交的切入進給方向即Z軸方向切入進給。Also, as shown in FIG. 1 , the
如圖1及圖2所示,工作夾台10為圓盤狀,且上表面11由吸引保持被加工物200的多孔板12、及圍繞多孔板12的圓環狀的金屬框體13所構成。多孔板12是藉由由多孔陶瓷等之多孔質材所形成而設有可吸引流體的孔。又,在實施形態1中,雖然是藉由多孔質材來構成多孔板12,但在本發明中並不限定為多孔質材。金屬框體13是藉由不鏽鋼等之金屬所構成,且具備圍繞多孔板12的框部14、及將框部14設置於外緣部之圓盤狀的本體部15。本體部15與多孔板12之間形成有空間16。空間16是藉由本體部15、框部14及多孔板12而被密閉。工作夾台10是將空間16與圖未示之真空吸引源連接,且藉由以真空吸引源進行吸引而將被加工物200吸引、保持於上表面11。多孔板12的上表面11與金屬框體13的上表面17相當於工作夾台10的上表面,且配置於同一平面上。亦即,工作夾台10的上表面是由多孔板12的上表面11與金屬框體13的上表面17所構成。又,工作夾台10是配置在可藉由加工進給單元而於X軸方向上移動自如之圖1所示的移動台18上,並且藉由圖未示之旋轉驅動源以繞著軸心的方式旋轉自如地設置。As shown in FIGS. 1 and 2 , the
切割單元20具備主軸22、主軸殼體23及切割刀片21,該主軸22是以繞著與Y軸方向平行的軸心的方式旋轉,該主軸殼體23是收容主軸且可藉由分度進給單元40及切入進給單元50而於Y軸方向與Z軸方向上移動,該切割刀片21是裝設於主軸22。切割刀片21是形成為極薄之環形形狀的切割磨石,且是藉由一邊被供給切割水一邊以繞著與Y軸方向平行的軸心的方式被主軸22旋轉,來對保持於工作夾台10的被加工物200進行切割加工的構成。又,切割單元20的主軸22及切割刀片21具有導電性。The
相機單元30是配設在與切割單元20在X軸方向上成行的位置上。在實施形態1中,相機單元30是組裝於主軸殼體23。相機單元30是藉由對保持於工作夾台10的被加工物200進行拍攝的CCD(電荷耦合元件,Charge Coupled Device)相機所構成。CCD相機是對保持於工作夾台10的被加工物200進行拍攝,而得到用於完成校準等之圖像,並將所得到的圖像輸出至控制單元100,其中該校準是進行被加工物200與切割刀片21的對位。The
又,在實施形態1中,於相機單元30上組裝有吹氣單元60。吹氣單元60具備有噴嘴,該噴嘴是將從圖未示之加壓氣體供給源所供給之已加壓的空氣700(示於圖5)噴附到工作夾台10的上表面11、17之中的相機單元30進行拍攝的範圍內。Moreover, in
又,切割裝置1具備圖未示之X軸方向位置檢測單元、圖未示之Y軸方向位置檢測單元及圖2所示之Z軸方向位置檢測單元70,該X軸方向位置檢測單元是用於檢測工作夾台10的X軸方向的位置,該Y軸方向位置檢測單元是用於檢測切割單元20的Y軸方向的位置,該Z軸方向位置檢測單元70是用於檢測切割單元20的Z軸方向的位置。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元70可以藉由與X軸方向、Y軸方向或Z軸方向平行的線性尺規71、及讀取頭72來構成。Z軸方向位置檢測單元70的線性尺規71是組裝在可藉由切割裝置1的分度進給單元40而朝Y軸方向移動的Y軸移動台41上,讀取頭72是組裝在切割單元20上,並且與切割單元20一起相對於Y軸移動台41而朝Z軸方向移動。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元70是將工作夾台10的X軸方向、切割單元20的Y軸方向或Z軸方向的位置輸出至控制單元100。In addition, the
又,如圖1所示,切割裝置1具備使修整板(相當於請求項1所記載之被加工物)300裝卸自如的副工作夾台(相當於請求項1所記載之工作夾台)80。副工作夾台80是固定於移動台18,並與工作夾台10一體地沿著X軸方向移動。副工作夾台80是形成為矩形狀,且將上表面81配置於與工作夾台10之上表面11、17成為相同的高度的位置,並且上表面81是藉由平坦的金屬材所構成。副工作夾台80在上表面81開口有與圖未示之真空吸引源連接的凹凸即吸引口82,且形成有連通於吸引口82之凹凸即吸引溝83。吸引溝83是從上表面81凹陷地形成。副工作夾台80是藉由以真空吸引源進行吸引而對已載置於上表面81的修整板300進行吸引保持。修整板300是將因堵塞或鈍化而使切割能力降低的切割刀片21磨銳,以使切割刀片21的切割能力回復的構成。將切割刀片21磨銳而使切割刀片21的切割能力回復之作法稱為修整。In addition, as shown in FIG. 1 , the
