TWI782033B - How to install the cutting blade - Google Patents

How to install the cutting blade Download PDF

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TWI782033B
TWI782033B TW107119320A TW107119320A TWI782033B TW I782033 B TWI782033 B TW I782033B TW 107119320 A TW107119320 A TW 107119320A TW 107119320 A TW107119320 A TW 107119320A TW I782033 B TWI782033 B TW I782033B
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cutting blade
cutting
unit
installation
mounting
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TW107119320A
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Chinese (zh)
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TW201907459A (en
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笠井剛史
岡村卓
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日商迪思科股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

[課題]提供一種切割刀片的安裝方法,該切割刀片的安裝方法可以抑制在安裝時之基準位置的誤差。 [解決手段]切割刀片的安裝方法具備:安裝位置探索步驟,以相機單元拍攝工作夾台的上表面,以探索未被檢測出傷痕或者異物之上表面的安裝位置;導通檢測步驟,將在安裝位置探索步驟中所探索到的上表面的安裝位置定位到切割刀片的正下方,並使切割單元朝Z軸方向移動,以檢測在安裝位置使切割刀片接觸於上表面之瞬間的電氣導通;以及基準位置設定步驟,將檢測出電氣導通之時的切割刀片的Z軸方向的位置作為基準位置來設定。[Problem] To provide a cutting blade mounting method capable of suppressing errors in reference positions at the time of mounting. [Solution] The installation method of the cutting blade includes: the installation position exploration step, using the camera unit to photograph the upper surface of the work clamp to explore the installation position on the upper surface of the undetected flaw or foreign object; the conduction detection step, which will be performed during the installation The installation position of the upper surface found in the position exploration step is positioned directly below the cutting blade, and the cutting unit is moved toward the Z-axis direction, so as to detect the electrical conduction at the moment when the cutting blade contacts the upper surface at the installation position; and In the reference position setting step, the position in the Z-axis direction of the cutting blade when electrical conduction is detected is set as the reference position.

Description

切割刀片的安裝方法How to install the cutting blade

發明領域 本發明是有關於一種切割刀片的安裝方法。FIELD OF THE INVENTION The present invention relates to a method of mounting a cutting blade.

發明背景 已知有一種切割裝置,是在以切割刀片對形成有半導體元件之晶圓、或封裝基板、陶瓷基板等各種板狀的被加工物進行切割中使用。切割裝置是將切割刀片之前端(下端)與工作夾台之上表面接觸的位置作為基準位置,以控制切割刀片的高度位置(參照例如專利文獻1及專利文獻2)。Background of the Invention There is known a dicing device which is used for dicing various plate-shaped workpieces such as wafers on which semiconductor elements are formed, package substrates, and ceramic substrates with dicing blades. The cutting device uses the position where the front end (lower end) of the cutting blade contacts the upper surface of the work chuck as a reference position to control the height position of the cutting blade (see, for example, Patent Document 1 and Patent Document 2).

基準位置是藉由基準位置檢測電路而求得,該基準位置檢測電路是在切割刀片接觸於工作夾台之上表面時,即可檢測出電氣導通的檢測電路。使該切割刀片接觸於工作夾台之上表面的動作稱為安裝。因為在每當工作夾台之更換等時就會實施安裝,所以會有在工作夾台的外周形成許多因切割刀片的接觸所形成的傷痕之情況。 先前技術文獻 專利文獻The reference position is obtained by a reference position detection circuit. The reference position detection circuit is a detection circuit that can detect electrical conduction when the cutting blade touches the upper surface of the work clamp. The action of making the cutting blade contact the upper surface of the work clamp is called mounting. Since the mounting is carried out every time the chuck is replaced or the like, many scratches caused by the contact of the cutting blade may be formed on the outer periphery of the chuck. Prior Art Documents Patent Documents

專利文獻1:日本專利特開平09-92711號公報 專利文獻2:日本專利特開2005-142202號公報Patent Document 1: Japanese Patent Laid-Open No. 09-92711 Patent Document 2: Japanese Patent Laid-Open No. 2005-142202

發明概要 發明欲解決之課題 前述之安裝若誤使切割刀片再次接觸於已形成的傷痕時,會導致將比原本之上表面的高度更低的傷痕之底部檢測作為基準位置,恐有導致將基準位置設成比工作夾台的上表面更朝下方偏離了數μm的位置之虞。又,安裝若是透過殘留在工作夾台之上表面的切割水的液滴而導致上表面與切割刀片導通時,恐有導致將基準位置設成比工作夾台的上表面更高相當於滴液之高度的位置之虞。如此,在專利文獻1及專利文獻2所示的方法中,恐有於安裝時的基準位置的誤差變大之虞。Summary of the Invention Problems to be Solved by the Invention If the aforementioned installation mistakenly causes the cutting blade to touch the formed scar again, the bottom of the scar that is lower than the original upper surface will be detected as the reference position, which may lead to the reference There is a possibility that the position is set a few μm below the upper surface of the work chuck. In addition, if the upper surface and the cutting blade are connected through the liquid droplets of cutting water remaining on the upper surface of the work clamp, it may cause the reference position to be set higher than the upper surface of the work clamp, which is equivalent to dripping liquid. The height and location of the risk. In this way, in the methods shown in Patent Document 1 and Patent Document 2, there is a possibility that the error in the reference position at the time of mounting becomes large.

本發明是有鑒於所述問題點而作成的發明,其目的在於提供一種可以抑制在安裝時之基準位置的誤差的切割刀片的安裝方法。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and an object of the present invention is to provide a cutting blade mounting method capable of suppressing errors in reference positions during mounting. means to solve problems

為了解決上述之課題並達成目的,本發明之切割刀片的安裝方法是使用切割裝置來設定切割刀片之切入進給方向的基準位置,該切割裝置具備:工作夾台,以上表面保持被加工物;切割單元,以裝設於主軸的該切割刀片對保持於該工作夾台的被加工物進行切割;切入進給單元,使該切割單元於與該上表面正交的切入進給方向上移動;相機單元,對保持於該工作夾台的被加工物進行拍攝,該切割刀片的安裝方法之特徵在於具備: 安裝位置探索步驟,以該相機單元拍攝該工作夾台的該上表面,以探索未被檢測出凹凸或者異物的該上表面的安裝位置; 導通檢測步驟,將在該安裝位置探索步驟中所探索到的該上表面的該安裝位置定位到該切割刀片的正下方,並使該切割單元朝該切入進給方向移動,以檢測在該安裝位置使該切割刀片接觸於該上表面之瞬間的電氣導通;以及 基準位置設定步驟,將檢測出電氣導通之時的該切割刀片的切入進給方向的位置作為該基準位置來設定。In order to solve the above problems and achieve the purpose, the installation method of the cutting blade of the present invention is to use a cutting device to set the reference position of the cutting blade's cutting and feeding direction. The cutting device is equipped with: a work clamp table, and the upper surface holds the workpiece; a cutting unit, which uses the cutting blade installed on the main shaft to cut the workpiece held on the work clamping table; a cut-in feed unit, which moves the cutting unit in a cut-in feed direction perpendicular to the upper surface; The camera unit photographs the workpiece held on the work clamp, and the method for installing the cutting blade is characterized in that it includes: an installation position searching step, in which the camera unit photographs the upper surface of the work clamp to explore future The installation position of the upper surface where unevenness or foreign matter is detected; conducting the detection step, positioning the installation position of the upper surface explored in the installation position exploration step directly below the cutting blade, and making the cutting blade The unit moves toward the cutting feed direction to detect electrical conduction at the moment when the cutting blade is brought into contact with the upper surface at the installation position; The position given the direction is set as this reference position.

在前述切割刀片的安裝方法中,亦可為:該工作夾台的該上表面是由吸引保持被加工物的多孔板、及圍繞該多孔板的金屬框體所構成,且該安裝位置是設定在該金屬框體。In the above-mentioned installation method of the cutting blade, it may also be: the upper surface of the work clamp is composed of a perforated plate that attracts and holds the workpiece, and a metal frame surrounding the perforated plate, and the installation position is set in the metal frame.

在前述切割刀片的安裝方法中,亦可為:該工作夾台之上表面是以平坦的金屬材所形成,且於該上表面形成有吸引口及吸引溝。In the aforementioned method for installing the cutting blade, it is also possible that: the upper surface of the work clamping table is formed of a flat metal material, and a suction opening and a suction groove are formed on the upper surface.

在前述切割刀片的安裝方法中,亦可為:在該安裝位置探索步驟中,在拍攝而取得之圖像的規定範圍檢測出傷痕或者異物的情況下,使該工作夾台旋轉直到在該規定範圍未被檢測出傷痕或者異物的位置為止。In the above-mentioned method for installing the cutting blade, in the step of searching for the installation position, when a flaw or a foreign object is detected in a predetermined range of the captured image, the work chuck may be rotated until it is within the predetermined range. up to the position where no scratches or foreign objects are detected.