又,切割裝置1具備圖2所示之基準位置設定單元90。基準位置設定單元90是設定使切割刀片21之刀尖的前端接觸於工作夾台10的上表面11、17之(或者位於同一平面上之)Z軸方向上的切割單元20的基準位置之單元,並且是設定使切割刀片21之刀尖的前端接觸於副工作夾台80的上表面81之(或者位於同一平面上之)Z軸方向上的切割單元20的修整用基準位置(相當於基準位置)之單元。基準位置及修整用基準位置是使切割刀片21之刀尖的前端即下端,與上表面11、17、81位於相同平面上之切割單元20的Z軸方向上的位置。又,在本發明中,是將設定基準位置及修整用基準位置的作法稱為安裝。In addition, the
如圖2所示,基準位置設定單元90具備電源91、導通檢測單元92及切換開關93。電源91是透過主軸22將電力供給至切割刀片21、工作夾台10的金屬框體13或者副工作夾台80的上表面81。切換開關93是將電源91供給電力的目的地,在工作夾台10的金屬框體13與副工作夾台80的上表面81之間進行切換。導通檢測單元92是在切割刀片21接觸於工作夾台10之金屬框體13的上表面17或者副工作夾台80的上表面81之時檢測流通的電流,並將表示檢測到電流之訊號輸出至控制單元100。As shown in FIG. 2 , the reference
基準位置設定單元90是在設定基準位置之時,藉由切換開關93對工作夾台10的金屬框體13供給電源91的電力。基準位置設定單元90是在當切割刀片21之刀尖接觸於金屬框體13的上表面17時,使導通檢測單元92對電流進行檢測,並將表示檢測到電流之訊號輸出至控制單元100。控制單元100是將表示檢測到電流之訊號輸入時的Z軸方向位置檢測單元70的檢測結果作為基準位置來設定。The reference
又,基準位置設定單元90在設定修整用基準位置之時,是藉由切換開關93對副工作夾台80的上表面81供給電源91之電力。基準位置設定單元90是在當切割刀片21之刀尖接觸於上表面81時,使導通檢測單元92對電流進行檢測,並將表示檢測到電流之訊號輸出至控制單元100。控制單元100是將表示檢測到電流的訊號輸入時的Z軸方向位置檢測單元70的檢測結果作為修整用基準位置來設定。In addition, the reference
控制單元100是分別控制構成切割裝置1的上述之各構成要素,並使切割裝置1實施對被加工物200之加工動作的單元。再者,控制單元100為電腦。控制單元100具有運算處理裝置、儲存裝置及輸入輸出介面裝置,該運算處理裝置具有如CPU(中央處理單元,central processing unit)的微處理器,該儲存裝置具有如ROM(唯讀記憶體,read only memory)或RAM(隨機存取記憶體,random access memory)之記憶體。控制單元100的運算處理裝置會依照儲存於儲存裝置的電腦程式實施運算處理,並透過輸入輸出介面裝置將用於控制切割裝置1的控制訊號,輸出至切割裝置1的上述之構成要素。The
又,控制單元100在對被加工物200進行切割之時,是依據基準位置來控制切割刀片21對被加工物200的切入量,並且在實施修整之時,是依據修整用基準位置來控制切割刀片21對修整板300的切入量。控制單元100是與圖未示之顯示單元及圖未示之輸入單元相連接,該顯示單元是藉由顯示加工動作之狀態或圖像等的液晶顯示裝置等所構成,該輸入單元是在操作人員登錄加工內容資訊等之時使用。輸入單元是藉由設置於顯示單元的觸控面板、及鍵盤等之外部輸入裝置之中至少一種所構成。Moreover, when the
又,切割裝置1具備片匣升降機110、洗淨單元120及圖未示之搬送單元,該片匣升降機110是供收容切割前後的被加工物200之片匣111載置且於Z軸方向上移動片匣111,該洗淨單元120是洗淨切割後的被加工物200,該搬送單元是使被加工物200於片匣111進出,並且搬送被加工物200。In addition, the
其次,就實施形態1之切割裝置1的加工動作進行說明。在加工動作中,是在操作人員將加工內容資訊登錄到控制單元100,且已由操作人員作出加工動作的開始指示的情況下,使切割裝置1開始加工動作。Next, the processing operation of the