在前述切割刀片的安裝方法中,亦可為:該安裝位置探索步驟具備有吹氣步驟,該吹氣步驟是在以該相機單元拍攝該上表面之前,以吹氣單元於進行拍攝之該上表面的範圍噴附空氣。 發明效果In the above-mentioned method for installing the cutting blade, it may also be that: the step of searching for the installation position includes an air blowing step, and the air blowing step is to use the air blowing unit on the upper surface for photographing before photographing the upper surface with the camera unit. The range of surfaces is sprayed with air. Invention effect

本發明之切割刀片的安裝方法會發揮下述效果:可以抑制在安裝時之基準位置的誤差。The mounting method of the cutting blade of the present invention exhibits the effect that the error of the reference position at the time of mounting can be suppressed.

用以實施發明之形態 針對用於實施本發明之形態(實施形態),一邊參照圖式一邊詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又,在以下所記載之構成要素中,包含所屬技術領域中具有通常知識者可輕易設想得到的或實質上是相同的。此外,以下所記載之構成是可以適當組合的。又,在不脫離本發明之要旨的範圍內,可進行各種構成之省略、置換或變更。Modes for Carrying Out the Invention Modes for carrying out the present invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily imagined by those skilled in the art or are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, omissions, substitutions, or changes of various configurations can be made without departing from the gist of the present invention.

[實施形態1] 依據圖式來說明本發明的實施形態1之切割刀片的安裝方法。圖1是顯示實施形態1之實施切割刀片的安裝方法的切割裝置之構成例的立體圖。圖2是將圖1所示之切割裝置的主要部位以局部截面顯示的側面圖。圖3是顯示圖1所示之切割裝置的修整板用之副工作夾台的立體圖。[Embodiment 1] A method of mounting a cutting blade according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a cutting device for carrying out a method of mounting a cutting blade according to Embodiment 1. Fig. 2 is a side view showing the main parts of the cutting device shown in Fig. 1 in partial cross-section. FIG. 3 is a perspective view showing an auxiliary work clamp for trimming a plate of the cutting device shown in FIG. 1 .

實施形態1之切割刀片的安裝方法是藉由圖1所示之切割裝置1來實施。切割裝置1是對被加工物200進行切割(加工)的裝置。在實施形態1中,被加工物200是以矽、藍寶石、鎵等作為母材的圓板狀的半導體晶圓或光元件晶圓。被加工物200是在正面藉由形成為格子狀的複數條分割預定線201而被區劃成格子狀的區域中形成有元件202。本發明之被加工物200可為將中央部薄化且在外周部形成有厚壁部之所謂的TAIKO(註冊商標)晶圓,除了晶圓外,亦可為具有複數個藉由樹脂密封之元件的矩形狀的封裝基板、陶瓷板、玻璃板等。被加工物200於背面貼附有保護構件即黏著膠帶210。黏著膠帶210於外周組裝有環狀框架211。The installation method of the cutting blade of Embodiment 1 is implemented by the cutting device 1 shown in FIG. 1 . The cutting device 1 is a device that cuts (processes) a workpiece 200 . In Embodiment 1, the workpiece 200 is a disc-shaped semiconductor wafer or an optical element wafer having silicon, sapphire, gallium, or the like as a base material. In the workpiece 200 , elements 202 are formed in a region partitioned into a grid pattern by a plurality of dividing lines 201 formed in a grid shape on the front surface. The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and a thick portion is formed in the outer peripheral portion. In addition to the wafer, it may also have a plurality of wafers sealed with resin. Rectangular packaging substrates, ceramic plates, glass plates, etc. for components. The adhesive tape 210 which is a protection member is attached to the back surface of the workpiece 200 . The adhesive tape 210 is assembled with a ring frame 211 around its periphery.

圖1所示之切割裝置1是以工作夾台10保持被加工物200,並以裝設於主軸22的切割刀片21沿著分割預定線201進行切割的裝置。如圖1所示,切割裝置1具備工作夾台10、切割單元20、相機單元30及控制單元100,該工作夾台10是以上表面11吸引保持被加工物200,該切割單元20是以切割刀片21對保持於工作夾台10的被加工物200進行切割,該相機單元30是對保持於工作夾台10的被加工物200進行拍攝。The cutting device 1 shown in FIG. 1 is a device in which a workpiece 200 is held by a work clamp 10 and cut along a planned dividing line 201 by a cutting blade 21 installed on a main shaft 22 . As shown in Figure 1, the cutting device 1 has a work clamp table 10, a cutting unit 20, a camera unit 30, and a control unit 100. The blade 21 cuts the workpiece 200 held on the work chuck 10 , and the camera unit 30 photographs the workpiece 200 held on the work chuck 10 .

又,如圖1所示,切割裝置1具備圖未示的加工進給單元、分度進給單元40及切入進給單元50,該加工進給單元是將工作夾台10朝與水平方向平行的加工進給方向即X軸方向加工進給、該分度進給單元40是將切割單元20朝與水平方向平行且正交於X軸方向的分度進給方向即Y軸方向分度進給,該切入進給單元50是將切割單元20朝與上表面11正交的切入進給方向即Z軸方向切入進給。Also, as shown in FIG. 1 , the cutting device 1 is provided with a processing feed unit, an index feed unit 40 and a plunging feed unit 50 not shown in the figure. The processing feed direction is the processing feed in the X-axis direction. The indexing feed unit 40 is to move the cutting unit 20 towards the indexing feed direction parallel to the horizontal direction and perpendicular to the X-axis direction, that is, the Y-axis direction. Here, the cutting and feeding unit 50 cuts and feeds the cutting unit 20 toward the cutting and feeding direction perpendicular to the upper surface 11 , that is, the Z-axis direction.

如圖1及圖2所示,工作夾台10為圓盤狀,且上表面11由吸引保持被加工物200的多孔板12、及圍繞多孔板12的圓環狀的金屬框體13所構成。多孔板12是藉由由多孔陶瓷等之多孔質材所形成而設有可吸引流體的孔。又,在實施形態1中,雖然是藉由多孔質材來構成多孔板12,但在本發明中並不限定為多孔質材。金屬框體13是藉由不鏽鋼等之金屬所構成,且具備圍繞多孔板12的框部14、及將框部14設置於外緣部之圓盤狀的本體部15。本體部15與多孔板12之間形成有空間16。空間16是藉由本體部15、框部14及多孔板12而被密閉。工作夾台10是將空間16與圖未示之真空吸引源連接,且藉由以真空吸引源進行吸引而將被加工物200吸引、保持於上表面11。多孔板12的上表面11與金屬框體13的上表面17相當於工作夾台10的上表面,且配置於同一平面上。亦即,工作夾台10的上表面是由多孔板12的上表面11與金屬框體13的上表面17所構成。又,工作夾台10是配置在可藉由加工進給單元而於X軸方向上移動自如之圖1所示的移動台18上,並且藉由圖未示之旋轉驅動源以繞著軸心的方式旋轉自如地設置。As shown in FIGS. 1 and 2 , the work holder 10 is disc-shaped, and the upper surface 11 is composed of a perforated plate 12 that attracts and holds the workpiece 200 , and an annular metal frame 13 that surrounds the perforated plate 12 . . The porous plate 12 is formed of a porous material such as porous ceramics, and has holes capable of attracting fluid. Moreover, in Embodiment 1, although the porous plate 12 was comprised with the porous material, it is not limited to a porous material in this invention. The metal frame body 13 is made of metal such as stainless steel, and includes a frame portion 14 surrounding the perforated plate 12 and a disk-shaped main body portion 15 in which the frame portion 14 is provided on the outer edge. A space 16 is formed between the body portion 15 and the perforated plate 12 . The space 16 is sealed by the main body 15 , the frame 14 and the perforated plate 12 . The work holder 10 connects the space 16 to a vacuum suction source not shown in the figure, and sucks and holds the workpiece 200 on the upper surface 11 by suctioning with the vacuum suction source. The upper surface 11 of the perforated plate 12 and the upper surface 17 of the metal frame 13 correspond to the upper surface of the work holder 10 and are arranged on the same plane. That is, the upper surface of the work holder 10 is composed of the upper surface 11 of the perforated plate 12 and the upper surface 17 of the metal frame 13 . In addition, the work clamp table 10 is arranged on the movable table 18 shown in FIG. 1 which can be moved freely in the X-axis direction by the processing feed unit, and is rotated around the axis by a rotary drive source not shown in the figure. The way to rotate freely set.

切割單元20具備主軸22、主軸殼體23及切割刀片21,該主軸22是以繞著與Y軸方向平行的軸心的方式旋轉,該主軸殼體23是收容主軸且可藉由分度進給單元40及切入進給單元50而於Y軸方向與Z軸方向上移動,該切割刀片21是裝設於主軸22。切割刀片21是形成為極薄之環形形狀的切割磨石,且是藉由一邊被供給切割水一邊以繞著與Y軸方向平行的軸心的方式被主軸22旋轉,來對保持於工作夾台10的被加工物200進行切割加工的構成。又,切割單元20的主軸22及切割刀片21具有導電性。The cutting unit 20 has a main shaft 22, a main shaft housing 23 and a cutting blade 21. The main shaft 22 rotates around an axis parallel to the Y-axis direction. The main shaft housing 23 accommodates the main shaft and can be moved by indexing. The feeding unit 40 and the cutting and feeding unit 50 move in the Y-axis direction and the Z-axis direction, and the cutting blade 21 is installed on the main shaft 22 . The cutting blade 21 is a cutting grindstone formed in an extremely thin annular shape, and is held in the work chuck by being rotated by the spindle 22 around an axis parallel to the Y-axis direction while being supplied with cutting water. The workpiece 200 on the table 10 is configured to be cut. In addition, the main shaft 22 and the cutting blade 21 of the cutting unit 20 have electrical conductivity.

相機單元30是配設在與切割單元20在X軸方向上成行的位置上。在實施形態1中,相機單元30是組裝於主軸殼體23。相機單元30是藉由對保持於工作夾台10的被加工物200進行拍攝的CCD(電荷耦合元件,Charge Coupled Device)相機所構成。CCD相機是對保持於工作夾台10的被加工物200進行拍攝,而得到用於完成校準等之圖像,並將所得到的圖像輸出至控制單元100,其中該校準是進行被加工物200與切割刀片21的對位。The camera unit 30 is arranged at a position aligned with the cutting unit 20 in the X-axis direction. In Embodiment 1, the camera unit 30 is assembled to the spindle housing 23 . The camera unit 30 is constituted by a CCD (Charge Coupled Device) camera that images the workpiece 200 held on the chuck 10 . The CCD camera photographs the workpiece 200 held on the work holder 10 to obtain images for calibration etc., and outputs the obtained images to the control unit 100, wherein the calibration is performed on the workpiece 200 and the alignment of cutting blade 21.

又,在實施形態1中,於相機單元30上組裝有吹氣單元60。吹氣單元60具備有噴嘴,該噴嘴是將從圖未示之加壓氣體供給源所供給之已加壓的空氣700(示於圖5)噴附到工作夾台10的上表面11、17之中的相機單元30進行拍攝的範圍內。Moreover, in Embodiment 1, the blower unit 60 is incorporated in the camera unit 30 . The air blowing unit 60 is provided with nozzles for blowing pressurized air 700 (shown in FIG. 5 ) supplied from a pressurized gas supply source not shown to the upper surfaces 11 and 17 of the work chuck 10 . The camera unit 30 among them takes pictures within the range.

又,切割裝置1具備圖未示之X軸方向位置檢測單元、圖未示之Y軸方向位置檢測單元及圖2所示之Z軸方向位置檢測單元70,該X軸方向位置檢測單元是用於檢測工作夾台10的X軸方向的位置,該Y軸方向位置檢測單元是用於檢測切割單元20的Y軸方向的位置,該Z軸方向位置檢測單元70是用於檢測切割單元20的Z軸方向的位置。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元70可以藉由與X軸方向、Y軸方向或Z軸方向平行的線性尺規71、及讀取頭72來構成。Z軸方向位置檢測單元70的線性尺規71是組裝在可藉由切割裝置1的分度進給單元40而朝Y軸方向移動的Y軸移動台41上,讀取頭72是組裝在切割單元20上,並且與切割單元20一起相對於Y軸移動台41而朝Z軸方向移動。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元70是將工作夾台10的X軸方向、切割單元20的Y軸方向或Z軸方向的位置輸出至控制單元100。In addition, the cutting device 1 is equipped with a position detection unit in the X-axis direction not shown in the figure, a position detection unit in the Y-axis direction not shown in the figure, and a position detection unit 70 in the Z-axis direction shown in FIG. In order to detect the position of the X-axis direction of the work clamp table 10, the Y-axis direction position detection unit is used to detect the position of the Y-axis direction of the cutting unit 20, and the Z-axis direction position detection unit 70 is used to detect the position of the cutting unit 20. The position in the Z-axis direction. The position detection unit in the X-axis direction, the position detection unit in the Y-axis direction, and the position detection unit 70 in the Z-axis direction can be constituted by a linear scale 71 parallel to the X-axis direction, the Y-axis direction, or the Z-axis direction, and a reading head 72. . The linear ruler 71 of the Z-axis direction position detection unit 70 is assembled on the Y-axis moving table 41 that can move toward the Y-axis direction by the index feed unit 40 of the cutting device 1, and the reading head 72 is assembled on the cutting device 1. unit 20, and moves in the Z-axis direction with respect to the Y-axis moving table 41 together with the cutting unit 20. The position detection unit in the X-axis direction, the position detection unit in the Y-axis direction, and the position detection unit in the Z-axis direction 70 output the positions in the X-axis direction of the work clamp table 10, the Y-axis direction or the Z-axis direction of the cutting unit 20 to the control unit 100 .

又,如圖1所示,切割裝置1具備使修整板(相當於請求項1所記載之被加工物)300裝卸自如的副工作夾台(相當於請求項1所記載之工作夾台)80。副工作夾台80是固定於移動台18,並與工作夾台10一體地沿著X軸方向移動。副工作夾台80是形成為矩形狀,且將上表面81配置於與工作夾台10之上表面11、17成為相同的高度的位置,並且上表面81是藉由平坦的金屬材所構成。副工作夾台80在上表面81開口有與圖未示之真空吸引源連接的凹凸即吸引口82,且形成有連通於吸引口82之凹凸即吸引溝83。吸引溝83是從上表面81凹陷地形成。副工作夾台80是藉由以真空吸引源進行吸引而對已載置於上表面81的修整板300進行吸引保持。修整板300是將因堵塞或鈍化而使切割能力降低的切割刀片21磨銳,以使切割刀片21的切割能力回復的構成。將切割刀片21磨銳而使切割刀片21的切割能力回復之作法稱為修整。In addition, as shown in FIG. 1 , the cutting device 1 is provided with a sub-work chuck (corresponding to the work chuck described in claim 1) 80 that enables the trimming plate (corresponding to the workpiece described in claim 1) 300 to be detachable. . The auxiliary chuck 80 is fixed to the moving table 18 and moves in the X-axis direction integrally with the chuck 10 . The sub table 80 is formed in a rectangular shape, and the upper surface 81 is arranged at the same height as the upper surfaces 11 and 17 of the table 10, and the upper surface 81 is made of a flat metal material. On the upper surface 81 of the sub-table 80, there is a concave-convex suction opening 82 connected to a vacuum suction source not shown in the figure, and a concave-convex suction groove 83 communicating with the suction port 82 is formed. The suction groove 83 is recessed from the upper surface 81 . The sub-chuck 80 suction-holds the trimming plate 300 placed on the upper surface 81 by suction with a vacuum suction source. The trimming plate 300 is configured to sharpen the cutting blade 21 whose cutting ability has been reduced due to clogging or blunting, and restore the cutting ability of the cutting blade 21 . The practice of sharpening the cutting blade 21 to restore the cutting ability of the cutting blade 21 is called dressing.

又,切割裝置1具備圖2所示之基準位置設定單元90。基準位置設定單元90是設定使切割刀片21之刀尖的前端接觸於工作夾台10的上表面11、17之(或者位於同一平面上之)Z軸方向上的切割單元20的基準位置之單元,並且是設定使切割刀片21之刀尖的前端接觸於副工作夾台80的上表面81之(或者位於同一平面上之)Z軸方向上的切割單元20的修整用基準位置(相當於基準位置)之單元。基準位置及修整用基準位置是使切割刀片21之刀尖的前端即下端,與上表面11、17、81位於相同平面上之切割單元20的Z軸方向上的位置。又,在本發明中,是將設定基準位置及修整用基準位置的作法稱為安裝。In addition, the cutting device 1 includes a reference position setting unit 90 shown in FIG. 2 . The reference position setting unit 90 is a unit for setting the reference position of the cutting unit 20 in the Z-axis direction of the upper surface 11, 17 of the work clamp table 10 (or on the same plane) where the front end of the cutting blade 21 is in contact with the tip of the knife. , and is to set the cutting unit 20 trimming reference position (equivalent to the reference position) on the Z-axis direction where the front end of the tip of the cutting blade 21 contacts the upper surface 81 of the auxiliary work chuck 80 (or is located on the same plane). position) unit. The reference position and the reference position for trimming are positions in the Z-axis direction of the cutting unit 20 where the lower end of the tip of the cutting blade 21 is located on the same plane as the upper surfaces 11 , 17 , and 81 . Also, in the present invention, the method of setting the reference position and the reference position for trimming is referred to as mounting.