在加工動作中,控制單元100是令搬送單元從片匣111取出切割前的被加工物200,並載置於工作夾台10而將被加工物200吸引保持在工作夾台10。控制單元100是藉由加工進給單元而將工作夾台10朝向切割單元20之下方移動,並將保持於工作夾台10的被加工物200定位到相機單元30之下方,而使相機單元30對被加工物200進行拍攝。控制單元100是執行型樣匹配等之圖像處理,而調整保持於工作夾台10的被加工物200與切割單元20的相對位置,其中該型樣匹配是用於進行保持於工作夾台10的被加工物200之分割預定線201與切割單元20之切割刀片21的對位。During the processing operation, the
然後,控制單元100是依據加工內容資訊,並藉由加工進給單元、分度進給單元40、切入進給單元50與旋轉驅動源,使切割刀片21及被加工物200沿著分割預定線201相對地移動,且一邊供給切割水一邊藉由切割刀片21切割分割預定線201。Then, the
控制單元100在對全部的分割預定線201進行切割,而將被加工物200分割成一個個的元件202時,會在使工作夾台10從切割單元20的下方退避之後,解除工作夾台10的吸引保持。控制單元100是令搬送單元將切割後的被加工物200搬送至洗淨單元120,並於以洗淨單元120洗淨之後收容於片匣111。When the
又,控制單元100在加工動作中,是在規定的修整時間點對切割刀片21進行修整。例如每切割預先設定之數量的分割預定線201,即是修整時間點。又,本發明之修整時間點可為即將在對一片被加工物200進行加工的途中,亦可為在連續加工複數片被加工物200之時更換被加工物200的時間點。In addition, the
接著,依據圖式說明控制單元100設定基準位置之切割刀片的安裝方法。圖4是顯示實施形態1之切割刀片的安裝方法之流程的流程圖。Next, the installation method of the cutting blade for setting the reference position by the
實施形態1之切割刀片的安裝方法(以下,簡記為安裝方法)是設定切割刀片21的Z軸方向的基準位置的方法。如圖4所示,安裝方法具備安裝位置探索步驟ST2、導通檢測步驟ST3及基準位置設定步驟ST4。The method of attaching the cutting blade of Embodiment 1 (hereinafter, simply referred to as the attaching method) is a method of setting the reference position of the
控制單元100在切割裝置1的加工動作中,是在預先設定之規定的時間點重複實施圖4所示之切割刀片的安裝方法的流程圖。在切割裝置1的加工動作中,控制單元100會判定是否為基準位置設定時間點(步驟ST1)。當控制單元100判定為並非基準位置設定時間點時(步驟ST1:否)時,會重複步驟ST1。基準位置設定時間點所指的是進行設定基準位置的時間點,例如在工作夾台10的更換後,每切割預先設定之數量的分割預定線201,切割裝置1的加工動作的開始時。當控制單元100判定為基準位置設定時間點(步驟ST1:是)時,即前進至安裝位置探索步驟ST2。The
(安裝位置探索步驟) 圖5是將圖4所示之切割刀片的安裝方法的安裝位置探索步驟以局部截面顯示的側面圖。圖6是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。圖7是顯示從圖6所示之狀態旋轉工作夾台之後的圖像之一例的圖。圖8是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的其他例的圖。圖9是顯示從圖8所示之狀態旋轉工作夾台之後的圖像之一例的圖。(Installation position search step) FIG. 5 is a side view showing a partial cross-section of the installation position search step of the cutting blade installation method shown in FIG. 4 . Fig. 6 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 7 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 6 . Fig. 8 is a diagram showing another example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 9 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 8 .