如圖2所示,基準位置設定單元90具備電源91、導通檢測單元92及切換開關93。電源91是透過主軸22將電力供給至切割刀片21、工作夾台10的金屬框體13或者副工作夾台80的上表面81。切換開關93是將電源91供給電力的目的地,在工作夾台10的金屬框體13與副工作夾台80的上表面81之間進行切換。導通檢測單元92是在切割刀片21接觸於工作夾台10之金屬框體13的上表面17或者副工作夾台80的上表面81之時檢測流通的電流,並將表示檢測到電流之訊號輸出至控制單元100。As shown in FIG. 2 , the reference position setting unit 90 includes a power supply 91 , a conduction detection unit 92 , and a selector switch 93 . The power source 91 supplies power to the cutting blade 21 , the metal frame 13 of the work clamp 10 or the upper surface 81 of the auxiliary work clamp 80 through the spindle 22 . The selector switch 93 is a destination for supplying electric power from the power source 91 , and switches between the metal frame 13 of the table 10 and the upper surface 81 of the sub table 80 . The conduction detection unit 92 detects the current flowing when the cutting blade 21 contacts the upper surface 17 of the metal frame 13 of the work clamp 10 or the upper surface 81 of the auxiliary work clamp 80, and outputs a signal indicating the detected current to the control unit 100.

基準位置設定單元90是在設定基準位置之時,藉由切換開關93對工作夾台10的金屬框體13供給電源91的電力。基準位置設定單元90是在當切割刀片21之刀尖接觸於金屬框體13的上表面17時,使導通檢測單元92對電流進行檢測,並將表示檢測到電流之訊號輸出至控制單元100。控制單元100是將表示檢測到電流之訊號輸入時的Z軸方向位置檢測單元70的檢測結果作為基準位置來設定。The reference position setting unit 90 supplies the power of the power source 91 to the metal frame 13 of the work chuck 10 through the switch 93 when setting the reference position. The reference position setting unit 90 makes the conduction detection unit 92 detect the current when the tip of the cutting blade 21 touches the upper surface 17 of the metal frame 13 , and outputs a signal indicating the detected current to the control unit 100 . The control unit 100 sets the detection result of the Z-axis direction position detection unit 70 when the signal indicating that the current is detected is input as a reference position.

又,基準位置設定單元90在設定修整用基準位置之時,是藉由切換開關93對副工作夾台80的上表面81供給電源91之電力。基準位置設定單元90是在當切割刀片21之刀尖接觸於上表面81時,使導通檢測單元92對電流進行檢測,並將表示檢測到電流之訊號輸出至控制單元100。控制單元100是將表示檢測到電流的訊號輸入時的Z軸方向位置檢測單元70的檢測結果作為修整用基準位置來設定。In addition, the reference position setting unit 90 supplies the power of the power source 91 to the upper surface 81 of the sub chuck 80 through the changeover switch 93 when setting the reference position for trimming. The reference position setting unit 90 enables the conduction detection unit 92 to detect the current when the tip of the cutting blade 21 touches the upper surface 81 , and outputs a signal indicating the detected current to the control unit 100 . The control unit 100 sets the detection result of the Z-axis direction position detection unit 70 when the signal indicating that the current is detected is input as the reference position for trimming.

控制單元100是分別控制構成切割裝置1的上述之各構成要素,並使切割裝置1實施對被加工物200之加工動作的單元。再者,控制單元100為電腦。控制單元100具有運算處理裝置、儲存裝置及輸入輸出介面裝置,該運算處理裝置具有如CPU(中央處理單元,central processing unit)的微處理器,該儲存裝置具有如ROM(唯讀記憶體,read only memory)或RAM(隨機存取記憶體,random access memory)之記憶體。控制單元100的運算處理裝置會依照儲存於儲存裝置的電腦程式實施運算處理,並透過輸入輸出介面裝置將用於控制切割裝置1的控制訊號,輸出至切割裝置1的上述之構成要素。The control unit 100 is a unit that individually controls each of the above-mentioned constituent elements constituting the cutting device 1 and causes the cutting device 1 to perform a processing operation on the workpiece 200 . Furthermore, the control unit 100 is a computer. The control unit 100 has an arithmetic processing device, a storage device, and an input-output interface device. The arithmetic processing device has a microprocessor such as a CPU (Central Processing Unit, central processing unit), and the storage device has a ROM (read-only memory, read-only memory). only memory) or RAM (random access memory, random access memory) memory. The calculation processing device of the control unit 100 performs calculation processing according to the computer program stored in the storage device, and outputs the control signal for controlling the cutting device 1 to the above-mentioned components of the cutting device 1 through the input and output interface device.

又,控制單元100在對被加工物200進行切割之時,是依據基準位置來控制切割刀片21對被加工物200的切入量,並且在實施修整之時,是依據修整用基準位置來控制切割刀片21對修整板300的切入量。控制單元100是與圖未示之顯示單元及圖未示之輸入單元相連接,該顯示單元是藉由顯示加工動作之狀態或圖像等的液晶顯示裝置等所構成,該輸入單元是在操作人員登錄加工內容資訊等之時使用。輸入單元是藉由設置於顯示單元的觸控面板、及鍵盤等之外部輸入裝置之中至少一種所構成。Moreover, when the control unit 100 cuts the workpiece 200, it controls the cutting amount of the cutting blade 21 to the workpiece 200 according to the reference position, and when trimming, it controls the cutting according to the reference position for trimming. The cutting amount of the blade 21 to the trimming plate 300 . The control unit 100 is connected to a display unit not shown in the figure and an input unit not shown in the figure. The display unit is composed of a liquid crystal display device or the like that displays the state of processing operations or images, etc. The input unit is operated It is used when a person registers processing content information, etc. The input unit is constituted by at least one of external input devices such as a touch panel provided on the display unit and a keyboard.

又,切割裝置1具備片匣升降機110、洗淨單元120及圖未示之搬送單元,該片匣升降機110是供收容切割前後的被加工物200之片匣111載置且於Z軸方向上移動片匣111,該洗淨單元120是洗淨切割後的被加工物200,該搬送單元是使被加工物200於片匣111進出,並且搬送被加工物200。In addition, the cutting device 1 is equipped with a cassette elevator 110, a cleaning unit 120, and a conveying unit not shown in the figure. The cassette elevator 110 is used to place the cassette 111 for accommodating the workpiece 200 before and after cutting and is positioned in the Z-axis direction. The cassette 111 is moved, the cleaning unit 120 cleans the cut workpiece 200 , and the transport unit moves the workpiece 200 in and out of the cassette 111 and transports the workpiece 200 .

其次,就實施形態1之切割裝置1的加工動作進行說明。在加工動作中,是在操作人員將加工內容資訊登錄到控制單元100,且已由操作人員作出加工動作的開始指示的情況下,使切割裝置1開始加工動作。Next, the processing operation of the cutting device 1 according to the first embodiment will be described. During the processing operation, the cutting device 1 is started to start the processing operation when the operator has registered the processing content information in the control unit 100 and the operator has given an instruction to start the processing operation.

在加工動作中,控制單元100是令搬送單元從片匣111取出切割前的被加工物200,並載置於工作夾台10而將被加工物200吸引保持在工作夾台10。控制單元100是藉由加工進給單元而將工作夾台10朝向切割單元20之下方移動,並將保持於工作夾台10的被加工物200定位到相機單元30之下方,而使相機單元30對被加工物200進行拍攝。控制單元100是執行型樣匹配等之圖像處理,而調整保持於工作夾台10的被加工物200與切割單元20的相對位置,其中該型樣匹配是用於進行保持於工作夾台10的被加工物200之分割預定線201與切割單元20之切割刀片21的對位。During the processing operation, the control unit 100 causes the transfer unit to take out the workpiece 200 before cutting from the cassette 111 and place it on the work chuck 10 to attract and hold the workpiece 200 on the work chuck 10 . The control unit 100 moves the work clamp table 10 toward the bottom of the cutting unit 20 through the processing feed unit, and positions the workpiece 200 held on the work clamp table 10 below the camera unit 30, so that the camera unit 30 The workpiece 200 is photographed. The control unit 100 performs image processing such as pattern matching, and adjusts the relative position of the workpiece 200 held on the work clamp 10 and the cutting unit 20 , wherein the pattern matching is used to carry out holding on the work clamp 10 The alignment between the planned dividing line 201 of the workpiece 200 and the cutting blade 21 of the cutting unit 20.

然後,控制單元100是依據加工內容資訊,並藉由加工進給單元、分度進給單元40、切入進給單元50與旋轉驅動源,使切割刀片21及被加工物200沿著分割預定線201相對地移動,且一邊供給切割水一邊藉由切割刀片21切割分割預定線201。Then, the control unit 100 makes the cutting blade 21 and the workpiece 200 along the planned dividing line through the processing feed unit, the index feed unit 40, the cutting feed unit 50 and the rotary drive source according to the processing content information. 201 moves relatively, and cuts the planned dividing line 201 by the cutting blade 21 while supplying cutting water.

控制單元100在對全部的分割預定線201進行切割,而將被加工物200分割成一個個的元件202時,會在使工作夾台10從切割單元20的下方退避之後,解除工作夾台10的吸引保持。控制單元100是令搬送單元將切割後的被加工物200搬送至洗淨單元120,並於以洗淨單元120洗淨之後收容於片匣111。When the control unit 100 cuts all the planned dividing lines 201 and divides the workpiece 200 into individual components 202 , it releases the work clamp 10 after retracting the work clamp 10 from below the cutting unit 20 . The attraction keeps. The control unit 100 instructs the conveying unit to convey the cut workpiece 200 to the cleaning unit 120 , and store it in the cassette 111 after being cleaned by the cleaning unit 120 .

又,控制單元100在加工動作中,是在規定的修整時間點對切割刀片21進行修整。例如每切割預先設定之數量的分割預定線201,即是修整時間點。又,本發明之修整時間點可為即將在對一片被加工物200進行加工的途中,亦可為在連續加工複數片被加工物200之時更換被加工物200的時間點。In addition, the control unit 100 dresses the cutting blade 21 at a predetermined dressing timing during the machining operation. For example, cutting a preset number of planned dividing lines 201 is the trimming time point. In addition, the trimming time point in the present invention may be in the middle of processing one workpiece 200, or may be a time point when the workpiece 200 is replaced when a plurality of workpieces 200 are continuously processed.

接著,依據圖式說明控制單元100設定基準位置之切割刀片的安裝方法。圖4是顯示實施形態1之切割刀片的安裝方法之流程的流程圖。Next, the installation method of the cutting blade for setting the reference position by the control unit 100 will be described according to the drawings. Fig. 4 is a flow chart showing the flow of the method of mounting the dicing blade according to the first embodiment.

實施形態1之切割刀片的安裝方法(以下,簡記為安裝方法)是設定切割刀片21的Z軸方向的基準位置的方法。如圖4所示,安裝方法具備安裝位置探索步驟ST2、導通檢測步驟ST3及基準位置設定步驟ST4。The method of attaching the cutting blade of Embodiment 1 (hereinafter, simply referred to as the attaching method) is a method of setting the reference position of the cutting blade 21 in the Z-axis direction. As shown in FIG. 4 , the mounting method includes a mounting position search step ST2 , a conduction detection step ST3 , and a reference position setting step ST4 .

控制單元100在切割裝置1的加工動作中,是在預先設定之規定的時間點重複實施圖4所示之切割刀片的安裝方法的流程圖。在切割裝置1的加工動作中,控制單元100會判定是否為基準位置設定時間點(步驟ST1)。當控制單元100判定為並非基準位置設定時間點時(步驟ST1:否)時,會重複步驟ST1。基準位置設定時間點所指的是進行設定基準位置的時間點,例如在工作夾台10的更換後,每切割預先設定之數量的分割預定線201,切割裝置1的加工動作的開始時。當控制單元100判定為基準位置設定時間點(步驟ST1:是)時,即前進至安裝位置探索步驟ST2。The control unit 100 is a flow chart of repeatedly implementing the cutting blade installation method shown in FIG. 4 at predetermined time points during the processing operation of the cutting device 1 . During the processing operation of the cutting device 1 , the control unit 100 determines whether the time point is set for the reference position (step ST1 ). When the control unit 100 determines that it is not the reference position setting time point (step ST1: NO), step ST1 will be repeated. The reference position setting time point refers to the time point when the reference position is set, for example, when the machining operation of the cutting device 1 starts after cutting a preset number of planned dividing lines 201 after the chuck 10 is replaced. When the control unit 100 determines that it is the reference position setting time point (step ST1: YES), it proceeds to the mounting position search step ST2.

(安裝位置探索步驟) 圖5是將圖4所示之切割刀片的安裝方法的安裝位置探索步驟以局部截面顯示的側面圖。圖6是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。圖7是顯示從圖6所示之狀態旋轉工作夾台之後的圖像之一例的圖。圖8是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的其他例的圖。圖9是顯示從圖8所示之狀態旋轉工作夾台之後的圖像之一例的圖。(Installation position search step) FIG. 5 is a side view showing a partial cross-section of the installation position search step of the cutting blade installation method shown in FIG. 4 . Fig. 6 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 7 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 6 . Fig. 8 is a diagram showing another example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 9 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 8 .

安裝位置探索步驟ST2是以相機單元30拍攝工作夾台10之金屬框體13的上表面17,以探索未被檢測出凹凸即傷痕500或者異物600之上表面17的安裝位置501(顯示於圖6、圖7、圖8及圖9)之步驟。又,安裝位置501所指的是工作夾台10的上表面17當中於安裝時讓切割刀片21接觸的位置,在實施形態1中,安裝位置501是設定在金屬框體13的上表面17。如圖5所示,在安裝位置探索步驟ST2中,控制單元100是在使相機單元30沿著Z軸方向而相向於工作夾台10的金屬框體13後,在以相機單元30拍攝工作夾台10的金屬框體13之上表面17之前,實施吹氣步驟ST21,該吹氣步驟ST21是以吹氣單元60在相機單元30拍攝之上表面17的一部分即範圍內噴附已加壓的空氣700。即,安裝位置探索步驟ST2具備吹氣步驟ST21。The installation position search step ST2 is to photograph the upper surface 17 of the metal frame 13 of the work clamping table 10 with the camera unit 30, so as to explore the installation position 501 on the upper surface 17 of the undetected unevenness, that is, the flaw 500 or the foreign object 600 (shown in FIG. 6. Steps in Fig. 7, Fig. 8 and Fig. 9). Also, the installation position 501 refers to the position where the cutting blade 21 contacts the upper surface 17 of the work holder 10 during installation. In Embodiment 1, the installation position 501 is set on the upper surface 17 of the metal frame 13 . As shown in FIG. 5 , in the installation position search step ST2, the control unit 100 makes the camera unit 30 face the metal frame 13 of the work clamp table 10 along the Z-axis direction, and then uses the camera unit 30 to photograph the work clamp. Before the upper surface 17 of the metal frame 13 of the table 10, the air blowing step ST21 is implemented. The air blowing step ST21 is to spray the pressurized air on the part of the upper surface 17 photographed by the camera unit 60, that is, within the range of the air blowing unit 60. Air 700. That is, the mounting position searching step ST2 includes an air blowing step ST21.

在安裝位置探索步驟ST2中,控制單元100是以相機單元30拍攝金屬框體13的上表面17(步驟ST22)。在安裝位置探索步驟ST2中,控制單元100是對經拍攝而取得的圖像400實施圖像處理,並判定在圖像400之規定範圍即包含安裝位置501的範圍401(顯示於圖6、圖7、圖8及圖9)內是否檢測出傷痕500(步驟ST23)。再者,傷痕500所指的是在控制單元100的圖像處理中被判定為所設定之傷痕的區域,在實施形態1中,當已被控制單元100判定為傷痕的區域超過將以切割刀片21形成之傷痕的預定面積的5%~30%時,即判定為檢測出傷痕500。In the installation position searching step ST2, the control unit 100 uses the camera unit 30 to photograph the upper surface 17 of the metal frame 13 (step ST22). In the installation position search step ST2, the control unit 100 performs image processing on the captured image 400, and determines that the range 401 including the installation position 501 within the specified range of the image 400 (shown in FIG. 7. Whether a flaw 500 is detected in FIG. 8 and FIG. 9 ) (step ST23). Furthermore, the scar 500 refers to the area that is determined to be the set flaw in the image processing of the control unit 100. In Embodiment 1, when the area that has been determined to be a flaw by the control unit 100 exceeds the area with a cutting blade 21 When the scars formed cover 5% to 30% of the predetermined area, it is judged that the scars 500 are detected.

如圖6所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出傷痕500(步驟ST23:是)時,會旋轉工作夾台10並移動相機單元30的拍攝位置(步驟ST24)。在安裝位置探索步驟ST2中,控制單元100在拍攝而取得之圖像400的範圍401內判定為如圖7所示地未檢測出傷痕500(步驟ST23:否)的情況下、以及已在步驟ST24中使工作夾台10旋轉後,會對在拍攝而取得之圖像400的範圍401內是否檢測出異物600進行判定(步驟ST25)。再者,在實施形態1中,異物600是切割水的滴液,但在本發明中並不限定為切割水。As shown in FIG. 6 , in the mounting position search step ST2, when the control unit 100 determines that a flaw 500 is detected within the range 401 of the captured image 400 (step ST23: Yes), the work chuck 10 is rotated. And the shooting position of the camera unit 30 is moved (step ST24). In the mounting position searching step ST2, when the control unit 100 determines that the flaw 500 is not detected within the range 401 of the captured image 400 as shown in FIG. After the table 10 is rotated in ST24, it is determined whether or not a foreign object 600 is detected within the range 401 of the captured image 400 (step ST25). Furthermore, in Embodiment 1, the foreign matter 600 is a drop of cutting water, but it is not limited to cutting water in the present invention.