安裝位置探索步驟ST2是以相機單元30拍攝工作夾台10之金屬框體13的上表面17,以探索未被檢測出凹凸即傷痕500或者異物600之上表面17的安裝位置501(顯示於圖6、圖7、圖8及圖9)之步驟。又,安裝位置501所指的是工作夾台10的上表面17當中於安裝時讓切割刀片21接觸的位置,在實施形態1中,安裝位置501是設定在金屬框體13的上表面17。如圖5所示,在安裝位置探索步驟ST2中,控制單元100是在使相機單元30沿著Z軸方向而相向於工作夾台10的金屬框體13後,在以相機單元30拍攝工作夾台10的金屬框體13之上表面17之前,實施吹氣步驟ST21,該吹氣步驟ST21是以吹氣單元60在相機單元30拍攝之上表面17的一部分即範圍內噴附已加壓的空氣700。即,安裝位置探索步驟ST2具備吹氣步驟ST21。The installation position search step ST2 is to photograph the
在安裝位置探索步驟ST2中,控制單元100是以相機單元30拍攝金屬框體13的上表面17(步驟ST22)。在安裝位置探索步驟ST2中,控制單元100是對經拍攝而取得的圖像400實施圖像處理,並判定在圖像400之規定範圍即包含安裝位置501的範圍401(顯示於圖6、圖7、圖8及圖9)內是否檢測出傷痕500(步驟ST23)。再者,傷痕500所指的是在控制單元100的圖像處理中被判定為所設定之傷痕的區域,在實施形態1中,當已被控制單元100判定為傷痕的區域超過將以切割刀片21形成之傷痕的預定面積的5%~30%時,即判定為檢測出傷痕500。In the installation position searching step ST2, the
如圖6所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出傷痕500(步驟ST23:是)時,會旋轉工作夾台10並移動相機單元30的拍攝位置(步驟ST24)。在安裝位置探索步驟ST2中,控制單元100在拍攝而取得之圖像400的範圍401內判定為如圖7所示地未檢測出傷痕500(步驟ST23:否)的情況下、以及已在步驟ST24中使工作夾台10旋轉後,會對在拍攝而取得之圖像400的範圍401內是否檢測出異物600進行判定(步驟ST25)。再者,在實施形態1中,異物600是切割水的滴液,但在本發明中並不限定為切割水。As shown in FIG. 6 , in the mounting position search step ST2, when the
如圖8所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出異物600(步驟ST25:是)時,會旋轉工作夾台10,並移動相機單元30的拍攝位置(步驟ST26),而返回到吹氣步驟ST21。如圖9所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出異物600時(步驟ST25:否)時,會前進至導通檢測步驟ST3。如此進行,在安裝位置探索步驟ST2中,在拍攝而取得之圖像400的範圍401內檢測出傷痕500或者異物600的情況下,會重複從吹氣步驟ST21進行至步驟ST26,並使工作夾台10旋轉直到在範圍401內未被檢測出傷痕500或者異物600的位置為止,來探索未存在有傷痕500及異物600之上表面17的一部分即安裝位置501。As shown in FIG. 8 , in the mounting position search step ST2, when the
(導通檢測步驟) 圖10是將圖4所示之切割刀片的安裝方法的導通檢測步驟以局部截面顯示的側面圖。(Continuity Test Step) FIG. 10 is a side view showing a conduction test step of the method of mounting the dicing blade shown in FIG. 4 in a partial section.