如圖8所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出異物600(步驟ST25:是)時,會旋轉工作夾台10,並移動相機單元30的拍攝位置(步驟ST26),而返回到吹氣步驟ST21。如圖9所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出異物600時(步驟ST25:否)時,會前進至導通檢測步驟ST3。如此進行,在安裝位置探索步驟ST2中,在拍攝而取得之圖像400的範圍401內檢測出傷痕500或者異物600的情況下,會重複從吹氣步驟ST21進行至步驟ST26,並使工作夾台10旋轉直到在範圍401內未被檢測出傷痕500或者異物600的位置為止,來探索未存在有傷痕500及異物600之上表面17的一部分即安裝位置501。As shown in FIG. 8 , in the mounting position search step ST2, when the control unit 100 determines that a foreign object 600 is detected within the range 401 of the captured image 400 (step ST25: Yes), the work clamping table 10 is rotated. , and move the photographing position of the camera unit 30 (step ST26), and return to the blowing step ST21. As shown in FIG. 9 , in the installation position search step ST2, when the control unit 100 determines that the foreign object 600 is not detected within the range 401 of the captured image 400 (step ST25: No), it proceeds to Conduction detection step ST3. In this way, in the installation position search step ST2, if a flaw 500 or a foreign object 600 is detected within the range 401 of the captured image 400, the air blowing step ST21 to step ST26 will be repeated, and the work clamp The table 10 rotates until a position where no flaw 500 or foreign object 600 is detected within the range 401 to search for an installation position 501 that is a part of the upper surface 17 where no flaw 500 or foreign object 600 exists.

(導通檢測步驟) 圖10是將圖4所示之切割刀片的安裝方法的導通檢測步驟以局部截面顯示的側面圖。(Continuity Test Step) FIG. 10 is a side view showing a conduction test step of the method of mounting the dicing blade shown in FIG. 4 in a partial section.

導通檢測步驟ST3是將在安裝位置探索步驟ST2中所探索到的上表面17的安裝位置501定位到切割刀片21的正下方,並使切割單元20於Z軸方向上移動,以檢測切割刀片21在安裝位置501接觸於上表面17之瞬間的電氣導通的步驟。在導通檢測步驟ST3中,控制單元100是如圖10之虛線所示,在使上表面17之安裝位置501與切割刀片21相向後,使切割刀片21朝Z軸方向下降直到導通檢測單元92檢測到電流為止,當導通檢測單元92檢測到電流時,會使切割刀片21朝Z軸方向上升。The conduction detection step ST3 is to locate the installation position 501 of the upper surface 17 found in the installation position search step ST2 directly below the cutting blade 21, and move the cutting unit 20 in the Z-axis direction to detect the cutting blade 21 A step of electrical conduction at the moment when the mounting position 501 touches the upper surface 17 . In the conduction detection step ST3, the control unit 100, as shown by the dotted line in FIG. Up to the current, when the conduction detection unit 92 detects the current, the cutting blade 21 is raised toward the Z-axis direction.

(基準位置設定步驟) 基準位置設定步驟ST4是將檢測出電氣導通之時的切割刀片21的Z軸方向的位置作為基準位置來設定。在基準位置設定步驟ST4中,控制單元100是在導通檢測步驟ST3中,將導通檢測單元92檢測出電流時的Z軸方向位置檢測單元70的檢測結果即切割刀片21的Z軸方向的位置,作為基準位置來設定、儲存。(Reference Position Setting Step) In the reference position setting step ST4, the position in the Z-axis direction of the cutting blade 21 at the time when electrical conduction is detected is set as a reference position. In the reference position setting step ST4, the control unit 100 is in the conduction detection step ST3, the detection result of the Z-axis direction position detection unit 70 when the conduction detection unit 92 detects the current, that is, the position of the Z-axis direction of the cutting blade 21, Set and store as the reference position.

如以上,實施形態1之安裝方法是在安裝位置探索步驟ST2中,預先以相機單元30拍攝用以使切割刀片21接觸之工作夾台10的上表面17,來確認傷痕500或異物600的有無。因此,實施形態1之安裝方法變得可抑制因切割刀片21接觸於傷痕500或者異物600而產生的安裝不良。其結果,實施形態1之安裝方法可以抑制在安裝時之基準位置的誤差。As mentioned above, in the mounting method of Embodiment 1, in the mounting position searching step ST2, the camera unit 30 photographs the upper surface 17 of the work clamp 10 for bringing the cutting blade 21 into contact in advance, and checks whether there is a flaw 500 or a foreign object 600. . Therefore, in the mounting method of the first embodiment, it becomes possible to suppress mounting failures caused by the dicing blade 21 coming into contact with the flaw 500 or the foreign matter 600 . As a result, the mounting method of Embodiment 1 can suppress the error of the reference position at the time of mounting.

又,實施形態1之安裝方法是在安裝位置探索步驟ST2中,在圖像400之範圍401內檢測出傷痕500或者異物600之情況下,移動拍攝位置直到在範圍401內未檢測出傷痕500或者異物600的位置為止。其結果,實施形態1之安裝方法可以抑制切割刀片21接觸於傷痕500或者異物600而安裝的情形,且可以抑制在安裝時之基準位置的誤差。In addition, in the mounting method of Embodiment 1, in the mounting position search step ST2, when a flaw 500 or a foreign object 600 is detected within the range 401 of the image 400, the imaging position is moved until the flaw 500 or foreign matter 600 is not detected within the range 401. 600 foreign objects. As a result, the mounting method of Embodiment 1 can prevent the cutting blade 21 from being mounted in contact with the flaw 500 or the foreign object 600, and can suppress errors in the reference position during mounting.

又,實施形態1之安裝方法具備吹氣步驟ST21,該吹氣步驟ST21是在安裝位置探索步驟ST2以相機單元30拍攝上表面17之前,以吹氣單元60於進行拍攝之上表面17的範圍噴附空氣700。因此,實施形態1之安裝方法可以去除上表面17之範圍401內的異物600,且可以抑制安裝時之基準位置的誤差。In addition, the mounting method according to the first embodiment includes an air blowing step ST21. The air blowing step ST21 is to shoot the upper surface 17 with the air blowing unit 60 before the mounting position search step ST2 uses the camera unit 30 to photograph the upper surface 17. Spray with Air 700. Therefore, the mounting method of Embodiment 1 can remove the foreign matter 600 within the range 401 of the upper surface 17, and can suppress the error of the reference position during mounting.

[實施形態2] 依據圖式來說明本發明的實施形態2之切割刀片的安裝方法。圖11是顯示實施形態2之切割刀片的安裝方法之流程的流程圖。圖12是顯示圖11所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的一例的圖。圖13是顯示從圖12所示之狀態使相機單元與副工作夾台相對地移動後的圖像之一例的圖。再者,圖11至圖13,是對與實施形態1相同的部分附加相同的符號而省略說明。[Embodiment 2] A method of mounting a cutting blade according to Embodiment 2 of the present invention will be described with reference to the drawings. Fig. 11 is a flow chart showing the flow of the method of mounting the dicing blade according to the second embodiment. Fig. 12 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 11 . Fig. 13 is a diagram showing an example of an image obtained by relatively moving the camera unit and the sub-table from the state shown in Fig. 12 . In addition, in Fig. 11 to Fig. 13, the same parts as those in the first embodiment are given the same reference numerals, and description thereof will be omitted.

實施形態2之切割刀片的安裝方法(以下,簡記為安裝方法)是控制單元100設定修整用基準位置的方法。如圖11所示,實施形態2之安裝方法與實施形態1同樣,具備安裝位置探索步驟ST2、導通檢測步驟ST3及基準位置設定步驟ST4。The cutting blade mounting method (hereinafter simply referred to as the mounting method) of the second embodiment is a method in which the control unit 100 sets the reference position for trimming. As shown in FIG. 11, the mounting method of the second embodiment is the same as the first embodiment, and includes a mounting position search step ST2, a conduction detection step ST3, and a reference position setting step ST4.

控制單元100是在切割裝置1的加工動作中,在預先設定之規定的時間點時重複實施圖11所示之安裝方法的流程圖。在切割裝置1的加工動作中,控制單元100會判定是否為修整用基準位置設定時間點(步驟ST1)。當控制單元100判定為並非修整用基準位置設定時間點(步驟ST1:否)時,會重複步驟ST1。修整用基準位置設定時間點所指的是設定修整用基準位置的時間點,例如在副工作夾台80的更換後等。當控制單元100判定為修整用基準位置設定時間點(步驟ST1:是)時,會前進至安裝位置探索步驟ST2。The control unit 100 is a flow chart of repeatedly implementing the installation method shown in FIG. 11 at a preset predetermined time point during the processing operation of the cutting device 1 . During the processing operation of the cutting device 1 , the control unit 100 determines whether or not the time point is set for the reference position for trimming (step ST1 ). When the control unit 100 determines that it is not the trimming reference position setting time point (step ST1: NO), step ST1 is repeated. The timing of setting the reference position for dressing refers to the timing of setting the reference position for dressing, for example, after the replacement of the sub chuck 80 . When the control unit 100 determines that it is the trimming reference position setting time point (step ST1: YES), it proceeds to the mounting position search step ST2.

在實施形態2之安裝方法的安裝位置探索步驟ST2的步驟ST22中,控制單元100是拍攝副工作夾台80之上表面81的一部分,並在步驟ST24、26中,藉由加工進給單元及分度進給單元40使相機單元30與副工作夾台80相對地移動。In the step ST22 of the installation position search step ST2 of the installation method of the second embodiment, the control unit 100 photographs a part of the upper surface 81 of the sub-table 80, and in steps ST24 and 26, by processing the feed unit and The index feeding unit 40 relatively moves the camera unit 30 and the sub-table 80 .

又,在實施形態2之安裝方法的安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出異物600(步驟ST25:否)時,會判定在拍攝而取得之圖像400的規定範圍即範圍401內是否檢測出凹凸即吸引口82或者吸引溝83(步驟ST27)。Also, in the mounting position search step ST2 of the mounting method according to the second embodiment, when the control unit 100 determines that the foreign object 600 has not been detected within the range 401 of the captured image 400 (step ST25: NO), it will It is judged whether or not the suction port 82 or the suction groove 83 is detected as unevenness in the range 401 which is a predetermined range of the captured image 400 (step ST27 ).

如圖12所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內檢測出吸引口82或者吸引溝83(步驟ST27:是)時,會前進至步驟ST26。如圖13所示,在安裝位置探索步驟ST2中,當控制單元100判定為在拍攝而取得之圖像400的範圍401內並未檢測出吸引口82或者吸引溝83(步驟ST27:否)時,會前進至導通檢測步驟ST3。又,圖12是顯示在範圍401內檢測出吸引溝83的情況。As shown in FIG. 12 , in the mounting position search step ST2, when the control unit 100 determines that the suction opening 82 or the suction groove 83 is detected within the range 401 of the captured image 400 (step ST27: Yes), it will Proceed to step ST26. As shown in FIG. 13 , in the mounting position search step ST2, when the control unit 100 determines that the suction opening 82 or the suction groove 83 is not detected within the range 401 of the captured image 400 (step ST27: NO). , the process proceeds to the conduction detection step ST3. In addition, FIG. 12 shows that the suction groove 83 is detected within the range 401 .

在實施形態2之安裝方法的安裝位置探索步驟ST2中,在拍攝而取得之圖像400的範圍401內檢測出傷痕500、異物600、吸引口82或者吸引溝83的情況下,會重複從吹氣步驟ST21進行至步驟ST27、步驟ST26,並使相機單元30與副工作夾台80相對地移動直到在範圍401內未檢測出傷痕500、異物600或吸引口82或吸引溝83的位置為止,以探索未存在有傷痕500、異物600或吸引口82或吸引溝83之上表面81之一部分即安裝位置501。In the mounting position search step ST2 of the mounting method according to the second embodiment, when a flaw 500, a foreign object 600, a suction port 82 or a suction groove 83 is detected within the range 401 of the captured image 400, the process from the blower to the Step ST21 proceeds to step ST27 and step ST26, and the camera unit 30 is moved relative to the auxiliary work clamp 80 until the position of the flaw 500, the foreign object 600, the suction port 82 or the suction groove 83 is not detected within the range 401, To explore the installation location 501 that is a part of the upper surface 81 of the suction port 82 or the suction groove 83 without the scar 500 , the foreign object 600 .

如以上,實施形態2之安裝方法是在安裝位置探索步驟ST2中,預先以相機單元30拍攝用以使切割刀片21接觸之副工作夾台80的上表面81,來確認傷痕500、異物600、或吸引口82或吸引溝83的有無。因此,實施形態2之安裝方法變得可抑制因切割刀片21接觸於傷痕500、異物600、或吸引口82或吸引溝83而產生的安裝不良。其結果,實施形態2之安裝方法可以抑制在安裝時之基準位置的誤差。As above, in the mounting method of Embodiment 2, in the mounting position search step ST2, the camera unit 30 is used to photograph the upper surface 81 of the auxiliary chuck 80 for making the cutting blade 21 contact in advance, so as to confirm the flaw 500, foreign matter 600, Or the presence or absence of the suction port 82 or the suction groove 83 . Therefore, in the mounting method of the second embodiment, it becomes possible to suppress mounting failures caused by the dicing blade 21 coming into contact with the flaw 500, the foreign matter 600, or the suction port 82 or the suction groove 83. As a result, the mounting method of the second embodiment can suppress the error of the reference position at the time of mounting.

又,實施形態2之安裝方法是在安裝位置探索步驟ST2中,在圖像400之範圍401內檢測出傷痕500、異物600或吸引口82或吸引溝83的情況下,移動拍攝位置直到在範圍401內未檢測出傷痕500、異物600或吸引口82或吸引溝83的位置為止。其結果,實施形態2之安裝方法可以抑制切割刀片21接觸於傷痕500、異物600或吸引口82或吸引溝83而安裝的情形,且可以抑制在安裝時之基準位置的誤差。In addition, in the mounting method of Embodiment 2, in the mounting position search step ST2, when a flaw 500, a foreign object 600, a suction opening 82 or a suction groove 83 is detected within the range 401 of the image 400, the shooting position is moved until it is within the range 401. 401 until the flaw 500, the foreign object 600, the position of the suction port 82 or the suction groove 83 are not detected. As a result, the mounting method of Embodiment 2 can prevent the cutting blade 21 from being mounted in contact with the flaw 500, the foreign matter 600, the suction port 82 or the suction groove 83, and can suppress errors in the reference position during mounting.

又,依據前述之實施形態1及實施形態2之切割刀片的安裝方法,可獲得以下的切割裝置。 (附記1) 一種切割裝置,該切割裝置的特徵在於具備: 工作夾台,以上表面保持被加工物; 切割單元,以裝設於主軸的切割刀片對保持於該工作夾台的被加工物進行切割; 切入進給單元,使該切割單元於與該上表面正交的切入進給方向上移動; 相機單元,對保持於該工作夾台的被加工物進行拍攝;以及 控制單元,控制各構成要素, 前述控制單元是實施下述步驟: 安裝位置探索步驟,以該相機單元拍攝該工作夾台的該上表面,以探索未被檢測出凹凸或者異物之該上表面的安裝位置; 導通檢測步驟,將在該安裝位置探索步驟中所探索到的該上表面的該安裝位置定位到該切割刀片的正下方,並使該切割單元朝該切入進給方向移動,以檢測在該安裝位置使該切割刀片接觸於該上表面之瞬間的電氣導通;以及 基準位置設定步驟,將檢測出電氣導通之時的該切割刀片的切入進給方向的位置作為該基準位置來設定。Moreover, according to the above-mentioned method of mounting the cutting blade of the first embodiment and the second embodiment, the following cutting device can be obtained. (Additional Note 1) A cutting device characterized by comprising: a work holder holding a workpiece held on the upper surface; cutting; a cutting feed unit that moves the cutting unit in a cutting feeding direction perpendicular to the upper surface; a camera unit that photographs the workpiece held on the work clamp; and a control unit that controls each component The above-mentioned control unit implements the following steps: the installation position search step, using the camera unit to photograph the upper surface of the work clamp, so as to explore the installation position of the upper surface where no unevenness or foreign matter is detected; the conduction detection step , positioning the installation position of the upper surface explored in the installation position exploration step directly below the cutting blade, and moving the cutting unit toward the cutting feed direction, so as to detect that the installation position makes the electrical conduction at the moment when the cutting blade contacts the upper surface; and a reference position setting step, setting the position of the cutting blade in the cutting feed direction when the electrical conduction is detected as the reference position.

上述切割裝置與實施形態1及實施形態2之切割刀片的安裝方法同樣,由於預先以相機單元拍攝用以使切割刀片接觸之工作夾台的上表面,以確認凹凸或者異物之有無,因此變得可防止由凹凸或異物所造成之安裝不良的情況,且可以抑制在安裝時的基準位置的誤差。The above-mentioned cutting device is the same as the installation method of the cutting blade in Embodiment 1 and Embodiment 2. Since the upper surface of the work chuck for making the cutting blade contact is photographed in advance with the camera unit to confirm the presence or absence of unevenness or foreign matter, it becomes It is possible to prevent poor mounting due to unevenness or foreign matter, and to suppress errors in the reference position during mounting.

再者,本發明並非受限於上述實施形態之發明。亦即,在不脫離本發明的主旨的範圍內可進行各種變形而實施。In addition, this invention is not limited to the invention of the said embodiment. That is, various deformation|transformation can be added and implemented in the range which does not deviate from the summary of this invention.