導通檢測步驟ST3是將在安裝位置探索步驟ST2中所探索到的上表面17的安裝位置501定位到切割刀片21的正下方,並使切割單元20於Z軸方向上移動,以檢測切割刀片21在安裝位置501接觸於上表面17之瞬間的電氣導通的步驟。在導通檢測步驟ST3中,控制單元100是如圖10之虛線所示,在使上表面17之安裝位置501與切割刀片21相向後,使切割刀片21朝Z軸方向下降直到導通檢測單元92檢測到電流為止,當導通檢測單元92檢測到電流時,會使切割刀片21朝Z軸方向上升。The conduction detection step ST3 is to locate the
(基準位置設定步驟) 基準位置設定步驟ST4是將檢測出電氣導通之時的切割刀片21的Z軸方向的位置作為基準位置來設定。在基準位置設定步驟ST4中,控制單元100是在導通檢測步驟ST3中,將導通檢測單元92檢測出電流時的Z軸方向位置檢測單元70的檢測結果即切割刀片21的Z軸方向的位置,作為基準位置來設定、儲存。(Reference Position Setting Step) In the reference position setting step ST4, the position in the Z-axis direction of the
如以上,實施形態1之安裝方法是在安裝位置探索步驟ST2中,預先以相機單元30拍攝用以使切割刀片21接觸之工作夾台10的上表面17,來確認傷痕500或異物600的有無。因此,實施形態1之安裝方法變得可抑制因切割刀片21接觸於傷痕500或者異物600而產生的安裝不良。其結果,實施形態1之安裝方法可以抑制在安裝時之基準位置的誤差。As mentioned above, in the mounting method of
又,實施形態1之安裝方法是在安裝位置探索步驟ST2中,在圖像400之範圍401內檢測出傷痕500或者異物600之情況下,移動拍攝位置直到在範圍401內未檢測出傷痕500或者異物600的位置為止。其結果,實施形態1之安裝方法可以抑制切割刀片21接觸於傷痕500或者異物600而安裝的情形,且可以抑制在安裝時之基準位置的誤差。In addition, in the mounting method of
又,實施形態1之安裝方法具備吹氣步驟ST21,該吹氣步驟ST21是在安裝位置探索步驟ST2以相機單元30拍攝上表面17之前,以吹氣單元60於進行拍攝之上表面17的範圍噴附空氣700。因此,實施形態1之安裝方法可以去除上表面17之範圍401內的異物600,且可以抑制安裝時之基準位置的誤差。In addition, the mounting method according to the first embodiment includes an air blowing step ST21. The air blowing step ST21 is to shoot the
[實施形態2] 依據圖式來說明本發明的實施形態2之切割刀片的安裝方法。圖11是顯示實施形態2之切割刀片的安裝方法之流程的流程圖。圖12是顯示圖11所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的一例的圖。圖13是顯示從圖12所示之狀態使相機單元與副工作夾台相對地移動後的圖像之一例的圖。再者,圖11至圖13,是對與實施形態1相同的部分附加相同的符號而省略說明。[Embodiment 2] A method of mounting a cutting blade according to Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 11 is a flow chart showing the flow of the method of mounting the dicing blade according to the second embodiment. Fig. 12 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 11 . Fig. 13 is a diagram showing an example of an image obtained by relatively moving the camera unit and the sub-table from the state shown in Fig. 12 . In addition, in Fig. 11 to Fig. 13, the same parts as those in the first embodiment are given the same reference numerals, and description thereof will be omitted.
實施形態2之切割刀片的安裝方法(以下,簡記為安裝方法)是控制單元100設定修整用基準位置的方法。如圖11所示,實施形態2之安裝方法與實施形態1同樣,具備安裝位置探索步驟ST2、導通檢測步驟ST3及基準位置設定步驟ST4。The cutting blade mounting method (hereinafter simply referred to as the mounting method) of the second embodiment is a method in which the
控制單元100是在切割裝置1的加工動作中,在預先設定之規定的時間點時重複實施圖11所示之安裝方法的流程圖。在切割裝置1的加工動作中,控制單元100會判定是否為修整用基準位置設定時間點(步驟ST1)。當控制單元100判定為並非修整用基準位置設定時間點(步驟ST1:否)時,會重複步驟ST1。修整用基準位置設定時間點所指的是設定修整用基準位置的時間點,例如在副工作夾台80的更換後等。當控制單元100判定為修整用基準位置設定時間點(步驟ST1:是)時,會前進至安裝位置探索步驟ST2。The
在實施形態2之安裝方法的安裝位置探索步驟ST2的步驟ST22中,控制單元100是拍攝副工作夾台80之上表面81的一部分,並在步驟ST24、26中,藉由加工進給單元及分度進給單元40使相機單元30與副工作夾台80相對地移動。In the step ST22 of the installation position search step ST2 of the installation method of the second embodiment, the
又,在實施形態2之安裝方法的安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出異物600(步驟ST25:否)時,會判定在拍攝而取得之圖像400的規定範圍即範圍401內是否檢測出凹凸即吸引口82或者吸引溝83(步驟ST27)。Also, in the mounting position search step ST2 of the mounting method according to the second embodiment, when the
如圖12所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出吸引口82或者吸引溝83(步驟ST27:是)時,會前進至步驟ST26。如圖13所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出吸引口82或者吸引溝83(步驟ST27:否)時,會前進至導通檢測步驟ST3。又,圖12是顯示在範圍401內檢測出吸引溝83的情況。As shown in FIG. 12 , in the mounting position search step ST2, when the
在實施形態2之安裝方法的安裝位置探索步驟ST2中,在拍攝而取得之圖像400的範圍401內檢測出傷痕500、異物600、吸引口82或者吸引溝83的情況下,會重複從吹氣步驟ST21進行至步驟ST27、步驟ST26,並使相機單元30與副工作夾台80相對地移動直到在範圍401內未檢測出傷痕500、異物600或吸引口82或吸引溝83的位置為止,以探索未存在有傷痕500、異物600或吸引口82或吸引溝83之上表面81之一部分即安裝位置501。In the mounting position search step ST2 of the mounting method according to the second embodiment, when a
如以上,實施形態2之安裝方法是在安裝位置探索步驟ST2中,預先以相機單元30拍攝用以使切割刀片21接觸之副工作夾台80的上表面81,來確認傷痕500、異物600、或吸引口82或吸引溝83的有無。因此,實施形態2之安裝方法變得可抑制因切割刀片21接觸於傷痕500、異物600、或吸引口82或吸引溝83而產生的安裝不良。其結果,實施形態2之安裝方法可以抑制在安裝時之基準位置的誤差。As above, in the mounting method of Embodiment 2, in the mounting position search step ST2, the
又,實施形態2之安裝方法是在安裝位置探索步驟ST2中,在圖像400之範圍401內檢測出傷痕500、異物600或吸引口82或吸引溝83的情況下,移動拍攝位置直到在範圍401內未檢測出傷痕500、異物600或吸引口82或吸引溝83的位置為止。其結果,實施形態2之安裝方法可以抑制切割刀片21接觸於傷痕500、異物600或吸引口82或吸引溝83而安裝的情形,且可以抑制在安裝時之基準位置的誤差。In addition, in the mounting method of Embodiment 2, in the mounting position search step ST2, when a