1‧‧‧切割裝置10‧‧‧工作夾台11、17、81‧‧‧上表面12‧‧‧多孔板13‧‧‧金屬框體14‧‧‧框部15‧‧‧本體部16‧‧‧空間18‧‧‧移動台20‧‧‧切割單元21‧‧‧切割刀片22‧‧‧主軸23‧‧‧主軸殼體30‧‧‧相機單元40‧‧‧分度進給單元41‧‧‧Y軸移動台50‧‧‧切入進給單元60‧‧‧吹氣單元70‧‧‧Z軸方向位置檢測單元71‧‧‧線性尺規72‧‧‧讀取頭80‧‧‧副工作夾台(工作夾台)82‧‧‧吸引口(凹凸)83‧‧‧吸引溝(凹凸)90‧‧‧基準位置設定單元91‧‧‧電源92‧‧‧導通檢測單元93‧‧‧切換開關100‧‧‧控制單元110‧‧‧片匣升降機111‧‧‧片匣120‧‧‧洗淨單元200‧‧‧被加工物201‧‧‧分割預定線202‧‧‧元件210‧‧‧黏著膠帶211‧‧‧環狀框架300‧‧‧修整板(被加工物)400‧‧‧圖像401‧‧‧範圍(規定範圍)500‧‧‧傷痕(凹凸)501‧‧‧安裝位置600‧‧‧異物700‧‧‧空氣X、Y、Z‧‧‧方向ST1~ST4、ST21~ST27‧‧‧步驟1‧‧‧Cutting device 10‧‧‧Jig table 11, 17, 81‧‧‧Upper surface 12‧‧‧perforated plate 13‧‧‧Metal frame 14‧‧‧Frame part 15‧‧‧Body part 16‧ ‧‧Space 18‧‧‧Mobile table 20‧‧‧Cutting unit 21‧‧‧Cutting blade 22‧‧‧Spindle 23‧‧‧Spindle housing 30‧‧‧Camera unit 40‧‧‧Indexing feed unit 41‧ ‧‧Y-axis moving table 50‧‧‧cutting feed unit 60‧‧‧air blowing unit 70‧‧‧Z-axis direction position detection unit 71‧‧‧linear gauge 72‧‧‧reading head 80‧‧‧pair Work clamp (work clamp) 82‧‧‧suction opening (concave-convex) 83‧‧‧suction groove (concave-convex) 90‧‧‧reference position setting unit 91‧‧‧power supply 92‧‧‧conduction detection unit 93‧‧‧ Switch 100‧‧‧control unit 110‧‧‧cassette elevator 111‧‧‧cassette 120‧‧‧cleaning unit 200‧‧‧processed object 201‧‧‧separation schedule line 202‧‧‧component 210‧‧ ‧Adhesive Tape 211‧‧‧Ring Frame 300‧‧‧Trimming Plate (Workpiece) 400‧‧‧Image 401‧‧‧Range (Specified Range)500‧‧‧Scar (Concave-Convex) 501‧‧‧Installation Position 600‧‧‧foreign matter 700‧‧‧air X, Y, Z‧‧‧direction ST1~ST4, ST21~ST27‧‧‧steps

圖1是顯示實施形態1之實施切割刀片的安裝方法的切割裝置之構成例的立體圖。 圖2是將圖1所示之切割裝置的主要部位以局部截面顯示的側面圖。 圖3是顯示圖1所示之切割裝置的修整板用之副工作夾台的立體圖。 圖4是顯示實施形態1之切割刀片的安裝方法之流程的流程圖。 圖5是將圖4所示之切割刀片的安裝方法的安裝位置探索步驟以局部截面顯示的側面圖。 圖6是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。 圖7是顯示從圖6所示之狀態旋轉工作夾台之後的圖像之一例的圖。 圖8是顯示圖4所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像的其他例的圖。 圖9是顯示從圖8所示之狀態旋轉工作夾台之後的圖像之一例的圖。 圖10是將圖4所示之切割刀片的安裝方法的導通檢測步驟以局部截面顯示的側面圖。 圖11是顯示實施形態2之切割刀片的安裝方法之流程的流程圖。 圖12是顯示圖11所示之切割刀片的安裝方法的安裝位置探索步驟之相機單元所拍攝到的圖像之一例的圖。 圖13是顯示從圖12所示之狀態使相機單元與副工作夾台相對地移動後的圖像之一例的圖。Fig. 1 is a perspective view showing a configuration example of a cutting device for carrying out a method of mounting a cutting blade according to Embodiment 1. Fig. 2 is a side view showing the main parts of the cutting device shown in Fig. 1 in partial cross-section. FIG. 3 is a perspective view showing an auxiliary work clamp for trimming a plate of the cutting device shown in FIG. 1 . Fig. 4 is a flow chart showing the flow of the method of mounting the dicing blade according to the first embodiment. FIG. 5 is a side view showing a partial cross-section of an installation position search step of the cutting blade installation method shown in FIG. 4 . Fig. 6 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 7 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 6 . Fig. 8 is a diagram showing another example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting a dicing blade shown in Fig. 4 . Fig. 9 is a diagram showing an example of an image after the table is rotated from the state shown in Fig. 8 . Fig. 10 is a side view showing the conduction detection step of the dicing blade installation method shown in Fig. 4 in a partial section. Fig. 11 is a flow chart showing the flow of the method of mounting the dicing blade according to the second embodiment. Fig. 12 is a diagram showing an example of an image captured by a camera unit in a step of searching for a mounting position of the method of mounting the dicing blade shown in Fig. 11 . Fig. 13 is a diagram showing an example of an image obtained by relatively moving the camera unit and the sub-table from the state shown in Fig. 12 .

ST1~ST4、ST21~ST26‧‧‧步驟 Steps ST1~ST4, ST21~ST26‧‧‧

Claims (3)

一種切割刀片的安裝方法,是使用切割裝置來設定切割刀片之切入進給方向的基準位置,該切割裝置具備:工作夾台,以上表面保持被加工物;切割單元,以裝設於主軸的該切割刀片對保持於該工作夾台的被加工物進行切割;切入進給單元,使該切割單元於與該上表面正交的該切入進給方向上移動;相機單元,對保持於該工作夾台的被加工物進行拍攝,該工作夾台之上表面是以平坦的金屬材所形成,且於該上表面形成有吸引口及吸引溝,該切割刀片的安裝方法具備:安裝位置探索步驟,以該相機單元拍攝該工作夾台的該上表面,以探索未被檢測出凹凸、傷痕、異物、該吸引口、及該吸引溝的該上表面的安裝位置;導通檢測步驟,將在該安裝位置探索步驟中所探索到的該上表面的該安裝位置定位到該切割刀片的正下方,並使該切割單元朝該切入進給方向移動,以檢測在該安裝位置使該切割刀片接觸於該上表面之瞬間的電氣導通;以及基準位置設定步驟,將檢測出電氣導通之時的該切割刀片的切入進給方向的位置作為該基準位置來設定。 A method for installing a cutting blade is to use a cutting device to set the reference position of the cutting blade in the cutting feed direction. The cutting blade cuts the workpiece held on the work clamp; the cutting feed unit moves the cutting unit in the cutting feed direction perpendicular to the upper surface; the camera unit maintains on the work clamp The upper surface of the work clamp table is formed of a flat metal material, and a suction port and a suction groove are formed on the upper surface. The installation method of the cutting blade includes: an installation position search step, Use the camera unit to photograph the upper surface of the work clamp to explore the installation positions of the upper surface of the suction port, the suction groove, and the undetected unevenness, flaws, foreign objects; the conduction detection step will be performed in the installation The installation position of the upper surface explored in the position searching step is positioned directly below the cutting blade, and the cutting unit is moved toward the cutting feed direction to detect that the cutting blade is brought into contact with the cutting blade at the installation position. Momentary electrical conduction of the upper surface; and a reference position setting step of setting the position in the cutting feed direction of the cutting blade when the electrical conduction is detected as the reference position. 如請求項1之切割刀片的安裝方法,其中在該安裝位置探索步驟中,在拍攝而取得之圖像的規定範圍檢測出該傷痕或者異物的情況下,使該工作夾台旋轉直到在該規定範圍未被檢測出該傷痕或者異物的位置為止。 The method for installing a cutting blade according to Claim 1, wherein in the step of searching for the installation position, when the flaw or foreign object is detected within a predetermined range of the captured image, the work clamp is rotated until it is within the predetermined range. until the position where the flaw or foreign object is not detected. 如請求項1或2之切割刀片的安裝方法,其中該安裝位置探索步驟具備吹氣步驟,該吹氣步驟是在以該相機單元拍攝該上表面之前,以吹氣單元於進行拍攝之該上表面的範圍噴附空氣。The method for installing a cutting blade according to claim 1 or 2, wherein the step of exploring the installation position has an air blowing step, and the air blowing step is to use an air blowing unit on the upper surface for shooting before taking pictures of the upper surface with the camera unit The range of surfaces is sprayed with air.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211350A (en) * 2002-01-18 2003-07-29 Tokyo Seimitsu Co Ltd Dicing device and cutter set method
JP2013098438A (en) * 2011-11-02 2013-05-20 Disco Abrasive Syst Ltd Cutting device
JP2015211120A (en) * 2014-04-25 2015-11-24 株式会社ディスコ Cutting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5340841B2 (en) * 2009-07-21 2013-11-13 株式会社ディスコ Cutting equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211350A (en) * 2002-01-18 2003-07-29 Tokyo Seimitsu Co Ltd Dicing device and cutter set method
JP2013098438A (en) * 2011-11-02 2013-05-20 Disco Abrasive Syst Ltd Cutting device
JP2015211120A (en) * 2014-04-25 2015-11-24 株式会社ディスコ Cutting device

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