又,依據前述之實施形態1及實施形態2之切割刀片的安裝方法,可獲得以下的切割裝置。 (附記1) 一種切割裝置,該切割裝置的特徵在於具備: 工作夾台,以上表面保持被加工物; 切割單元,以裝設於主軸的切割刀片對保持於該工作夾台的被加工物進行切割; 切入進給單元,使該切割單元於與該上表面正交的切入進給方向上移動; 相機單元,對保持於該工作夾台的被加工物進行拍攝;以及 控制單元,控制各構成要素, 前述控制單元是實施下述步驟: 安裝位置探索步驟,以該相機單元拍攝該工作夾台的該上表面,以探索未被檢測出凹凸或者異物之該上表面的安裝位置; 導通檢測步驟,將在該安裝位置探索步驟中所探索到的該上表面的該安裝位置定位到該切割刀片的正下方,並使該切割單元朝該切入進給方向移動,以檢測在該安裝位置使該切割刀片接觸於該上表面之瞬間的電氣導通;以及 基準位置設定步驟,將檢測出電氣導通之時的該切割刀片的切入進給方向的位置作為該基準位置來設定。Moreover, according to the above-mentioned method of mounting the cutting blade of the first embodiment and the second embodiment, the following cutting device can be obtained. (Additional Note 1) A cutting device characterized by comprising: a work holder holding a workpiece held on the upper surface; cutting; a cutting feed unit that moves the cutting unit in a cutting feeding direction perpendicular to the upper surface; a camera unit that photographs the workpiece held on the work clamp; and a control unit that controls each component The above-mentioned control unit implements the following steps: the installation position search step, using the camera unit to photograph the upper surface of the work clamp, so as to explore the installation position of the upper surface where no unevenness or foreign matter is detected; the conduction detection step , positioning the installation position of the upper surface explored in the installation position exploration step directly below the cutting blade, and moving the cutting unit toward the cutting feed direction, so as to detect that the installation position makes the electrical conduction at the moment when the cutting blade contacts the upper surface; and a reference position setting step, setting the position of the cutting blade in the cutting feed direction when the electrical conduction is detected as the reference position.
上述切割裝置與實施形態1及實施形態2之切割刀片的安裝方法同樣,由於預先以相機單元拍攝用以使切割刀片接觸之工作夾台的上表面,以確認凹凸或者異物之有無,因此變得可防止由凹凸或異物所造成之安裝不良的情況,且可以抑制在安裝時的基準位置的誤差。The above-mentioned cutting device is the same as the installation method of the cutting blade in
再者,本發明並非受限於上述實施形態之發明。亦即,在不脫離本發明的主旨的範圍內可進行各種變形而實施。In addition, this invention is not limited to the invention of the said embodiment. That is, various deformation|transformation can be added and implemented in the range which does not deviate from the summary of this invention.
1‧‧‧切割裝置10‧‧‧工作夾台11、17、81‧‧‧上表面12‧‧‧多孔板13‧‧‧金屬框體14‧‧‧框部15‧‧‧本體部16‧‧‧空間18‧‧‧移動台20‧‧‧切割單元21‧‧‧切割刀片22‧‧‧主軸23‧‧‧主軸殼體30‧‧‧相機單元40‧‧‧分度進給單元41‧‧‧Y軸移動台50‧‧‧切入進給單元60‧‧‧吹氣單元70‧‧‧Z軸方向位置檢測單元71‧‧‧線性尺規72‧‧‧讀取頭80‧‧‧副工作夾台(工作夾台)82‧‧‧吸引口(凹凸)83‧‧‧吸引溝(凹凸)90‧‧‧基準位置設定單元91‧‧‧電源92‧‧‧導通檢測單元93‧‧‧切換開關100‧‧‧控制單元110‧‧‧片匣升降機111‧‧‧片匣120‧‧‧洗淨單元200‧‧‧被加工物201‧‧‧分割預定線202‧‧‧元件210‧‧‧黏著膠帶211‧‧‧環狀框架300‧‧‧修整板(被加工物)400‧‧‧圖像401‧‧‧範圍(規定範圍)500‧‧‧傷痕(凹凸)501‧‧‧安裝位置600‧‧‧異物700‧‧‧空氣X、Y、Z‧‧‧方向ST1~ST4、ST21~ST27‧‧‧步驟1‧‧‧Cutting device 10‧‧‧Jig table 11, 17, 81‧‧‧Upper surface 12‧‧‧perforated plate 13‧‧‧Metal frame 14‧‧‧Frame part 15‧‧‧Body part 16‧ ‧‧Space 18‧‧‧Mobile table 20‧‧‧Cutting unit 21‧‧‧Cutting blade 22‧‧‧Spindle 23‧‧‧Spindle housing 30‧‧‧Camera unit 40‧‧‧Indexing feed unit 41‧ ‧‧Y-axis moving table 50‧‧‧cutting feed unit 60‧‧‧air blowing unit 70‧‧‧Z-axis direction position detection unit 71‧‧‧linear gauge 72‧‧‧reading head 80‧‧‧pair Work clamp (work clamp) 82‧‧‧suction opening (concave-convex) 83‧‧‧suction groove (concave-convex) 90‧‧‧reference position setting unit 91‧‧‧power supply 92‧‧‧conduction detection unit 93‧‧‧ Switch 100‧‧‧control unit 110‧‧‧cassette elevator 111‧‧‧cassette 120‧‧‧cleaning unit 200‧‧‧processed object 201‧‧‧separation schedule line 202‧‧‧component 210‧‧ ‧Adhesive Tape 211‧‧‧Ring Frame 300‧‧‧Trimming Plate (Workpiece) 400‧‧‧Image 401‧‧‧Range (Specified Range)500‧‧‧Scar (Concave-Convex) 501‧‧‧Installation Position 600‧‧‧foreign matter 700‧‧‧air X, Y, Z‧‧‧direction ST1~ST4, ST21~ST27‧‧‧steps
圖1是顯示實施形態1之實施切割刀片的安裝方法的切割裝置之構成例的立體圖。 圖2是將圖1所示之切割裝置的主要部位以局部截面顯示的側面圖。 圖3是顯示圖1所示之切割裝置的修整板用之副工作夾台的立體圖。 圖4是顯示實施形態1之切割刀片的安裝方法之流程的流程圖。 圖5是將圖4所示之切割刀片的安裝方法的安裝位置探索步驟以局部截面顯示的側面圖。 圖6是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。 圖7是顯示從圖6所示之狀態旋轉工作夾台之後的圖像之一例的圖。 圖8是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的其他例的圖。 圖9是顯示從圖8所示之狀態旋轉工作夾台之後的圖像之一例的圖。 圖10是將圖4所示之切割刀片的安裝方法的導通檢測步驟以局部截面顯示的側面圖。 圖11是顯示實施形態2之切割刀片的安裝方法之流程的流程圖。 圖12是顯示圖11所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。 圖13是顯示從圖12所示之狀態使相機單元與副工作夾台相對地移動後的圖像之一例的圖。Fig. 1 is a perspective view showing a configuration example of a cutting device for carrying out a method of mounting a cutting blade according to
ST1~ST4、ST21~ST26‧‧‧步驟 Steps ST1~ST4, ST21~ST26‧‧‧
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